GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems
Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI Santa Clara, Calif., Sept. 20, 2017 […]
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GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications
Technology platforms are uniquely positioned to enable a new era of ‘connected intelligence’ with the transition to 5G Santa Clara, […]
GLOBALFOUNDRIES and Soitec Enter Into Long-term Supply Agreement on FD-SOI Wafers
Strategic milestone to help guarantee a secure, high-volume supply of FD-SOI technology Santa Clara, Calif., and Bernin (Grenoble), France, Sept. […]
GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology Platform
Technology solution delivers ‘connected intelligence’ to next generation high-volume wireless and IoT applications with lower power and significantly reduced cost […]
GLOBALFOUNDRIES Announces Availability of Embedded MRAM on Leading 22FDX® FD-SOI Platform
Advanced embedded non-volatile memory solution delivers ‘connected intelligence’ by expanding SoC capabilities on the 22nm process node Santa Clara, Calif., […]
GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance Applications
New 12LP technology offers density and performance improvement over current generation Platform features enhancements for next-gen automotive electronics and RF/analog […]
GLOBALFOUNDRIES Announces Enhanced RF SOI Process Design Kit For Use with CWS’ SiPEX™ Design Solution
Enhanced PDK incorporates design productivity tool to further enhance high-performance RF SOI switches Santa Clara, Calif., September 18, 2017 — […]
GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications
Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system Santa Clara, Calif., August 9, […]