By Suzanna Chang, Sr. Director, IoT End Market at GlobalFoundries 

Today, seamless connectivity is a necessity. We are moving to smarter homes and more connected devices, causing the demand for reliable and efficient Wi-Fi solutions to grow exponentially. In fact, according to Parks Associates’ Smart Home Dashboard, since last year, 18% of U.S. homes alone have six or more smart devices in them. At GlobalFoundries, we are supporting this exciting revolution by offering cutting-edge platforms perfectly suited for Wi-Fi applications. So, let’s dive into why GF’s FDX™ and FinFET are the ideal choice for your Wi-Fi needs.  

Where we started versus where we are going with Wi-Fi 7 and beyond 

Wi-Fi technology today is unrecognizable compared to how it used to be in the early days. From Wi-Fi 4 to the innovative advancements of Wi-Fi 6, each iteration has brought critical improvements in speed, efficiency, connectivity and more. And now, we are on the brink of another revolution with Wi-Fi 7, certified in 2024. The latest protocol delivers ultra-fast data rates of up to 46 Gbps, leveraging a 320 MHz channel bandwidth and advanced 4K QAM (Quadrature Amplitude Modulation) to maximize spectral efficiency. This enables seamless connectivity for multiple devices on a single network — without compromising performance. 

At GF, we’ve been advancing Wi-Fi chip technology since Wi-Fi 5, starting with 28LPS in 2018. Since then, we’ve delivered Wi-Fi 6/6E on 22FDX® and Wi-Fi 7 on both 22FDX® and 12LP+ FinFET. Now, we’re enabling next-gen connectivity with Wi-Fi 7 products and preparing the roadmap to Wi-Fi 8—bringing faster, smarter and more energy-efficient wireless performance to tomorrow’s connected devices. 

Where GF’s process technologies stand out 

The 22FDX® and 12LP+ FinFET platforms, cornerstones of our Ultra Low Power offerings, offer LV SRAM as low as 0.4V Vdd, suite of LDMOS devices, enabling highly integrated, power-efficient wireless connectivity. These platforms are built for connected intelligence at the edge, combining high performance with ultra-low power consumption. 

GF technologies for Wi-Fi iPA performance 6Ghz band 

Wi-Fi iPA at 6Ghz	22FDX®+	12LP+ FinFET
Iddq (mA)	125	56
Gain (dB)	26.5	25
Psat (dBM)	29	26.8
Peak PAE (%)	40	32.5

GF technologies for Wi-Fi iLNA performance 6Ghz band 

Frequency	22FDX+ (5.6Ghz)	12LP+ FinFET (5.8Ghz)
Noise Figure (dB)	2.1*	1.5**
Gain (dB)	18	20
Power mW ( @Vdd)	2(@1V)	1.6 (@0.8V)

* Limitation due on chip Lg size and Q, ** Not final Rg needs to be validated and limited due to Lg size and Q 

Here are the key features and benefits of our 22FDX® and 12LP+ FinFET platforms: 

1. Full SoC integration: Our platforms offer full System-on-Chip (SoC) integration, including digital, analog and high-performance RF for signal range. This integration maximizes system power and minimizes the bill of materials, making it a cost-effective solution for your Wi-Fi applications. 

2. High performance and low power: Our 22FDX® platform offers FinFET-class performance in planar technology with ultra-low leakage standard cells and LDMOS amplifiers for power-efficient connectivity. With that, our 12 LP+ FinFET platform also offers lower digital power with 1 to 3-Fin standard cells for power, performance and area efficiency boost. This means you can achieve superior performance without compromising on battery life or system power consumption – a big win-win for everyone. 

3. Robust RF capabilities: Our 22FDX® transistors boast >350GHz Ft and >400GHz Fmax with a sample Noise Figure (NFmin) down to 0.2dB. GF Ultra Low Power platforms RF devices deliver exceptional performance in “noisy” environments like a smart home hub connected to many devices inside a home.  

4. Adaptive body biasing: Unique to our 22FDX® technology is the industry’s only FD-SOI Adaptive Body Bias ecosystem with Foundation IP & design methodology support. Designers can use ABB for process variability improvement, device performance or leakage reduction.   

