GF labs use the latest technologies to see what is nearly invisible

by Gary Dagastine

“Semiconductor manufacturing isn’t rocket science, you know – it’s much harder” is a running joke in many semiconductor fabs. While rocket scientists may disagree, there’s no question that designing and manufacturing today’s essential chips include many incredibly difficult engineering challenges.

After all, we’re talking about small pieces of silicon which may contain millions or billions of transistors. They are made from 40, 60 or more layers of materials with unique electrical characteristics, and with feature sizes approaching the dimensions of DNA molecules – only a few nanometers. The transistors are interconnected in increasingly complicated ways, such that if all the wiring within a fingernail-sized chip were laid end-to-end, it would be measured in meters.

But how can we know what’s actually going on in such a complex system? How can we learn if there are design issues, electrical faults, thermal effects or other surprises that will impact performance? Further, how can we ensure that the manufacturing process is as efficient as possible?

The answers can be found through wide range of characterization techniques in our global analytical laboratories.  GlobalFoundries (GF) boasts some of the leading technical experts in this field, along with one of the industry’s most well-equipped laboratories, outfitted with the latest electron microscopes and other tools needed to inspect and evaluate these tiny and impossibly complex devices.

GF’s very own C.S.I. unit

“We’re the C.S.I. unit at GlobalFoundries,” said Julie Lee, director of the global analytical laboratories at GF’s headquarters and manufacturing facility in Malta, New York. “We collect physical evidence from a chip during the manufacturing process, look at it in exquisite detail to see how its performance can be improved, and recommend to the fab how to accommodate those improvements.”

The lab Lee leads is the company’s newest facility for physical, material, electrical, optical and packaging analysis. It is part of a global analytical laboratories’ organization with branches in the U.S., Singapore and Germany, staffed by more than 250 engineers and technicians with a wide range of expertise who support the fab on a 24/7 basis.

Among other advanced instrumentation, it features state-of-the-art transmission electron microscopes (TEMs), which can magnify objects up to 2 million times. This capability enables visualization at the atomic level so that, for example, the “doping” of silicon (i.e., the impurities added to it to modify its electrical properties) can be seen and evaluated. TEMs also enable the analysis of errors that can’t be seen directly, such as electrical faults.

As semiconductor dimensions have scaled to smaller sizes, the microscopes needed to look at their features have also evolved, and GF’s laboratory contains a mix of optical and electron-based technologies, said Dr. Frieder Baumann, Principal Member of the Technical Staff at GF.

“Optical microscopes used to be the workhorse, but now they are mostly used with photonic devices such as GF’s Fotonix™ platform,” he said “We also have a number of scanning electron microscopes (SEMs), which offer high throughput and a resolution of a few nanometers. We use them to look at specific material layers, such as a chip’s resist layer, and to check for cracks in a chip’s interconnect, or wiring. While SEMs were the workhorse microscopy technology in past years, today their main use here at GF is for inline inspection to keep the manufacturing process flowing smoothly.”

Getting a closer look with TEMs

The latest evolution of microscopy is the TEM, which provides a larger field of view and much greater resolution than SEMs, and also permits users to instantly see on a screen exactly what is going on in the chip sample under study.

“TEMs have evolved from a pure imaging tool into a versatile instrument for comprehensive physical and compositional characterization, in conjunction with new techniques that we use to prepare samples for study,’ Baumann said. “It has become almost unthinkable to conduct modern semiconductor manufacturing without using a focused ion beam (FIB) tool to prepare a sample, and a TEM to understand what is going on inside it.”

The analytical laboratories team in Malta, New York, and other GF sites uses a suite of TEM tools, including both older and newer models, to study several thousand samples per month company-wide around the world.

“It’s amazing to think how far TEM technology has come in such a short time, and how versatile today’s machines are,” Baumann said. For example, automotive is a key market for GF, and a embedded memory is increasingly important for automotive applications because it is nonvolatile and stands up to the harsh real-world environments in which vehicles operate. “Thanks to our advanced TEM capabilities, we are one of only a few within the industry who can fully characterize every single element in the memory cell to determine that it is, in fact, built and operating properly.”    

