GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth June 4, 2025 Backed by leading tech giants, the investment reinforces domestic semiconductor production and U.S.-based innovation in AI-enabling and power efficient technologies MALTA, N.Y., June 4, 2025 – GlobalFoundries (Nasdaq: GFS) (GF), working with the Trump Administration and with support from leading technology companies aiming to onshore critical components of their supply chain, today announced plans to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities across its facilities in New York and Vermont. GF’s investment is a strategic response to the explosive growth in artificial intelligence, which is accelerating demand for next-generation semiconductors designed for power efficiency and high-bandwidth performance across datacenters, communications infrastructure and AI-enabled devices. GF is collaborating with major technology companies such as Apple, SpaceX, AMD, Qualcomm Technologies, Inc., NXP and GM, that are committed to reshoring semiconductor production to the U.S. and diversifying their global supply chains. These companies partner with GF to support their production of U.S.-made chips, underscoring GF’s role as a trusted supplier of essential semiconductors and a key enabler of supply chain security. “At GlobalFoundries, we are proud to partner with pioneering technology leaders to manufacture their chips in the United States—advancing innovation while strengthening economic and supply chain resiliency,” said Tim Breen, CEO of GlobalFoundries. “The AI revolution is driving strong, durable demand for GF’s technologies that enable tomorrow’s datacenters – including GF’s leading silicon photonics, as well as GaN for power applications. Meanwhile at the edge, GF’s proprietary FDX technology is uniquely positioned to support AI functionality with low power consumption. With all these technologies and more manufactured right here in the U.S., GF is proud to play its part in accelerating America’s semiconductor leadership.” “GlobalFoundries investment is a great example of the return of United States manufacturing for critical semiconductors,” said U.S. Secretary of Commerce, Howard Lutnick. “President Trump has made it a fundamental objective to bring semiconductor manufacturing home to America. Our partnership with GlobalFoundries will secure U.S. semiconductor foundry capacity and technology capabilities for future generations.” The rapid rise of AI in both the cloud and at the edge is driving the adoption of new technology platforms and 3D heterogeneous integration technologies. These advanced solutions are essential to meet the exponentially growing requirements for power efficiency, bandwidth density and performance. GF is uniquely positioned to lead in this space, with its 22FDX® and silicon photonics capabilities in production in New York and advanced development of differentiated GaN-based power solutions in Vermont. GF’s investment builds upon the company’s existing U.S. expansion plans, including more than $13 billion to expand and modernize its New York and Vermont facilities and funding for its recently launched New York Advanced Packaging and Photonics Center—the first U.S.-based facility of its kind dedicated to silicon photonics packaging. GF is committing an additional $3 billion, which includes advanced research and development initiatives focused on packaging innovation, silicon photonics and next-generation GaN technologies. In aggregate, these investments represent a $16 billion plan to strengthen U.S. semiconductor leadership and accelerate innovation in AI, aerospace, automotive and high-performance communications. “Today’s announcement is a direct result of President Trump’s leadership and his vision to bring back high-paying manufacturing jobs and reestablish secure, domestic supply chains for critical technologies,” said Dr. Thomas Caulfield, Executive Chairman of GlobalFoundries. “We look forward to continuing to work with the U.S. government to help create the conditions for industry and government to work together and drive meaningful, long-term impact.” “GlobalFoundries has supplied semiconductors for Apple products since 2010 and we’re excited to see them expand right here in the United States. These chips are an essential part of Apple products like iPhone, and they’re a powerful example of American manufacturing leadership.” Tim Cook, Apple’s CEO “Advanced semiconductors are critical to the advanced satellite capabilities which SpaceX has been pioneering for over two decades. We are excited by the expansion of GlobalFoundries’ manufacturing base right here in the U.S., which is core to Starlink’s growth and our commitment to manufacturing in the U.S., as well as our mission to deliver high-speed internet access to millions of people around the world.” Gwynne Shotwell, president and COO at SpaceX “As a valued technology partner, we’re