Santa Clara, Calif., October 1, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced that it has received the 2014 award for Excellence in Silicon Ecosystems from Cisco.

This prestigious award recognizes GF for performing beyond expectations by partnering with Cisco as a critical sub-tier supply chain partner on developing advanced technologies in the areas of silicon wafer manufacturing, IC packaging, assembly and test. The distinction was awarded during Cisco’s 23rd Annual Supplier Appreciation Event, held September 18 at the Santa Clara Convention Center.

“Our Supplier Appreciation Awards give us an opportunity to highlight exceptional performances by the very best of our extended supply chain,” said Gary Cooper, vice president, Global Supplier Management, Cisco. “These partners have demonstrated outstanding achievement in their core operations, and consistently exceeded expectations in supporting the success of Cisco and our customers.”

Cisco presented awards to suppliers in recognition of their contributions to Cisco’s success in fiscal year 2014. At the event, Cisco recognized the hard work and dedication of its strategic suppliers and manufacturing partners—underscoring the company’s commitment to close collaboration with its supply network to drive customer satisfaction, innovation, and operational efficiency.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

CONTACTS:

Jason Gorss
GF
518-305-9022
[email protected]

New Scholarship Recognizes Rising Semiconductor Industry Talent

Santa Clara, California, September 9, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced the “GF Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry. The GF Undergraduate Research Scholarship will fund undergraduate research opportunities (URO) and intern scholars through the Semiconductor Research Corporation’s (SRC) Education Alliance.

Presented at SRC’s annual TECHCON conference in Austin, Texas, the scholarship was created by GF in partnership with SRC to recognize and reward science, technology and engineering students who demonstrate promise in their academic and professional efforts. The selected recipients of this scholarship will have the opportunity to interact with GF researchers and access the professional resources of SRC and the SRC Education Alliance.

“Building a pipeline of highly skilled talent is essential to our business and to the competitiveness of the entire semiconductor industry,” said Suresh Venkatesan, senior vice president of technology development, GF. “SRC connects companies with the top universities, which results in exciting research and educational opportunities for the best and the brightest students. The GF Undergraduate Research Scholarship gives us the opportunity to support science, technology, engineering and mathematics education and help develop the technical leaders who will continue to drive innovation in the semiconductor industry in the future.”

Until recently, SRC focused exclusively on students seeking advanced degrees, providing fellowships for them to do university research that had practical applications for corporate members of its unique consortium. The URO is SRC’s innovative program providing undergraduates with valuable research experience and mentoring. The goal of the URO is to empower bright, well-educated, and experienced scientists and engineers for which U.S. high-tech companies are seeking.

“Recognizing the critical importance of a strong pipeline of new talent for the semiconductor industry, the SRC Education Alliance through the URO Program provides financial assistance to undergraduates, allowing students and universities to recognize the connections between the materials they are learning in the classroom and the technological innovations that transform the world,” said SRC President Larry Sumney. “We are thrilled to collaborate with GF as we continue to develop our URO program.”

Rising sophomores, juniors and seniors in an accredited undergraduate program majoring in the field of engineering are encouraged to apply. Additional information about the scholarship can be obtained by visiting: www.src.org/program/srcea/uro/globalfoundries.

Every year TECHCON brings together the brightest minds in microelectronics research to exchange news about the progress of new materials and processes created by SRC’s network of more than 100 of the top engineering universities. Students and industry leaders discuss basic research that is intended to accelerate advancements for both private and public entities.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contact:

Travis Bullard
GF
(518) 305-9025
[email protected]

ArcticLink® 3 S2 silicon platform to use 65nm process technologies

Sunnyvale and Santa Clara, Calif., September 8, 2014 – QuickLogic Corporation (NASDAQ: QUIK), the innovator of ultra-low power programmable Customer Specific Standard Products (CSSPs), and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced that QuickLogic’s next-generation ArcticLink 3 S2 Ultra-low Power Sensor Hub is sampling on GF’s low-power 65 nanometer (nm) process technology.

The ArcticLink 3 S2 Sensor Hub is an ultra-low power, context-aware sensor hub optimized for smartphone and wearable devices. Building on QuickLogic’s ArcticLink 3 S1, the S2 offers OEMs four times the computational capability, four times the sensor algorithm memory, and eight times the sensor data memory in a pin-identical footprint.

