GF Publishes 2024 Sustainability Report June 27, 2024 By Brian Raley Director of Corporate Environmental, Health, and Safety and Sustainability, GlobalFoundries It is my pleasure to announce GlobalFoundries (GF) has published its 2024 Sustainability Report. This comprehensive report is a testament to our company’s longstanding commitment to corporate responsibility and doing the right thing for our global team, our communities and the planet. The achievements highlighted in the 2024 Sustainability Report are the culmination of efforts from nearly every area of our business. Throughout its pages, you’ll read about a range of topics. From employee health and safety, to resource conservation and sustainable manufacturing. From fostering a secure and responsible supply chain, to the way we engage with our communities and other stakeholders, and so much more. Below are a few examples of stories and information you’ll find: GF’s new goal of achieving net zero greenhouse gas emissions by 2050 GF’s commitment to employee safety, achieving 2023 results that surpass our 2022 best-in-class performance. Chips made by GF are in the James Webb telescope and have traveled to Mars and beyond the moons of Jupiter to pioneer new discoveries. GF winning the “Equity 100 Award” from the Human Right’s Campaign for being a leader in LGBTQ+ workplace inclusion. The good we are doing in our communities, with GF and its employees collectively donating more than $1.3 million USD in 2023 to support 1,443 charities globally. Our four global manufacturing sites having earned the maximum score of 200, with zero finding, in their most recent Responsible Business Alliance audits. This work is in service to GF’s mission of innovating and partnering with customers to deliver solutions for humanity; our vision of changing the industry that is changing the world; and our living our values “Create, Embrace, Partner and Deliver” always with unyielding integrity. For many of us at GF, this work goes beyond our professional life and duties. This sentiment is reflected in the words Dr. Thomas Caulfield, president and CEO of GF, wrote in his introduction to the report: “This is a calling for us as companies, organizations and individuals to take responsibility and personal ownership of these important topics. We owe this to ourselves and future generations.” I invite you to read through GF’s 2024 Sustainability Report, learn more about the meaningful outcomes achieved by our talented team, and see how this work reflects our company’s ongoing commitment to doing the right thing. Brian Raley is the Director of Corporate Environmental, Health, and Safety and Sustainability at GlobalFoundries. Based in Malta, New York, Brian has been with GF since its founding in 2009. He has focused on sustainability efforts in the semiconductor industry for 29 years.
BAE Systems and GlobalFoundries Collaborate to Strengthen Supply of Essential Semiconductors for National Security Programs June 20, 2024 Collaboration to focus on U.S. chip manufacturing and joint research and development for advanced chip technologies MALTA, N.Y., June 20, 2024 — BAE Systems (LON: BA) and GlobalFoundries (Nasdaq: GFS) (GF) today announced a new collaboration to strengthen the supply of critical semiconductors for national security programs. Under the strategic agreement, the companies will align technology roadmaps and collaborate on long-term strategies for increasing U.S. semiconductor innovation and manufacturing, with the joint goal of advancing the ecosystem for domestic fabrication and packaging of secure chips and solutions for use in aerospace and defense systems. Together, the companies will engage in long-term planning for emerging technologies and collaborate on research and development in a range of areas, including advanced semiconductor packaging and integration, gallium nitride on silicon chips, silicon photonics and advanced technology process development. The new non-exclusive collaboration builds upon the longtime relationship between BAE Systems and GF, and further brings together BAE Systems’ expertise in microelectronics for critical defense systems with GF’s expertise as one of the world’s leading high-volume semiconductor manufacturers and the most advanced supplier of secure, essential chips to the U.S. Department of Defense (DoD). Both BAE Systems and GF were recently named as recipients of planned direct funding from the U.S. government as part of the CHIPS and Science Act. “Our leadership in microelectronics for critical defense systems is predicated on a reliable and secure supply chain and the availability of trusted, uncompromised semiconductors,” said Terry Crimmins, president of BAE Systems’ Electronic Systems sector. “This new collaboration with GlobalFoundries, with its expertise in secure chip manufacturing, is imperative for BAE Systems to advance the overmatch thresholds of technologies, stay ahead of the increasingly complex defense environment, and enable creative solutions to mitigate the growing challenges to both the integrity of microelectronics and their associated supply chains.” “GF is committed to