Featured technologies
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Learn more: FDX™ FD-SOI
FDX™ FD-SOI
Purpose built for intelligence at the edge, our FDX FD-SOI solutions enable true SoC integration – combining digital, analog and RF on a single chip – delivering uncompromising energy efficiency, best-in-class RF, adaptive performance through body biasing and robust feature integration to support always-on, responsive consumer, industrial and automotive applications. -
Learn more: Feature-rich CMOS
Feature-rich CMOS
Our portfolio of feature-rich CMOS solutions provides reliable, application-driven process technologies optimized for cost-effective integration. Built on advanced planar CMOS platforms, these solutions balance performance, power and cost while enabling highly integrated designs through rich embedded functionality. -
Learn more: FinFET
FinFET
Proven as the industry’s most complete FinFET solution, our process technology harnesses FinFET’s enhanced transistor architecture to deliver significant area compaction with robust feature enhancements and radiation resilience to enable demanding high performance and mission-critical processing applications.
Scale your designs with our trusted partner ecosystem
Access our global partner ecosystem, with validated IP, EDA and design services expertise across our CMOS platforms to accelerate development from concept to production.
CMOS
Frequently asked questions
We offer a comprehensive CMOS portfolio designed to match different power, performance, area and cost needs, depending on your application priority.
- FDX FD-SOI’s forward body biasing is optimized for ultra-low power and dynamic performance
- FinFET delivers maximum logic density for compute intensive designs
- Feature-rich planar CMOS provides a cost-effective, balanced option for highly integrated SoCs.
Yes. We offer MPW prototyping across all of our process technologies, including FDX FD-SOI, feature-rich CMOS and FinFET.
Learn more about our GlobalShuttle™ MPW program and view upcoming schedules.
Our CMOS technologies are supported by a diversified manufacturing footprint:
- FDX FD-SOI: Multi-site 300mm manufacturing across our facilities in Malta, New York and Dresden, Germany
- Feature-rich CMOS: Global manufacturing across our facilities in the U.S., Dresden, Germany and Singapore. Additional manufacturing options available through our manufacturing partners in China
- FinFET: 300mm U.S. manufacturing at our Malta, New York facility
Latest news & insights
- Learn more: SerDes, Ethernet and the silicon that connects them: Why SerDes for high-bandwidth sensors?
SerDes, Ethernet and the silicon that connects them: Why SerDes for high-bandwidth sensors?
- Learn more: GlobalFoundries announces customer availability of UX platform technologies for intelligent edge, connectivity and Physical AI applications
GlobalFoundries announces customer availability of UX platform technologies for intelligent edge, connectivity and Physical AI applications
- Learn more: GlobalFoundries and RAAAM Memory Technologies announce the joint development of next-generation GCRAM technology and test chip on FDX platform
GlobalFoundries and RAAAM Memory Technologies announce the joint development of next-generation GCRAM technology and test chip on FDX platform
- Learn more: CEA Leti advances European FD-SOI innovation with GlobalFoundries’ collaboration in the FAMES Pilot Line
CEA Leti advances European FD-SOI innovation with GlobalFoundries’ collaboration in the FAMES Pilot Line