The ArcticLink® 3 S2 leverages GF’s 65nm LPe (low-power enhanced) technology, which uses innovative leakage reduction techniques to significantly improve power utilization and extend battery life, making it especially well-suited for battery-operated and cost-sensitive mobile applications. The S2 Sensor Hub is expected to be production-certified in Q4 2014.

“The fast-growing market for sensor hubs in smartphones and wearables presents a wide array of new applications that match perfectly with our ArcticLink 3 S2 sensor hub solution,” said Brian Faith, VP of worldwide sales and marketing at QuickLogic. “This new collaboration with GF as the manufacturer for the S2 platform will help us meet our demanding time-to-market requirements with a technology that delivers the right balance of performance, power consumption, and cost.”

“As the industry continues its seismic shift from PC to mobility, a whole new set of applications and devices are driving the need for differentiated silicon solutions,” said Gregg Bartlett, senior vice president of product management at GF. “Innovative designers like QuickLogic need a collaborative foundry to help them bring their creative ideas to market, and we are pleased to partner with them to deliver their next-generation sensor hub on our 65nm technology.”

About QuickLogic

QuickLogic Corporation is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon platforms plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit www.quicklogic.com

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contacts:

Jason Gorss
GLOBALFOUNDRIES
(518) 305-9022
[email protected]

Andrea Vedanayagam
Veda Communications
(408) 656-4494
[email protected]

Santa Clara, Calif., September 4, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, announced today that Louis “Lou” Lupin has joined the company as senior vice president and chief legal officer. In this role, Lupin is responsible for the company’s global legal affairs including litigation, intellectual property and corporate matters and will oversee all compliance programs. Lupin has also assumed the role as secretary to the GF board of directors.

Lupin succeeds Alexie Lee, who had served as GF’s general counsel since the inception of the company and who has recently taken on the role of chief of staff to the CEO.

“Lou is an accomplished and respected corporate general counsel with nearly 30 years of experience in litigation, intellectual property licensing, strategic relationships and portfolio management,” said Sanjay Jha, CEO, GF. “Moreover, he has a keen understanding of technology, which is critical to our success. We are excited to have Lou join the GF leadership team.”

Before joining GF, Lupin was a legal consultant to Qualcomm Incorporated since 2008. Prior to that, he served as Qualcomm’s executive vice president, general counsel, and assistant secretary to the board, and as a member of the executive committee. He also sits on the advisory boards of a number of public and private companies.

Previous to Qualcomm, Lupin was a partner with Cooley, Godward, Castro, Huddleson and Tatum (now Cooley LLP) where he focused on intellectual property litigation in the telecommunications, software and biotechnology industries. He also served as a special agent for the U.S. Department of Justice, Drug Enforcement Administration and a border patrol agent for the U.S. Department of Justice, Immigration and Naturalization Service.

Lupin holds a bachelor’s degree from Swarthmore College and a J.D. from Stanford Law School.

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About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contacts:

Travis Bullard
GF
(518) 305-9025
[email protected]

CEO Sanjay Jha expands executive team to help lead next phase of growth

Santa Clara, Calif., August 4, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, announced today the addition of William “Bill” Davidson, Jr. as senior vice president and chief administrative officer (CAO), strengthening the company’s leadership team. As the company’s first CAO, Davidson takes over global leadership of critical corporate functions supporting the company’s worldwide operations including Human Resources, IT, Corporate Marketing and Communications, Government Relations, and Risk Management, Sustainability and Real Estate.

“Bill is an accomplished industry executive who brings to GF a strong track record of managerial success,” said Sanjay Jha, CEO, GF. “His ability to develop and lead global teams across complex organizations will help drive our next phase of growth.”

Davidson joins GF with more than 25 years of experience in leading technical sales, marketing and general management roles in the telecommunications and semiconductor industries. He most recently served in a dual role as senior vice president, strategy and operations and senior vice president, investor relations at Qualcomm Inc. In these roles, Davidson oversaw reporting and operations, executed on strategic global business initiatives, and served as the primary liaison with the investment community and Qualcomm shareholders. During his time at Qualcomm, Davidson also led global marketing and communications for more than six years.

Davidson also spent 13 years at Bell Atlantic where he gained substantial experience in the wireline business at New Jersey Bell, as well as serving as vice president of wireless data sales and marketing for Bell Atlantic Mobile. Davidson’s background also includes serving as vice president of commercial sales operations for GE Capital’s telecommunications financial services division.

