GF’s First Decade: Finding Their Center September 30, 2019By: Dave Lammers The second of a three-part series looking back at GF’s first 10 years, and looking forward to the next decade and beyond. GLOBALFOUNDRIES’ first decade was a ten-year period during which the foundry met a series of remarkable challenges, ranging from technology transitions that tested the mettle of its staff to decisions about how to differentiate GF from its competition. How GF got from delivering just a few technology solutions for AMD in 2009 to where it is today – with a portfolio of RF-based solutions dominating the marketplace and a serious thrust underway in fully depleted SOI – is arguably the most interesting story in the semiconductor industry over the past decade. The journey to build an at-scale global semiconductor manufacturerSource: GF I talked to Gregg Bartlett, now GF’s head of engineering and technology, who was recruited to join the brand-new company at the very beginning. Bartlett remembers 2009 as the year when he joined GLOBALFOUNDRIES and immediately was thrust into what was a demanding start for the new foundry, but it also was a time when management learned to assess how much risk it should take on technology and product transitions – a valuable lesson. A Challenging Beginning GF, spun out from AMD in early 2009 with financial backing from Abu Dhabi’s Mubadala investment fund, was immediately tasked with bringing up a new AMD product architecture, on a new 32nm high-k/metal gate process. That combination proved to be very challenging to build in high volume production. Bartlett recalled, AMD’s flagship new “APU” part –which pioneered the combination of a graphics processing engine and a CPU core on one die – required focused execution at GF’s flagship fab in Dresden, Germany. “It was quite a humbling time, a really difficult time – but we persevered,” Bartlett said. Patrick Moorhead, now an industry analyst at Moor Insights & Strategy, was part of AMD’s management team a decade ago. “If you look at it from a historical perspective, Llano had one of the first large pieces of graphics IP that was integrated with the APU. At that time, no smart phone processor was delivering anything like it. But getting it going came in fits and starts, and there were super, super challenges in getting that part going.” Bartlett said the main lesson GF management learned was to manage the amount of risk being taken. “Right out of the chute, GF was trying to be something that was going to be hard to do, introduce a revolutionary new silicon technology. We tried to change our chip architecture, while at the same time making technological innovations. I look at our company today, and can say we have learned a lot about working with customers to better manage technology innovation with customer design innovation.” From Three to 300 Customers Then in 2010 GF’s management, with backing from the leadership at the Mubadala fund, acquired Chartered Semiconductor. GF and the Dresden fab had produced just a few different parts for a small group of customers who needed the leading-edge technology offered in the fab, and Bartlett said GF’s management realized it needed to learn to deal with multiple customers with various process technologies. “We asked ourselves then: How do you change a fab with three customers to one with 30 customers, and then 300 customers? How do you change your business processes? The answer was, of course: not easily. Chartered brought us skills and processes to deal with hundreds of customers all at once,” Bartlett said, praising the “customer orientation” that Chartered’s Singapore team brought into the GF culture. GLOBALFOUNDRIES acquired the Singapore site from Chartered Semiconductor on January 13, 2010. Chartered Semiconductor originally opened the fab in 1995. It was one of the first 200mm fabs. Source: GF “What Chartered had figured out was how to always have contingency plans for customers to ensure they hit their market introductions,” he said. Bartlett gave credit to the leaders at the Mubadala investment fund, saying they were “willing to make the large investment in acquiring Chartered, knowing how transformative the acquisition was.” The acquisition gave GF several 200 and 300mm fabs in Singapore, and roughly 200 customers. The acquisition began a transformation of the new foundry, creating a process of dealing with many dozens of customers. “This was an inorganic transformation that accelerated our ability to operate as a global foundry. Today, Singapore is a very successful part of our corporation and has proliferated processes and talent across our company,” Bartlett said. A ‘Very Fortuitous” Cooperation Building on lessons learned from Dresden’s work on the 32/28nm node, five years later the new Malta fab faced the challenge at the 14nm node, when FinFETs were first introduced. This time, GF and AMD came through it smoothly, with Moorhead describing the happy endpoint: “When the first versions of (the AMD 14nm) Ryzen came out, as an industry analyst I had to ask myself, ‘What is not going to work?’ It is one thing to ship a few thousand samples, but shipping hundreds of thousands, and then millions, is a different thing. It was a super-impressive ramp, to say the least. And to do that while outperforming many of Intel’s products on cache cell size, on performance of the transistors, on power consumption and the amount of heat, was truly remarkable.” GF’s groundbreaking ceremony to officially start construction of the Admin 2 office building as part of Fab 8 in Saratoga County, New York. Source: GF Learning to Collaborate To achieve that 14nm success, GF went through an honest self-appraisal. Bartlett, who by then was GF’s chief technology officer, recalls that at the time, members of the IBM technology alliance all had come up with different answers to the 14nm node. IBM was pursuing an SOI-based process that included its deep-trench embedded DRAM, while GF and Samsung went their separate ways toward bulk CMOS finFET 14nm processes. While GF and Samsung were holding intermittent discussions about if and how to cooperate, they realized cooperation was a good way to manage supply risk for a very large customer in the mobile space. This brought GF and Samsung together to collaborate on deployment of a single technology between the two companies. When it became apparent that there was a deal, that turned out to be very beneficial,” Bartlett said. By working with Samsung on 14nm, GF accelerated its transition to go into high-volume manufacturing. At the same time, GF was able to grow the technology development team in Malta that is now differentiating that platform for more applications and customers today. A First Step Toward Differentiation with FD-SOI Bartlett said that when GF was in the process of acquiring IBM Microelectronics, management concluded it needed a technology diversification strategy, something different than what its main competitor was doing at the 28nm node. “FD-SOI was our first conscious choice to differentiate on a technology platform. Rather than go imitate the industry leader, we decided to drive a superior technology solution for market segments we believed needed FDSOI such as IoT and integrated RF,” Bartlett said. GF’s 22FDX platform technology relies on planar transistors as well as fully-depleted SOI wafersSource: GF That ability to make tough decisions, to be flexible, was needed again last year, when GF’s new management team, led by Tom Caulfield, concluded that it needed to pivot away from 7nm to be more relevant to our customers. This pivot freed development resources, allowing more investment in the technology platforms that the majority of GF’s customer base was using, including 12nm FinFET, 22FDX®, RF, silicon photonics and other platforms. Moorhead said he believes the 22FDX process has power advantages for edge processing that will play a major role as 5G RF and data processing converge. “The opportunity for GF is huge. 5G — and all of the associated circuitry that goes with it – will be fundamentally connected to the Internet of Things. That is going to define the next ten years. It gets us to hyper-connectivity,” Moorhead said. I asked Bartlett if GF’s experiences over its first decade had created a battle-tested workforce, better able to meet future challenges. “We’ve learned a lot from our first ten years of existence, understanding which decisions we got right, and which ones we got wrong and why. And when we got them wrong, to have gone through them together as one GF team means we are better able to deal with future challenges.” he said. “Will we make mistakes going forward? Very likely, but not because we hadn’t considered the risks. When I look at our company today, we have learned a lot about how you support our customers, how you manage the risk you are taking, and most importantly about being relevant to the customers where their needs align with core capabilities. We know who we are, where our core competencies are and are excited for a future going on offense with those capabilities.” In the final installment in this series, we will examine the future of GF and how its differentiated portfolio will enable its customers and change the industry that’s changing the world. About Author Dave Lammers Dave Lammers is a contributing writer for Solid State Technology and a contributing blogger for GF’s Foundry Files. Dave started writing about the semiconductor industry while working at the Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry. He joined E.E. Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave received a master’s in journalism at the University of Missouri School of Journalism.
CSEM joins GLOBALFOUNDRIES’ FDXcelerator™ Program bringing ultra-low-Power IP to 22FDX® process September 24, 2019CSEM, a leader in low-power RFIC design and embedded systems, announced today at GLOBALFOUNDRIES (GF) annual Global Technology Conference (GTC) that CSEM is developing ultra-low power Bluetooth Low Energy® (BLE), CMOS radar mmWave IP and embedded machine-learning accelerators on GLOBALFOUNDRIES (GF) 22nm FD-SOI (22FDX®) platform.