pleased to see GlobalFoundries deepen its commitment to U.S. manufacturing. These efforts are critical to building a secure and resilient semiconductor supply chain in the U.S. to support the next wave of innovation in our industry.” Dr. Lisa Su, AMD Chair and CEO “As a strategic supplier of Qualcomm, GlobalFoundries shares our vision for strengthening U.S. chip production capacity. This commitment from GlobalFoundries will help secure a resilient semiconductor supply chain to support the next wave of U.S. technology innovation, especially in areas vital to enabling power efficient computing, connectivity, and edge intelligence.” Cristiano Amon, president and CEO of Qualcomm Incorporated “Deepening our partnership with GlobalFoundries aligns with NXP’s hybrid manufacturing strategy, where we work with leading foundry partners to better serve our customers’ strategic technology, capacity and resilience needs. This collaboration allows us to scale efficiently, expand production in the U.S. and continue delivering for our customers. It’s a strong step forward in building a resilient, high-performing semiconductor supply chain in the United States.” Kurt Sievers, chief executive officer of NXP Semiconductors “Semiconductors are critical to the future of vehicles, and their importance will only grow. GlobalFoundries’ investment supports our work to secure a reliable, U.S.-based chip supply—essential for delivering the safety, infotainment and features our customers expect.” Mark Reuss, president of General Motors About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity and sustainability. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-looking Information This press release includes “forward-looking statements” that reflect our current expectations and views of future events. These forward-looking statements are made under the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995 and include but are not limited to, statements regarding our financial outlook, future guidance, product development, business strategy and plans, and market trends, opportunities and positioning. 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For example, our business could be impacted by geopolitical conditions such as the ongoing political and trade tensions with China; the market for our products may develop or recover more slowly than expected or than it has in the past; our operating results may fluctuate more than expected; there may be significant fluctuations in our results of operations and cash flows related to our revenue recognition or otherwise; a network or data security incident that allows unauthorized access to our network or data or our customers’ data could result in a system disruption, loss of data or damage our reputation; we could experience interruptions or performance problems associated with our technology, including a service outage; global economic conditions could deteriorate; and our expected results and planned expansions and operations may not proceed as planned if funding we expect to receive is delayed or withheld for any reason. It is not possible for us to predict all risks, nor can we assess the impact of all factors on our business or the extent to which any factor, or combination of factors, may cause actual results or outcomes to differ materially from those contained in any forward-looking statements we may make. Moreover, we operate in a competitive and rapidly changing market, and new risks may emerge from time to time. These statements are based on our historical performance and on our current plans, estimates and projections in light of information currently available to us, and therefore you should not place undue reliance on them. Although we believe that the expectations reflected in our statements are reasonable, we cannot guarantee that the future results, levels of activity, performance or events and circumstances described in the forward-looking statements will be achieved or occur. Moreover, neither we, nor any other person, assumes responsibility for the accuracy and completeness of these statements. Except to the extent required by federal securities laws, we undertake no obligation to update any information or any forward-looking statements as a result of new information, subsequent events or any other circumstances after the date hereof, or to reflect the occurrence of unanticipated events. Investors are urged to review in detail the risks and uncertainties discussed in our 2024 Annual Report on Form 20-F, current reports on Form 6-K and other reports filed with the Securities and Exchange Commission. Media Contact:Erica McGille[email protected]