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About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contacts:

Travis Bullard
GF
(518) 305-9025
[email protected]

JSR Corporation, Lam Research, Tokyo Electron Ltd. and SUMCO Corporation honored for outstanding collaboration, service and cost leadership

Santa Clara, Calif., June 19, 2014 – GLOBALFOUNDRIES today recognized the winners of its first-ever global Supplier Awards at the company’s 2014 Supplier Day event in Malta, NY. Recipients were recognized for their exceptional collaboration and support, as well as a demonstrated ability to perform at the highest level based on the specific needs of GF.

JSR Corporation was named the recipient of the Excellence Award for Collaboration and Sustained Support. JSR Corporation, headquartered in Tokyo, provides advanced materials for the semiconductor, flat panel display, and optical materials fields. JSR Corporation demonstrated superior collaboration with GF on programs that drive defectivity improvement cost-effectively. JSR Corporation is the first supplier to meet GF’s formal award criteria.

Additionally, Spotlight Awards for suppliers that exhibited superior performance and collaboration were presented to Lam Research, Tokyo Electron Ltd. and SUMCO Corporation.

“The goal of the Supplier Day event and Awards is to strengthen relationships with key suppliers who are committed to collaborating with GF to deliver maximum value to our customers,” said Magnus Matthiasson, GF chief procurement officer. “We are pleased to recognize suppliers that support GF’s commitment to manufacturing excellence, and we thank them for their dedication and support.”

The Supplier Day event provides a collaborative forum to foster strong supplier relationships and continually improve GF’s supply chain capabilities. This year’s event, themed ‘Collaborative Growth,’ drew top executives from over 30 of GF key suppliers.

This is GF’s first annual Supplier Awards, a program that is being launched to recognize supplier excellence. The program identifies the highest performing suppliers by assessing their execution to GF’s goals for technology, quality, cost and operational indicators.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contact:

Jessica Kerley
GF
(518) 305-9469
[email protected]

Sophia Antipolis – France, Santa Clara – Calif, June 4, 2014: Scaleo chip today announced that they are the first fabless company to introduce an automotive microcontroller manufactured with the new GLOBALFOUNDRIES 55nm automotive-specific advanced semiconductor manufacturing platform.

Scaleo chip, the leading fabless semiconductor company in automotive electronics for powertrain, body control and driver-information, has used the GF 55nm eFlash NVM Platform to develop a new family of microcontrollers embedding unique technologies related to real-time process and control of highly electrified internal combustion engines and electric motors based on programmable logic (AMEC®), as well as a set of ISO 26262 compliant functional safety features which improve powertrain system safety integrity and accuracy (SILant®).

GF, a leading provider of advanced semiconductor manufacturing technology and a member of the Automotive Electronics Council (AEC), developed the optimized semiconductor manufacturing platform to specifically meet the stringent and evolving needs of the automotive industry. Built on the company’s 55nm Low Power process and AEC-Q100 Group D qualified, the platform supports the implementation of non-volatile memory (NVM) in MCUs and SoC designs, as well as best-in-class, automotive grade SST-based embedded flash technology.

With a projected revenue growth of about 11% over the 2013-2016 period, automotive semiconductors are one of the fastest growing segments, with about twice the growth rate of the mobile device segment. The growing need for fuel-efficient, eco-friendly, safer and more connected cars is sustaining an increase of electronics content in vehicles. Powertrain applications are one of the fastest growing sub-segments and car manufacturers require more integrated, powerful and complex electronic systems to address both the stringent ISO 26262 functional safety standard along with mandatory reduction of emissions and fuel consumption.

“The growing need for advanced automotive electronics is driving semiconductor companies to strengthen their collaboration with foundry partners, so together we can act at all levels of the supply chain to provide the best products to our customers,” said Ana Hunter, vice president of product management at GF. “The combination of Scaleo chip’s new microcontrollers and our 55nm automotive platform will improve the efficiency, performance, and power consumption of automotive ICs while maintaining adherence to the industry’s strict safety and quality standards.”

“Above and beyond the quality and efficiency of GF’s technology and team, their long-term commitment to the automotive market, demonstrated by their current investment and roadmap, is a key foundation of our preference for the GF 55nm eFlash NVM Platform,” said Bruno Paucard, President & CEO of Scaleo chip. “We see GF as a critical partner for us, fully supporting the success of Scaleo chip and our products as well as the satisfaction of our customers.”

OLEA microcontroller silicon samples are already available for selected customers. Demonstration of the first plug-in, full hybrid demonstration car powered by OLEA microcontrollers will be available shortly.