Evaluation Boards Now Available for Flex Logix EFLX® 4K eFPGA on GLOBALFOUNDRIES’ Most Advanced FinFET Platform September 24, 2019Flex Logix Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, today announced that it has received working first silicon of its validation chip for the EFLX 4K eFPGA IP cores running on GLOBALFOUNDRIES (GF) 12nm Leading-Performance (12LP) FinFET platform and newly announced 12LP+ solution. The chip is currently in characterization and Flex Logix will be demonstrating the evaluation board at the GLOBALFOUNDRIES Technology Conference (GTC 2019) on Tuesday, September 24 in Santa Clara California.
格芯推出适合云端和边缘人工智能应用的12LP+ FinFET解决方案 September 24, 2019该创新解决方案基于格芯最先进的FinFET平台，具有一流的性能、能够满足不断变化的人工智能需求的多项全新重要特性、引人注目的经济效应和业界领先的Arm物理IP 加利福尼亚州圣克拉拉，2019年9月24日——作为先进的特殊工艺半导体代工厂，格芯(GlobalFoundries)今日在其全球技术大会上宣布推出12LP+，这是一种适合人工智能训练和推理应用的全新创新解决方案。12LP+为芯片设计者提供了性能、功耗和尺寸的一流组合，以及一系列新的重要特性、成熟的设计和产品生态系统、经济高效的开发和快速的上市时间，适合快速增长的云端和边缘人工智能应用。 格芯的新型12LP+基于格芯现有的12nm领先性能（12LP）平台，与基础12LP平台相比，性能提高20%或功耗降低了40%，而且逻辑区面积减少了15%。一个重要特性是具有高速、低功耗的0.5V SRAM位单元，用于支持处理器和存储器之间进行高速、节能的数据传输，对于计算和有线基础设施市场中的人工智能应用来说，这是一项重要要求。 12LP+还具有一些其他重要特性，使客户能够充分抓住人工智能市场上的机遇，其中包括面向人工智能应用的参考设计包以及设计/技术联合开发（DTCO）服务，这两者能够让客户全面地看待人工智能电路设计，从而实现低功耗并降低成本。另一个重要特性是包含用于2.5D封装的新中介层，这有助于实现高带宽存储器与处理器的集成，从而实现快速、节能的数据处理。 12LP+解决方案采用Arm® Artisan® 物理IP和ARM针对人工智能应用为格芯开发的POP™IP。Arm提供的这两种解决方案也将应用于格芯的12LP平台。 Arm物理设计部门总经理兼研究员Gus Yeung表示：“人工智能、汽车和高端消费电子移动等诸多快速增长的应用推动了市场对高性能SoC的迫切需求。凭借广泛采用的ARM Artisan物理IP和先进的处理器设计，格芯的12LP+可以帮助设计人员轻松、快速且经济高效地推出相关产品来把握这一需求从市场中获利。” 格芯数字技术解决方案副总裁Michael Mendicino表示：“格芯的战略是为客户提供差异化的解决方案，12LP+正是为此而推出的，与替代方案相比，该方案能够在不中断工作流程的情况下非常经济高效地拓展设计。例如，作为一种先进的12nm技术，我们的12LP+解决方案已经为客户提供了他们期望从7nm工艺中获得的大部分性能和功率优势，但他们的NRE（非重复性工程）成本平均只有一半左右，这大大节省了成本。此外，由于12nm节点技术使用时间更长，也更为成熟，因此客户能够快速地进行流片生产并充分利用对人工智能技术日益增长的需求。” 12LP+ PDK现已上市，并且格芯已经在与多个客户展开合作。从格芯的纽约马耳他8号晶圆厂获悉，预计2020年下半年将流片，2021年将量产。 关于格芯 格芯是全球领先的特殊工艺半导体代工厂，提供差异化、功能丰富的解决方案，赋能我们的客户为高增长的市场领域开发创新产品。格芯拥有广泛的工艺平台及特性，并提供独特的融合设计、开发和生产为一体的服务。格芯拥有遍布美洲、亚洲和欧洲的规模生产足迹，以其灵活性与应变力满足全球客户的动态需求。格芯为阿布扎比穆巴达拉投资公司(Mubadala Investment Company)所有。欲了解更多信息，请访问 https://www.globalfoundries.com/cn。
GLOBALFOUNDRIES’ GlobalFoundries Technology Conference 2019 in Silicon Valley to Spotlight Specialized Solutions for Emerging Markets September 24, 2019A rich program of talks, panels and partner exhibits will provide 700+ attendees with insights and networking opportunities in 5G, artificial intelligence, autonomous vehicles and other emerging areas Santa Clara, Calif., September 24, 2019 – At its annual Global Technology Conference (GTC) today, GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, will feature its wide range of specialized application solutions for the industry’s fastest-growing market segments. More than 700 expected attendees will be able to gain insight into how GF is helping clients shape our world, from the solutions we create to enabling the products they deliver. GF’s CEO Tom Caulfield will kick-off the event with a keynote address on, ‘The Future of Innovation,’ which will explore how there are – and always have been – many different paths toward true innovation. Dr. Aart de Geus, Chairman and co-CEO of Synopsys will then take the stage to share how technology is changing the way we live and work, and how strategic partnerships are critical to helping clients innovate from silicon to software. The conference stage will feature GF executives who will share insights on how GF’s multiple technology platforms plus a host of specialized features and turnkey services from GF and its ecosystem partners lead to unique, innovative solutions. Speakers include: ‘High-Growth Markets Enabled by Specialized GF Solutions,’ by Dr. Bami Bastani, Sr. VP and GM of Mobile and Wireless Infrastructure SBU ‘Si Technology Innovation in the Era of Specific Application Solutions,’ by Gregg Bartlett, Sr. VP of Global Engineering and Technology ‘The Journey to a Differentiated Ecosystem,” by Mike Cadigan, Sr. VP of Customer Design Enablement In the afternoon, talks and panel discussions with industry leaders including executives from Lightmatter, Marvell, NXP