Category: Uncategorized

Flexcompute and GlobalFoundries Enable Integrated Design and Simulation on GF Silicon Photonics Platform

Luceda Photonics and GlobalFoundries Announce Strategic Collaboration to Deliver Luceda PDK, Accelerating Silicon Photonics Innovation

NLM Photonics Samples Silicon Organic Hybrid PICs Manufactured at GlobalFoundries

EXFO’s Industry-leading Innovations Supporting AI Infrastructure from Chip to System to Data Center Exhibited at OFC 2026

Siluxtek has collaborated closely with GlobalFoundries to jointly promote the Mass-Produce 200G/Lane Silicon Photonic Receiver Chips

Lightwave Logic High-Speed Modulator Platform Now Available in GDS Factory PDK for GlobalFoundries Silicon Photonics Platform

Advancing High‑Performance Silicon Photonics and Silicon Germanium (SiGe) for the Next Era of Optical Connectivity 

Radhika Arora, VP/GM Pluggables Silicon Photonics
Kyra Ledbetter, RF Product Manager
Arvind Narayanan, Director, SiGe Product Line

As cloud infrastructure scales and AI workloads accelerate, data centers face unprecedented demand to deliver dramatically higher bandwidth with greater energy efficiency. While compute performance rapidly advances, the system bottleneck has shifted to the optical interconnects and transceivers that link these systems together.

Achieving longer reach, higher bandwidth density and lower energy per bit now demands a fundamental shift in optical module architectures – and the technologies that enable them. 

Leadership at 200G/λ: GF’s Scalable Silicon Photonics and High-Performance SiGe Solutions 
Data centers are rapidly approaching the limits of electrical interconnects, making silicon photonics the only scalable path forward. Enabling higher per‑lambda (λ) data rates, optical I/Os and packaging‑aware integration, GF’s silicon photonics solutions are redefining how bandwidth scales in next‑generation scale‑up and scale‑out architectures. 

GF’s silicon photonics technologies deliver the reach, bandwidth density and energy efficiency required to support the industry’s transition to 200G/λ and beyond. Combined with qualified 300mm manufacturing and wafer-level test capabilities, GF delivers a scalable, flexible, production-ready platform designed to evolve with future data rates and advanced packaging architectures – with capabilities including: 

  • 200G/λ PAM4 support, fundamental to enable scalable 1.6T transceivers 
  • Multiple modulator options for high-speed transmitter architectures, including Mach-Zehnder, MicroRing and RAMZI 
  • High speed photodetectors enabling advanced receiver performance 
  • Integration of silicon nitride (SiN) waveguides and spot‑size converters for higher optical launch power, improved coupling efficiency and long‑term reliability 
  • Support for both v-grooves and standard edge coupled fibers  
  • Through-silicon via (TSV)‑based 2.5D/3D integration to shorten electrical paths, reduce power and enable near‑package and co‑packaged optics at 1.6T  

As a compliment, Silicon Germanium (SiGe) remains a critical enabler of high‑performance optical transceivers – powering the analog and mixed‑signal electronics that drive and receive optical signals.  

After enabling industry‑leading 100G/λ deployments with our SiGe8XP technology, GF is positioned to lead the transition to 200G/λ with its added high-performance SiGe solutions – including 9HP+. GF’s SiGe 9HP+ platform sets a new benchmark in HBT performance, delivering ft/fmax of 340/410 GHz alongside one of the industry’s most complete BiCMOS offerings. Its combination of high‑speed HBTs, advanced CMOS integration, low‑loss metallization and high‑voltage LDMOS has made it the technology of choice for today’s highest‑performance optical transceivers. Beyond raw transistor speed, SiGe 9HP+ enables critical system‑level advantages: 

  • Higher integration density for compact, thermally efficient designs 
  • A robust portfolio of precision passives, including metal resistors, MIM capacitors and transmission lines 
  • Industry‑leading PDK infrastructure and device models that accelerate design closure and reduce design iterations 

Together, these capabilities enable designers to meet the stringent power, bandwidth and aggressive form-factor requirements of the 200G/λ generation.  

A Unified Path from Optics to Electronics: Co-integration of Silicon Photonics and SiGe  
GF uniquely enables co‑integration of silicon photonics and SiGe, delivering a streamlined, end-to-end solution spanning optics, electrical ICs and advanced packaging. This comprehensive approach reduces system complexity, improves scalability and empowers customers to harness the strengths of both technologies – unlocking the speed, power efficiency and integration required to overcome today’s architectural stopgaps. 