About Scaleo chip:

Scaleo chip is a fabless semiconductor company that designs, develops and sells complete and high value solutions, combining System-on-Chip (SoC) and embedded software for the future of automotive electronics industry. Scaleo chip product offering includes standard automotive microcontrollers addressing powertrain, body control, driver information and infotainment applications. The company leverages its technology and know-how by offering additionally custom products development and manufacturing for applications requiring added quality constraints as in defense or industrial markets. Scaleo chip is headquartered in Sophia-Antipolis, France. For more information, visit: scaleochip.com.

About GF:

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Communication/Press contact:

Scaleo chip
Marie Redureau
Tel: +33 (0)497 152 050
E-mail: [email protected]

GF
Jason Gorss
Tel: (518) 305-9022
E-mail: [email protected]

Marketing/Sales contact:

Scaleo chip
Tel: +33 (0)497 152 000
E-mail: [email protected]

Santa Clara, Calif., May 14, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today appointed Dr. Thomas Caulfield as senior vice president and general manager of the company’s latest leading-edge 300mm semiconductor wafer manufacturing facility (Fab 8), located in Saratoga County, NY. Caulfield, an accomplished industry leader with more than 20 years of technical and global executive experience, will lead the operations, expansion and ramp of semiconductor manufacturing production at Fab 8, where GF supports customers on the world’s most advanced semiconductor manufacturing technology platforms including 28 nanometer (nm), 20nm, and the recently announced 14nm FinFET platform.

“We are expanding our Fab 8 manufacturing campus, strengthening strategic partnerships, and deepening customer relationships so we can offer our customers leading-edge technology and a more flexible and cost-effective way of doing business,” said GF CEO Sanjay Jha. “Tom is a proven and respected industry leader with more than two decades of semiconductor technology and manufacturing experience and we are excited to have him join our team to drive the next phase of growth at Fab 8.”

Caulfield joins GF with an impressive track record of results through his extensive career spanning engineering, management, operational leadership and global executive experience with leading technology companies.

Most recently, Caulfield served as president and chief operations officer (COO) at Soraa, the world’s leading developer of GaN on GaN™ (gallium nitride on gallium nitride) solid-state lighting technology. Prior to Soraa, Caulfield served as president and COO of Ausra, a leading provider of large-scale concentrated solar power solutions for electricity generation and industrial steam production. Before leading global operations at Ausra, Caulfield served as executive vice president of sales, marketing and customer service at Novellus Systems, Inc. where he oversaw world-wide field operations for over 1,200 employees.

Prior to joining Novellus Systems, Caulfield spent 17 years at IBM in a variety of senior leadership roles, ultimately serving as vice president of 300mm semiconductor operations for IBM’s Microelectronics Division, leading its state-of-the-art wafer fabrication operations in East Fishkill, NY.

Construction on the Fab 8 project began in July 2009 and the facility is currently supporting multiple customers on multiple technology platforms, as well as completing construction on additional manufacturing facilities to support increased customer demand. Since 2009 the project has created approximately 2,200 new direct jobs and expects to create an additional 600 jobs through the end of the year, supporting more than approximately 10,000 indirect jobs in the economy based on research by the Semiconductor Industry Association. In addition, the project has required more than 6 million man hours to complete and created more than 10,000 new construction jobs and thousands of additional construction-related jobs since 2009.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers.

With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contacts:

Travis Bullard
GF
(518) 305-9025
[email protected]

55nm solution provides advanced technology and comprehensive design enablement support optimized to meet unique requirements of in-vehicle ICs

Santa Clara, Calif., May 7, 2014 – GLOBALFOUNDRIES today introduced an optimized semiconductor manufacturing platform aimed specifically at meeting the stringent and evolving needs of the automotive industry. Built on the company’s 55-nanometer (nm) Low Power process and AEC-Q100 Group D qualified, the solution includes a comprehensive set of technology and design enablement capabilities tailored to improve the efficiency, performance, and power consumption of automotive ICs while maintaining adherence to the industry’s strict safety and quality standards.

The automotive platform is a comprehensive solution consisting of the necessary design tool support, IP, technology, and services to leverage GF’s 55nm low power process. It allows customers to quickly migrate their automotive microcontrollers, ASSPs and ASICs to a more advanced technology, leveraging the significant area, performance and power benefits of the process. The platform supports the implementation of non-volatile memory (NVM) in MCUs and SoC designs, as well as best-in-class SST-based embedded flash technology of automotive grade with an endurance of 100K erase/program cycles or higher and data retention of more than 20 years.

