Technologies

Advanced packaging

Our advanced packaging services for compact, high-performance and energy-efficient systems integrate multiple technologies to enable new AI-driven architectures.

Scaling next-generation systems

As demand for compact, high-performance and energy-efficient solutions accelerates, advanced packaging becomes critical to enable next-generation systems as traditional scaling approaches reticle limits. Our advanced packaging solutions unify multiple process technologies into a single system, reducing interconnect distances and enabling new architectures across a range of applications.

  • 2.5D & 3D integration

    Advanced interposer technology enables high-density 3D integration (3DI), flexible wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding for heterogenous integration of logic, memory and power, with through-silicon vias (TSVs) available

  • Integrate leading technologies

    Supports W2W and D2W for industry and GF technologies, including our lauded CMOS, RF and silicon photonics platforms, for an integrated solution tailored to your application needs

  • End-to-end integration

    Delivers a continuous flow from wafer fabrication to assembly, packaging and test, with optimization, test coverage and full management to our production standards

Advanced packaging services

Our advanced packaging services are structured to deliver a complete, end-to-end flow, supported by our dedicated advanced packaging centers, a globally distributed manufacturing footprint and trusted partners complementing our manufacturing for assembly, packaging and test, delivering a streamlined path to production.

  • Interposer/bridges

    High-density interconnects between multiple dies using silicon interposers or bridges, with support for stitched and non-stitched implementations, integrates deep trench capacitors for enhanced on-interposer capacitance, enabling high-bandwidth, low-latency system integration

  • Wafer-to-wafer bonding

    Advanced bonding technologies, including W2W with dual-wafer bonding fabric for reliable interconnect and SLATE wafer-to-wafer bonding technology for homogenous integration of select GF platforms, deliver dense 3DI and shorter interconnect distances for system-level scaling

  • Die-to-wafer bonding

    Supports advanced 3D integration by bonding individual die onto wafers, enabling higher integration density and flexible chiplet-based architectures

  • Thru-silicon vias (TSV)

    Enables high-density vertical interconnects for W2W and D2W integration, allowing heterogenous logic, memory and power devices to be interconnected in advanced 3D architectures; within advanced silicon interposers, TSVs provide the vertical electrical path from the top-mounted die through the interposer to the package substrate

Advanced packaging centers

Our advanced packaging centers in the U.S. and Singapore deliver next-generation differentiated silicon-proven solutions for advanced packaging. Our Advanced Packaging and Photonics Center (APPC) in Malta, New York focuses on silicon photonics co-packaged optics (CPO) development and our advanced packaging R&D center of excellence in Singapore specializes in next-generation photonics and developing capability in chip-stacking and wafer bonding technologies.

Learn more: Advanced packaging centers

Advanced packaging applications

Aerospace & defense

Enables secure, high-reliability integration of multiple technologies into compact systems, supporting mission-critical performance and trusted manufacturing flows

Learn more: Aerospace & defense

Data center & communications infrastructure

Enables high-bandwidth, low-latency system integration for optical and electrical interconnects, supporting AI-driven workloads and next-generation data center and network infrastructure

Learn more: Data center & communications infrastructure

Home & industrial IoT

Enables compact, energy-efficient system integration by combining multiple functions within a single package, supporting scalable IoT and edge AI deployments

Learn more: Home & industrial IoT

Smart mobile devices

Supports highly integrated, space-efficient packaging to enable advanced functionality within compact mobile form factors

Learn more: Smart mobile devices
Advanced packaging

Frequently asked questions

Advanced packaging enables tight integration of photonic and electronic components to meet bandwidth, power and form factor requirements. By supporting high-density interconnects, flexible fiber attach, thermal management and 2.5D/3D integration, our advanced packaging services provide the foundation for assembling, testing and deploying complete photonics systems as architectures evolve, enabling scaling from pluggable modules to co-packaged optics (CPO) and more integrated architectures.

Yes. Our U.S.-based APPC center supports secure, onshore manufacturing, packaging and test, enabling trusted supply chain options for sensitive applications.

We support a range of advanced packaging technologies, including 2.5D interposer-based integration with TSV formation and reveal, redistribution layers (RDL) and passivation for signal routing and protection, with W2W and D2W bonding – extending to 3D integration using TSV-enabled stacking.

Advanced packaging’s ability to support heterogeneous integration across multiple technology nodes, including logic, memory and power, are essential to enable evolving AI workloads and high-performance, compact solutions across communications infrastructure, data centers, aerospace and defense, automotive and IoT systems.

Yes. We support the full lifecycle from development and qualification through volume manufacturing, enabling customers to scale designs from concept to production.

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