Technologies

Achieve your next application innovation with our market-driven, purpose-built technologies and custom silicon solutions.

Differentiated, essential chip technology

We innovate and partner with customers to deliver high-performance, power-efficient and feature-rich technology solutions for high-growth and emerging markets. Backed by diversified 200mm and 300mm manufacturing and comprehensive design support, we help you achieve your differentiated design goals at scale.

  • Advanced packaging

    Our advanced packaging services for compact, high-performance and energy-efficient systems integrate multiple technologies to enable new AI-driven architectures. 
    Learn more: Advanced packaging
  • CMOS

    Our CMOS solutions optimize power, performance and area through feature-rich, application-specific technologies. Designed for intelligent edge systems and beyond, our CMOS portfolio enables applications across connectivity, processing and sensing systems with strong RF integration and scalable manufacturing.
    Learn more: CMOS
  • Power

    Our power technologies enable efficient energy conversion and advanced power management, supporting power delivery and electrification applications, including automotive, industrial and data center systems, with high power density, efficiency and design flexibility.
    Learn more: Power
  • RF

    Our RF technologies are foundational for high-performance wireless connectivity across aerospace & defense, automotive, smart mobile and wireless infrastructure. With industry-leading platforms and novel materials, our RF portfolio enables communications and radar sensing applications with low-noise, high-linearity and high-power performance.
    Learn more: RF
  • Silicon photonics

    Our silicon photonics technologies deliver high-bandwidth, energy-efficient optical connectivity for modern data centers and AI infrastructure. Supporting pluggables and co-packaged optics (CPO), our advanced silicon photonics platform enables optical interconnect applications through integration of photonics, RF and advanced packaging.
    Learn more: Silicon photonics
  • MIPS, a GlobalFoundries company

    As decisions move closer to where data is generated and actions are taken, a new class of systems is emerging: Physical AI, where sensing, thinking, acting and communicating happen seamlessly in real time for agentic platforms. MIPS, a GlobalFoundries company, delivers the virtual platforms, standards-based compute and ASSP design capabilities for making software into silicon.
    Visit MIPS (opens in a new tab)

GlobalShuttle MPW program

Our GlobalShuttle MPW program is your gateway to accessible innovation, supporting prototyping and early design across all GF process technologies.

Resources at your fingertips

Explore our extensive resource library of solutions briefs, technical webinars and videos to learn more about GF process technologies, design resources and real-world applications in the markets we serve.