Paving the Way to 400G/λ with Next-Generation Photonics and Advanced SiGe BiCMOS  
Enabling 400G/λ and beyond requires advancing beyond traditional modulator limits. As it is recognized that silicon alone will face increasing challenges beyond 200G/λ, GF continues to push the boundaries of silicon while also exploring novel materials. This includes a strategy centered around the hybrid and heterogenous integration of high Pockels effect materials – such as thin‑film lithium niobate (TFLN), barium titanate (BTO) and advanced electro‑optic polymers – directly onto our silicon photonics platform to enable ultra‑high bandwidth (>100 GHz) operation at lower drive voltage. 

GF has also introduced CBIC, the industry’s first SiGe Complementary BiCMOS platform, to support the leap to 400G/λ. By combining high‑speed SiGe HBTs with a flexible CMOS integration, CBIC enables new power‑efficient transceiver architectures optimized for extreme bandwidth demands – with key advantages including: 

  • Industry‑leading NPN with ft/fmax > 400GHz, delivering enhanced analog performance 
  • Support for innovative amplifier topologies that deliver high gain‑bandwidth with significantly reduced power consumption 
  • A modular approach that allows customers to tailor cost, performance and integration for specific optical module classes 

Looking Ahead: Enabling the Future of Optical Systems 
As optical data rates advance toward multi‑terabit architectures, innovation across silicon photonics, SiGe and advanced packaging becomes increasingly critical. To empower this, GF’s roadmap focuses on continued HBT performance scaling and advanced 3D integration to enable tighter co-packaging of optical and electrical components.  

With a proven foundation and a clear roadmap, GF is committed to spearheading the evolution of optical connectivity technologies that will define the next decade of cloud and AI infrastructure. 

Interested in learning more? Connect with GF’s silicon photonics and SiGe experts at OFC and visit us at booth #817 to explore how we’re enabling the next generation of optical connectivity. 

GlobalFoundries Announces Pricing of Public Secondary Offering and Concurrent Share Repurchase

MALTA, N.Y., March 11, 2026 – GlobalFoundries (Nasdaq: GFS) (GF) today announced the pricing of a secondary public offering of 20,000,000 ordinary shares to the public at a price to the public of $42.00 per share and $300 million of ordinary shares to be repurchased by GF, as described below. All of the shares in the offering are being offered by Mubadala Technology Investment Company (the “Selling Shareholder”). The Selling Shareholder is a wholly owned subsidiary of Mubadala Investment Company PJSC (which, together with its affiliates, is GF’s largest shareholder). The Selling Shareholder has also granted the underwriters a 30-day option to purchase up to an additional 3,000,000 of GF’s ordinary shares (equal to 15% of the initial ordinary shares being sold to the public) at the public offering price minus underwriting discounts and commissions. The offering is expected to close on March 13, 2026, subject to customary closing conditions.

GF is not selling any ordinary shares in the offering and will not receive any proceeds from the sale of the shares being offered by the Selling Shareholder.

GF has agreed to concurrently repurchase from the underwriters $300 million of the Selling Shareholder’s ordinary shares at a price per share equal to the price paid by the underwriters in the offering (the “Share Repurchase”). The Share Repurchase will be executed as part of the $500 million share repurchase authorization approved by the Board of Directors of GF in February 2026. GF intends to fund the Share Repurchase with cash on its balance sheet. GF expects the closing of the Share Repurchase to occur substantially simultaneously with the closing of the offering. The closing of the Share Repurchase is conditioned on the closing of the offering. The closing of the offering is not conditioned on the closing of the Share Repurchase. The Share Repurchase is not contingent on any exercise of the underwriters’ option to purchase additional shares in the offering, and any such exercise will not have any impact on the amount or price of the Share Repurchase. The underwriters are not receiving any discount or commission with respect to the ordinary shares being repurchased by GF pursuant to the Share Repurchase.

J.P. Morgan and Morgan Stanley are acting as lead book-running managers for the offering. BofA Securities, Citigroup and Goldman Sachs & Co. LLC are acting as active book-running managers for the offering. BNP Paribas, Evercore ISI and UBS Investment Bank are acting as additional book-running managers for the offering. Baird, Needham & Company, Raymond James, Wedbush Securities and Wolfe Capital Markets and Advisory are acting as co-managers for the offering.

