April 17, 2014Shared technology allows global capacity for 14nm FinFET fabrication in the U.S. and Korea Seoul, Korea and Santa Clara, Calif. April 17, 2014 – Samsung Electronics Co., Ltd. and GLOBALFOUNDRIES today announced a new strategic collaboration to deliver global capacity for 14 nanometer (nm) FinFET process technology. For the first time, the industry’s most advanced 14nm FinFET technology will be available at both Samsung and GF, giving customers the assurance of supply that can only come from true design compatibility at multiple sources across the globe. The new collaboration will leverage the companies’ worldwide leading-edge semiconductor manufacturing capabilities, with volume production at Samsung’s fabs in Hwaseong, Korea and Austin, Texas, as well as GF’ fab in Saratoga, New York. Developed by Samsung and licensed to GF, the 14nm FinFET process is based on a technology platform that has already gained traction as the leading choice for high-volume, power-efficient system-on-chip (SoC) designs. The platform taps the benefits of three-dimensional, fully depleted FinFET transistors to overcome the limitations of planar transistor technology, enabling up to 20 percent higher speed, 35 percent less power and 15 percent area scaling over industry 20nm planar technology. The platform is the first FinFET technology in the foundry industry to provide true area scaling from 20nm. The technology features a smaller contacted gate pitch for higher logic packing density and smaller SRAM bitcells to meet the increasing demand for memory content in advanced SoCs, while still leveraging the proven interconnect scheme from 20nm to offer the benefits of FinFET technology with reduced risk and the fastest time-to-market. Through this multi-year exclusive technology license, process design kits (PDKs) are available now, allowing customers to start designing with models, design rule manuals, and technology files that have been developed based on silicon results from 14nm FinFET test chips. Mass production for the 14nm FinFET technology will begin at the end of 2014. “This unprecedented collaboration will result in a global capacity footprint for 14nm FinFET technology that provides AMD with enhanced capabilities to bring our innovative IP into silicon on leading-edge technologies,” said Lisa Su, senior vice president and general manager of Global Business Units at AMD. “The work that GF and Samsung are doing together will help AMD deliver our next generation of groundbreaking products with new levels of processing and graphics capabilities to devices ranging from low-power mobile devices, to next-generation dense servers to high-performance embedded solutions.” “This strategic collaboration extends the value proposition of a single GDSII multi-sourcing to the FinFET nodes. With this true multi-source platform, Samsung and GF have made it easy for fabless semiconductor companies to access FinFET technology and increase first-time silicon success,” said Dr. Stephen Woo, president of System LSI business, device solutions, Samsung Electronics Division. “Through this collaboration, we are advancing the foundry business and support model to satisfy what customers have been asking for.” “Today’s announcement is further proof of the importance of collaboration to enable continued innovation in semiconductor manufacturing,” said GF CEO Sanjay Jha. “With this industry-first alignment of 14nm FinFET production capabilities, we can offer greater choice and flexibility to the world’s leading fabless semiconductor companies, while helping the fabless industry to maintain its leadership in the mobile device market.” About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. is a global leader in technology, opening new possibilities for people everywhere. Through relentless innovation and discovery, we are transforming the worlds of TVs, smartphones, tablets, PCs, cameras, home appliances, printers, LTE systems, medical devices, semiconductors and LED solutions. We employ 286,000 people across 80 countries with annual sales of US$216.7 billion. To discover more, please visit www.samsung.com. * Editors’ Note : Samsung Electronics’ Foundry business is dedicated to support fabless and IDM semiconductor companies offering full service solutions encompassing design kits and proven IP to fully turnkey manufacturing to achieve market success with advanced IC designs. For more information, please visit www.samsung.com/Foundry About GF GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit https://www.globalfoundries.com. CONTACTS: Jason GorssGF518-305-9022[email protected] Lisa Warren-PlungySamsung Semiconductor408-544-5377[email protected] Click here to access the press release (PDF)Click here to access the Overview Presentation (PDF)