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Inside A Car’s Digital Brain: MCUs, the Engine Powering SDV Innovation May 22, 2025 Wael Fakhreldin, End-Market Director of Automotive Processing at GlobalFoundries Software-defined vehicles (SDVs) have taken center stage as part of the automotive industry’s digital revolution. Think of SDVs as smartphones on wheels. And at the center of it all – but not so visible – are microcontroller units (MCUs) — the “digital brains” of today’s cars. These tiny but powerful chips, ranging from the size of a fingernail to a grain of rice, control everything from essential systems like brakes, to ambient lighting. So, to break it all down, we turned to Wael Fakhreldin, GF’s Director of Automotive Processing, about the trends shaping the next generation of vehicle architectures, the evolving demands on MCUs, and how GlobalFoundries is co-innovating with its automotive customers to push the boundaries of what’s possible. Let’s start big picture — what are some of the biggest automotive challenges you’re seeing that are pushing the need for new architecture? Consumers want their in-vehicle experience to be as seamless as using the smartphone in their hands, and automakers are on a mission to make driving as safe as possible. But, what does that mean? In traditional vehicle architectures, each new feature would require its own hardware, creating significant complexities and costs for OEMs to integrate multiple different control units. The push for smarter and more connected vehicles demands new architecture, empowering drivers to access new features instantly, without the need for costly hardware upgrades. Now, these pressures have spurred the acceleration toward SDVs that can rapidly deliver new features to keep pace with consumer expectations and market demand for new functionalities, without requiring physical updates. This approach relies on versatile, scalable high-performance compute platforms, enabling seamless over-the-air updates. They are key to overcoming these challenges. What do you see as the most promising vehicle architectures today, and how do you think they’ll evolve over the next few years? SDV zonal architecture is raising the standard for efficiency and performance, and it’s doing so in multiple ways. For instance, it is: 1) consolidating control & processing features based on their physical location in the vehicle, rather than their function and 2) significantly reducing wiring complexity and overall vehicle harness weight. In recent years, cross-domain zonal architectures have gained traction because they align well with the physical layout of modern vehicles. Each zonal controller manages different vehicle domain functions – from body and comfort to chassis control, or gateways – and different zonal controllers are connected via a fast ethernet up to 10Gbps, which acts as the vehicle’s backbone. Central compute architecture is not expected to be broadly adopted until 2030, but adoption is already underway. This approach introduces a high-performance compute cluster, which orchestrates almost all vehicle functions, routing data from various sensors and components through aggregators to a central processing unit. Semiconductor innovations, such as automotive chiplets, will be critical in advancing these architectures, providing the high-performance capabilities required to support the on-demand software updates that consumers now expect. There’s lots of talk about updating SDV architectures to drive more efficiency. What demands are zonal architectures placing on microcontroller units (MCUs) to deliver from a computing standpoint? SDVs are only as smart as the architecture behind them. Simply put, they cannot reach their full potential without Zonal Controller Units. These controllers consolidate vehicle functions by physical cluster, rather than by feature. This shift is putting a big spotlight on MCUs and pushing the boundaries of what MCUs need to deliver — process faster, connect more devices, and support emerging features like AI at the edge. More Compute: MCUs are being pushed to handle far more real-time computing. As chipmakers seek out arrays of different of logic cores, which run at higher operating frequencies. They are moving to more advanced nodes and bringing different digital cores’ virtualization concepts allowing MCUs to manage multiple tasks flexibly and efficiently. Input/Output Overload: Modern vehicles have over 90 smart sensors, 800 sensors and loads, requiring zonal MCUs to have denser digital and analog I/O offerings to handle this level of data processing. Memory That Can Keep Up: Embedded non-volatile memory (eNVM) has to get both bigger and faster. Bigger up to 32MB and more, and faster to support the fast-switching digital cores without adding any latencies or risking bottlenecks. Faster Communication: The volume of data in cars continues to surge, and MCUs need to move that data — fast. Technologies like high-speed Ethernet and Serializer-Deserializer (SerDes) interfaces are becoming standard to guarantee reliable communication between zones and between zones and complex vehicle sensors. GF’s