Innovating for the future of Wi-Fi and beyond  

As we look to the future, the rapid transition from Wi-Fi 4 to Wi-Fi 6/6E and beyond is transforming the Smart Home and IoT landscape. Our RF technology is designed to enhance the smart home experience and assist innovation as Wi-Fi evolves. We help enable seamless connectivity for a wide range of devices, from Broadband Network Gateway (BNG) to desktop and laptop computers to smart home appliances (i.e., Smart TV, Washer/Dryer) / gadgets (i.e. Soundbar, Smart Speakers, Smart Home Hub). And with Wi-Fi 7 and the upcoming Wi-Fi 8 protocol, we are committed to delivering even more power-efficient and high-performance solutions that keep your devices connected and users satisfied.  

GlobalFoundries’ FDX™ and FinFET offerings are a strong fit for current and future Wi-Fi applications, providing the perfect blend of performance, power efficiency and reliability. We are excited to continue pushing the boundaries of wireless connectivity. 

To learn more about our offerings for smart home connectivity, you can contact us anytime through gf.com.  

Suzanna Chang is a Senior Director of Home & IOT Connectivity Segment at GlobalFoundries. She focuses on the wireless connectivity and tracking segments enabling the next generation home and consumer wireless platforms and asset tracking/management.  

GlobalFoundries (GF) has a long history of corporate responsibility and operational excellence. These high standards help us stay true to our company values and deliver for our customers. Our commitment is exemplified through GF’s membership in the Responsible Business Alliance (RBA) and our participation in the RBA’s Validated Assessment Program (VAP) audits. These comprehensive audits are critical for demonstrating that GF adheres to the highest standards of social, environmental and ethical practices. 

Every corner of the company 

RBA VAP audits look at nearly 100 unique requirements, from safety and human resource policies to governance and sustainability. To remain conformant, companies must undergo an audit every two to three years. The RBA began in 2004 as the “Electronics Industry Code of Conduct,” a collaborative effort among leading electronic companies to promote social, environmental and ethical responsibility. Today, it has evolved into the world’s largest industry coalition dedicated to responsible business practices across the globe.  

“The idea is to have a single standard that everyone can operate to, which simplifies compliance and ensures consistency across the industry,” said Brian Raley, Director of corporate sustainability at GF. “There’s a lot of value in having a standardized set of code requirements that everybody can agree to and align to. There’s power in this standardization, both to require it in your supply chain, and to be a strong partner to your customers and be able to say, ‘yes, we are aligned to the standardized code.’” 

Participating in the standardized RBA VAP audits streamlines our compliance efforts, enabling GF to meet the highest standards efficiently and consistently. It minimizes the need for overlapping audits from various agencies and customers, saving valuable time and resources while reinforcing our commitment to excellence, Raley said. 

The RBA VAP audits are conducted by independent, third-party firms approved by the RBA. These audits involve a thorough review of documents, interviews with management and employees, and a visual site survey. The goal is not just to identify issues but to correct them, ensuring continuous improvement and adherence to the RBA standards  

A day in the life of an RBA VAP audit 

While RBA standards conforming business practices are ongoing, preparation for an on-site audit begins months in advance and requires input and information across a wide matrix of teams and roles. The days of the audit are long and intensive. 

“Human resources, ethics and compliance, and Environment, health and safety are key stakeholders in the audit process,” said Ruma Kohli, principal member of technical staff on GF’s sustainability team. “We start preparing months in advance, holding weekly meetings to strategize and identify any gaps. It’s a lot of work, but collaboration and communication are key to our success.” 

Silke Hermanns, principal member of technical staff on GF’s sustainability team based in Germany, said GF’s supply chain is a major component of the RBA VAP audits. “We check suppliers that contribute around 80% of our primary commodity supplier spend for RBA code conformity. This involves a detailed review of their practices and ensuring they align with our standards,” she said.  

“The auditing of smaller on-site service providers, which can be more challenging due to their size and the nature of their work, is another important aspect,” Hermanns said. 

Global footprint 

Performing well in RBA audits is no small feat, particularly for a company like GF with a global footprint and manufacturing facilities in the U.S., Germany and Singapore. Each location presents unique audit complexities, which factor in everything from language translation to varying local regulations. Despite these challenges, GF continues to deliver world-class results. In three out of four of our most recent RBA Validated Assessment Program (VAP) audits, GF achieved Platinum level perfect scores—200 out of 200. Over the last three years, we exceeded our goal to achieve a combined annual score average of at least 180/200. Across all four most recent RBA VAP audits, we achieved full conformance across the sections: Health and Safety, and Environment, Ethics, and Supply Chain Management, and just one excursion for Labor, that is currently being remediated. These scores reflect our unwavering dedication to operating responsibly, ethically and sustainably at every site across the globe.  