strengthening the semiconductor supply chain for national security and innovating to meet the future needs of the aerospace and defense sector,” said Dr. Thomas Caulfield, president and CEO of GF. “We are proud to deepen our strategic relationship with BAE Systems, and further strengthen supply chain resiliency. Together, we will accelerate the research and development of a new generation of essential technologies and securely manufacture essential chips for a diverse range of critical defense applications.” A recent example of successful collaboration between the two companies, BAE Systems leveraged GF’s 12LP and 12S0 technology platforms for custom radiation-hardened by design semiconductor solutions for sensitive space applications. These highly differentiated U.S.-made chips enable electronic systems to withstand the harsh environment of space, while offering power efficiency, area benefits, and a robust design ecosystem to enable cost-efficient and quick-turn prototyping. These chips deliver the performance, reliability and yield of GF’s high-volume commercial sector offerings, tailored to the needs of the aerospace and defense industry by BAE Systems, and manufactured by GF with the right level of security – up to the DoD’s highest security level, Trusted Supplier Category 1A. GF’s U.S. manufacturing facilities have Trusted Foundry accreditation from the U.S. government to securely manufacture chips in partnership with the DoD Defense Microelectronics Activity (DMEA) for use in some of the nation’s sensitive national security and critical infrastructure systems on land, air, sea and in space. In 2023, the DoD awarded GF a new $3.1 billion, 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications. The new contract was the third sequential 10-year contract of its kind between the DoD and the Trusted Foundry business team at GF. About BAE Systems BAE Systems, Inc. and its nearly 41,000 people are part of a global defense, aerospace, and security company with approximately 100,000 employees worldwide. We deliver products and services for air, land, sea, and space, as well as advanced electronics, intelligence, security, and IT solutions and support services. Our dedication shows in everything we design, produce and deliver— to protect those who protect us in a high-performance, innovative culture. We push the limits of possibility to provide a critical advantage to our customers where it counts. About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers. GF is redefining innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. GF offers a unique mix of design, development, and fabrication services. With a talented and diverse workforce and an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its worldwide customers. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-looking Information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contacts: BAE Systems Paul Roberts [email protected] GlobalFoundries Michael Mullaney [email protected]
Bits in Space: Connecting the World with Satellite Technology June 18, 2024 Alexandros Margomenos, GlobalFoundries Director RF Product Management As recently as just a few decades ago, the idea of delivering broadband and cellular connectivity from space was a futuristic dream. Fast forward to today, and this dream is rapidly becoming a reality. Advances in satellite technology are revolutionizing global connectivity. These types of advancements are powered by essential innovations in semiconductor technology, like those we are pioneering here at GlobalFoundries, which are helping to bring high-speed communication to every corner of the globe, even the most remote areas. These innovations are essential for creating immersive user experiences and transforming industries. So, How Does It Work? You may be asking, what do all these satellites mean, and how does it impact me? Let’s break it down. There are two main types of satellites used for communication: Geosynchronous (GEO) and Low Earth Orbit (LEO) satellites. GEO Satellites: These orbit 36,000 km above the Earth and stay fixed over one spot. They can cover large areas with just a few satellites but have higher latency (delay) because of their distance. LEO Satellites: These orbit much closer to Earth, between 500 to 1,200 km. They provide lower latency (less delay) and faster internet speeds but require many more satellites to cover the globe because they move quickly across the sky. LEO satellites travel at nearly 25 times the speed of sound, enabling significantly lower latency (<20 milliseconds). Connecting the Dots: How Satellites Communicate Satellite networks include four types of communication links. In all cases, the downlink from the satellite is at a lower frequency compared to the uplink to optimize the power amplifiers on the satellite. User Link: Connects the satellite to your home or mobile device. This is how you receive data from the satellite. Feeder Link: Connects the satellite to ground stations (gateway terminals), linking the satellite network to the terrestrial internet. Telemetry, Tracking, and Command (TT&C) Link: Manages the satellite’s