advanced chip technologies like 12LP+ MRAM and 22FDX MRAM are helping chipmakers support the complex processing of today’s cars with fast, power-efficient vehicle controllers. As zonal compute rises, the analog tasks shift to the vehicle’s edges. Now, auto chipmakers are bundling these functions – motor controllers, audio amps, even communication interfaces into single MCUs on GF’s 130BCD or 55BCD technology platforms. Speaking of the edge, AI acceleration in vehicles is skyrocketing. How is AI at the edge reshaping the requirements of automotive MCUs in SDVs? AI at the edge is powering many newer features – battery lifetime extension, in-cabin sensing, voice recognition, intelligent motor control. This approach reduces complexity, costs and power consumption, but it also enhances user privacy by processing information locally, rather than on the cloud. In instances like these where AI acceleration is not happening in central computers or ZCUs, end nodes require embedded AI acceleration to execute these functionalities. With this evolution, some MCUs are adapting by offering specialized IPs primed for AI acceleration: graphics processing units (GPUs) to run complex mathematical models, language processing units (LPUs) for language and communication models, and digital signal processing (DSPs) to transform real-time signals. For more intensive workloads, MCUs are also integrating faster, more reliable interfaces to connect with external memory, ensuring they can process high volume data required for advanced AI applications. Following Aerial Top Down Drone View: Autonomous Self Driving Car Moving Through City Highway, Overtaking Other Cars. Visualization Concept: Sensor Scanning Road Ahead for Vehicles, Speed Limits Safety, security and functionality are non-negotiable. How are MCUs evolving to ensure that SDVs are meeting the highest standards when it comes to these areas? Functional safety is at the core of automotive design, but the transition to SDVs adds a layer of complexity. Modern MCUs play a vital role in maintaining freedom from interference by isolating safety critical systems from non-safety critical functions. This ensures that safety critical systems, like steering systems, brakes, and airbags, have uninterrupted access to computing resources needed without delays. MCUs can also support advanced error detection triggering fail-safe or fail-operational mechanisms with the right corrective actions to keep passengers safe. A safe driving experience also requires cybersecurity. MCUs are responsible for securing over-the-air (OTA) updates, verifying new software images come from trusted sources, and protecting the communication happening between nodes. As more critical safety functions become software-driven, the possibilities of vehicle theft schemes, cyber breaches and unauthorized communications rise. What’s happening behind the scenes with MCUs to enable fast connectivity and low power consumption? Connectivity is the backbone of SDVs, and MCUs are at the root of connecting everything from zonal controllers to ADAS features and the in-cabin experience. The direction toward simplified network architectures, like IP-to-the-Edge, reduces wire complexity and eliminates the need for multiple gateways, sending data directly from sensors to MCUs with low latency. To support this, MCUs are adopting technologies like Ethernet, which can transfer data at speeds up to 10 Gbps, and 10BaseT1s with multi-drop technology delivering advantages in reducing system costs and system power consumption. And who doesn’t want lower power consumption and more range on electric vehicles? MCUs are engines powering this future of power-efficient vehicles. Advanced platforms like our 22FDX+ offer minimal power leakage, leading the charge forward to a future of higher performance, lower power vehicles. Finally, how is GlobalFoundries enabling the next generation of automotive MCUs to support the shift to software-defined vehicles? GF offers scalability with automotive-qualified platforms to serve diverse SDV needs ranging from compute-heavy analog-heavy or analog-light zonal MCUs to compute-light analog-heavy last mile MCUs. Each GF platform offers a broad portfolio of automotive qualified IPs relevant to its performance class and supported applications. Resilience is a key part of the equation for success, especially given the long and complex path that comes with qualifying MCU alternatives. That’s why we’ve built a global team and manufacturing footprint, ensuring our customers have reliable access to cutting-edge MCU technologies. This approach empowers us to support the world’s leading automotive manufacturers as they embrace the next chapter of software-defined vehicle architecture. Wael Fakhreldin is a director of automotive processing at GlobalFoundries. He focuses on automotive microcontrollers, microprocessors, AI accelerators and chiplets enabling next generation vehicle electronic architectures.
