EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC January 30, 2025 Mannheim, Germany, January 30, 2025 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®. “This collaboration emphasizes EXTOLL´s strength in ultra-low power design, particularly on GF’s 22FDX process geometry enabling future communication innovations. We are happy and honored to jointly work with BeammWave on creating solutions for breakthrough digital beamforming technology,” says Dirk Wieberneit, CEO of EXTOLL. EXTOLL´s IP is optimized to deliver highest speeds at smallest footprint and lowest power consumption, enabling a super energy-efficient solution for chiplet-based systems and providing a unique solution for the rising demand on multiple lanes connections. The complete SerDes IP core supports line speeds up to 32 Gbps per lane and comes with generic support of various protocols and available on GF’s 22FDX, 12LP and 12LP+ platforms. GF’s 22FDX process technology offers superior RF/Mixed-Signal performance, power efficiency, SoC integration and radiation-hardened reliability for technologies in the communications infrastructure and SATCOM markets. 22FDX is the only fully depleted SOI solution that combines high-performance RF capabilities with high-speed, high-density digital logic, ensuring efficient and reliable connectivity for various applications like beamforming, which demand both power efficiency and high-speed connectivity. “We are thrilled to partner with EXTOLL on their industry leading Very Short Reach SerDes technology in 22nm,“ said Per-Olof Brandt, Chief Technology Officer at BeammWave. “Extoll is continuing to innovate on this important process node for us, enabling a unique solution for best-in-class power and performance that our customers need. This makes them a perfect fit for BeammWave´s ambitious mmWave products for 5G and 6G.” “As we see an increasing market demand for our 22FDX process technology in various beamforming applications, we are delighted to see our IP partner EXTOLL continuing to innovate on this node, enabling next-generation chiplet solutions based on their ultra-low power interconnect technologies,” said Ziv Hammer, Senior Vice President of Design Platforms and Services at GlobalFoundries. “GF remains fully committed to working with our partners and customers to deliver solutions for essential technologies that support global connectivity.” Please address your inquiries to [email protected] and visit our website at www.extoll.com. About EXTOLL EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC- and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces. EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age. Find out more about our products and solutions – please visit us at www.extoll.com About BeammWave BeammWave AB are experts in communication solutions for frequencies over 24GHz. The company is building a solution intended for 5G and 6G, in the form of a radio chip with antenna and associated algorithms. The company’s approach with digital beamforming is unique and patented, with the aim of delivering a solution with higher performance at a lower cost. The company’s Class B shares (BEAMMW B) are listed on the Nasdaq First North Growth Market in Stockholm. About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented and diverse team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit www.gf.com.
Celebrating GF’s Julio Costa, IEEE Fellow Class of 2025 January 29, 2025 GlobalFoundries (GF) is thrilled to celebrate the accomplishment of Julio Costa, our vice president of RF technology, being named among the IEEE Fellow Class of 2025. This prestigious recognition, the highest level of membership in the world’s largest technical professional organization, was awarded for his significant contributions to the development of RF silicon-on-insulator (SOI) technologies and circuits for mobile applications. Julio’s journey in the semiconductor industry spans nearly three decades, marked by groundbreaking innovations and a relentless pursuit of excellence. His work has not only advanced RF technology but has also helped position GF as the leading global manufacturer and design solutions provider of essential RF chips. Foundry Files sat down with Costa to discuss his thoughts on being named an IEEE Fellow, his journey with RF SOI technology, the challenges he faced, advice for aspiring inventors, and his vision for the future of RF chips. Julio Costa Q: Thank you for taking the time to meet! What was your initial reaction upon learning that you were elected an IEEE Fellow? Costa: I was extremely honored and just really humbled by the award. It’s something that every researcher in the electronic semiconductor area aspires to achieve. This recognition represents the culmination of over 20 years of hard work and dedication. It’s a testament to the pioneering contributions made in the development of RF SOI technology, which was virtually non-existent until the early 2000s. Can you explain the significance of RF SOI technology and its impact on the industry? RF SOI technology has been a game-changer for the mobile wireless industry. When we started this journey in the early 2000s, the industry relied on gallium arsenide switches, which were bulky, expensive and limited in performance. We set out to develop a silicon-based solution that would overcome these limitations. Today, RF SOI technology is a multi-billion-dollar market, and its switches and tuners are ubiquitous in modern cell phones, tablets and other devices. It’s hard to imagine life in 2025, with all of the gadgets we rely on, without RF SOI technology! What were some of the speed bumps along the path of RF SOI technology’s journey from the early 2000s to today? The development of RF SOI technology was not without its challenges, for everyone in the industry. For example, we discovered that having substrates with too high resistivity negatively impacted performance. It was a very subtle issue, but through perseverance and dedication, we were able to overcome these setbacks and achieve significant advancements. Linearity and power handling required the invention of specific SOI layers to overcome some very fundamental issues. Where are GF’s RF chips making a difference today? GF has established itself as a leader in the RF SOI market through innovation and excellence. Our RF chips are critical components in a wide range of