Technologies

SiGe

Industry-leading silicon germanium (SiGe) technologies for high-frequency applications offering the perfect balance of speed, performance, cost, reliability and efficiency

High speed, low noise, power efficient

As mobile experiences evolve and data center bandwidth demands grow, the need for solutions that can balance power efficiency and performance is unprecedented. By combining SiGe heterojunction bipolar transistors (HBT) with CMOS (BiCMOS), our SiGe technology offers high-voltage swing, output power and uncompromising signal integrity.

  • Broad application versatility

    Spanning mobile and Wi-Fi, wireless infrastructure, optical communications, automotive radar, SATCOM and high-speed analog for data centers

  • High performance, optimized design

    Strong high-frequency performance, low noise and amplifier efficiency with extensive RF and digital integration on an economical silicon base

  • Leading speed & bandwidth

    Exceptional ft/fmax offering the performance necessary to empower next-generation mmWave and optical transceiver applications

  • Global manufacturing

    High-volume, multisite manufacturing across our U.S. and Singapore facilities for scale and reliability

  • Leading design enablement

    Rich suite of active and passive devices, comprehensive device models and PDKs and low-loss back-end-of-line (BEOL), with the ability to codesign RF, analog and digital circuits on a single chip

  • True BiCMOS integration

    Select platforms enable true monolithic integration of high-speed SiGe HBTs and CMOS, supporting power-efficient RF and high-speed analog architectures

High-performance SiGe technologies

We offer a broad portfolio of SiGe technologies with competitive benchmarks. Through a modular approach, we empower you to select the combination of performance, integration and cost that best fits your application needs.

As the industry’s first complementary bipolar technology, our CBIC technology delivers state-of-the-art integration of both negative-positive-negative (NPN) and positive-negative-positive (PNP) demonstrating market leading performance (ft > 200+ GHz), enabling high-speed analog amplifiers and low-noise amplifiers at low DC power consumption.

Optimized for ultra-high frequency and low noise operation, our HPS technologies – including established 8HP/8HP+ and latest-generation 9HP/HP+ technologies – deliver exceptional speed, bandwidth and signal integrity for demanding RF, mmWave and high-speed analog applications, while enabling dense RF and digital integration on an economical silicon base.

Designed for higher voltage swing, reliability and output power, our high-voltage SiGe technologies enable applications that balance performance, robustness and integration across wireless infrastructure and connectivity markets.

SiGe applications

Aerospace & defense

High-frequency performance, low noise and robust integration for mission-critical radar, secure communications and satellite systems

Learn more: Aerospace & defense

Automotive

High-performance and power efficiency to enable automotive radar and in-vehicle connectivity, supporting safety and reliability in harsh environments

Learn more: Automotive

Data center & communications infrastructure

GF’s HPS and CBIC family of technologies enable compact, low-noise, high gain-bandwidth designs for high-speed optical amplifiers and drivers and high-element antenna arrays

Learn more: Data center & communications infrastructure

Home & industrial IoT

GF SiGe solutions provide compact, power-efficient mixed-signal integration for low-noise, high-speed connectivity and always-on operation in space-constrained edge devices

Learn more: Home & industrial IoT

Smart mobile devices

GF HPS technologies reduce current consumption to extend battery life while maintaining ultra-low noise performance for LNAs, while HVS technologies enable robust low-cost power amplifier products for Wi-Fi applications

Learn more: Smart mobile devices

Scaling data center transmission with SiGe & silicon photonics

Our silicon photonics and SiGe technologies enable optical interconnects that deliver much higher data rates, lower latency and significantly better energy efficiency than copper. These platforms support the high‑bandwidth links required for AI clusters and large‑scale cloud deployments. With integrated photonics, RF and CMOS on a single platform, we enable faster and more efficient data movement across modern data center architectures.

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