Life in the Labs

In addition to advanced microscopy, the labs offer a wide range of techniques and are involved in many aspects of manufacturing operations, from incoming chemical analysis through manufacturing processing and customer feedback.  

“Just as GF’s fabs around the globe transfer technology and capabilities to one another to establish multiple sources of production worldwide, our worldwide labs also participate and support technology transfers,” Lee said. “We as a global lab organization are staffed with materials engineers, physicists, mathematicians, and technicians. On a regular basis, we share knowledge and lessons learnt between the global teams across all verticals of physical, chemical and electrical analysis, discussing specific issues, and capitalizing on what we’ve learned to improve GF’s overall manufacturing performance.”  

At the end of the day, Lee said the lab also brings her and her colleagues a great deal of personal satisfaction. “I find it very rewarding to be in an environment focusing on problem-solving and innovation.  It is especially satisfying when solutions are found as well as witnessing the growth of our team members.”

GF-made essential chips are at the forefront of space exploration, providing the capabilities, quality, security, and reliability needed to undertake critical missions in the harsh environment of space 

By Deniz Civay  
Deputy Director, Aerospace and Defense, GlobalFoundries 

Space tourism is a budding industry, and it’s easy to imagine that one day visitors may be welcome aboard an international space hotel. Vacation planning could take on a whole new vertical, catching a rocket to a space hotel that shares an orbit near the International Space Station (ISS). However, the thermosphere – the layer of Earth’s atmosphere where the ISS is located – is not what most of us would consider a vacation destination. 

Temperatures in the thermosphere fluctuate from an unfathomably cold -160°C to an oven like 80°C. A million pieces of marble-sized space debris cruise along at 17,500 mph. Not to mention ionospheric plasma, the vacuum’s complete lack of air, and the constant barrage of radiation. You get the idea: the thermosphere is no place for a picnic. 

An important part of my job at GlobalFoundries (GF) is helping companies that manufacture spacecraft ensure the semiconductors in their systems are able to withstand the harsh environments on Earth, in the thermosphere, and beyond. At a recent conference, I asked a deep space expert about how we could showcase the GF-made chips reliable performance on the ISS, and it prompted a laugh.

“You don’t want to highlight that your chips are on the International Space Station. That environment is nothing,” he said. “GF chips have been to Mars. To the moons of Jupiter. Now those are harsh environments.” 

GF chips are critical to our advancement in space exploration. GF-made semiconductors aren’t just in your phones, smart speakers, and automobiles, they’re also in incredibly sophisticated space systems. Chips made in GF’s Vermont facility are on the James Webb Telescope. Chips made in GF’s Malta, New York, facility are on their way to Mars, past the moons of Jupiter, and will head even further into deep space. 

This is no small feat, as the environment gets harsher and more challenging the further away from Earth you get. Chips in space systems need to be robust, reliable, power efficient, and enable very specific capabilities from taking images, to receiving and transmitting information, to performing other tasks and functions. It is also critical these chips are securely manufactured and perform exactly as intended. 

GF is a manufacturing leader in both these realms: chips that are secure and uncompromised, and can withstand the rigors of space. 

In terms of security, GF’s U.S. facilities, people, and processes are accredited by the Department of Defense to the highest level, Trusted Supplier Category 1A, which implements proven stringent security measures to protect sensitive information and manufacture chips with the highest levels of integrity to ensure they are uncompromised. GF additionally complies with strict export controls necessary to protect the information and chips being manufactured for this important sector.  

To survive in the harsh environment of space, chips must be hardened to withstand the environment. There are two primary ways to harden a chip to ensure it can survive in space; radiation hardening by design (RHBD) and radiation hardening by process (RHBP). RHBD is managed by defense companies who are building the satellite, rocket or other product to be launched into space. They achieve RHBD though redundancy and charge dissipation mitigation, among other techniques and strategies.  