Team effort and preparation 

“RBA VAP audits are a full team effort,” said Sam Sherman, Director of EHS for GF in Singapore. The GF team prepares internal audits, he said, in preparation for external third-party audits. 

“We have an audit-ready culture,” Sherman said. “We organize all the necessary documents and evidence related to the code, making it easy for auditors to review. It’s a collective effort across a huge number of various departments.” 

Another benefit from both internal and external audits are the opportunities for continuous improvement, as feedback from auditors helps GF enhance its practices and programs. 

“Passing the RBA audit with no findings validates our systems and ensures we are implementing programs correctly. It’s not just a box-checking exercise; these audits provide meaningful KPIs that we strive to meet,” Sherman said. 

Celebrating success 

At GF, RBA VAP audits are more than just a compliance requirement, they are a testament to our commitment to corporate responsibility, Raley said.   

“By adhering to the RBA standards, we ensure that our practices are ethical, sustainable, and socially responsible,” he said. “The RBA audits help us maintain high standards and provide third-party validation of our systems. It’s a crucial part of our commitment to excellence.” 

Read more about corporate responsibility at GF at: https://gf.com/about-us/corporate-responsibility/ 

Dr. Anirban Bandyopadhyay, Senior Director & Head of the Medical IoT End Market at GlobalFoundries 

Healthcare is no longer confined to doctor’s offices or hospitals – its boundaries are being pushed to what can be done in the comfort of your own home through technology. In fact, as healthcare and technology become increasingly inseparable, it’s advancing patient care and transforming how we think of it. From continuous glucose monitors (CGM) to AI-enabled ultrasounds, innovations in healthcare are unlocking possibilities once thought impossible. The rise of ultra-portable, data-rich medical devices is changing how we detect, diagnose and manage health conditions. And it’s doing it before a patient ever steps into a clinic. 

What is powering this shift? Semiconductors — more specifically, our essential chips.  

To understand the role GlobalFoundries plays in enabling these medical and health IoT breakthroughs, we spoke with Dr. Anirban Bandyopadhyay, PhD, IEEE Fellow and Senior Director & Head of the Medical IoT End Market. In our conversation, Anirban shares what’s driving the shift, where the biggest opportunities lie and why this space is both a technical frontier and a deeply personal mission. 

Tell us about the intersection of semiconductors and healthcare. Where do you see it evolving in the next few years? 

We’re at an inflection point in the medtech industry. The medical segment is broadly divided into pharmacology (drugs) and medtech (devices). Here, I’m talking about the latter where we’ve seen a dramatic shift in the last two to three years toward ultra-portable devices. 

There are a few reasons for this: Healthcare is expensive, it’s time-consuming to access, and the medical stakes only rise as conditions progress. But if we can catch issues earlier (through monitoring, tracking and diagnostics), we can not only improve outcomes but also reduce long-term costs. That’s where point-of-care devices come in. 

Point-of-care means treatment or diagnostics happen at the site of the patient, whether that’s in a clinic or at home. These devices handle everything from monitoring and diagnosis to therapeutics. For example, think about wearable devices like continuous glucose monitors. As a benchmark, last year, 300 million were sold. That’s unheard of in the medical space. 

Semiconductors make this possible. To create a device that’s small, low-power and high-performing, you need advanced semiconductor technology. Miniaturization, power efficiency and onboard processing are only possible with custom chips; that’s where GlobalFoundries comes in. This is now more important than ever as the MedTech industry, who once depended on off-the-shelf chips that could be reused for various applications and fields beyond medical, has switched to using custom chips, known as application specific integrated circuits (ASICS), to meet the performance/power needs of their end products, allowing our customers to create truly differentiated solutions suited to their unique applications. 

Bring us back to the very beginning. How did you get involved in this space, and what drew GF towards it? 

There are two answers. From GF’s side, we started to see that customers were already using our chips in medical applications — sometimes without us even knowing. That was when we realized we had a unique value proposition: Our technologies could enable power-efficient, high-performance and highly reliable devices.  

So, we made a conscious decision to lean in as we saw advancing digital healthcare not just as an opportunity, but as a social responsibility aligned with our mission. 

As for me, I’ve spent most of my career in connectivity, and the industry knows me for that work. But at home, my wife is a microbiologist, and my daughter is entering medicine. Talking to them, I realized I didn’t always understand their world, but I wanted to. It made me think deeply about how semiconductors could power the breakthroughs they’re working toward. That personal connection inspired my pivot into medical IoT. 

