Key Features of GF Post-fab Services: “A La Carte” or complete full turnkey manufacturing services ➞ faster time to market In-house bump and probe capabilities ➞ fast yield feedback Advanced packaging and test solutions ➞ differentiated end products “A La Carte” or Complete Turnkey Manufacturing Services GF manufacturing services are offered in “A La Carte” or complete turnkey options for faster time to market. Customers choose the flow that best fits their design and capabilities. Turnkey manufacturing services include: Package design Package and supplier selection Custom tooling Pricing negotiation Quality/capacity/project management Operations management Supplier audit This successful supply chain model is based on: A collaborative model with more than 15 years of experience and success Assembly and test co-development with leading-edge OSATs Development and validation of design flow, rules and tool alignment with EDA, IP and design vendors at the front end Managed Turnkey Services GF also provides a full, global turnkey flow from wafer tape-out to delivery of fully tested and packaged products. Turnkey service advantages include: Single Purchase Order (PO) concept with a simplified billing system for the complete and customized silicon-to-package value chain Optimized cycle time from planned and aligned process milestones in the value chain Dedicated turnkey Operations, Engineering/New Process Development, Quality, Accounts, and Planning teams ensure seamless integration, exceptional quality, competitive cost, and on-time delivery In-house Bump and Probe Capabilities With internal bump and probe capabilities, GF provides the fastest path to entitlement yields. Capabilities include: Bump High capacity – up to 60k/month Lead free and Cu pillar in production uBump in qualification Fast prototype cycle times Sort Wide array of test platforms (190 testers in production) Fully automated data transaction and handling In-house probe card maintenance and repair Advanced Packaging and Test Solutions GF advanced packaging and test solutions provide a direct path to power, performance, cost, and form-factor optimized solutions. Advanced test development and capabilities include: RF, analog, embedded memory and mmWave applications 3D TSV at advanced nodes Novel wafer-level fan-out solutions (HD-FO)Non-monolithic integrated solutions (2.5/3D)2.5D silicon interposersExpertise in test insertion for complex 2.5D and 3D solutions High bandwidth memoryAdvanced memory integration with stacked memoriesIntegrated on interposer, parallel interface Hybrid memory cube (standalone memory, serial interface)