operations, ensuring they stay on course and function correctly. Intersatellite Links (ISL): Allow satellites to talk to each other, transferring data and coordinating handoffs as they orbit. Typically, user, feeder, and TT&C links use RF and millimeter-wave frequencies, while ISL links can utilize both millimeter-wave frequencies and optical communications. To put it simply, think of it as a relay race. The user link is like the baton passed from the satellite to your device. The feeder link is the baton passed from the satellite to the ground station, connecting you to the wider internet. The TT&C link ensures the satellites stay on course, much like a coach guiding the runners. Finally, ISLs are like runners passing the baton between each other to ensure seamless coverage as they orbit the Earth. The Evolution of Satellite Antennas Imagine those old satellite systems: giant, rigid dish antennas—like the ones you might see in old movies. These large dishes were excellent for sending focused signals but lacked flexibility. They could only point in one direction at a time and needed to be physically moved to change their focus. Today, the game has changed with the advent of phased array antennas. Instead of one big dish, think of these antennas as being made up of thousands of tiny elements, each capable of steering a part of the signal. These elements work together to create a powerful, flexible system that can direct beams electronically, without any moving parts. This technological leap means that modern satellites can connect to multiple places at once, seamlessly switching between different targets. It’s like having a spotlight that can instantly shine in any direction, or even multiple directions at once, without physically moving. Choosing the Right Technology Creating these advanced satellite systems requires selecting the right semiconductor technology. Key considerations include the type of beamforming (analog, digital, or hybrid), system design (placing amplifiers close to antennas vs. integrating them with beamformers) and achieving a low noise figure (NF) for better performance. Lower NF means fewer required elements, simplifying design and reducing costs, making the system more efficient overall. Powering the Future of Connectivity At GF, we offer a wide range of technologies supporting all the components necessary for creating any possible configuration of satellite communication phased arrays. Here are some of our key technologies: 130NSX: Perfect for ground terminals, offering excellent performance for smaller phased arrays. High-Performance SiGe: Efficient power amplifiers and low noise for high-volume manufacturing. 9SW and 45RFSOI: Advanced RF SOI technologies optimized for beamformers, ensuring high efficiency and low noise. 22FDX: Combines high-density logic and memory, ideal for digital beamformers and integrated systems. By leveraging these essential technologies, we are helping to create satellite systems that are more efficient, cost-effective, and capable of bringing high-speed connectivity to every corner of the globe. Significant progress has been made to expand access and adoption of broadband services. The number of internet users doubled between 2010 and 2020, reaching over 4 billion users worldwide. As we continue to innovate and develop these technologies, the dream of connecting the next 4 billion people is closer than ever.
GlobalFoundries Joins CHIPS Women in Construction Framework June 18, 2024 GF commits to framework of U.S. Commerce Secretary Gina Raimondo’s “Million Women in Construction” Initiative MALTA, N.Y., June 18, 2024 — GlobalFoundries announced today a commitment to the U.S. Department of Commerce’s CHIPS Women in Construction Framework, a set of five best practices intended to increase representation of women and economically disadvantaged individuals in the construction workforce. The Framework is part of U.S. Secretary of Commerce Gina Raimondo’s ongoing Million Women in Construction initiative that aims to expand the American construction workforce by doubling the number of women in construction over the next decade. GF Chief People Officer Pradheepa Raman announced the company’s commitment at the “CHIPS Women in Construction Roundtable” event at the White House. In voluntarily committing to the Framework, GF is agreeing to work with contractors, trade unions, and other community and workforce partners to implement best practices that will expand the construction workforce by increasing the participation of women and economically disadvantaged individuals. These recruitment and retention best practices will help support on-time and successful completion of CHIPS program-funded projects. “At GlobalFoundries, we celebrate our diversity and are steadfast in our commitment to shaping the future of the semiconductor industry. Every day, our talented team is pushing the boundaries of innovation to shape essential technologies that are making the world a better place,” Raman said. “We applaud the leadership of Secretary Raimondo in taking action to diversify our nation’s workforce. GlobalFoundries is proud to commit to the