RHBP involves a change to the manufacturing process of a chip to ensure it can survive in space.  RHBD and RHBP are two different methods to achieve the same goal of enabling electronics to function reliably in space. 

It requires no shortage of time, brain power, precision, and care to manufacture chips the size of a postage stamp that can withstand a trip to the ISS, Mars, Jupiter, and beyond. But it never ceases to amaze me both the kinds of innovations that semiconductors enable, and the countless wonders that space science and space technology are uncovering.  

Next time you see the latest breathtaking James Webb Telescope images, or a new scientific observation about Mars or Jupiter, or watch a video of astronauts aboard the ISS, remember that GF-made chips are deep within those systems and make it all possible. 

Dr. Deniz Civay leads the Harsh Environment battleground at GF with the goal of ensuring the most secure onshore advanced technologies for deep space and defense products. She’s deputy director of GF’s aerospace and defense business strategy team. When she started at GF 12 years ago, she worked in R&D inventing novel technologies resulting in 10 patents and many papers. She is PMP certified and holds a Ph.D. in polymer science and engineering from the University of Massachusetts Amherst. 

By Bob O’Donnell

At this point, most people have heard about generative AI and some of the amazing things the technology can do. What most people don’t know, however, is that in some of the more advanced applications of GenAI, organizations are starting to run into challenges that are limiting the performance of large-scale models.

The problem is creating models with hundreds of billions of parameters in them—as is becoming increasingly common—demands moving huge amounts of data into large arrays of interconnected GPUs and data center systems. In order to do that, organizations need the fastest possible data connections between these devices to ensure that latencies and other data delays don’t limit the performance of these extremely expensive systems (both to purchase and to run!)

To start to address this issue, companies like Nvidia have moved away from traditional copper-based Ethernet connections and towards proprietary InfiniBand-based interconnect technologies. These certainly address some of the initial issues that large AI model developers started to notice, but even they have their power and bandwidth limitations.

Looking ahead, several organizations have started to look for optical-based interconnect technologies, such as those powered by silicon photonics. With these types of connections, data literally travels at the speed of light via photons that are sent over thin glass fibers. In truth, silicon photonics has been around in some form or other for over 30 years, but it’s never reached widespread adoption because of the complexity of manufacturing, the lack of standards, and the challenges of working with the technology at foundry scale.

Thanks to new advancements in the fabrication of silicon photonics, such as what semiconductor manufacturer GlobalFoundries has been able to achieve with their GF Fotonix portfolio of products, however, real-world silicon photonics applications have started to come to life. What’s unique to GF’s offerings is the monolithic integration of both the optical and electrical components onto a single die. Up until now, this has had to be done with separate components made with different manufacturing processes.

Integrating the two allows companies to create chips that incorporate optical elements such as modulators, couplers, multiplexers and more as well as CMOS-based electrical elements including RF components and traditional logic into a single design. In addition to reducing the cost and complexity of creating silicon photonics-based products, the monolithic integration brings system level performance advantages that are unrealizable with other approaches.

Recently, GF recently partnered with a startup called Ayar Labs that’s created a custom optical I/O chiplet named TeraPHY™ using the GF Fotonix fabrication process that currently allows up to 16 simultaneous optical connections (with 128 simultaneous logical data channels) on a single fiber. The net result is 4 Tbps bi-directional throughput and 10 times lower latency, with up to 8 times the power efficiency versus traditional electrical I/O interconnects. By integrating this solution into future data center-based server designs, companies could completely avoid the potential performance bottlenecks that they’ve started to run into when training extremely large generative AI models.

Moving into the real world, this means that organizations will start to be able to build data center hardware with the connection and data transfer needs that even the largest and most demanding GenAI-based foundation models require. Plus, because the technology is based on silicon photonics, they can do so over longer distances and use less power in the process. This, in turn, will enable more flexibility in data center designs as well as reduced operational costs, two factors that many organizations who are working with large foundation models are going to really appreciate.

