22FDX® Revving up for Automotive Applications at CDNLive EMEA July 7, 2017By: Gerd Teepe Recently, Cadence hosted its two-day European CDNLive event at a multi-purpose arena in Munich. The arena at the INFINITY Hotel & Conference Resort is also often a draw for ice-hockey tournaments, rock concerts and other high-profile events and visitors. In fact, the Bayern-Munich soccer team has gathered here before important games the last couple of years, bringing further glamour to the area. While the Bayern Munich players did not occupy the arena this year, there was another star attraction at the show—a technical innovation heralding a new era in image processing. Dream Chip Technologies GmbH of Hannover, Germany demonstrated a system with an image processing chip designed and manufactured with GLOBALFOUNDRIES’ 22nm FD-SOI (22FDX®) technology. Dream Chip’s ADAS SoC system platform is based on a quad ARM® A53 processor complemented with a dual ARM-R5 lock-step processor, making the chip suitable for enhanced ASIL-type security applications. The image workhorse of the chip is the Vision-P6 processor from Cadence. Source Dream Chip: Full system architecture of the image processing platform, soon to be implemented by Dream Chip. The Vision P6 architecture from Cadence is based on the Tensilica architecture and is targeted for Convolutional Neural Network computations (CNNs). Image objects are detected by correlation of video images with a database of known images. For applications in the car, like sign- and pedestrian-recognition, this application needs to run at real-time with 30 frames per second. In essence, it’s a massive computational comparison of pictures occurring in real-time. The prototype shown at CDNLive is the first-ever live system with an SoC implemented with GF’s 22FDX technology. The chip is 64mm2 and is mounted on a package substrate together with two LPDDR4 memories. Source Dream Chip: System module with chip and two LPDDR4-memories The Dream Chip ADAS chip is a complex and multifunctional SoC. At CDNlive, Dream Chip demonstrated video capabilities through a system board mounted on top of a model car, with the signal of a hood-mounted GoPro camera fed into the system board. Jens Benndorf, COO of Dream Chip, explained the further signaling path: “First fed into the chip, the video signal is passed to one of the four IVPs running a filter algorithm, then passed to the video-output and on to the display. It demonstrated that the IVP6 is working.” Source GF: Dream Chip live Demo setup at CDNLive EMEA In addition to the demo, Benndorf and his team gave a number of presentations on the system, the chip architecture and the CNN-based image processing for which the chip is targeted in the near future. Dream Chip, GF, and partners are working fast and furious (pun intended!) to accelerate the SoC prototype for production readiness. First silicon was demonstrated in February 2017 at Mobile World Congress in Barcelona, and a video on the platform was showcased at CDNLive in May. What will be next? Ride with us, and find out! 22FDX is enabling innovation in ADAS applications and eventually will for autonomous driving too. By then, Bayern Munich players will certainly notice. About Author Gerd Teepe In his role as Director Marketing for Europe, Gerd is responsible for leading the CMOS Platforms marketing initiatives in this region, with focus on accelerating design wins in the IoT/Industrial and Automotive segments as well as emerging markets. Prior to this, Gerd was leading the Design Engineering Organization of GLOBALFOUNDRIES. Gerd Teepe has been with GLOBALFOUNDRIES since its creation in 2009 and is based at the FAB1-site in Dresden. Prior to GLOBALFOUNDRIES, Gerd was with AMD, Motorola-Semiconductors, and NEC, Japan in R&D, Design, Product Management and Marketing roles. Gerd holds a Master’s Degree and a phd from Aachen University, Germany.
AImotive Releases aiWare: The First of its Kind, AI-Optimized Hardware Accelerator For Autonomous Driving July 3, 2017MOUNTAIN VIEW and SANTA CLARA, Calif., June 29, 2017 – AImotive (www.aimotive.com) today announced its much anticipated, AI-optimized hardware IP is available to global chip manufacturers for license. aiWare, built from the ground up for running neural networks, is up to 20 times more power efficient than other leading AI acceleration hardware solutions on the market. VeriSilicon Holdings Co., Ltd. (www.verisilicon.com), a Silicon Platform as a Service (SiPaaS®) company, will be the first to integrate aiWare into a chip design,and the aiWare-based test chips will be fabricated on the GLOBALFOUNDRIES (GF) 22FDX® semiconductor process (www.globalfoundries.com)
eVaderis加入FDXcelerator™项目，为格芯22FDX®技术平台提供内存IP June 29, 2017eVaderis today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program to provide scalable, advanced memory IP to be compatible with GF’s 22FDX® technology. The advanced memory IP is expected to offer performance and energy saving advantages over competing memory solutions.
EVADERIS JOINS FDXCELERATOR™ PROGRAM TO DELIVER MEMORY IP TO GLOBALFOUNDRIES 22FDX® TECHNOLOGY PLATFORM June 29, 2017eVaderis today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program to provide scalable, advanced memory IP to be compatible with GF’s 22FDX® technology. The advanced memory IP is expected to offer performance and energy saving advantages over competing memory solutions.