The offering of these securities is being made only by means of a prospectus. A registration statement relating to these securities has been filed with the Securities and Exchange Commission (the “SEC”) and has become effective. A preliminary prospectus supplement and accompanying prospectus relating to the offering has been filed, and a final prospectus supplement and accompanying prospectus relating to the offering will be filed with the SEC. Copies of the final prospectus supplement and the accompanying prospectus relating to this offering may be obtained from: J.P. Morgan Securities LLC, c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717 or by email at [email protected] and [email protected]; Morgan Stanley & Co. LLC, Attention: Prospectus Department, 180 Varick Street, 2nd Floor, New York, NY 10014, or by email at [email protected] or by accessing the SEC’s website at www.sec.gov.

This press release shall not constitute an offer to sell or the solicitation of an offer to buy any securities, nor shall there be any sale of these securities in any state or jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction.

About GlobalFoundries
GF is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented, global team delivers results with an unwavering focus on security, longevity and sustainability.

©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners.

Forward-Looking Statements
This press release includes “forward-looking statements” that reflect our current expectations and views of future events. These forward-looking statements are made under the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995 and include but are not limited to, statements regarding the expected completion of the offering and the Share Repurchase. These statements are based on current expectations, assumptions, estimates, forecasts, projections and limited information available at the time they are made. Words such as “expect,” “anticipate,” “should,” “believe,” “hope,” “target,” “project,” “goals,” “estimate,” “potential,” “predict,” “may,” “will,” “might,” “could,” “intend,” “shall,” “outlook,” “on track,” and variations of these terms or the negative of these terms and similar expressions are intended to identify these forward-looking statements, although not all forward-looking statements contain these identifying words. Forward-looking statements are subject to a broad variety of risks and uncertainties, both known and unknown including regarding market conditions, our business and the Selling Shareholder. Any inaccuracy in our assumptions and estimates could affect the realization of the expectations or forecasts in these forward-looking statements. Recipients are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date such statements are made and should not be construed as statements of fact. Except to the extent required by federal securities laws, we undertake no obligation to update any information or any forward-looking statements as a result of new information, subsequent events, or any other circumstances after the date hereof, or to reflect the occurrence of unanticipated events. For a discussion of potential risks and uncertainties, please refer to the risk factors and cautionary statements in our 2025 Annual Report on Form 20-F, current reports on Form 6-K and other reports filed with the Securities and Exchange Commission. Copies of our SEC filings are available on our Investor Relations website, investors.gf.com, or from the SEC website, www.sec.gov.

Investor contact
[email protected]

Media contact
[email protected]

GlobalFoundries Announces Launch of Public Secondary Offering and Concurrent Share Repurchase

MALTA, N.Y., March 11, 2026 – GlobalFoundries (Nasdaq: GFS) (GF) today announced the launch of a secondary public offering of 20,000,000 ordinary shares to the public and approximately $300 million of ordinary shares to be repurchased by GF, as described below. All of the shares in the offering are being offered by Mubadala Technology Investment Company (the “Selling Shareholder”). The Selling Shareholder is a wholly owned subsidiary of Mubadala Investment Company PJSC (which, together with its affiliates, is GF’s largest shareholder). The Selling Shareholder is expected to grant the underwriters a 30-day option to purchase up to an additional 3,000,000 of GF’s ordinary shares (equal to 15% of the initial ordinary shares being sold to the public) at the public offering price minus underwriting discounts and commissions.

GF is not selling any ordinary shares in the offering and will not receive any proceeds from the sale of the shares being offered by the Selling Shareholder.

GF intends to concurrently repurchase from the underwriters approximately $300 million of the Selling Shareholder’s ordinary shares at a price per share equal to the price paid by the underwriters in the offering (the “Share Repurchase”). The Share Repurchase will be executed as part of the $500 million share repurchase authorization approved by the Board of Directors of GF in February 2026. GF intends to fund the Share Repurchase with cash on its balance sheet. GF expects the closing of the Share Repurchase to occur substantially simultaneously with the closing of the offering. The closing of the Share Repurchase is conditioned on the closing of the offering. The closing of the offering is not conditioned on the closing of the Share Repurchase. The Share Repurchase is not contingent on any exercise of the underwriters’ option to purchase additional shares in the offering, and any such exercise will not have any impact on the amount or price of the Share Repurchase. The underwriters are not receiving any discount or commission with respect to the ordinary shares being repurchased by GF pursuant to the Share Repurchase.