Looking further ahead, the GF Fotonix manufacturing technology—which leverages IP that is unique to GlobalFoundries—is going to enable many other types of silicon photonics-based applications as well, including satellite communications and wireless infrastructure, co-packaged optics, and enterprise networking.

The optical interconnect technology underlying silicon photonics has held a lot of promise for a very long time. By making its integration with traditional CMOS components possible, as GF has done with Fotonix, the possibility of living up to that promise is looking more real every day.

Bob O’Donnell is the president and chief analyst of TECHnalysis Research, LLC a market research firm that provides strategic consulting and market research services to the technology industry and professional financial community. You can follow him on Twitter @bobodtech.

As we move forward into the new year, Foundry Files takes a step back to reflect on the key accomplishments of GlobalFoundries (GF) in 2023.  

From being a trusted partner, to strengthening our global footprint, to advancing our essential semiconductor technologies, to maintaining relentless focus on our team, let’s look at this past year’s GF news and milestones. 

Strengthening Our Global Footprint 

New Singapore Facility Opens 

GF’s $4 billion facility expansion in Singapore officially opened in September, in partnership with customers and the Singapore government. Singapore’s most advanced semiconductor production facility, it will produce an additional 450,000 300mm wafers annually, boosting GF’s total annual capacity in Singapore to about 1.5 million 300mm wafers. The new facility boosts GF’s global manufacturing footprint and is instrumental in ensuring that we have the capacity our customers around the world need as they seek to strengthen their supply chains. 

Click here to watch Yew Kong Tan, SVP and GM of GF’s Singapore site, discuss the expansion, and check out news coverage from Reuters, Bloomberg, and CNBC. 

Also, click here to read about the many ways this new facility is raising the bar for sustainability and efficiency with state-of-the-art environmental performance and controls.  

Opening New Malaysia Office 

Complementing the Singapore expansion was the opening of GF’s new hub facility in Penang, Malaysia. This new facility is part of a strategic hub network that will provide fundamental round-the-clock support for GF’s global manufacturing operations, enabling us to deliver supply chain resiliency as we deliver on our commitments to meet the market demand for essential GF-manufactured chips. The close proximity between Malaysia and Singapore also opens opportunities for cross-border initiatives, and for broadening the talent pool. 

Read more about the announcement in the New Straits Times and Tech in Asia.

U.S. CHIPS and Science Act 

In September GF announcing it applied for funding from the U.S. CHIPS and Science Act, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce. The submitted applications were for capacity expansion and modernization of GF’s U.S. manufacturing facilities. 

Click here to watch Dr. Thomas Caulfield, president and CEO of GF, discuss the CHIPS Act on CNBC. 

Helping Our Partners Achieve Supply Chain Resiliency 

GF and GM Join Forces 

February saw the announcement of a strategic long-term agreement between GF and General Motors (GM). The first-of-its-kind agreement created dedicated production capacity exclusively for GM at GF’s fab in Malta, New York. The agreement strengthens U.S. semiconductor manufacturing and supports GM’s strategy to reduce the number of unique chips needed to power increasingly complex vehicles.  

As Doug Parks, GM executive vice president of Global Product Development, Purchasing and Supply Chain, said:  

“We see our semiconductor requirements more than doubling over the next several years as vehicles become technology platforms. The supply agreement with GlobalFoundries will help establish a strong, resilient supply of critical technology in the U.S. that will help GM meet this demand, while delivering new technology and features to our customers.” 

Check out news coverage of the announcement from Reuters, New York Times, AP, and CNN. Click here to read more about the ways GF technology is driving automation in the automotive industry. 