Department of Commerce’s CHIPS Women in Construction Framework. A more diverse construction workforce benefits all of us, strengthening our industry and our communities.” The five best practices GF is committing to adopt are: Set goals and monitor progress towards increasing the participation of women on CHIPS-funded construction projects. Build community partnerships with community organizations with a track record of increasing women and economically disadvantaged individuals’ exposure to and recruitment into the construction industry. Develop training pathways such as training investments, apprentice utilization goals, or apprentice readiness program partnerships that serve women and economically disadvantaged individuals. Provide access to supportive services such as child care or transportation that will increase retention of women and economically disadvantaged individuals in the workforce. Maintain healthy, safe, and respectful workplaces and prevent and address harassment, discrimination, retaliation, and violence through workplace training, policy and practice. In the coming months, GF will work with the CHIPS Program Office (CPO), the Department of Commerce, and collaborate with local partners, such as contractors, trades unions and community-based organizations to develop and implement activities carrying out the best practices. GF’s support of CHIPS Women in Construction framework is the company’s latest effort to support workplace diversity and build a critical talent pipeline for the current and future workforce. In May, GF announced a partnership with Micron Technology and the U.S. National Science Foundation to invest in workforce development at Minority Serving Institutions (MSI) to help meet the growing workforce needs of the U.S. semiconductor ecosystem and help develop the next generation of talent for the industry. In November 2023, the company announced a new student loan repayment program to help U.S.-based employees and eligible new recruits pay up to $28,500 in student loan debt, tax-free, to help ease the financial burden of higher education and training. GF also offers tuition reimbursement for employees pursuing undergraduate and graduate degrees, fully paid parental leave, employee fitness stipend to promote good health and childcare subsidy towards dependent care. GF’s first-of-its-kind apprenticeship program provides opportunities for individuals with no prior experience or training in the semiconductor industry, offering full-time paid positions and cost-free college courses to high school graduates. GF has established strategic partnerships nationwide with top universities and strong regional engagements with community colleges in New York and Vermont as well as access to worldwide talent through its global footprint to help build a diverse workforce and semiconductor talent pipeline. To help inspire younger children, GF has a robust STEM outreach program to engage with regional middle schools and high schools, including Early College High School and Career and Technical Education programs, to bring industry awareness and hands-on experiences to students. About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers. GF is redefining innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. GF offers a unique mix of design, development, and fabrication services. With a talented and diverse workforce and an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its worldwide customers. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-looking Information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contact: Michael Mullaney [email protected]
SEMICON West June 8-11, 2024San Francisco, Moscone Center Monday, July 8 3:45pm PDTLocation: Julia Morgan Ballroom (15th Floor) Keynote and Expert TalksFireside Chat: Isabelle Ferain – VP Product Development Engineering, GlobalFoundries Tuesday, July 9 8:30am – 3:30pm PDTLocation: Keynote Stage, North Hall, Room 24 CEO Summit: Investing in America’s Manufacturing FutureFireside Chat: Dr. Thomas Caulfield, President and CEO, GlobalFoundries 1:00pm – 2:00pm PDTLocation: South Hall, Expo Floor, Smart Manufacturing Pavilion Stage CXO Panel: Can AI/Gen AI + Digital Twin Transform Semiconductor Manufacturing?Panelist: Pradip Singh, Chief Manufacturing Officer, GlobalFoundries Wednesday, July 10 2:20pm – 3:20pm PDTLocation: Keynote Stage, North Hall, Room 24 Beyond Tier Mapping – Creating a Robust and Resilient Supply Chain RiskPanelist: Roger Kao, Vice President, Global Supply Management, GlobalFoundries
GSA European Executive Forum June 18 & 19, 2024Munich, Germany Industry Outlook – Fireside Chat Moderator: Luc Van den hove, President and CEO, imec Participants: Kurt Sievers, President & CEO, NXP Dr. Thomas Caulfield, President & CEO, GlobalFoundries
