Every major semiconductor material has gone through the same progression before reaching scale, beginning with initial development, followed by gradual maturation and ultimately deployment. Silicon did it first, then gallium arsenide (GaAs) and silicon germanium (SiGe) and now wide-bandgap materials are making that same climb. Today, gallium nitride (GaN) is taking that step in electrical…
Quantum computing is quickly moving out of the lab toward full utility scale. The theory has been understood for decades, and the first small-scale quantum computers are now operating in research labs around the world. What turns those systems into useful machines is exactly where GF excels. We bring differentiated process technology, deep co-development partnerships…
As consumer demand accelerates for next-generation smart mobile devices and RF and battery performance requirements continue to rise, every square millimeter of board space matters. Front-end modules must support more bands, more functionality and more complex switching architectures without increasing footprint. Achieving this level of integration requires both advanced RF switch technology and innovative design…
Last week at IMS and RFIC 2026 in Boston, we showcased our latest RF portfolio developments, demonstrating how differentiated process technologies are advancing next-generation applications across wireless connectivity, aerospace and defense, SATCOM and industrial systems. At the GF booth, attendees engaged with our technology experts and explored live wafer displays, including GF RFGaN1 (130RFGaN) and…
Just as the proliferation of AI is driving data center growth, the rising demand of mobile data traffic is driving next-generation wireless communications systems. Across SATCOM, aerospace, defense and communications infrastructure, next-generation RF systems must deliver higher output power, wider bandwidth and increased efficiency while simultaneously reducing system size, cost and complexity. The innovative engine…
When Artemis II lifted astronauts beyond Low Earth Orbit for the first time in more than 50 years, it marked another milestone in human exploration. But missions like these are only possible because of electronics that perform flawlessly in one of the most unforgiving environments imaginable. Navigation, communication and life-support systems for modern spaceflight all…
The defining challenge in advanced semiconductor innovation today is aligning breakthrough ideas with the realities of manufacturing as early as possible. As architecture becomes more interdisciplinary and system‑driven, early technical decisions increasingly shape what can ultimately be built, produced and sustained over time. When manufacturability, yield and system level integration are addressed late, options quickly…
AI infrastructure is scaling simultaneously within the rack, across the data center and between data center campuses. That multidimensional growth is redefining the industry’s core challenge. The constraint is no longer compute alone, but the speed, efficiency and reliability of data movement at scale. As AI workloads grow more distributed and bandwidth-intensive, the industry is…
Imagine a world where semiconductor manufacturing operations extend beyond the physical boundaries of the wafer fabrication plant (“fab”). A world where engineering support, data analytics and process optimization teams are seamlessly working 24/7 across time zones and locations, delivering speed and efficiency to customers. That’s the idea behind GlobalFoundries’ Global Fab Engineering Services (GFES), a…
Every day, GF teams run some of the most complex manufacturing environments in the world. That work takes energy, water and specialty materials. And it takes constant attention to how those resources are used. At GF, sustainability is not separate from manufacturing. It is part of how we operate our manufacturing sites, how we make…