Collaborating with Lockheed Martin on Secure Chips 

In June, GF and defense contractor Lockheed Martin announced a strategic collaboration to accelerate technological innovation and increase the security, reliability and resiliency of domestic supply chains for mission-critical national security systems. The collaboration directly supports U.S. government goals of increasing traceability, provenance, and onshore production of critical semiconductor technologies. 

The announcement was made at our Malta, New York, facility by U.S. Senate Majority Leader Charles Schumer, Lockheed Martin Chairman, President and CEO Jim Taiclet, and GF President and CEO Dr. Thomas Caulfield. 

As Jim Taiclet said: 

“Lockheed Martin is focused on delivering cutting-edge 21st Century Security capabilities that advance deterrence and keep our customers ahead of emerging threats. This begins with securely manufactured semiconductors. We look forward to working with GlobalFoundries to help increase access to domestically produced microelectronics – a true national security imperative.” 

Read news coverage of the announcement from Reuters, EE Times, Defense News, and Fierce Electronics.

 

Ongoing Leadership in Aerospace and Defense  

GF is a longstanding partner to the U.S. government and the leading supplier of securely manufactured essential chips for the aerospace and defense industry.  

In September, the U.S. Department of Defense (DoD) extended its partnership with GF, with the award of a 10-year, $3.1 billion contract for the supply of secure semiconductors for use across a wide range of critical aerospace and defense applications. Many of these chips will be manufactured using GF’s advanced 12nm FinFET technologies, and will be used in DoD systems on land, sea, air and in space. This year also saw the DoD accredit GF’s Malta, New York, facility to the highest security level, Trusted Supplier Category 1A.  

Read news coverage of the announcement of the new 10-year DoD contract at Tom’s Hardware, EE News, and Electronic Design. 

Advancing Essential Chip Technology and Innovation 

Growing Our Portfolio of Differentiated Technologies  

GF added many new and enhanced capabilities to its already broad and deep portfolio of differentiated technologies in 2023. At GF’s annual Technology Summit in Europe, we announced a suite of advancements to our fast-growing 22FDX^® (22nm FD-SOI) platform. These innovations bring exceptional power efficiency, enhanced performance, temperature-resistant operation and other benefits to demanding IoT and automotive applications. 

At the GF Technology Summit in North America, GF announced our new 9SW RFSOI platform, an advancement of the industry’s first 300 mm RFSOI foundry solution. Building upon GF’s 9swexisting 8SW RFSOI technology – and designed collaboratively with key customers – it is the industry’s most advanced RF solution. It offers significant improvements in flexibility, performance, integration, size and cost for 5G mobile and wireless communications applications. 

As David Archbold, vice president of product marketing for the wireless semiconductor division at Broadcom said about 9SW RFSOI: 

“Developing high-speed, more reliable connectivity is critical for the key 5G mobile and next-generation applications that we all depend on to live, work and play. With this new generation of technology, Broadcom will enable our customers to deliver the best possible 5G mobile experience to their end users.” 

Also at that summit, GF announced additions to two of its technology platforms for next-generation electric and autonomous vehicles. Our 40ESF3 AutoPro™ 175 is a new technology that gives automotive customers a set of both technology solutions and manufacturing services to help minimize certification efforts and speed time-to-market. Our new 130BCDLite Gen2 ATV125 power management solution supports high-voltage and other automotive applications, and meets the rigorous Auto Grade 1 qualification for high-temperature operation.  

Innovating the Next Generation of Essential Chips 

GF remains hard at work researching and developing new essential chip technologies that hold the promise of new game-changing capabilities and features. In October, GF was awarded was awarded $35 million in U.S. Department of Defense funding to accelerate implementation of large-scale manufacturing of GF’s gallium nitride (GaN)-on-silicon semiconductors at our facility in Essex Junction, Vermont. GaN technology is positioned to offer significant performance and efficiency for smartphones, electric vehicles, power grids, and many other applications.  

