November 19, 2018 Attopsemi’s I-fuse OTP Passed 250 degrees Celsius for 1,000hrs Wafer-level Burn-in Studies on GLOBALFOUNDRIES 22FDX FD-SOI TechnologyAttopsemi’s I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for automotive […] Read Press Release
November 1, 2018 VeriSilicon Announces Ultra Low Power BLE 5.0 RF IP based on GLOBALFOUNDRIES 22FDX® FD-SOI Process for IoT ApplicationsShanghai, China – November 1, 2018 – VeriSilicon Holdings Co., Ltd. (VeriSilicon) today announced its Bluetooth Low Energy (BLE) 5.0 RF […] Read Press Release
October 31, 2018 Netronome Announces Open Chiplet Architecture for Advanced SoC DesignsNetronome, a leader in high-performance intelligent networking solutions, today announced an open architecture for domain-specific accelerators designed to significantly reduce […] Read Press Release
October 17, 2018 eMemory’s OTP IP Qualified on GLOBALFOUNDRIES 22nm FD-SOI processeMemory today announced that its one-time programmable (OTP) non-volatile memory IP, NeoFuse, has been qualified on GLOBALFOUNDRIES (GF) 22FDX ® […] Read Press Release
October 12, 2018 Power Regulation IPs now Silicon Proven on GLOBALFOUNDRIES 22FDX® Technology PlatformDolphin Integration today announced the qualification of the first wave of Power Management IPs on GLOBALFOUNDRIES 22nm FD-SOI (22FDX®) process […] Read Press Release
October 10, 2018 Mentor releases optimized flow, new fill automation for GLOBALFOUNDRIES’ 22FDX IC manufacturing processMentor, a Siemens business, today announced it has qualified complete solutions from its Calibre® nmPlatform™, Analog FastSPICE™ (AFS)™ Platform, Eldo® […] Read Press Release