ICE-P3 能量处理单元（EPU）集成了温度补偿的电压与频率控制，追求最大节能效果 June 26, 2017San Jose, Calif. – June 26, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today introduced ICE-P3™, the IP industry’s first product to automate implementation of dynamic voltage and frequency scaling (DVFS). ICE-P3 is the newest member of the ICE-Grain™ Family of Energy Processing Units (EPU) that identifies, sequences, and controls power state transitions in hardware up to 500X faster than conventional software-based approaches.
ICE-P3 EPU Integrates Temperature-Compensated Voltage and Frequency Control for Maximum Energy Savings June 26, 2017San Jose, Calif. – June 26, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today introduced ICE-P3™, the IP industry’s first product to automate implementation of dynamic voltage and frequency scaling (DVFS). ICE-P3 is the newest member of the ICE-Grain™ Family of Energy Processing Units (EPU) that identifies, sequences, and controls power state transitions in hardware up to 500X faster than conventional software-based approaches.
Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node June 20, 2017Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its custom/analog and full-flow digital and signoff tools are now enabled for v0.5 of the GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET semiconductor technology. The 7LP process node is expected to deliver 40 percent better performance and twice the area scaling than the previous 14nm FinFET technology.
Synopsys and GLOBALFOUNDRIES Collaborate to Deliver Design Platform and IP Enablement for 7-nm FinFET Process June 20, 2017Synopsys, Inc. (Nasdaq: SNPS) today announced the enablement of the Synopsys Design Platform and DesignWare® Embedded Memory IP on GLOBALFOUNDRIES 7-nm Leading-Performance (7LP) FinFET process technology. Synopsys and GF collaboration on the new process addressed several new challenges specific to the 7LP process. This process is expected to deliver 40 percent more processing power and twice the area scaling compared to GF’s 14nm FinFET process. Designers of premium mobile processors, cloud servers and networking infrastructure can take advantage of these benefits by confidently deploying the silicon-proven Synopsys Design Platform and Embedded Memory IP.
GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC Family June 19, 201755nm LPx RF-enabled platform, with SST’s highly reliable embedded SuperFlash®, provides low power and cost for IoT and “Connected” Health and Wellness Devices Singapore and Santa Clara, Calif., June 19, 2017 – GLOBALFOUNDRIES and ON Semiconductor (Nasdaq: ON) today announced the availability of a System-on-Chip (SoC) family of devices, on GF’s 55nm Low Power Extended (55LPx), RF-enabled process technology platform. ON Semiconductor’s new RSL10 products are based on a multi-protocol Bluetooth 5 certified radio SoC capable of supporting the advanced wireless functionalities in IoT and “Connected” Health and Wellness markets. “Bluetooth low energy technology continues to advance as the key enabler for connecting IoT devices, especially with low power consumption requirements,” said Robert Tong, vice president of ON Semiconductor’s Medical and Wireless Products Division. “GF’s 55LPx platform – with its low power logic and highly reliable embedded SuperFlash® memory combined with proven RF IP – was an ideal match. The RSL10 family offers the industry’s lowest power consumption in Deep Sleep Mode and Peak Receiving Mode, enabling ultra-long battery life, and supporting functionalities like Firmware Over the Air updates. ON Semiconductor’s new RSL10 SoCs use these advanced features to address a wide range of applications including wearables and IoT edge-node devices such as smart locks and appliances.” “GF’s 55LPx platform, combined with ON Semiconductor’s design, has delivered wearable SoC technology at 55nm, with industry leading energy efficiency,” said David Eggleston, vice president of embedded memory at GF. “This is another proof point that 55LPx is becoming the preferred choice for SoC designers that are seeking cost effective performance, low power consumption, and superior reliability in extreme environments.” GF’s 55nm LPx RF-enabled platform provides a fast path-to-product solution that includes silicon qualified RF IP and Silicon Storage Technology’s (SST) highly reliable embedded SuperFlash® memory featuring: Very fast read speed (<10ns) Small bitcell size Superior data retention (> 20 years) Superior endurance (> 200K cycles) Fully qualified for Auto Grade 1 operation (AEC-Q100) GF’s 55LPx eFlash platform has been in volume production at the foundry’s 300mm line in Singapore since 2015. The 55LPx eFlash platform is a cost effective solution for a broad range of products, ranging from wearable devices to automotive MCUs. Customers can start optimizing their chip designs with GF’s process design kits, enabling designers to develop differentiated eFlash solutions that require cost effective performance, low power consumption, and superior reliability in extreme environments. For more information on GF’s mainstream CMOS solutions, contact your GF sales representative or go to www.globalfoundries.com. To learn more about the RSL10 product family, visit the product page and read the “Bringing Industry’s Lowest Power to Bluetooth Low Energy Technology” blog . To request samples or order an evaluation board, please contact your local ON Semiconductor sales representative. About ON Semiconductor ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient, power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace and defense applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance and ethics program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions. For more information, visit https://www.onsemi.com. About GLOBALFOUNDRIES GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. GLOBALFOUNDRIES® and the GLOBALFOUNDRIES logo and sphere design are trademarks and/or service marks of GLOBALFOUNDRIES Inc. in the United States and other jurisdictions. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected] Brittany BaguioON Semiconductor408) 822-2196[email protected]