and VeriSilicon along with members of GF’s management and technical teams will detail the specific needs and opportunities in emerging market segments. In addition, these presentations will showcase how GF’s platforms and application solutions are enabling three targeted market segment groups, automotive, industrial and multi-market (AIM); mobile and wireless infrastructure (MWI); and computing and wired infrastructure (CWI). Attendees will experience a full day of tech that will feature more than 35 event sponsors and GF ecosystem partners, giving attendees the opportunity to learn about their offerings. Platinum sponsors for GTC 2019 are Analog Bits, Cadence Design Systems, Mentor and Synopsys. Gold sponsors are Arm, Dolphin Integration and Flex Logix™. About GTC GLOBALFOUNDRIES’ annual Global Technology Conference features keynotes from industry leaders and presentations from senior members of the GF management and technical teams, with a special emphasis on how the company achieves time-to-volume leadership by leveraging global collaboration with clients and partners. GTC 2019 began Tuesday, September 24 in the heart of California’s Silicon Valley, kicking off a series of GTC 2019 events at strategic international venues including Munich, Singapore and Taiwan. For more information on GTC 2019, visit: https://www.globalfoundries.com/. About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications September 24, 2019Innovative solution based on GF’s most advanced FinFET platform offers best-in-class performance, key new features to address evolving AI requirements, compelling economics and industry-leading physical IP from Arm Santa Clara, Calif., September 24, 2019 – GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, announced today at its Global Technology Conference the availability of 12LP+, an innovative new solution for AI training and inference applications. 12LP+ offers chip designers a best-in-class combination of performance, power and area, along with a set of key new features, a mature design and production ecosystem, cost-efficient development and fast time-to-market for high-growth cloud and edge AI applications. Derived from GF’s existing 12nm Leading Performance (12LP) platform, GF’s new 12LP+ provides either a 20% increase in performance or a 40% reduction in power requirements over the base 12LP platform, plus a 15% improvement in logic area scaling. A key feature is a high-speed, low-power 0.5V SRAM bit cell that supports the fast, power-efficient shuttling of data between processors and memory, an important requirement for AI applications in the computing and wired infrastructure markets. Other key features of 12LP+ that enable clients to capitalize on AI market opportunities are a design reference package for AI applications and design/technology co-development (DTCO) services, both of which allow clients to look at AI circuit designs from a holistic perspective in order to achieve lower power budgets and reduced costs. Another key feature is a new interposer for 2.5D packages, which facilitates the integration of high-bandwidth memory with processors for fast, power-efficient data processing. The 12LP+ solution makes use of Arm® Artisan® physical IP as well as POP™ IP for AI applications, developed for GF by Arm. Both solutions from Arm will also be applied to GF’s original 12LP platform. “AI, automotive and high-end consumer mobility are just a few of the growing applications creating urgent demand for high-performance SoCs,” said Gus Yeung, general manager and fellow, Physical Design Group, Arm. “Supported by the widely-used Arm Artisan physical IP and advanced processor designs, GLOBALFOUNDRIES’ 12LP+ will help designers deliver products that monetize this demand easily, quickly and cost-effectively.” “The rollout of 12LP+ is a result of GF’s strategy to provide clients with differentiated solutions that extend the ability to scale designs with no disruption to work flows very cost-efficiently compared to alternatives,” said Michael Mendicino, vice president of Digital Technology