What market or patient trends are driving demand for miniaturized, AI-capable medical devices? 

One of the biggest drivers is early detection. Right now, if you go to your doctor and reference data from your smartwatch or health ring, they won’t use it to inform the diagnosis they’ll make. But that’s changing. Even if a device isn’t 100% accurate, it can flag early indicators to prompt faster diagnostics and that can save lives. 

Consumers want to understand how their bodies respond to food, stress or sleep. Devices like CGMs, smartwatches and wearables are increasingly capable of giving those insights. Some are FDA-approved; others aren’t, but they still serve as early warning systems. 

So, that’s where we’re headed: an era where your body is continuously monitored, and you’re empowered with real-time information on your own health. 

So, what benefits are GF’s platforms bringing to medical and health IoT devices? 

Medical device manufacturers are looking for four things: miniaturization, power efficiency, excellent signal-to-noise ratio and extreme reliability. 

Take our 22FDX® platform for example. It offers industry-leading ultra-low power performance, exceptional receiver sensitivity and a low-noise amplifier. Most medical devices today still use essential nodes (130nm, 90nm, 65nm), but we’re also seeing a shift. As requirements evolve, more customers are moving to 22FDX® to meet next-gen performance and form factor needs. 

On top of that, GF has a proven track record of supporting long-lifecycle products — critical to the medical field. Our experience in aerospace and automotive, where support over decades is non-negotiable, makes us an ideal foundry for this market. 

Are there any specific medical applications you’re particularly excited about? 

Two areas stand out: imaging and diagnostic sequencing. 

Traditionally, when we think of imaging, we picture big machines like CT scanners. But we’re evolving. Handheld ultrasound devices that connect to smartphones are already here, and they’re a real game changer — especially in areas with limited access to care. With minimal training, someone can capture an image and get AI-assisted diagnostics. 

The second is diagnostic sequencing – DNA and protein sequencing to be precise. Why send raw data to a massive server farm for processing when you could do it locally with a system-on-chip? Putting a semiconductor chip directly under the sequencer allows real-time analysis and immediate action. Now, that’s revolutionary. 

GF recently announced its advanced packaging center. How does that fit into the picture? 

Miniaturization doesn’t stop at node scaling. Chiplet architectures and advanced packaging, like vertically stacked chips, allow us to reduce form factors even further. We’re already working with customers on stacked chip designs at both the wafer and die level. 

What sets us apart is how we handle power dissipation in these stacked designs. That’s one of the biggest challenges, and we believe we have a more efficient approach than most competitors. That’s a big differentiator in the medical space, where power and heat management are crucial. 

Final thoughts — what’s really important but often forgotten when it comes to the industry?  

One thing people often overlook is the lifecycle support required for medical devices. These aren’t short-term products. You need a foundry that can support a device for a decade or longer. GF has that scale and that mindset. We’ve done it for aerospace; we’ve done it for automotive, and we’re ready to do it for medical. 

That long-term commitment matters. Because at the end of the day, it’s not just about performance or cost; it’s about trust.  

Dr. Anirban Bandyopadhyay, PhD, is the Senior Director and Head of the Medical/Healthcare segment within GlobalFoundries. Dr. Bandyopadhyay is also an IEEE Fellow and a Distinguished Lecturer of IEEE Electron Devices Society and represents GF in different industry consortia and alliances. Prior to his current role, he held leadership responsibilities within GF, IBM Microelectronics and Intel in areas such as RF Design Enablement, Silicon Photonics, signal integrity in RF and Mixed signal SOC’s and RF technology evaluations for wireless connectivity within different end devices.

The world is becoming increasingly connected, driven by the exponential growth of data and the rise of transformative technologies like AI. This connectivity revolution is placing unprecedented demands on RF technologies, from the need for seamless cloud-edge data links to the continued evolution of 5G, 6G and beyond.  

GF’s comprehensive RF portfolio, including our industry-leading RFSOI, SiGe, 22FDX+ and RF GaN platforms, is purpose-built to push the boundaries of what’s possible in connectivity, but we’re not doing it alone. Together with innovative partners like Falcomm, we’re moving the industry forward, providing our customers with cutting-edge solutions to enhance performance, power and integration and create connected technologies with higher signal quality, better efficiency and longer battery life.  

As the RF world prepares to gather in San Francisco for IMS 2025, GF and Falcomm are excited to share the latest milestones from our partnership that is shaping the future of RF technology. 