Driving Automotive Innovation on the Semiconductor Superhighway June 11, 2024 GlobalFoundries’ Next-Generation Technology Will Shape What’s Essential in the Auto Industry Today’s vehicles are marvels of integrated technology—an intelligent edge device on wheels. Look under the hood, and it’s likely you’ll find a semiconductor born in one of GF’s global manufacturing facilities. The shift from traditional combustion engines to autonomous, connected, and electrified (ACE) vehicles—and eventually to Software Defined Vehicles (SDVs)—is a giant technological stride. And GF’s 12LP+ AutoPro150 platform is precisely engineered to fuel this transition. The Evolution of Automotive Performance From self-driving features to efficient power management and central controls, the modern car is experiencing an explosion of advancements in user experience, safety, and connectivity—all while moving toward zero emissions. With 15 years of expertise in automotive solutions, GF has been pivotal in this evolution. 12LP+ AutoPro150 not only meets these complex demands but is built to withstand the rigors of automotive operation—engineered to perform reliably even at the high temperatures of up to 150 degrees Celsius. Power, Performance, Area: The Core of 12LP+ AutoPro150 In automotive electronics, three factors are crucial: power, performance, and the area—or PPA. 12LP+ AutoPro150 excels in all three, offering a 16% boost in performance and slashing power consumption by 32% over our prior 12LP models. This puts it miles ahead of older 16nm technologies, packing more power into a smaller space with enhanced efficiency. Unleashing Performance with Precision Future-ready vehicles require compact, powerful semiconductors. Enter 12LP+ AutoPro150, with its logic Contacted Poly Pitch (CPP) of just 84nm—fine electrical paths for a more potent chip. “What’s a logic Contacted Poly Pitch?” you might wonder. It’s the measure of space between the transistors on a chip, determining how many can fit in a given area. The smaller the CPP, the more transistors we can pack in, and the more powerful the semiconductor. The Heart of Automotive Evolution: Efficiency It’s not just about miles per gallon; efficiency extends to the silicon that powers every electronic process in your vehicle. 12LP+ AutoPro150 marks a significant step toward sustainability, reducing power usage by up to 32% and improving overall vehicle performance. A History of Excellence and Innovation Our Malta, New York fab has dispatched more than 2 million wafers globally, embodying our relentless pursuit of innovation and dedication to quality. 12LP+ AutoPro150 builds on this heritage, robust enough to withstand the intense conditions of modern driving and GF’s long-standing mission to enhance automotive security and safety. Wiring the Future, Layer by Layer 12LP+ AutoPro150’s intricate multi-layer copper wiring facilitates swift, efficient data transfer, essential for enhanced autonomous driving and vehicle connectivity—akin to an urban grid designed for optimal traffic flow. Customization at its Core Offering four voltage threshold options, 12LP+ AutoPro150 tailors to the nuanced needs of various vehicles. This adaptability allows automakers to fine-tune system performance, whether it’s for a family SUV or a high-octane sports car, without complicating the manufacturing process. The Road Ahead For drivers, this translates to a vehicle that’s smarter, safer, and perfectly aligned with your lifestyle—transforming every journey with unparalleled technology, comfort, and efficiency. As we forge ahead, GF is excited to introduce several new features as part of this platform in the development pipeline: Ultra Low Leakage (ULL) – We are enhancing the digital logic and memory components of our semiconductors to ensure they perform optimally even in extreme automotive environments. This development is crucial for supporting connectivity functions that need to be continuously active, helping the modern vehicle transition into an always-connected, AI-enhanced platform. ZG 3.3V – This innovation involves the introduction of higher voltage devices that can manage a wider array of signals from complex automotive sensors. These sensors are vital for enhancing vehicle safety and responsiveness by providing more accurate real-time data. eMRAM – We are deploying a differentiated non-volatile memory (eMRAM) that offers high endurance, high density, and low power consumption. It is designed to meet the increased code and data storage needs of advanced microcontrollers used in cars, facilitating more sophisticated AI and machine learning applications. GF Customers will find these innovations particularly applicable in the design of: ADAS processors at the edge: These are crucial for features like automatic braking or lane-keeping, focusing on reliability while consuming less power. Digital Signal Processors: Enhancing the audio and infotainment systems inside your car, making your ride more enjoyable. High-Speed Connectivity devices: Essential for features that require fast data transfer, like downloading maps or streaming music. MRAM and ZG 3.3V technologies in 12LP+: Soon, these will help manage the car’s built-in sensors more effectively, improving performance and safety. The 12LP+ AutoPro150 platform is yet another milestone in GF’s journey to shape the future of the automotive. As cars increasingly resemble computers, our essential semiconductors are the heart—capable, efficient, and future-ready.
