PIPES Researchers Demonstrate Optical Interconnects to Improve Performance of Digital Microelectronics March 25, 2020Researchers replace traditional electronic I/O with optical signaling interfaces to achieve major improvements in link reach and efficiency
MixComm Announces Breakthrough 5G 28GHz Beamforming “SUMMIT 2629TM” Front End IC on GLOBALFOUNDRIES Enhanced 45RFSOI Solution March 18, 2020MixComm’s Novel Architecture with GLOBALFOUNDRIES’ mmWave Features Delivers the Ideal Combination of Output Power, Energy Efficiency and Integration
Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm March 12, 2020Magnetoresistive Random Access Memory (MRAM) continues to scale for both eMRAM and discrete MRAM solutions
Anokiwave Gen-2 Ku and K/Ka-Band Silicon Beamformer ICs in Large Scale Production at GLOBALFOUNDRIES March 11, 2020Anokiwave’s 2nd Generation of Ku and K/Ka band Silicon Beamformer ICs for SATCOM market are in Full Volume Production, with a Turnkey Solution in partnership with GLOBALFOUNDRIES. These ICs serve as industry’s trusted choice to enable Flat Panel Electrically Steered Antennas for LEO/MEO/ GEO and Satcom-on-the-Move (SOTM).
QuickLogic’s eFPGA Qualified on GLOBALFOUNDRIES 22FDX® Platform for IoT and Edge AI Applications March 11, 2020QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low-power multicore voice-enabled system-on-chips (SoCs), embedded FPGA (eFPGA), intellectual property (IP), Internet of Things (IoT), and endpoint artificial intelligence (AI) solutions, today announced that its ArcticPro™ 2 eFPGA IP has been qualified on GLOBALFOUNDRIES® (GF®) 22FDX® platform.
GLOBALFOUNDRIES Delivers Industry’s First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications February 27, 2020Company’s advanced embedded non-volatile memory on its FDX™ platform provides a cost-effective solution for low-power, non-volatile code and data storage applications Santa Clara, Calif., February 27, 2020 – GLOBALFOUNDRIES® (GF®) today announced its embedded magnetoresistive non-volatile memory (eMRAM) on the company’s 22nm FD-SOI (22FDX®) platform has entered production, and GF is working with several clients with multiple production tape-outs scheduled in 2020. Today’s announcement represents a significant industry milestone, demonstrating the scalability of eMRAM as a cost-effective option at advanced process nodes for Internet of Things (IoT), general-purpose microcontrollers, automotive, edge-AI (Artificial Intelligence), and other low-power applications. Designed as a replacement for high-volume embedded NOR flash (eFlash), GF’s eMRAM allows designers to extend their existing IoT and microcontroller unit architectures to access the power and density benefits of technology nodes below 28nm. GF’s eMRAM is a highly versatile and robust embedded non-volatile memory (eNVM) that has passed five rigorous real-world solder reflow tests, and has demonstrated 100,000-cycle endurance and 10-year data retention across the -40°C to 125°C temperature range. The FDX eMRAM solution supports AEC-Q100 quality grade 2 designs, with development in process to support an AEC-Q100 quality grade 1 solution next year. “We continue our commitment to differentiate our FDX platform with robust, feature rich solutions that allow our clients to build innovative products for high performance and low power applications,” said Mike Hogan, senior vice president and general manager of Automotive and Industrial Multi-market at GLOBALFOUNDRIES. “Our differentiated eMRAM, deployed on the industry’s most advanced FDX platform, delivers a unique combination of high performance