Technologies

FinFET

We harness FinFET’s three-dimensional architectural advantages, transistor density and strength to deliver high-performance, area advantages, low-leakage and operating voltage for unrelenting power efficiency.

Unlock increased performance & unrelenting power management with FinFET

With over a decade of high-volume production, our FinFET process technologies are production-proven across consumer and industrial applications. Backed by our vast single-fin and multi-fin IP libraries, we offer the most complete FinFET solution on the market, delivering unrelenting power management and high-performance capabilities.

  • Automotive-ready

    Automotive-grade solutions and robust portfolio of automotive-ready IPs and design resources

  • Built to scale for RF applications

    RF-optimized features deliver high performance, power efficiency and area advantages

  • Trusted U.S. manufacturing

    Demonstrated high-volume manufacturing at our Malta, New York facility, full PDKs and broad IP availability, including single-fin libraries

  • Leading power efficiency

    Up to 20% lower logic core power compared to 22nm-class technologies, ultra-low SRAM leakage (0.5 pA/cell HD retention) and integrated 3.3V/5V power management

  • Robust enhancements

    Added integrations including leading RF, ULL and LDMOS devices for low leakage general purpose I/Os (GPIOs)

  • Advanced packaging

    Including through-silicon via (TSVs) to support 2.5/3D integration, interposers and wafer-to-wafer (W2W) bonding

Comprehensive, customizable enhancements for your needs

We offer next-level customization capabilities with application-focused feature enhancements. Whether you need higher drive or lower power, we enable you to build on our FinFET process technology for a solution that fits your application needs.

Our AutoPro 150 FinFET solutions are optimized for demanding, next-generation automotive applications with improved PPA (vs industry 16nm automotive solutions) and Auto Grade 1 qualification (up to 150°C) for reliable, long-term operation.

Our RF enhancement delivers significant power reductions and area scaling (vs 22nm solutions), RF devices for integrated power amplifiers (PAs) and superior RF/analog performance.

Our ULL enhancement offers improved energy efficiency with logic and SRAM power reduction, enabling longer battery life and lower standby power through a new ultra-high threshold voltage (UHVT) device for 10x reduction (<0.5pA/cell) and SRAM UHVT Iret for 30x reduction.

FinFET applications

Aerospace & defense

Powering SATCOM front-end modules and secure processing with high performance, radiation-resilient design characteristics and trusted U.S. manufacturing for mission-critical applications

Learn more: Aerospace & defense

Automotive

Enabling smart sensors, automotive processors and radar SoCs that deliver real-time processing, low-latency decision-making and industry-grade reliability for advanced driver assistance systems (ADAS) and software-defined vehicle (SDV) architectures

Learn more: Automotive

Data center & communications infrastructure

Supporting 5G cellular and wireless infrastructure with high-performance compute and connectivity that balance throughput, power efficiency and reliability for always-on network deployments

Learn more: Data center & communications infrastructure

Home & industrial IoT

Enabling wireless SoCs, MCUs and human-machine interfaces (HMI) – including display driver ICs (DDIC) and image signal processors (ISP) – optimized for low power, compact form factors and intelligent edge processing

Learn more: Home & industrial IoT

Smart mobile devices

Powering 5G mmWave front-end modules, imaging subsystems, display drivers and secure elements (NFC/SE) that demand high performance, low leakage and tight integration in space-constrained mobile designs

FinFET

Frequently asked questions (FAQs)

Our FinFET process technologies support Auto Grade 1 designs with a broad ecosystem of proven IPs tailored to automotive applications, including logic, memory, interface and analog IP to enable safety-critical applications.

Our FinFET’s RF-optimized architecture delivers high performance, power efficiency and area scaling for RF designs, supporting today’s advanced wireless applications.

Our FinFET process technologies are manufactured at our accredited Malta, New York facility, delivering a secure and trusted solution aligned with U.S. regulatory requirements.

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