September 20, 2017 GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance ApplicationsNew 12LP technology offers density and performance improvement over current generation Platform features enhancements for next-gen automotive electronics and RF/analog […] Read Press Release
September 18, 2017 GLOBALFOUNDRIES Announces Enhanced RF SOI Process Design Kit For Use with CWS’ SiPEX™ Design SolutionEnhanced PDK incorporates design productivity tool to further enhance high-performance RF SOI switches Santa Clara, Calif., September 18, 2017 — […] Read Press Release
August 10, 2017 GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud ApplicationsSolution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system Santa Clara, Calif., August 9, […] Read Press Release
August 3, 2017 GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance for Hybrid and Electric VehiclesSilicon Mobility and GF’s 55nm LPx -enabled platform, with SST’s highly-reliable SuperFlash® memory technology, boosts automotive performance, energy efficiency, and […] Read Press Release
July 13, 2017 GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT NetworksIntegrated solution leverages GF’s 22FDX® technology to decrease power, area, and cost for NB-IoT and LTE-M applications Santa Clara, Calif. […] Read Press Release
June 19, 2017 GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC Family55nm LPx RF-enabled platform, with SST’s highly reliable embedded SuperFlash®, provides low power and cost for IoT and “Connected” Health […] Read Press Release