IMS 2024 June 16-21, 2024Washington, DC IMS is dedicated to all things microwaves and RF, including numerous sessions focused on GF technologies and solutions, developed under GF Labs. Industry Workshop (IWTU1)Tuesday, June 18, 8am ET “Silicon technologies for 5G/6G Cellular Front-End Modules” Abstract – “The research area of improving the performance, cost and size of 5G RF solutions and evolution to 6G is very active with many developments and it is one of the driving factors for semiconductor industry. Mobile cellular subscribers reached more than 6 billion in 2022 and 5G LTE brings high data capacity as low latency using sub-6GHz and mm-Wave spectrum. Mm-Wave up to 300GHz will play a major role in future 6G networks. The proliferation of worldwide smartphones has been in part possible due to increased computational power of CMOS technology and RF integration This has made also possible to essentially enhance RF CMOS through digital signal processing (DSP) and digital calibration. The industrial workshop will cover 5G semiconductor technologies and architectures currently used in RF Front End Modules for cellular applications, the challenges for the 5G deployment as well the evolution to 6G.” Presented by: Dr. Venkata Vanukuru, Globalfoundries, India: Silicon technologies for 5G/6G Cellular Circuits Dr. Anuranjan Puttaraju, Skyworks, USA: Principles of 5G/5G+ Cellular Power Amplifier Design. Dr. Florinel Balteanu, Skyworks, USA: 5G/6G Cellular Front End Module Principles Conference Professor University Technology Title RFIC Inchan Ju Ajou SIGE8XP Fully Integrated SiGe HBT BiCMOS Transmit-Receive Front-End IC for 5G mmW Radio with a Reconfigurable Built-In Diode RF Switch, RFIC Inchan Ju Ajou SIGE8XP An Efficient, High Power Q-Band SiGe HBT Power Amplifier with a Compact Four-Way Wilkinson Power Combiner Balun for Emerging Very Low-Earth-Orbit SATCOM RFIC Inchan Ju Ajou SIGE8XP A Compact, Highly Linear Ku-Band SiGe HBT Power Amplifier Using Shared Single Center-Tap Four-Way Output Transformer Balun for Emerging Low Earth Orbit SATCOM Phased-Array Transmitter IMS Kaushik Sengupta Princeton SIGE9HP Deep Learning Enabled Generalized Synthesis of Multi-Port Electromagnetic Structures and Circuits for mmWave Power Amplifiers RFIC Payam Heydari UC Irvine 45RFSOI A CMOS Fully Integrated 120-Gbps RF-64QAM F-band Transmitter with an On-Chip Antenna for 6G Wireless Communication IMS Payam Heydari UC Irvine 22FDX A Power-Efficient, F-Band, 6.5-dB NF, Staggered-Tuned, Inverter-Based CMOS LNA for 6G Receivers RFIC Hua Wang ETHZ 45RFSOI "A D-Band Complex Neutralization Cascode Power Amplifier with A Source-Gate Driven Cascode for Enhanced Bandwidth and Efficiency" RFIC Hua Wang ETHZ 22FDX "A 25-40 GHz Three-Way Power Amplifier with No Load ModulationAchieving Broadband Deep Power Back-Off Efficiency Enhancement" IMS Hua Wang ETHZ 22FDX "Transfer Learning Assisted Fast Design Migration Over Technology Nodes: A Study on Transformer Matching Network" IMS Hua Wang ETHZ 22FDX "A 24-GHz 4-Element Multi-Beam Wireless Energy Harvesting Array with Class-F Rectifiers Achieving 51.5% PCE" IMS Hua Wang ETHZ 45RFSOI Analysis and Design of Differential Complex Neutralization Power Amplifiers for Efficient-Yet-Linear High Mm-Wave Applications” IMS Çağrı Ulusoy KIT 22FDX A 124–144GHz Rectifier Achieving 22% RF-to-DC Conversion Efficiency in 22nm FD-SOI CMOS Technology IMS Ken O UT Dallas 22FDX 19-GHz VCO with Phase Noise of -117dBc/Hz at 1-MHz Offset Using an Array of Near Minimum Size Transistors and Intelligent Post Fabrication Selection IMS John Cressler Georgia Tech SIGE9HP A W-Band Stacked Frequency Quadrupler With A Dual Driven Core Achieving 10.3% Drain Efficiency IMS John Cressler Georgia Tech SIGE9HP A 43–84GHz, Wideband Frequency Doubler With a Symmetric, AC-Terminated Transformer Balun IMS Gabriel M. Rebeiz UCSD 45RFSOI A 140GHz FMCW Ultra Wideband High Dynamic Range RADAR Utilizing 8×8 Phased Arrays IMS Joseph Bardin UMass Amherst 45SG01 A 1.6 mW Cryogenic SiGe LNA IC For Quantum Readout Applications Achieving 2.6 K Average Noise Temperature from 3–6 GHz IMS Taiyun Chi Rice U 45RFSOI Automated mmWave Power Amplifier Design Flow and a 28-GHz Design Example in 45-nm CMOS SOI RFIC Frank Ellinger TU Dresden 22FDX A Class-J/F 60GHz Power Amplifier with 42.3% Power Added Efficiency in FDSOI CMOS RFIC Gabriel M. Rebeiz UCSD 45RFSOI A 26.5–35GHz High Linearity VGA with an RMS Phase Error of 0.9°–2.8° Utilizing a Novel Hybrid Coupling Technique in 45RFSOI RFIC Patrick Reynaert KU Leuven 22FDX A D-Band Power Amplifier with Optimized Common-Mode Behaviour Achieving 32Gb/s in 22-nm FD-SOI RFIC Harish Krishnaswamy Columbia 45RFSOI Phased-Array-Compatible Area-Efficient D-Band Power Amplifiers in 45 RF SOI Based on