RF, low power logic and integrated power management in an easy-to-integrate eMRAM solution that enables our clients to deliver a new generation of ultra-low power MCUs and connected IoT applications.” Custom design kits featuring drop-in, silicon validated MRAM macros ranging from 4 to 48 mega-bits, along with the option of MRAM built-in-self-test support is available today from GF and our design partners. eMRAM is a scalable feature that is expected to be available on both FinFET and future FDX platforms as a part of the company’s advanced eNVM roadmap. GF’s state-of-the-art 300mm production line at Fab 1 in Dresden, Germany, will support volume production of 22FDX with MRAM. For more information on GF’s 22FDX and MRAM features, contact your GF sales representative or go to globalfoundries.com. About GLOBALFOUNDRIES GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
格芯面向IoT和汽车应用推出业界首款基于22FDX平台且可批量生产的eMRAM February 27, 2020 公司基于FDX™平台的先进嵌入式非易失性存储器为低功耗、非易失性代码和数据存储应用提供了一种高性价比解决方案 加利福尼亚州圣克拉拉，2020年2月27日–格芯®(GF®)今日宣布基于其22nm FD-SOI (22FDX®)平台的嵌入式、磁阻型非易失性存储器(eMRAM)已投入生产。格芯正在接洽多家客户，计划2020年安排多次生产流片。此次公告是一个重要的行业里程碑，表明eMRAM可在物联网(IoT)、通用微控制器、汽车、终端人工智能和其他低功耗应用中作为先进工艺节点的高性价比选择。 格芯的eMRAM产品旨在替代高容量嵌入式NOR闪存(eFlash)，帮助设计人员扩展现有物联网和微控制器单元架构，以实现28nm以下技术节点的功率和密度优势。 格芯的eMRAM是一款可靠的多功能嵌入式非易失性存储器(eNVM)，已通过了5次严格的回流焊实测，在-40℃至125℃温度范围内具有100,000次使用寿命和10年数据保存期限。FDX eMRAM解决方案支持AEC-Q100 2级设计，且还在开发工艺，预计明年将支持AEC-Q100 1级解决方案。 格芯汽车、工业和多市场战略业务部门高级副总裁和总经理Mike Hogan表示：“我们将继续通过功能丰富的可靠解决方案实现差异化FDX平台，客户可利用这些解决方案来构建适用于高性能和低功耗应用的创新产品。我们的差异化eMRAM部署在业界先进的FDX平台之上，可在易于集成的eMRAM解决方案中实现高性能射频、低功耗逻辑和集成电源管理的独特组合，帮助客户提供新一代超低功耗MCU和物联网应用。” 格芯携手设计合作伙伴，即日起提供定制设计套件，包括通过芯片验证的插入式MRAM模块（4至48MB），以及MRAM内置自检功能支持。 eMRAM是一种可扩展功能，预计将在FinFET和未来的FDX平台上推出，作为公司先进eNVM路线图的组成部分。格芯位于德国德累斯顿1号晶圆厂的先进300mm产品线将为MRAM 22FDX的量产提供支持。 如需了解更多有关格芯®（GLOBALFOUNDRIES®）22FDX和MRAM特性的信息，请联系您的格芯®（GLOBALFOUNDRIES®）销售代表或访问globalfoundries.com。 About GF GLOBALFOUNDRIES (GF) is a leading specialty foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
Anokiwave Announces the Full Commercial Release of its 3rd Generation 5G mmW IC Family February 25, 2020Anokiwave, Inc., a leader in providing highly integrated IC solutions for mmW markets and a trusted choice of Tier-1 and -2 OEMs, announces the commercial high-volume availability of the industry’s most advanced and complete portfolio of Silicon ICs for mmW 5G. The latest generation brings a complete RF signal chain solution for all mmW bands in play – 24/26 GHz, 28 GHz, and 37/39 GHz – to the market while providing extensive functionality that simplifies the active antenna array design. The scalable architecture underpinning the mmW 5G IC family supports everything from mmW 5G macro-cells to small-cells to customer premises equipment (CPE) with a scalable architecture that supports each use case.
格芯与环球晶圆签署合作备忘录，未来将长期供应12英寸SOI晶圆 February 24, 2020全球领先的半导体晶圆代工厂格芯（GLOBALFOUNDRIES）于2月24日宣布已和全球前三大硅晶圆制造商环球晶圆（Globalwafers.Co.,Ltd）签订合作备忘录(MOU)，协议表明环球晶圆将负责对格芯12英寸晶圆的长期供应。 环球晶圆是全球领先的8英寸SOI制造者之一，也是格芯8英寸SOI晶圆的长期供应商，双方长期保持着良好的合作关系。环球晶圆也是12英寸晶圆制造商，基于双方未来发展与稳定供应需求，环球晶圆与格芯有望紧密协作，有力扩大环球晶圆12英寸SOI晶圆生产产能。 格芯计划利用本次协议规定的12英寸晶圆供应，满足业界对于RF SOI技术持续增长的需求。这些技术经过优化，为目前和下一代行动装置和5G应用，提供低功耗、高效能和易于整合的解决方案。 格芯移动与无线基础设施高级副总裁Bami Bastani先生表示：「移动、无线和5G为格芯带来了庞大的商机，目前市场上超过85％的智能型手机，都采用了本公司的RF技术。格芯很高兴能与环球晶圆合作，期盼能共同开发出新增的12英寸SOI晶圆供应链，从而整合到格芯的制程中，进一步满足对于RF SOI技术解决方案不断增长的需求。」 格芯高级副总兼首席采购官Tom Weber表示：“鉴于我们的市场定位，我们和我们的客户都需要建立多样化的12英寸SOI晶圆供应链，同时符合格芯与客户之间的最大利益。环球晶圆则是达成这一目标的最佳伙伴。” 环球晶圆董事长暨首席行政官徐秀兰表示：“很高兴能借着市场向下一代RF应用发展的契机来扩大与格芯的长期合作的伙伴关系。这次合作最终一定会为双方带来更大的成功！” ### 关于环球晶圆 环球晶圆总部位于台湾新竹，为全球三大硅晶圆制造厂商之一。成立于1981年，前身为中美硅晶制品股份有限公司的半导体事业处，并在2011年更名为环球晶圆圆股份有限公司。环球晶圆专精硅晶圆制造，产品应用多元，包括电源管理、汽车、loT、内存、传感器和微机电系统。环球晶圆在台湾、日本、美国、韩国、意大利、丹麦、马来西亚和中国等国家皆有设厂运营，并在台北证券交易所上市。有关环球晶圆的更多信息，请访问https://www.sas-globalwafers.com。 关于格芯 格芯是全球领先的特殊工艺半导体代工厂，提供差异化、功能丰富的解决方案，赋能我们的客户为高增长的市场领域开发创新产品。格芯拥有广泛的工艺平台及特性，并提供独特的融合设计、开发和生产为一体的服务。格芯拥有遍布美洲、亚洲和欧洲的规模生产足迹，以其灵活性与应变力满足全球客户的动态需求。格芯为阿布扎比穆巴达拉投资公司(Mubadala Investment Company)所有。欲了解更多信息，请访问 https://www.globalfoundries.com/cn。 媒体垂询： 杨颖（Jessie Yang） (021) 8029 6826 [email protected] 邢芳洁（Jay Xing） 86 18801624170 [email protected]
GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers February 24, 2020Santa Clara, California, and Hsinchu, Taiwan, February 24, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, and GlobalWafers Co., Ltd. (GWC), one of the top three silicon wafer manufacturers in the world, today announced they have signed a memorandum of understanding (MOU) to develop a long-term supply agreement for 300mm silicon-on-insulator (SOI) wafers. GWC is one of the world’s leading manufacturers of 200mm SOI wafers, and has a long and ongoing relationship with GF for supplying 200mm SOI wafers. GWC also manufactures 300mm SOI wafers, and under the anticipated supply agreement, GWC and GF will collaborate closely to significantly expand GWC’s 300mm SOI wafer manufacturing capacity. GF intends to use the resulting additional supply of 300mm SOI wafers to meet the growing demand for its industry-leading RF SOI technologies, which are optimized to deliver a low power, high performance, and easy-to-integrate solution for current and next-generation mobile and 5G applications. “Mobile, wireless, and 5G represent a significant opportunity for GLOBALFOUNDRIES, and our vital RF technology is featured in more than 85 percent of smartphones on the market today,” said Bami Bastani, senior vice president for mobile and wireless infrastructure at GF. “We are pleased to collaborate with GlobalWafers, and look forward to working with them to develop and qualify an additional supply of 300mm SOI wafers to integrate into our manufacturing processes and help meet the growing demand for our RF SOI solutions.” “Given our market position, it is in our best interest – and the best interest of our clients – to build out and diversify the supply chain for 300mm SOI wafers,” said Tom Weber, senior vice president and chief procurement officer at GF. “GlobalWafers is the right partner for us to make this happen.” “We are pleased with this opportunity to extend the long-standing partnership between GlobalFoundries and GWC, in light of the market evolution toward next-generation RF applications,” said Doris Hsu, Chairman and CEO of GWC. “Ultimately, this collaboration will lead to even greater success for both companies.” About GlobalWafers Co., Ltd. GlobalWafers, headquartered in Hsinchu, Taiwan, is one of the three largest silicon wafer manufacturers in the world. Founded in 1981, it was the semiconductor business unit of SAS (Sino-American Silicon Products Inc.) and spun off as GlobalWafers Co., Ltd. in 2011. Specializing in silicon wafer manufacturing, its product applications extend through power management, automotive, IoT, memory, sensors and MEMS. GlobalWafers operates out of 15 facilities in Taiwan, Japan, USA, Korea, Italy, Denmark, Malaysia, and China and is listed on the Taipei Stock Exchange. For more information about GlobalWafers, please visit https://www.sas-globalwafers.com. About GLOBALFOUNDRIES GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com. Contacts: Michael Mullaney GLOBALFOUNDRIES (518) 305-1597 [email protected] William Chen GlobalWafers Co., Ltd. +886-3-577-2255 EXT: 2280 [email protected]
