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  • Quantum’s future depends on volume manufacturing

    Quantum computing is quickly moving out of the lab toward full utility scale. The theory has been understood for decades, and the first small-scale quantum computers are now operating in research labs around the world. What turns those systems into useful machines is exactly where GF excels. We bring differentiated process technology, deep co-development partnerships…

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  • Unlocking smaller, smarter RF front-ends with SLATE advanced packaging technology on 9SW

    As consumer demand accelerates for next-generation smart mobile devices and RF and battery performance requirements continue to rise, every square millimeter of board space matters. Front-end modules must support more bands, more functionality and more complex switching architectures without increasing footprint. Achieving this level of integration requires both advanced RF switch technology and innovative design…

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  • Shaping the future of RF: GF at IMS and RFIC 2026

    Last week at IMS and RFIC 2026 in Boston, we showcased our latest RF portfolio developments, demonstrating how differentiated process technologies are advancing next-generation applications across wireless connectivity, aerospace and defense, SATCOM and industrial systems. At the GF booth, attendees engaged with our technology experts and explored live wafer displays, including GF RFGaN1 (130RFGaN) and…

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  • Scaling RF power and efficiency: How GF is bringing RF GaN to system-level reality

    Just as the proliferation of AI is driving data center growth, the rising demand of mobile data traffic is driving next-generation wireless communications systems. Across SATCOM, aerospace, defense and communications infrastructure, next-generation RF systems must deliver higher output power, wider bandwidth and increased efficiency while simultaneously reducing system size, cost and complexity. The innovative engine…

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  • From Artemis II to deep space: why space-grade chips must be built for the harshest conditions

    When Artemis II lifted astronauts beyond Low Earth Orbit for the first time in more than 50 years, it marked another milestone in human exploration. But missions like these are only possible because of electronics that perform flawlessly in one of the most unforgiving environments imaginable. Navigation, communication and life-support systems for modern spaceflight all…

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  • Building what comes next: Why startups need a manufacturing-first approach to innovation

    The defining challenge in advanced semiconductor innovation today is aligning breakthrough ideas with the realities of manufacturing as early as possible. As architecture becomes more interdisciplinary and system‑driven, early technical decisions increasingly shape what can ultimately be built, produced and sustained over time. When manufacturability, yield and system level integration are addressed late, options quickly…

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  • From electrons to photons: Scaling optical connectivity with silicon photonics and SiGe

    AI infrastructure is scaling simultaneously within the rack, across the data center and between data center campuses. That multidimensional growth is redefining the industry’s core challenge. The constraint is no longer compute alone, but the speed, efficiency and reliability of data movement at scale. As AI workloads grow more distributed and bandwidth-intensive, the industry is…

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  • How GlobalFoundries’ “virtual fabs” are redefining semiconductor manufacturing

    Imagine a world where semiconductor manufacturing operations extend beyond the physical boundaries of the wafer fabrication plant (“fab”). A world where engineering support, data analytics and process optimization teams are seamlessly working 24/7 across time zones and locations, delivering speed and efficiency to customers. That’s the idea behind GlobalFoundries’ Global Fab Engineering Services (GFES), a…

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  • A conversation with GF’s pioneer silicon photonics leader and Optica Fellow Dr. Yusheng Bian

    Silicon photonics didn’t become a manufacturing reality overnight, and few people have shaped that journey as directly as Dr. Yusheng Bian. Recently named an Optica Fellow for transformative contributions to silicon photonics, Bian has spent almost a decade at GF advancing the innovations that underpin scalable, high‑volume CMOS platforms. Following his recognition as an Optica…

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