Cascade Stacking RFIC Gabriel M. Rebeiz UCSD SIGE9HP Transimpedance Amplifiers with 95GHz Transimpedance Bandwidth and 1.5% THD for 800G Coherent Optical Communications RFIC Waleed Khalil Ohio State 45SG01 A Study of Total Dose Radiation Effects in Ka-Band Fractional-N PLLs in 45nm SiGe BiCMOS RFIC Gabriel M. Rebeiz UCSD 45RFSOI A 2×40Gb/s Ultra-Wideband 131–173GHz Dual Receiver for Point-to-Point Communication Systems with NF of 5.7dB in RFSOI RFIC Gabriel M. Rebeiz UCSD 45RFSOI A D-Band Scalable 128-Channel Dual-Polarized Receive Phased-Array with On-Chip Down Converters for 2×2 MIMO Achieving 2×42Gbps RFIC Gabriel M. Rebeiz UCSD 45RFSOI A Compact Ultra-High-Linearity 7-to-20GHz Passive Mixer Achieving up to 37dBm IIP3 and 25.1dBm IP1dB in 45nm CMOS SOI RFIC Aydin Babakhani UCLA SIGE9HP A 360GHz Single-Element Multi-Mode Orbital Angular Momentum Cavity Antenna-Based Transmitter in 90nm SiGe BiCMOS RFIC Payam Heydari UC Irvine 45RFSOI A CMOS Fully Integrated 120-Gbps RF-64QAM F-Band Transmitter with an On-Chip Antenna for 6G Wireless Communication RFIC Wooram Lee Penn State 45RFSOI A D-Band Bi-Directional Current-Reuse Common-Gate Amplifier in 45nm RFSOI Generated by wpDataTables
GF’s Essential Chips Enable Sustainability June 5, 2024 By Brian RaleyDirector of Corporate Environmental, Health, and Safety and Sustainability, GlobalFoundries In celebration of World Environment Day, and as I think about how GlobalFoundries (GF) continues to lean into our commitment to sustainability, I am excited about the ways the essential chips we manufacture enable our customers to create devices and technologies necessary for building a more resource-efficient and sustainable future. GF’s announcement last month of new goals to achieve net zero greenhouse gas (GHG) emissions and 100% carbon-neutral power by 2050 is a critical step in our Journey to Zero Carbon and our role as a responsible corporate steward of the environment. These goals reflect the all-hands-on-deck effort needed at every level of society to combat climate change. The benefits of the essential chips we manufacture go beyond environmental sustainability. In addition to more energy-efficient devices and shaping technologies from electric vehicles to smart devices to datacenters, the essential chips we make are also key for enabling improved medical diagnostics, safety, and health and fitness across a range of technologies and devices. Let’s look at three of our end-markets: Automotive Automotive, our fastest growing end market in 2023, is a prime example of GF chips enabling a more sustainable future. I am inspired to imagine a new era of electric transportation driven by GF’s BCD and BCDLite® CMOS platforms delivering differentiated power efficiency and management to the battery systems critical for (hybrid) electric vehicles. Automotive radar is another area where GF’s technology solutions support human needs. Radar is the basis for safety features like adaptive cruise control, automatic emergency braking, blind-spot monitoring and other advanced driver-assistance system (ADAS) functions. Data Center As society demands more from AI and other data center services, we continue to see unprecedented energy demands to support these services. GF technology is addressing these massive energy demands in several ways. First, GF’s products are used across the full range of power delivery systems to improve the efficiency of the delivery of energy to run data centers. Additionally, GF’s Fotonix™ platform is enabling the fundamental shift of communication from electrons to photons, delivering higher data bandwidth that is not possible with conventional chips to enable large language AI models to run efficiently across multiple processors within a server or across multiple servers. Internet of Things (IoT) The IoT devices GF’s technology supports range from retail tags that improve supply chain functionality to health and fitness trackers helping people better understand their health metrics. One of the most impactful examples of this is enabling life-changing continuous glucose monitoring for people with diabetes, a condition which impacts more than 500 million people around the world. These are just a few ways in which GF-made chips are helping to build a healthier, safer and more sustainable world. Read more on this topic here or in the “Technology for Humanity” section of our 2023 Corporate Responsibility Report. We’ll have even more examples in our forthcoming 2024 Report. Brian Raley is the Director of Corporate Environmental, Health, and Safety and Sustainability at GlobalFoundries. Based in Malta, New York, Brian has been with GF since its founding in 2009. He has focused on sustainability efforts in the semiconductor industry for 29 years.
