Advancing co-packaged optics with silicon photonics GF’s SCALE™ CPO solution is the industry’s first Optical Compute Interconnect Multi-Source Agreement (OCI MSA) capable platform, engineered to support emerging CPO architectures. Built with GF’s advanced silicon photonics technology, GF’s SCALE CPO solution combines integrated photonic devices, coarse and dense wavelength-division multiplexing (CWDM, DWDM) and advanced packaging enablement to improve bandwidth density and system scalability – versus traditional copper wiring – for next-generation optical compute interconnects. Leverages broadband detachable fibers with flat insertion loss over the CWDM spectrum to future-proof scaling from 4λ in each direction to 8λ and beyond, while enabling serviceability and known-good-die testability for next-generation AI interconnects. Exceeds requirements for the OCI MSA’s optical interconnect specification for modern AI scale-up architectures Offers an advanced portfolio of fully-qualified photonic devices, such as 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes Supports through silicon vias (TSVs) for high-speed signaling and power delivery and copper pad pitches ranging from 110µm down to sub-45µm for 2.5/3D stacking from organic substrates to silicon interposers, enabling customers to move quickly from design to volume production Integrates electrical ICs on single-digit advanced nodes to optimize best-in-class compute and state-of-the-art optics without compromising performance Delivering a new era of data connectivity of silicon photonics Billions of connected, intelligent devices and increased data center power consumption are driving the need for innovative solutions to move more data faster and more efficiently. As a result, moving from electrons to photons is now an essential technical disruption. Solutions for all form factors, from pluggable optical transceivers – including coherent and long-haul optics – linear driver pluggable optics (LPO), near packaged optics (NPO) and CPO Demonstrated 8λ and 16λ bi-directional DWDM, positioned to support the shift to CPO and accelerate the adoption of optical scale-up interconnects. Address the increasing need for higher data rates with 5-10x greater power efficiency than long-range electrical interconnect, and supercharging fiber-optic communication networks while boosting reliability through minimized signal loss and degradation Flexible fiber attach, including direct and detachable options High-bandwidth, low-power optical interconnects for leading-edge data center products Avoid the reach limitations of copper cables while offering up to 8x the data rate, consuming less power and generating less heat Sorry, this video requires cookie consent. Please accept marketing-cookies to watch this video. Silicon photonics-based networks Conventional copper wire connections are becoming prohibitive from power consumption, data rate, and bandwidth perspectives. GF silicon photonics platform addresses the increasing need for data centers to handle ever-higher data rates and volumes with greater power efficiency. Advantages of photons include no crosstalk, temperature resiliency and quantum information capabilities Integrated photonic components with high performance CMOS logic and RF to enable monolithic electrical and optical computing Combine photonics and electronics for next-generation computing platforms suitable for purpose-built AI Deliver compute that is faster and more efficient for results that are not possible with conventional chips Leverage GF’s silicon photonics platform for advanced tooling with industry-leading manufacturing and rigorous process controls for reliability Innovative features GF’s silicon photonics portfolio addresses the increasing need for higher data rates with greater power efficiency, supercharging fiber-optic communication networks while minimizing signal loss and degradation. Monolithic electro-optical integration of high-performance CMOS, RF and photonic components on the same chip Comprehensive high-performance state of the art libraries and PDKs to support the co-design of RF CMOS and photonics High-level integration onto a photonics integrated circuit (PIC) and innovative packaging solutions including passive attachment of larger fiber arrays, support for 2.5D packaging and on-die integrated lasers Supply confidence with the industry’s only high-volume 300mm CMOS manufacturing foundry for silicon photonics Expanded silicon photonics innovation with Advanced Micro Foundry (AMF) In 2025, GF announced the acquisition of Advanced Micro Foundry (AMF), a silicon photonics foundry based in Singapore, marking a pivotal step in our strategy to advance innovation and its leadership in silicon photonics. The acquisition brings together AMF’s manufacturing assets, extensive intellectual property and skilled talent to significantly expand GF’s silicon photonics technology and establish GF as the largest silicon photonics pure-play foundry by revenue. View the resources below for more information, and explore AMF multi-project wafer shuttle runs. Download brochure Learn more about AMF platforms Learn more about AMF PDKs Contact Us