GF, a member of the Automotive Electronics Council (AEC), has developed the 55nm automotive platform to address critical industry trends, such as increased fuel economy and safety standards, along with higher consumer demand for in-vehicle information and entertainment. By delivering a foundry-based solution, the company is providing needed advanced manufacturing capabilities and services to OEMs and IDMs that are developing more sophisticated and efficient semiconductors to power safety, body, powertrain and infotainment applications in vehicles.

“Vehicle manufacturers and their suppliers are facing extremely challenging requirements by both regulators and customers. Better fuel efficiency, higher safety standards, increased in-vehicle communications capabilities and more demanding consumer requirements are all driving the need for more performance and lower power ICs for these systems,” said Paul Colestock, director of segment marketing at GF. “We are applying our advanced manufacturing technology to address these requirements directly with our focused automotive platform. This provides OEMs and IDMs with a full-service, cost-effective and reduced-risk foundry solution that enables an efficient implementation of advanced capabilities within the unique demands of the automotive electronics segment.”

Design enablement focused on unique needs of automotive sector

The platform’s complete design enablement support through certified models and design rules, PDKs and EDA tools support streamline the automotive IC design process. Its automotive-specific flow includes defect detection, defect reduction and outlier controls to provide significant improvement in quality and reliability. Robust design-for-manufacturing (DFM) support for automotive builds in quality and yield at the design stage.

The automotive platform supports the use of ARM core technology with a variety of standard cell and compilers, as well as IP blocks for GPIO, interface, and oscillator functions.

The platform is backed by an automotive services package to meet automotive grade quality and reliability requirements. The services offering includes 15 years record retention, a continuous improvement program with the aim to achieve “Zero Defects”, and comprehensive failure analysis and 8D problem resolution.

The 55nm low power process PDK, embedded flash PDK, and flash macro design service are available now.

Partnership will enable FFSA and ASIC solutions on GLOBALFOUNDRIES technologies

Santa Clara, Calif., April 21, 2014 – GF today announced that Toshiba Corporation will join the company’s GLOBALSOLUTIONS ecosystem of partners. As a worldwide ASIC partner, Toshiba will enable its Fit Fast Structured Array (FFSATM) and ASIC solutions based upon GF’s technologies and services for customers across the globe.

The agreement includes participation on multi-project wafer (MPW) runs and production wafers covering the whole portfolio of GF technologies, including leading-edge process nodes.

Initially, the partnership will focus on implementations of Toshiba’s FFSAs manufactured with GF’s 65nm and 40nm low-power process technologies, with 28nm arrays to follow. Toshiba’s FFSA products—including libraries and intellectual property (IP)—allow customers to reduce development time and costs by customizing existing base wafers, choosing from a number of design platforms at GF. For higher-volume applications, customers can work with Toshiba’s libraries to develop fully custom system-on-chips (SoCs). With an initial product completed, customers can then leverage the embedded FFSA technology to provide quick-turn derivative products, with much lower development costs.

“We are very pleased to join GLOBALSOLUTIONS Ecosystem as Worldwide ASIC Partner.” said Tatsuo Noguchi, Vice President, Toshiba Corporation Semiconductor & Storage Products Company. “Our FFSATM products, developed with BaySand licensed technology and in collaboration with BaySand Inc. of the U.S., can be configured simply by customizing the design of a few metal layers, and satisfy increasing market needs for high performance and low power technologies. We believe that GF customers will benefit from our FFSATM.”

“We are excited to have Toshiba, one of the world’s leading semiconductor companies, join our GLOBALSOLUTIONS ecosystem,” said Chuck Fox, senior vice president of worldwide sales at GF. “Toshiba has a strong track record of providing ASIC solutions throughout the world. We believe that many of our customers will benefit from the combination of Toshiba’s world-class design resources and our proven 65nm, 40nm, and 28nm process technology.”

GLOBALSOLUTIONS is the sum of GF’s internal resources and ecosystem partners, combined to efficiently enable the fastest time-to-volume for GF’s customers. The GLOBALSOLUTIONS ecosystem includes partners in all aspects of design enablement and turnkey services, OPC and mask operations, and advanced capabilities in assembly solutions.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit https://www.globalfoundries.com

CONTACTS:

Jason Gorss
GF
518-305-9022
[email protected]