Technologies
BCD
Achieve efficient power management with BCD technology
Our BCD solutions combine analog, digital and power integration to deliver a modular foundation for efficient power management. By integrating low- and high-voltage bipolar devices, EDMOS/LDMOS power transistors, precision passives and embedded non-volatile memory (eNVM), our portfolio supports highly integrated, energy-efficient power management ICs across a broad range of applications.
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Flexible voltage coverage
Scalable power management support across a wide range of application needs
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Resilient, high-performance
Optimize performance, robustness and integration for demanding system requirements with modular platforms
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Leading power efficiency
High power-conversion efficiency for reduced energy loss and lower system operating costs
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High digital density & integration
Mixed-signal integration with embedded passives and non-volatile memory, including eFlash, OTP and MTP
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Proven global manufacturing
Dual-sourced manufacturing across our U.S., Dresden, Germany and Singapore facilities supports high-volume deployment
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Long-lifecycle support
Engineered for longevity with stable process platforms supporting extended product lifecycles and sustained availability
Delivering best-in-class power management
With broad low- to high-voltage capability, GF BCD process technologies enable designers to balance efficiency, performance, integration and robustness.
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5V to 150V voltage support
across GF’s BCD and BCD HV portfolio
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Automotive Grade 1 & Grade 0
solutions for high-reliability application
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Up to 200V high-voltage isolation
with deep trench isolation (DTI) and a broad passive device offering
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Strong analog, power & digital integration
for mixed-signal smart-power ICs
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High digital density
enabling more intelligence and control in compact power management designs
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Power-conversion efficiency
optimized by application, with leading device and integration options across the portfolio
BCD technologies at-a-glance
Our comprehensive BCD portfolio delivers scalable, customizable platforms for highly integrated mixed-signal power ICs. This portfolio approach empowers customers to match the right platform to the application — from cost-optimized, lower-voltage power management to high-voltage smart-power systems requiring stronger robustness, wider voltage coverage and deeper mixed-signal integration.
High-voltage BCD
Our high-voltage BCD solutions are engineered for demanding high-voltage applications requiring broader voltage coverage, stronger robustness and deeper smart-power integration. With deep trench isolation (DTI) up to 200V, operating ranges from 5V to 150V and optimized RDS(on) across voltage classes, our high-voltage BCD portfolio supports automotive, industrial, communications and data center systems where power density, efficiency, reliability and integration matter most.
Our advanced bulk high-voltage BCD process technology for next-generation smart power integration, supporting the broadest voltage range in the portfolio (5V–150V class, with 165V capability). Our 55BCD HV variant delivers >200 MHz logic, 25–40% die area reduction and >1M gates/mm², enabled by reduced metallization (10 µm Cu, bond-over-active) for maximum integration and performance.
- Fully rated 175°C devices
- Auto Grade 0 robustness
- Best-in-class 80V switching performance for 48V systems
- High digital density for memory, control, interfaces and local intelligence
- Multiple high-voltage device classes for 48V regulated rails, core switching, front-end protection and battery-adjacent control
- Strong IP foundation to accelerate time-to-market
Our established 300mm automotive-qualified high-voltage BCD platform, supporting smart power applications up to 120V. With proven manufacturability, established reliability and a stable, cost-effective flow, this technology is well suited for automotive and industrial customers seeking faster deployment, lower risk and a qualified high-volume platform.
BCD
Our lower-voltage BCD platforms support a wide 5V–65V operating range, integrate low-noise devices and are Auto Grade 1 qualified to enable reliable, highly integrated power and mixed-signal ICs across consumer, automotive and mobile applications.
Our 55BCD technology delivers best-in-class RDS(on)·Area (5V < 0.7 mΩ·mm²), reduced metallization overhead (10 µm copper, bond-over-active, copper pillars), ultra-low leakage and noise to enable high-efficiency, compact power ICs.
Our 130BCD technology is the industry’s first BCD on 300mm with Cu back-end-of-line (BEOL), supporting a wide 5V–40V range and optimized RDS(on) for efficient power delivery with flexible single and dual-gate IP and modular flows that enable scalable, customizable smart power designs.
Our 180BCD technology is our production-proven BCD platform with over 14 years of high-volume manufacturing, offering time-tested reliability, broad IP reuse and support for multi-programmable (MTP) solutions to enable stable, long-lifecycle power and mixed-signal ICs.
BCD applications
Latest news & insights
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Learn more: GlobalFoundries and Renesas Expand Partnership to Accelerate U.S. Semiconductor ManufacturingFeb 16, 2026GlobalFoundries and Renesas Expand Partnership to Accelerate U.S. Semiconductor Manufacturing
- Learn more: Cirrus Logic and GlobalFoundries Expand Strategic Investment to Advance Next-Generation Mixed-Signal Semiconductor Manufacturing in the U.S.Aug 19, 2025
Cirrus Logic and GlobalFoundries Expand Strategic Investment to Advance Next-Generation Mixed-Signal Semiconductor Manufacturing in the U.S.
- Learn more: GlobalFoundries Enhances Technology Platforms to Enable Critical Applications for Next Generation Electric and Autonomous VehiclesAug 29, 2023
GlobalFoundries Enhances Technology Platforms to Enable Critical Applications for Next Generation Electric and Autonomous Vehicles
