November 15, 2017 GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart CardGF’s 55LPx platform with embedded non-volatile memory and integrated RF enables Fudan to create China’s most advanced CPU bank card […] Read Press Release
October 23, 2017 GTC Shanghai Highlights GF’s Momentum in ChinaCompany shares details of technology roadmap and customer adoption in the world’s fastest-growing market for semiconductors Shanghai, October 23, 2017 […] Read Press Release
October 12, 2017 GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow’s Connected CarAutoPro™ provides a full range of technologies and manufacturing services to help carmakers harness the power of silicon for a […] Read Press Release
September 20, 2017 GLOBALFOUNDRIES Delivers 8SW RF SOI Technology for Next-Generation Mobile and 5G ApplicationsAdvanced 8SW 300mm SOI technology enables cost-effective, high-performance RF front-end modules for 4G LTE mobile and sub-6GHz 5G applications Santa […] Read Press Release