ElevATE Semiconductor and GlobalFoundries Partner on High-Voltage Chips for Commercial and National Security Applications June 5, 2024 Following demand from customers, collaboration will provide a new supply of chips on GF’s power efficient and feature-rich 7HV semiconductor platform SAN DIEGO and ESSEX JUNCTION, VT., June 5, 2024 — ElevATE Semiconductor and GlobalFoundries (Nasdaq: GFS) (GF) today announced a manufacturing partnership for high-voltage chips produced at GF’s facility in Essex Junction, Vermont. Designed by ElevATE and manufactured at scale by GF on its proven and power-efficient 7HV technology platform, the chips are vital to both commercial semiconductor testing equipment and critical applications for aerospace and defense systems. The agreement outlines GF’s supply of its 7HV chip technology to ElevATE and the marketplace. Manufactured on 200mm wafers at GF’s Vermont facility, the mature-node chips pair power management and wireless sensing capabilities, delivering the performance, design flexibility and power efficiency required by a range of electronics devices in national security systems. The 7HV platform is optimized for cost and performance, and offers a full suite of features and options with well-characterized design tools, as well as proven manufacturing reliability with robust yields. To meet the demands of commercial clients and the aerospace and defense industry, ElevATE and GF are collaborating to provide restart support and reestablish the production of 7HV chips. The renewed availability of the 7HV platform will save customers costs, time, and the challenge of redesigning their products using a different chip technology. The new supply will build upon the success of the millions of 7HV chips previously manufactured at GF’s Vermont facility. “This collaboration marks a significant transformation in ElevATE’s production strategy, transitioning its fabrication processes to GlobalFoundries,” said Anil Kodali, Vice President of Operations and Quality Assurance at ElevATE. “With GF as our manufacturing partner, we can be sure of a robust and reliable source of supply, enabling us to meet the escalating demands of our customers in terms of volume, quality and time-to-market.” “Our collaboration with ElevATE underscores GF’s commitment to ensuring the U.S. semiconductor and national security ecosystems have a reliable supply of secure, domestically manufactured chips,” said Nicholas Sergeant, vice president and head of the aerospace, defense and critical infrastructure business at GF. “As the leading supplier of essential chips for the U.S. aerospace and defense industry and a longstanding partner to the Department of Defense, GF goes above and beyond to ensure our national security customers have the chips they need, manufactured where they want them, with the right level of security.” GF’s facility in Essex Junction, Vermont, near Burlington, was among the first major semiconductor manufacturing sites in the United States. Today, around 1,800 GF employees work at the site. Built on GF’s differentiated technologies, these GF-made chips are used in smartphones, automobiles, and communications infrastructure applications around the world. The facility is a DMEA-accredited Trusted Foundry and manufactures secure chips in partnership with the U.S. government. Read more about GF’s aerospace, defense and critical infrastructure offerings at: https://gf.com/markets/aerospace-and-defense/ About ElevATE Semiconductor ElevATE Semiconductor is a leader in the global semiconductor manufacturing industry, offering cutting-edge semiconductor test and ATE solutions. The company is committed to supporting the semiconductor and system test community by providing advanced integrated circuits (ICs) that address the complex challenges of ATE. With a focus on designing efficient, high-density solutions, ElevATE Semiconductor aims to reduce the overall cost of testing for its customers, both now and in the future. Visit www.elevatesemi.com. About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers. GF is redefining innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. GF offers a unique mix of design, development, and fabrication services. With a talented and diverse workforce and an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its worldwide customers. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-looking Information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contacts: ElevATE Semiconductor Tim Bakken, Vice President of Global Sales [email protected] GlobalFoundries Michael Mullaney [email protected]