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Steering the future: advanced satellite communications phased arrays with GF 45RFSOI, 45RFE and 130NSX May 20, 2025 By Alex Margomenos Director, RF Product Management at GlobalFoundries Providing broadband and cellular connectivity from space has become feasible due to advancements in rocket engineering, satellite technology, and RF semiconductors. Through these advancements and innovations, we are now able to build sufficient satellite constellations and offer affordable ground terminals to support seamless global communications networks with reliable connectivity. When designing a SATCOM ground terminal, the goal is to receive the signal from space at a quality that allows the demodulation of the received data. This specification is quantified by the signal-to-noise ratio (SNR), which is influenced by the power and bandwidth of the transmitted signal from the satellite, the altitude of its orbit, and the receiver gain over noise temperature (G/T). Among these factors, the G/T ratio is the only parameter that can be controlled by the ground terminal designer. In this context, the gain (G) in the numerator is determined by the area of the phased array, which correlates to the number of phased array elements. The noise temperature (T) in the denominator is determined by the noise figure (NF) of the low noise amplifiers (LNA). By decreasing the NF of the LNA, a designer can reduce the gain of the phased array while maintaining the same SNR (keeping G/T constant). Consequently, lowering the NF directly decreases the required number of phased array elements. Each 0.1 dB improvement in NF results in a 5% reduction in the number of phased array elements. Fewer antenna elements require fewer chips, emphasizing the significant impact of selecting the appropriate technology with the suitable NF on the overall cost of a ground terminal. GlobalFoundries provides three, US-manufactured RF process technologies for SATCOM front-ends and beamformers, ranked by digital density: 45RFSOI, 45RFE, and 130NSX. 45RFSOI is a partially depleted RF SOI technology developed for mmWave phased arrays with 40nm logic. The platform offers matched, high performance nFET/pFET regular Vt (RVT) devices (ft/fmax of 290/330GHz and 245/300GHz respectively) and an advanced nFET (ADNFET) with ft/fmax of 230/400GHz and a 20% increase in maximum voltage compared to RVT devices [Jain 2021]. It comes with a full suite of passive devices (capacitors, resistors, diodes, ESD, eFuse) as well as SRAM. Finally, it provides three back end of the line metal stacks and supports dual thick Cu and thick Al for very high Q inductors. During the last decade, our customers, university partners, and internal reference designers have published over 300 papers on 45RFSOI circuits. Some recent examples include Ka-, Q- and D- band beamformers [Baek 2025, Ren 2024, Ahmed 2024, Khalil 2021], 1.3dB NF Ku-band LNA [Kanar 2023], 27dBm/44% PAE Ku-band PA [Alluri 2024], 19dBm/48% PAE Ka-band PA [Syed 2020], 20dBm/38% PAE Doherty Ka-band PA [Ibrahim 2025], and a high linearity Ku-band mixer [Hassan 2025]. 45RFE is a partially depleted RF SOI on a high resistivity substrate, offering two gate dielectrics for optimal RF performance, high voltage support, and low leakage. It includes three types of nFETs: RVT, ADNFET, and DGADNFET, with increasing voltage handling capabilities. The platform supports passive devices such as resistors, capacitors, diodes, ESD, and eFuse. An 8-metal layer stack with 2 thick copper layers enables high Q-passives. GF announced this technology in 2024 [Jain 2024], highlighting 1.3dB LNA and 21dBm/44% PAE PA at Ka band. 130NSX is a bulk CMOS technology on high resistivity substrate. It offers thin oxide devices for LNA applications that have demonstrated excellent performance at Ku/Ka frequency bands. It includes thick oxide digital logic, passives (capacitors, resistors, ESD, eFuse) and different back end of the line metal stacks with thick copper and aluminum that enable high Q inductors. GF’s reference design team has published a series of circuit examples showcasing the excellent performance of 130NSX for SATCOM applications. These include a 0.95dB NF LNA at Ku band [Das 2024], a 1.2dB NF LNA at Ka band [Kakara 2024], and a 16dBm / 50% PAE PA at Ku band [Bantupalli 2024]. If you would like to learn more about GF’s differentiated RF and ultra-low power CMOS portfolio for SATCOM applications, we invite you to visit our booth (#149) at the upcoming 2025 International Microwave Symposium (IMS), happening June 17-19 in San Francisco, CA. We look forward to connecting with you and discussing how GF can support your next-gen innovations. Alex Margomenos oversees the product management of the RF Product Line at GlobalFoundries. The RF Product Line encompasses RFSOI, RF GaN, and SiGe technologies, which support cellular RF front-ends, satellite communications, aerospace and defense, and cellular infrastructure. He has been with GlobalFoundries for four years. Previously, he held managerial and individual contributor positions at Apple, Intel, Infineon, and HRL Laboratories.
GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation May 19, 2025 The collaboration will provide GF with access to A*STAR’s state-of-the-art R&D facilities, capabilities and technical support for technology development and workforce skills enhancement in advanced packaging SINGAPORE, 20 MAY 2025 – GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency. Advanced packaging has become a key R&D priority for the semiconductor industry amid growing demand for artificial intelligence (AI) and other data-intensive applications ranging from high performance data computing and datacenters to 5G / 6G communication and more. To meet these needs, acceleration in advanced packaging technologies will be key to delivering the compact, high-performance and energy-efficient technology solutions needed to drive the industry’s long-term growth. Under the MOU framework, A*STAR will provide GF with access to its R&D facilities, capabilities and technical support, while GF will provide critical equipment to A*STAR to further its R&D efforts. The collaboration will accelerate GF’s plan to develop and ramp its advanced packaging solutions and expand its offerings to provide customers one-stop solutions for semiconductor chips to be manufactured, processed, packaged and tested at GF’s Singapore manufacturing facility. “With a robust semiconductor ecosystem and strong R&D support from the government and institutions like A*STAR, Singapore is an ideal location for us to develop and scale our essential innovations at the foundry level,” said Gregg Bartlett, GF’s Chief Technology Officer. “This aligns to our global advanced packaging roadmap and reinforces our commitment to deliver more energy-efficient essential chips that are crucial for our customers, especially in the AI era.” This collaboration will see skills enhancement initiatives implemented for GF employees, where they can develop new expertise in the area of advanced packaging. It reflects both A*STAR’s and GF’s shared dedication to nurturing the next generation of high technology talent, as well as the continuous upskilling and retraining of talent in tandem with the industry’s evolving needs. “As Singapore strengthens its position as a critical node in the global semiconductor supply chain, continued R&D collaboration between public research and the industry is essential to drive innovation and maintain our competitive edge. A*STAR looks forward to working closely with GlobalFoundries to accelerate innovation and talent development in advanced packaging technologies and become leaders in this domain,” said Terence Gan, Executive Director at A*STAR Institute of Microelectronics (A*STAR IME). “Our partnership with A*STAR marks yet another milestone for GF in Singapore, as we continue to play our part in growing local capabilities and talent,” said Tan Yew Kong, Senior Vice President and General Manager of GlobalFoundries Singapore. “With growing demand for AI applications, we’re excited to tap into A*STAR’s expertise and infrastructure to fast-track the deployment of new advanced packaging offerings, and most importantly, upskill our workforce. Our joint efforts in R&D and talent development will ultimately spur the continued growth of Singapore’s semiconductor ecosystem as we work towards Singapore’s Manufacturing 2030 vision.” The MOU with A*STAR follows an earlier announcement by GF in January this year, where the company announced plans to create a new Advanced Packaging and Photonics Center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Together, these developments mark significant progress on GF’s strategic roadmap to enhance and scale its advanced packaging offerings in response to customer demand across the regions. ### About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented and diverse team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit www.gf.com. About the Agency for Science, Technology and Research (A*STAR) The Agency for Science, Technology and Research (A*STAR) is Singapore’s lead public sector R&D agency. Through open innovation, we collaborate with our partners in both the public and private sectors to benefit the economy and society. As a Science and Technology Organisation, A*STAR bridges the gap between academia and industry. Our research creates economic growth and jobs for Singapore, and enhances lives by improving societal outcomes in healthcare, urban living, and sustainability. A*STAR plays a key role in nurturing scientific talent and leaders for the wider research community and industry. A*STAR’s R&D activities span biomedical sciences to physical sciences and engineering, with research entities primarily located in Biopolis and Fusionopolis. For ongoing news, visit www.a-star.edu.sg. Follow us on Facebook | LinkedIn | Instagram | YouTube | TikTok Media Contact The Hoffman Agency on behalf of GlobalFoundriesSingapore [email protected]
