GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card
GF’s 55LPx platform with embedded non-volatile memory and integrated RF enables Fudan to create China’s most advanced CPU bank card […]
GF Press Releases
Archive
Current ReleasesRead Press Release
GTC Shanghai Highlights GF’s Momentum in China
Company shares details of technology roadmap and customer adoption in the world’s fastest-growing market for semiconductors Shanghai, October 23, 2017 […]
GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow’s Connected Car
AutoPro™ provides a full range of technologies and manufacturing services to help carmakers harness the power of silicon for a […]
GLOBALFOUNDRIES Delivers 8SW RF SOI Technology for Next-Generation Mobile and 5G Applications
Advanced 8SW 300mm SOI technology enables cost-effective, high-performance RF front-end modules for 4G LTE mobile and sub-6GHz 5G applications Santa […]