In the academic world, GF is a key partner for university collaborations on many levels. On a technical level, GF’s university network ecosystem fosters collaborations with professors who are world experts in technical disciplines relevant to GF’s end markets. GF works with the professors, gives them access to its differentiated technologies, provides engineering support, and manufactures their designs. In return, GF receives valuable technical feedback and has learned many different ways in which its platform technologies can be used to create innovative solutions for customers. This type of rich collaboration is at the heart of our announcement in March about GF’s new partnership with Georgia Institute of Technology. 

Fostering a Culture of Innovation 

Innovation is fundamental to GF and the semiconductor industry. In 2023 during our annual GF Patent Week celebration, GF announced the new GFX Prize, a $50,000 award which recognizes a single groundbreaking invention from among all of GF’s inventors worldwide. The inaugural winner was Dr. Yusheng Bian, a technology development engineer, GF Master Inventor, and 2021 DEI in Inventorship Champion. Dr. Bian has more than 170 worldwide patents and 260 patents pending and was awarded the GFX Prize for his work in silicon photonics technology. Be sure to check out this great Q&A with Dr. Bian. 

In addition to the GFX Prize, GF Patent Week recognized six new Master Inventors from the U.S., India and Europe, to support GF’s company-wide culture of inventorship and innovation. Laura Silverstein, an integration engineer with GF in Essex Junction, Vermont, was recognized as GF’s 2023 Diversity, Equity and Inclusion (DEI) in Inventorship Champion. 

Relentless Focus on People and Community 

Innovative Student Loan Repayment Program 

Investing in our workforce and building a talent pipeline is a critical need for GF, our communities, and our industry. In November we announced a new student loan repayment program to help U.S.-based employees and eligible new recruits pay up to $28,500 in student loan debt, tax-free. The goal is to strengthen the semiconductor talent workforce by helping to ease the financial burden of higher education and training of GF’s present and future employees. 

As Dr. Thomas Caulfield, president and CEO of GF, said: 

“In the semiconductor industry, poised to double again over the next decade, the blueprint for tomorrow’s innovations is directly linked to the talent we cultivate today. By enhancing our employee benefit programs, especially through our student loan assistance, GF is not only strengthening and building its own talent pipeline but also striving to set an industry benchmark. It’s this very talent that is critical to delivering the essential semiconductors the world relies on to live, work and connect.” 

Click here to read Newsweek’s coverage of this new program. 

Putting People First 

People are GF’s most valuable resource. Recognizing and valuing GF’s employees and encouraging them to bring their authentic self to work every day, is critical to supporting GF’s company-wide culture of diversity, equity, and inclusion.  

GF was proud to celebrate International Women’s Day 2023 in March and recognize women across the company for their outstanding work. GF’s largest employee resource group (ERG) is GlobalWomen, which has chapters around the world. Every year each chapter celebrates and awards women and allies who exemplify GF’s values with recognition events. In 2023, there were 10 such events and more than 1,000 attendees in total.  

Click here to see the current list of GF’s employee-driven ERGs, including our newest ERG, ConnectAbility, which enables inclusion, accessibility, awareness, and support for individuals with disabilities, caregivers, and allies. This group creates a supportive network where individuals can connect, share experiences and strategies, and empower the potential of every individual in navigating life and career journeys. 

Click here to read more about diversity, equity, and inclusion at GF. 

Commitment to ESG, Corporate Responsibility and Community 

GF has demonstrated a longstanding commitment to corporate responsibility, and in 2023 we received several recognitions for our environmental, social, and corporate governance (ESG) efforts. 

In addition to being included on Newsweek’s “America’s Most Responsible Companies 2024” list, GF was named to Morningstar Sustainalytics’ “2023 Industry Top-Rated ESG Companies” List. Also in 2023, GF maintained its “Low Risk” rating from Morningstar Sustainalytics and maintained its “Prime” Corporate ESG rating from Institutional Shareholder Services (ISS). 

As Stacey Barrick, GF’s global head of ESG, said:  

“GF is committed to environmentally sustainable manufacturing and to being a world-class employer. Corporate responsibility and ESG are fundamental to who we are as a company, and factor into every decision we make.” 