Right Before our Eyes: GF Driving Innovations in Display Technology May 13, 2025 by Ruby Yan IoT End Market Director of Sensing & Display, ID & Security, GlobalFoundries In our fast-paced digital world, display driver technology plays a crucial role in how we interact with devices, from televisions and PC monitors to smartphones and healthcare equipment. As technology continues to advance, the innovations in display and display drivers (DDIC) are transforming our viewing experiences and enhancing the functionality of various applications. For those designing display devices, GF offers a comprehensive long-term roadmap and will be your partner on this journey. We consider display an extremely important market, and whether you’re working in microdisplays or next-generation OLEDs or Mini LEDs, we can help. In this blog, we will explore the latest trends and innovations in display driver technology across different sectors. Television: A New Era of Visual Experience Television technology has advanced significantly, and display drivers are at the heart of this evolution. With the rise of 4K and 8K resolution TVs, display drivers are now capable of handling higher bandwidths to support these ultra-high-definition formats. Innovations such as High Dynamic Range (HDR) and Wide Color Gamut (WCG) require advanced display drivers that can process and render richer colors and deeper contrasts, providing viewers with a more immersive experience. Moreover, the integration of smart technology in TVs has led to the development of display drivers that support advanced features like variable refresh rates and low latency modes, enhancing gaming experiences and streaming quality. As we move towards OLED and MicroLED technologies, display drivers will continue to evolve with enhanced driving architecture including microIC to enable low dimming, ensuring that we can enjoy stunning visuals with minimal power consumption. GF’s 150MCU technology with 5V core and ultra-low mask layer count is the ideal platform to address the microIC needs in both performance and cost competitiveness. Image Source: Sony PC Monitors: Enhancing Productivity and Gaming In the realm of PC monitors, display driver technology has seen significant advancements aimed at improving productivity and gaming experiences. Modern display drivers now support features like G-Sync and FreeSync, which synchronize the refresh rates of the monitor with the graphics card, reducing screen tearing and providing smoother gameplay. Additionally, the rise of ultrawide and multi-monitor setups has necessitated the development of display drivers that can efficiently manage multiple displays, ensuring seamless transitions and consistent color accuracy across screens. Innovations in display technology, such as Mini-LED and Quantum Dot displays, are also pushing the boundaries of what display drivers can achieve, offering users vibrant colors and enhanced contrast ratios. GF is offering a comprehensive solution to serve the IC needs in this market. From middle size OLED monitors with 55HV, to microLED backplane with 22FDX+uLED, GF is leading the foundry effort to enhance PC monitor displays. Image source: Apple Vision Pro Smartphones: The Power of Portability Smartphones have become an integral part of our daily lives, and display driver technology is key to delivering high-quality visuals on these compact devices. With the advent of high-resolution displays, such as Retina and AMOLED screens, display drivers must efficiently manage power consumption while providing stunning visuals. Recent innovations include adaptive refresh rate technology, which adjusts the screen’s refresh rate based on the content being displayed, optimizing battery life without compromising on performance. Furthermore, advancements in touch technology, such as in-display fingerprint sensors and haptic feedback, rely on sophisticated display drivers to create a seamless user experience. GF’s advanced 22FDX+HV platform is addressing the need for the next generation high performance smartphone display, with integrated an edge AI processor, sensor hubs and wireless connectivity. Healthcare: Revolutionizing Patient Care In the healthcare sector, display driver technology is playing a vital role in improving patient care and diagnostics. Medical imaging devices, such as MRI and CT scanners, rely on high-resolution displays to provide clear and accurate images for diagnosis. Innovations in display drivers ensure that these images are rendered with precision, allowing healthcare professionals to make informed decisions. Moreover, telemedicine has gained traction, especially