J.P. Morgan Securities LLC and Morgan Stanley & Co. LLC are acting as lead book-running managers for the offering.

The offering of these securities is being made only by means of a prospectus. A registration statement relating to these securities has been filed with the Securities and Exchange Commission (the “SEC”) and has become effective. A preliminary prospectus supplement and accompanying prospectus relating to the offering will be filed with the SEC. A copy of the preliminary prospectus relating to the offering, when available, may be obtained from: J.P. Morgan Securities LLC, c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717 or by email at [email protected] and [email protected]; Morgan Stanley & Co. LLC, Attention: Prospectus Department, 180 Varick Street, 2nd Floor, New York, NY 10014, or by email at [email protected] or by accessing the SEC’s website at www.sec.gov.

This press release shall not constitute an offer to sell or the solicitation of an offer to buy any securities, nor shall there be any sale of these securities in any state or jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction.

About GlobalFoundries
GF is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented, global team delivers results with an unwavering focus on security, longevity, and sustainability.

©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners.

Forward-Looking Statements
This press release includes “forward-looking statements” that reflect our current expectations and views of future events. These forward-looking statements are made under the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995 and include but are not limited to, statements regarding the terms, timing and expected completion of the offering and the Share Repurchase. These statements are based on current expectations, assumptions, estimates, forecasts, projections and limited information available at the time they are made. Words such as “expect,” “anticipate,” “should,” “believe,” “hope,” “target,” “project,” “goals,” “estimate,” “potential,” “predict,” “may,” “will,” “might,” “could,” “intend,” “shall,” “outlook,” “on track,” and variations of these terms or the negative of these terms and similar expressions are intended to identify these forward-looking statements, although not all forward-looking statements contain these identifying words. Forward-looking statements are subject to a broad variety of risks and uncertainties, both known and unknown, including regarding market conditions, our business and the Selling Shareholder. Any inaccuracy in our assumptions and estimates could affect the realization of the expectations or forecasts in these forward-looking statements. Recipients are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date such statements are made and should not be construed as statements of fact. Except to the extent required by federal securities laws, we undertake no obligation to update any information or any forward-looking statements as a result of new information, subsequent events, or any other circumstances after the date hereof, or to reflect the occurrence of unanticipated events. For a discussion of potential risks and uncertainties, please refer to the risk factors and cautionary statements in our 2025 Annual Report on Form 20-F, current reports on Form 6-K and other reports filed with the Securities and Exchange Commission. Copies of our SEC filings are available on our Investor Relations website, investors.gf.com, or from the SEC website, www.sec.gov.

Investor contact
[email protected]

Media contact
[email protected]

Embedding Physical AI at the RF edge for defense systems

How GlobalFoundries and MIPS enables “sense–think–act–communicate” architectures for radar, SATCOM, and electromagnetic advantage. 

Ashish Shah, Deputy Director, Aerospace and Defense, GlobalFoundries
Eric Schulte, Sales Director, MIPS

Defense RF platforms are evolving from “sense-and-stream” architectures to “sense–think–act–communicate” Physical AI architectures where inference and control occur as close to the antenna as possible to shorten decision loops and improve performance in contested environments. This shift is driven by rapidly increasing spectrum and waveform complexity, paired with strict size, weight, power and cost (SWaP‑C) constraints, and the growing need for trusted microelectronics in sensitive defense applications.

In practical terms, operators need RF systems that can adapt to dense spectral occupancy, interference, jamming/spoofing, multipath and complex multi-function sensor operations without relying on high latency backhaul to centralized compute. As spectrum becomes more crowded, and decisions more real time, defense systems must redesign RF architectures to achieve in-theatre electromagnetic advantage with closed-loop, edge-resident intelligence.

Physical AI is not a software add-on with associated high overhead. It is a real-time workload within the RF signal chain driving performance upgrades to RF fidelity, compute, power/thermal design and mission assurance from silicon through deployment.

