Technologies

FDX™ FD-SOI

Our industry-leading FDX fully depleted silicon-on-insulator (FD-SOI) platform is purpose-built for intelligence at the edge, delivering unparalleled energy efficiency and adaptive performance to support always-on, intelligent devices.

Achieve lower power and higher integration with FDX

There is a growing need for real-time, responsive experiences to power the next generation of intelligent systems. FDX solutions are proven to deliver uncompromising energy efficiency, adaptive performance and a robust suite of application-optimized enhancements for increased design freedom, empowering you to bring your consumer or industry solution to life at the edge or beyond.

  • Leading RF/mmWave performance

    Leading front-end and back-end feature set enables long-range, secure wireless connectivity with power efficiency improvements

  • Ultra-low voltage & leakage

    Build on FD-SOI’s inherent leakage advantages with the option for ultra-low voltage (ULV) operation and ultra-low leakage (ULL) logic and SRAM

  • Adaptive body biasing (ABB)

    Harness FD-SOI’s architectural advantage to dynamically optimize performance and energy efficiency with greater design flexibility

  • Flexible feature set

    Robust, application-optimized suite of enhancements, including automotive-grade options, embedded non-volatile memory (eNVM) solutions, flexible voltage support and AI toolkits

  • Manufacturing reliability

    Supplying ICs in flagship products of global Tier-1 companies, with multi-site manufacturing across accredited facilities in Malta, New York and Dresden, Germany

  • Advanced packaging

    Support for advanced packaging integration with proven wafer warpage management, prototyping-ready through-silicon via (TSVs) and bonding fabric for 2.5/3D integration

Comprehensive, customizable enhancements for your needs

Build on our FDX process technology and its expanding suite of feature enhancements, so you can select the memory, voltage or analog solution that best fits your application criteria.

Premium Auto Grade 1 embedded non-voltatile memory (eNVM) solution delivering superior performance with rapid read and write speeds and exceptional reliability with >500K cycles endurance and 20-year data retention at 150 °C.

Cost-efficient, back-end-of-line (BEOL) friendly integration built in-house on proven OxRAM technology with optimized write power*, ultra-low power operation for read operations, demonstrated scalability (sub-10ppm), 3D integration capability and total environmental field immunity.

*versus eFlash

Flexible voltage support (up to 25V), SRAM for advanced display and high-power applications, 0.65V digital operation for reduced dynamic power, gate-first process with 20-30% lower mismatch for reduced area and power.

Enhanced RF device options enable improved noise figure, linearity, power amplifiers (PAs) efficiency and best-in-class mmWave performance.

High endurance, automotive-grade reliability with eMRAM

eMRAM is the most widely adopted eNVM solution for demanding, safety‑critical automotive functions due to its thermal resilience, fast access times, robust error correction and long‑term reliability.

Building on 15+ years of automotive manufacturing experience, our AutoPro150 eMRAM solution leverages FDX process technology to deliver automotive‑grade reliability at scale – empowering you to optimize speed, power, and area for next‑generation automotive applications.

Learn More: High endurance, automotive-grade reliability with eMRAM

GF business webinar series: Enabling the evolution of edge to Physical AI

This webinar showcases how MIPS and our CMOS technologies are driving the evolution of smart, autonomous and connected devices from edge to Physical AI applications.

Watch webinar

FDX applications

Aerospace & defense

Supporting SATCOM front-end module applications and supporting electronics with trusted manufacturing, RF capability and low-leakage operation for mission-critical environments

Learn more: Aerospace & defense

Automotive

Enabling smart sensors, automotive processing and radar SoCs designed for real-time operation, supporting advanced sensing and processing needs with industry-grade reliability

Learn more: Automotive

Data center & communications infrastructure

Key solution for 5G cellular and wireless infrastructure, enabling efficient integration of RF and digital functions for base stations, small cells and related network equipment

Learn more: Data center & communications infrastructure

Home & industrial IoT

Powering wireless solutions, MCUs and HMI components, including DDICs and ISPs, supporting always-on (AON) operation and power-efficient designs for connected devices at the edge

Learn more: Home & industrial IoT

Smart mobile devices

Supporting 5G mmWave front-end modules, imaging devices, DDICs, NFC and secure elements, enabling advanced, secure functionality in compact consumer designs

Learn more: Smart mobile devices
FDX

Frequently asked questions (FAQs)

Our FDX technology offers embedded memory solutions for MRAM and RRAM, enabling non-volatile data retention with low power, fast access and improved system efficiency.

The choice depends on your application priorities. If your design requires premium performance, high endurance and long-term reliability, MRAM is the preferred option. For applications that prioritize efficient integration in high-volume designs, RRAM provides a flexible, cost-effective solution.

FDX is designed to deliver system-level cost efficiency by enabling lower power operation, higher integration and reduced design complexity, which may help offset production costs through smaller die sizes and simplified system architectures.

FDX uses standard CMOS design flows and does not require unique EDA tools. Backed by our robust IP ecosystem and unique body biasing support, FDX enables simplified adoption, streamlined design and time-to-market.

Yes. We continue to actively invest and expand on our industry-leading FDX platform, with ongoing feature enhancements and sustained ecosystem growth.

Latest news & insights