You have the vision – see it realized with CMOS technology from GF. GF’s feature-rich CMOS platforms, combined with foundational and complex IP and design enablement, offer mixed-technology solutions on volume production-proven processes. As a result, they are well-suited for a wide variety of applications. Technology features include BCD for power management, high-voltage triple-gate oxide for display drivers and embedded non-volatile memory for micro-controllers. Over 3.5 million 180nm BCDLite® wafers have shipped since 2010 in mobile/charger markets and the industry’s first 55nm BCD process Industry’s first pure 130nm BCD technology with DTI support in automotive Grade 0 Display driver technology platforms (55DDI, 40DDI and 28SLP-HV) in mass production, with over 150K total wafers shipped for DDIC since 2015 Embedded magnetoresistive RAM (eMRAM), embedded resistive RAM (eRRAM) and embedded Flash (eFlash) to address the requirements of broad market segments