end-markets, including smart mobile devices, communications infrastructure, automotive, Internet of Things (IoT), and aerospace and defense. For example, GF has led the way for 5G adoption in the cellular industry with our 7SW and 8SW RF SOI platforms that can be found in approximately 80% of all smartphones on the market. Our 9SW RF SOI platform, which we launched in 2024, is positioned for leadership in 5G and beyond. Not to mention our low power 22FDX platform, which delivers superior power efficiency and performance to RF devices across the world, from your smartphone to satellites and every stop between. You are a prolific inventor with more than 60 patents. What advice would you offer to young engineers aspiring to innovate and make an impact in the semiconductor industry? Perseverance is key. Find an area that you love and that you believe has potential for significant improvement and really dedicate yourself to it. Building strong relationships with experts in the field and being open to learning from them is also crucial. There will be setbacks, but it’s important to hold on, believe in the technology, and keep pushing forward. What is your approach to leadership? I consider myself a hands-on leader who enjoys getting involved in the technical aspects of projects while also focusing on strategic thinking. I value approachability and encourage open communication within my team. What’s next for RF? The future of RF technology is very exciting. We are facing challenges such as the increasing demand for high data rates, lower latency, and increasing congestion of existing frequency bands. New frequency bands between 6 GHz and 15 GHz will be crucial in meeting this demand. Additionally, AI will drive the need for higher data rates, and we are developing innovative solutions to address these emerging needs. Technologies like 3D heterogeneous engineering and RF gallium nitride will play a significant role in the future of RF technology. When you’re not in the lab or the office, what do you enjoy doing? Outside of work, I enjoy playing the piano, scuba diving and traveling. These hobbies provide me with a sense of relaxation and fulfillment outside of my professional life. Thank you again for taking the time, and congratulations again on your well-deserved honor! My pleasure, thank you!
GlobalFoundries Announces New York Advanced Packaging and Photonics Center January 17, 2025 First of-its-kind center will offer advanced packaging and test capabilities in New York for U.S.-made essential chips used in AI, automotive, aerospace and defense, and other applications MALTA, NY, January 17, 2025 — GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by investments from the State of New York and the U.S. Department of Commerce, the first-of-its-kind center aims to enable semiconductors to be securely manufactured, processed, packaged and tested entirely onshore in the United States to meet the growing demand for GF’s silicon photonics and other essential chips needed for critical end markets including AI, automotive, aerospace and defense, and communications. Growth in AI is driving the adoption of silicon photonics and 3D and heterogeneously integrated (HI) chips to meet power, bandwidth and density requirements in datacenters and edge devices. Silicon photonics chips are also positioned to address power and performance needs in automotive, communications, radar, and other critical infrastructure applications. To meet this growing demand, GF’s New York Advanced Packaging and Photonics Center is expected to offer: Advanced packaging, assembly and testing for GF’s differentiated silicon photonics platform, which brings together optical and electrical components on a single chip to realize power efficiencies and performance advantages. Full turnkey advanced packaging, bump, assembly and testing for aerospace and defense customers under GF’s Trusted Foundry accreditation, allowing chips used in sensitive national security systems to never leave the U.S. during production. New production capabilities for the advanced packaging, wafer-to-wafer bonding, assembly and testing of 3D and HI chips using GF’s 12LP+, 22FDX®, and other leading platforms. “We’re proud to partner at the state and federal level on this new center, which is a direct response to our customers asking for more geodiversity in their supply chains and additional support with advanced packaging solutions for GF silicon photonics, Trusted, and 3D/HI offerings,” said Dr. Thomas Caulfield, president and CEO of GF. “The New York Advanced Packaging and Photonics Center will be unique in our industry and will play a vital role in the continued growth of the Empire State’s world-class semiconductor manufacturing and innovation ecosystem.” The New York Advanced Packaging and Photonics Center aims to expand GF’s advanced packaging capabilities – the process of transforming chips into individual packages ready for end-product use – to provide customers an end-to-end U.S.-based solution for chips made at GF’s New York manufacturing facility. Across the semiconductor industry, most advanced packaging today takes place in Asia. GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next 10-plus years. These efforts are expected to create approximately 100 new full-time GF jobs in New York over the next five years. New York state will provide up to $20 million in new support for the new center, which is in addition to the previously announced $550 million in support for GF from the New York State Green CHIPS program. The U.S. Department of Commerce will provide up to $75 million in direct funding to support the center, supplementing the previously announced GF award under the CHIPS and Science Act. GF employs approximately 2,500 people at its Malta, New York, fab and has invested more than $16 billion in the facility since it opened in 2011. GF’s New York fab has Trusted Foundry accreditation and manufactures secure chips in partnership with the U.S. government. About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented and diverse team delivers results with an unyielding focus on security, longevity and sustainability. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. 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Quantum Motion Announces Record Integration of Quantum Devices and Partnership with Semiconductor Manufacturer, GlobalFoundries January 6, 2025