in recent years, and display drivers are essential for delivering high-quality video consultations. The ability to transmit clear visuals in real-time is crucial for effective remote patient monitoring and consultations, making display driver technology a key component in the future of healthcare. GF’s enhanced 40HV technology with increased voltage to 34V is addressing the high-resolution, high-contrast needs in healthcare display. Image source: AG Neovo What’s next? As we continue to embrace new technologies, display driver innovations will remain at the forefront of enhancing our visual experiences across various industries. From televisions and PC monitors to smartphones and healthcare applications, the advancements in display driver technology are paving the way for richer, more immersive interactions. As we look to the future, we can expect even more exciting developments that will redefine how we see and engage with the world around us. For more information on how GF can help you build your advanced display devices, contact me at [email protected] Ruby Yan is a seasoned Business Line Director at GlobalFoundries, where she oversees the Sensing & Display, ID & Security business line. With more than 13 years of experience in the company, she has held various roles and responsibilities including technology development and product management. Ruby established company initiatives in AR/VR/MR and wearables with comprehensive go-to market strategy and is a Master Inventor in GlobalFoundries, boasting an impressive track record with more than 20 patents granted and over 70 peer-reviewed papers published.
Pradheepa Raman named CHRO of the Year May 8, 2025 GlobalFoundries’ Chief People Officer and team honored for transformative leadership On May 1 at the CHRO of the Year Awards, GF Chief People Officer Pradheepa Raman was recognized for her outstanding efforts in revolutionizing the semiconductor industry. Awarded by HRO Today, the 2025 Leader of Distinction, Large Market award is a testament to the collective dedication and hard work of the entire GF team. Best-in-class benefits Since Raman took the reins at GF two years ago, her team has revolutionized the approach to talent management, focusing on creating a culture that prioritizes the wellbeing of its people. One of the most impactful initiatives has been the Student Loan Repayment Program, a pioneering effort in the semiconductor industry. This program offers U.S.-based employees a tax-free benefit of up to $28,500, helping them alleviate student debt and empowering them to invest in their futures. In less than a year, 237 employees have enrolled, with the program already repaying over $100,000 in loans. Participants have reported newfound financial freedom, allowing them to focus on family planning, home buying, or retirement. The team’s efforts have also led to other exceptional policies and benefits, like 20 weeks of paid parental leave and childcare credit. The holistic approach to employee wellbeing and career development has reshaped GF’s identity as a people-centric organization. Employee engagement through ERGs With Pradheepa’s leadership, GF has recommitted to a culture of inclusivity. Her team’s dedication to inclusivity and employee engagement is evident through GF’s ten Employee Resource Groups (ERGs) and 22 chapters across the globe. Open to all employees, these groups are vital– they build community, boost engagement and ensure everyone feels seen and heard. In fact, 26% of GF employees are members. Notably, GF’s Early Tenure Professionals (ETP) ERG launched in Austin, TX, India, Germany and Singapore over the last two years and provide an instant community for new college and university graduates upon hire. Our inclusive culture is built and sustained by our more than 13,000 global team members. Building a strong talent pipeline Recognizing the importance of a sustainable talent pipeline, GF’s team has spearheaded partnerships with institutions like Hudson Valley Community College, resulting in a $1 million donation to enhance workforce training and apprenticeship programs. Initiatives such as the Global Journey Re-Entry Program and the semiconductor industry’s first U.S. Registered Apprenticeship program have broadened the candidate pool, increased retention and advancement and ensured that employees from diverse backgrounds have opportunities to grow and succeed. Congratulations to Pradheepa and the entire GlobalFoundries team on this well-deserved recognition. Their collective efforts and dedication to fostering a supportive and thriving workplace culture have truly set a new standard in the industry. The award was announced at the 2025 HRO Today Forum, which annually brings together HR leaders, practitioners, technology experts, and innovators who are building the workforces and setting the policies that will be the future of North American and global business.