Click here to read further about our resource conservation efforts, and click here to read more about ESG at GF. Click here to view GF’s full 2023 Corporate Responsibility Report, which offers a comprehensive review of our ESG successes over the past year. 

Last, but certainly not least, GF’s team came together once again to make a positive impact in our communities. In 2023, GF and employees made total donations of $1.2 million USD and volunteered a total of 8,867 hours to benefit more than 1,400 different nonprofits and charities. Click here to read more about our GlobalGives employee giving program. 

By Emma Cheer
Director, Diversity, Equity, Inclusion and Belonging at GlobalFoundries

At GF, our people are our most valuable resource. Our business operates 24 hours a day, seven days a week across three continents. The people behind our success are innovative, talented and dedicated to providing outstanding solutions for our customers.

We are 13,000 employees strong, with each team member encouraged to bring their authentic self to work. So how does GF support that?

From our first employee resource group, GlobalWomen, to our newest, ConnectAbility, our employees have a range of opportunities to meet like-minded team members from around the world.

What are ERGs?

Employee Resource Groups (ERG) are voluntary, employee-led communities who share a common cause or similar identity to foster a diverse, inclusive workplace aligned with GF’s organizational mission, values, goals, business practices and objectives. Here at GF, we benefit from a number of ERG groups, each initiated by employees with executive sponsorship and company endorsement.

Why are ERGs important?

An important component of our comprehensive Diversity, Equity, Inclusion, & Belonging (DEIB) program, ERGs play a crucial role in shaping GF’s culture and promoting diversity and inclusion at all levels of the organization. ERGs provide a platform for underrepresented voices to be heard and empower employees to contribute their unique perspectives. They also collaborate across departments, sites, and business units fostering cross functional collaboration. As a result, GF’s ERGs are the catalysts for positive change, driving initiatives that promote equity and inclusion, and enhance the overall employee experience.

Meet our ERGs

Asian Society for Inclusion and Awareness (ASIA) is dedicated to creating an inclusive and socially just environment for Asian employees and allies. ASIA aims to support and promote the interests of the Asian community through networking, mentoring and increasing awareness of Asian culture and values.

Black Resource Affinity Group (BRAG) embraces diverse experiences of black employees and provides a safe place to express individualism, while continuing to build inclusive cultures.

ConnectAbility enables inclusion, accessibility, awareness, and support for individuals with disabilities, caregivers, and allies. This group creates a supportive network where individuals can connect, share experiences and strategies, and empower the potential of every individual in navigating life and career journeys.

Early Tenure Professionals (ETP) fosters, encourages, and empowers personal and professional development of individuals who have recently entered into a “new” career role by offering academic, philanthropic and social programs.

GlobalFamilies provides a community for employees and their families and share helpful resources to promote a work-life balance.

GlobalWomen (GW) is an alliance of women and allies whose mission is to create a sustainable framework for the professional development of women at GF, working in partnership with allies to drive initiatives that have a positive impact on our people, culture and business.

Pride@GF is dedicated to providing an inclusive environment for members of the LGBTQ+ community and their allies, empowering employees to bring their full selves to work, and informing and guiding GF to create a culture of inclusion.

Remote@GF enables GF remote employees to feel a sense of belonging, thrive and be engaged no matter where the working location is – bringing together a diverse array of individuals who work remotely full-time or hybrid.

Unidos (Hispanic/Latinx Resource Group) promotes and educates GF about the rich Hispanic/Latinx culture and heritage while cultivating advancement and growth of the Hispanic/Latinx employee population.

United States Veteran’s Resource Group (VRG) builds GF’s veteran talent pool, fosters a professional network, and supports veterans throughout the community. The VRG’s values are SERVE: Support, Empower, and Recognize Veteran Expertise.

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Interested in learning more about Diversity, Equity, Inclusion and Belonging at GF? Click here to learn more.