Technologies
Achieve your next application innovation with our market-driven, purpose-built technologies and custom silicon solutions.
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Learn more: Advanced packaging
Advanced packaging
Our advanced packaging services for compact, high-performance and energy-efficient systems integrate multiple technologies to enable new AI-driven architectures. -
Learn more: CMOS
CMOS
Our CMOS solutions optimize power, performance and area through feature-rich, application-specific technologies. Designed for intelligent edge systems and beyond, our CMOS portfolio enables applications across connectivity, processing and sensing systems with strong RF integration and scalable manufacturing. -
Learn more: Power
Power
Our power technologies enable efficient energy conversion and advanced power management, supporting power delivery and electrification applications, including automotive, industrial and data center systems, with high power density, efficiency and design flexibility. -
Learn more: RF
RF
Our RF technologies are foundational for high-performance wireless connectivity across aerospace & defense, automotive, smart mobile and wireless infrastructure. With industry-leading platforms and novel materials, our RF portfolio enables communications and radar sensing applications with low-noise, high-linearity and high-power performance. -
Learn more: Silicon photonics
Silicon photonics
Our silicon photonics technologies deliver high-bandwidth, energy-efficient optical connectivity for modern data centers and AI infrastructure. Supporting pluggables and co-packaged optics (CPO), our advanced silicon photonics platform enables optical interconnect applications through integration of photonics, RF and advanced packaging. -
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MIPS, a GlobalFoundries company
As decisions move closer to where data is generated and actions are taken, a new class of systems is emerging: Physical AI, where sensing, thinking, acting and communicating happen seamlessly in real time for agentic platforms. MIPS, a GlobalFoundries company, delivers the virtual platforms, standards-based compute and ASSP design capabilities for making software into silicon.