Technologies
BCD
Achieve efficient power management with BCD technology
Our BCD solutions combine analog, digital and power integration to deliver a modular foundation for efficient power management. By integrating low- and high-voltage bipolar devices, EDMOS/LDMOS power transistors, precision passives and embedded non-volatile memory (eNVM), our portfolio supports highly integrated, energy-efficient power management ICs across a broad range of applications.
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Flexible voltage coverage
Scalable power management support across a wide range of application needs
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Resilient, high-performance
Optimize performance, robustness and integration for demanding system requirements with modular platforms
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Leading power efficiency
High power-conversion efficiency for reduced energy loss and lower system operating costs
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High digital density & integration
Mixed-signal integration with embedded passives and non-volatile memory, including eFlash, OTP and MTP
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Proven global manufacturing
Dual-sourced manufacturing across our U.S., Dresden, Germany and Singapore facilities supports high-volume deployment
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Long-lifecycle support
Engineered for longevity with stable process platforms supporting extended product lifecycles and sustained availability
Delivering best-in-class power management
With broad low- to high-voltage capability, GF BCD process technologies enable designers to balance efficiency, performance, integration and robustness.
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5V to 150V voltage support
across GF’s BCD and BCD HV portfolio
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Automotive Grade 1 & Grade 0
solutions for high-reliability application
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Up to 200V high-voltage isolation
with deep trench isolation (DTI) and a broad passive device offering
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Strong analog, power & digital integration
for mixed-signal smart-power ICs
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High digital density
enabling more intelligence and control in compact power management designs
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Power-conversion efficiency
optimized by application, with leading device and integration options across the portfolio
BCD technologies at-a-glance
Our comprehensive BCD portfolio delivers scalable, customizable platforms for highly integrated mixed-signal power ICs. This portfolio approach empowers customers to match the right platform to the application — from cost-optimized, lower-voltage power management to high-voltage smart-power systems requiring stronger robustness, wider voltage coverage and deeper mixed-signal integration.
High-voltage BCD
Our high-voltage BCD solutions are engineered for demanding high-voltage applications requiring broader voltage coverage, stronger robustness and deeper smart-power integration. With deep trench isolation (DTI) up to 200V, operating ranges from 5V to 150V and optimized RDS(on) across voltage classes, our high-voltage BCD portfolio supports automotive, industrial, communications and data center systems where power density, efficiency, reliability and integration matter most.
Our advanced bulk high-voltage BCD process technology for next-generation smart power integration, supporting the broadest voltage range in the portfolio (5V–150V class, with 165V capability). Our 55BCD HV variant delivers >200 MHz logic, 25–40% die area reduction and >1M gates/mm², enabled by reduced metallization (10 µm Cu, bond-over-active) for maximum integration and performance.
- Fully rated 175°C devices
- Auto Grade 0 robustness
- Best-in-class 80V switching performance for 48V systems
- High digital density for memory, control, interfaces and local intelligence
- Multiple high-voltage device classes for 48V regulated rails, core switching, front-end protection and battery-adjacent control
- Strong IP foundation to accelerate time-to-market
Our established 300mm automotive-qualified high-voltage BCD platform, supporting smart power applications up to 120V. With proven manufacturability, established reliability and a stable, cost-effective flow, this technology is well suited for automotive and industrial customers seeking faster deployment, lower risk and a qualified high-volume platform.
BCD
Our lower-voltage BCD platforms support a wide 5V–65V operating range, integrate low-noise devices and are Auto Grade 1 qualified to enable reliable, highly integrated power and mixed-signal ICs across consumer, automotive and mobile applications.
Our 55BCD technology delivers best-in-class RDS(on)·Area (5V < 0.7 mΩ·mm²), reduced metallization overhead (10 µm copper, bond-over-active, copper pillars), ultra-low leakage and noise to enable high-efficiency, compact power ICs.
Our 130BCD technology is the industry’s first BCD on 300mm with Cu back-end-of-line (BEOL), supporting a wide 5V–40V range and optimized RDS(on) for efficient power delivery with flexible single and dual-gate IP and modular flows that enable scalable, customizable smart power designs.
Our 180BCD technology is our production-proven BCD platform with over 14 years of high-volume manufacturing, offering time-tested reliability, broad IP reuse and support for multi-programmable (MTP) solutions to enable stable, long-lifecycle power and mixed-signal ICs.
BCD applications
Latest news & insights
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