What changes with Physical AI in RF systems (systems view)

Traditional RF architectures often capture, digitize and stream data to downstream processing, resulting in limited ability to respond quickly to dynamic threats or changing propagation conditions. Physical AI changes this paradigm by placing decision-making in the loop, enabling the RF system to sense–think–act–communicate.

For radar, SATCOM/communications and electromagnetic advantage, this Physical AI approach translates into energy efficient functions such as adaptive waveform selection, beam/mode scheduling, interference recognition/avoidance, emitter classification and spectral triage happening closer to the sensor—reducing latency and bandwidth demand while improving resilience.

RF systems block diagram

Three system-level challenges to address

1) RF fidelity (wide spectral bandwidth + dense interference)

Physical AI implementations in RF applications are only as good as the signals they receive. If the RF front end saturates, distorts, or loses linearity in the presence of blockers, downstream feature extraction and inference can be compromised. System architects should continue to improve linearity, isolation and predictable RF behavior as they look to implement Physical AI.

Example outcomes:

  • Radar: higher signal-to-noise ratio improves AI-assisted clutter/interference handling and classification.
  • SATCOM/Comms: stable front-end behavior improves interference avoidance and link adaptation decisions.
  • Signal Intelligence: high isolation protects feature extraction for real-time classification and geolocation under co-site emitters.

2) SWaP‑C + thermal headroom for in-loop inference and control

Implementing intelligence at this level adds compute and memory requirements near the RF sensor. Many defense platforms have tight power, thermal and size constraints while requiring deterministic timing. Embedded processors enable event-driven “compute bursts” (infer when needed, return to low-power monitoring when idle) and provide predictable control paths to keep the sensing loop stable while staying within constraints.

3) Uninterrupted supply of uncompromised microelectronics

Readiness and deterrence require assured access to microelectronics components that are securely designed, manufactured and tested, with robust protections for confidentiality and integrity and verifiable provenance traceability. Thwarting the adversary also demands less vulnerable microelectronics that integrate more of the digital and RF functions. For adaptive systems, primes also need a credible path for secure updates (firmware and models) via secure communications. GF technologies support both CMOS and high-performance RF circuit integration to design advanced signal processing functions with high performance RF signal chains.

GF and MIPS enable embedded Physical AI

Physical AI success depends on more than inference throughput. It requires deterministic closed-loop control inside the RF chain. MIPS embedded cores best serve as that decision and control anchor that turns RF observations into timely actions, supporting local classification, policy selection and real-time modification of the RF signal chain. Integrated using GF technologies, this approach can reduce integration and adversary compromise risk (fewer off chip interfaces), improve timing predictability and support qualification paths that require trusted manufacturing options.

MIPS anchors its value proposition with targeted solutions aligned to customer-specific workloads. This enables defense integrators to tune microarchitecture and real-time features to the exact sensing, classification and control loops required by mission profiles while simultaneously optimizing power and performance. By nature of the RISC-V instruction set architecture (ISA) being an open standard, customers can perform independent verification of the privilege models and security extensions while also avoiding vendor lock-in or any opaque microarchitectural behaviors. Additionally, the open standard of RISC-V enables tailored ISA extensions, hardware roots of trust and domain-specific cryptographic accelerators. Mission capability is advanced, and integration risks are mitigated by using MIPS Atlas Explorer virtual platform for digital engineering with software-first development. This digital twin of the CPU core provides early workload validation and pre-silicon performance modeling necessary for shortening development and qualification timelines. The entire Atlas portfolio from MIPS is purpose-built for Physical AI workloads by combining deterministic control, scalable compute and security primitives to support the next generation of RF systems.

MIPS embedded Physical AI cores at the RF edge (Proven Partner):

• Deterministic real-time control to close the sense→think→act→communicate loop near the RF data path 
• Configurable architecture to tailor compute to RF-control + lightweight inference workflows 
• Low-power integration aligned to SWaP‑C 
• Secure deployment alignment to support long-life platforms and controlled updates within trusted design, manufacturing, and test flows

Building the right RF-to-AI architecture from the start

If you are developing AI-assisted RF capabilities for radar, SATCOM/communications, or signal intelligence, GlobalFoundries can help map system requirements to the right combination of RF platform, help you architect embedded MIPS Physical AI cores and trusted secure supply options—accelerating from architecture definition to fielding tested qualified microelectronics while reducing system integration risk. Engage GF (MIPS) early to align on the embedded processor subsystem choices for deterministic Physical AI at the RF edge.