About Falcomm  

Headquartered in Atlanta, Georgia, Falcomm, a member of the GlobalFoundries (GF) GlobalSolutions™ Ecosystem, is an emerging leader in the design and development of high-efficiency RF and millimeter-wave integrated circuits. Founded by Dr. Edgar Garay out of pioneering research at Georgia Tech, the company is scaling rapidly, driven by demand across defense, aerospace, and commercial wireless markets. Falcomm’s team includes some of the industry’s best RFIC designers, with core expertise in RF power amplifier (PA) and front-end module design. 

At the heart of Falcomm’s innovation is its patented Dual-Drive™ power amplifier technology. This process- and frequency-agnostic circuit architecture delivers breakthrough performance in power-added efficiency (PAE), output power, linearity, and bandwidth. The technology has now been successfully implemented across multiple GF platforms including 22FDX®, 130NSX, 45RFSOI, demonstrating impressive results in diverse applications. Most recently, Falcomm is implementing Dual-Drive™ architecture on GF’s 130RF GaN process, with the goal of delivering the world’s most efficient and linear GaN power amplifiers to date.  

Falcomm is proudly U.S.-based, and all products are fully designed and manufactured domestically, including products manufactured by GF through their trusted facilities in New York and Vermont. This ensures not only performance excellence but also supply chain resilience for critical infrastructure and defense applications. 

Now, let’s take a look at some of the exciting technologies that we will be showcasing at IMS this year. 

FCM1401 on GF 130NSX Ku-band PA  

Available for evaluation and licensing to qualified partners 

Falcomm has completed timely validation of its FCM1401 product, a high-efficiency Ku-band power amplifier fabricated using GF’s 130NSX bulk CMOS process. This PA delivers a compelling combination of performance, integration, and cost scalability. Performance highlights include: 

• Frequency: 12.5GHz – 16GHz 

• PAE: 50 % 

• Output Power: 20 dBm 

• Gain: 23 dB 

This product is being used in tactical and commercial Ku-band applications where efficiency, cost and performance are critical. The FCM1401 and FCM1401 evaluation boards are currently available for purchase at Falcomm.com and IP licensing agreements through GF IP Portal.  

FCM2801 & FCM3901 – 28 GHz / 39 GHz Power Amplifiers on GlobalFoundries 45RFSOI for 5G mmWave 

Available for evaluation and licensing to qualified partners 

Falcomm has launched two high-efficiency mmWave power amplifiers: FCM2801 (28 GHz) and FCM3901 (39 GHz), built on GlobalFoundries’ 45RFSOI platform and optimized for 5G New Radio (NR) FR2 applications. These solutions are designed to maximize silicon-area/power efficiency, linearity, thermal performance, and output power, making them ideal for ground-based radios, mobile devices, infrastructure, phased arrays, and broadband front ends. 

The GF 45RFSOI process enables high power density and efficient heat dissipation without large die size or complex thermal strategies, supporting cost-effective and compact system designs. Both products leverage Falcomm’s patented Dual-Drive™ PA architecture to support advanced SWaP-constrained platforms. 

39GHz 5G PA in GF 22FDX+ and enhanced 28GHz high-power PA in GF 45RFSOI for 5G mmWave 

Available for evaluation and licensing in Q4 2025 

Falcomm is expanding its mmWave product line with two advanced 5G power amplifiers: a new 39 GHz PA built on GF 22FDX+ platform and an enhanced high-power 28 GHz PA on GF 45RFSOI. These solutions are engineered for exceptional power efficiency, linearity, and thermal performance—ideal for 5G NR FR2 applications across infrastructure, phased arrays, and compact, power-constrained platforms. 

The 22FDX+ version of the 39 GHz PA delivers outstanding integration potential with digital and mixed-signal blocks, making it an ideal candidate for advanced beamforming ICs and phased array modules. The updated 28 GHz PA on 45RFSOI achieves higher output power and improved thermal handling, while maintaining Falcomm’s signature Dual-Drive™ efficiency and compact footprint. 

Join Us at IMS 2025  

Falcomm will be showcasing its latest technologies alongside GlobalFoundries at IMS 2025. We invite attendees, partners, and customers to visit Falcomm at Booth 4103 and GF at Booth 149 to explore how your products can benefit from Falcomm’s patented Dual-Drive™ power amplifier architecture and GF’s storied RF-leadership and manufacturing excellence. Join us to discover how we’re pushing the boundaries of RF performance with unmatched efficiency, linearity, and integration! 

For more information or to schedule a meeting at IMS, contact us at [email protected]