Solutions at GF. “For example, as an advanced 12nm technology, our 12LP+ solution already offers clients a majority of the performance and power advantages they would expect to gain from a 7nm process, but their NRE (non-recurring engineering) costs will average only about half as much, a significant savings. Additionally, because the 12nm node has been running longer and is much more mature, clients will be able to tape-out quickly and take advantage of the growing demand for AI technology.” The 12LP+ PDK is available now and GF is already working with several clients. Tape outs are expected in the second half of 2020 and volume production is set for 2021 from GF’s Fab 8 in Malta, New York. About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
Analog Bits and Aragio Solutions Team Up with GLOBALFOUNDRIES to Deliver Automotive IP Solutions September 24, 2019IP providers further strengthen ability to serve clients’ automotive IP needs on GLOBALFOUNDRIES’ 22FDX® platform Santa Clara, Calif., September 24, 2019 – GLOBALFOUNDRIES (GF), Analog Bits and Aragio Solutions (Aragio) announced today at GF’s annual Global Technology Conference (GTC) that they are collaborating to develop a portfolio of I/O libraries on GF’s 22nm FD-SOI (22FDX®) platform. The portfolio is designed to maximize energy efficiency and reliability while creating differentiated IP solutions that meet the varying standards of automotive applications. This latest collaboration extends GF’s ecosystem of suppliers for its 22FDX platform, with Synopsys being the first IP partner to announce development of its automotive-grade DesignWare® IP on this process. Analog Bits and Aragio will develop a portfolio of automotive Foundation, Analog and Interface IP for GF’s 22FDX process. The addition of Aragio’s silicon-proven low-leakage libraries and Analog Bits’ programmable interconnect solutions on GF’s 22FDX, is expected to further reduce design effort and accelerate AEC-Q100 qualification of system-on-chips (SoCs) for automotive applications such as advanced driver assistance systems (ADAS) and infotainment. “Analog Bits’ industry-leading PLL and sensor technology, in combination with sophisticated circuit techniques and innovative I/O design, provide area- and power-efficient IP solutions that customers can easily integrate into their SoC designs,” said Mahesh Tirupattur, executive vice president at Analog Bits. “Our close collaboration with GF gives us the opportunity to help our mutual customers deliver a unique low-power capability with the best possible PPA for demanding applications such automotive.” “GF’s advanced 22FDX platform gives our IP circuit designers the flexibility to be creative as they push for state-of-the-art performance in terms of speed, power, low-leakage, functionality and I/O size,” said Glen Haas, Aragio Solutions’ Chief Technologist. “GF provides a range of solutions that enable Aragio to address the full complement of world-wide market segments from Automotive G1 and G2 to battery-powered IoT applications. The flexible reverse body bias gives our designers another tool to use to provide unique solutions to our clients.” “Customers are expanding their product portfolios and are looking for connectivity solutions to match the evolving needs of power-sensitive applications in rapid-growth markets,” said Mark Ireland, vice president of Ecosystem Partnerships at GF. “Our collaboration with Synopsys, Analog Bits and Aragio will help us to deliver a strong IP portfolio of differentiated power, performance and reliability designs while shortening our clients’ time-to-market for automotive SoCs on 22FDX.” GF’s 22FDX provides a fast path-to-product solution that includes silicon-qualified IP. The platform is in volume production on GF’s 300mm line at Fab 1 in Dresden, Germany. Design kits with these additional features will be available on GF’s 22FDX starting Q4 2019. For more information on GF’s automotive solutions go to globalfoundries.com. About Analog Bits Founded in 1995, Analog Bits, Inc. is a leading supplier of mixed-signal IP with a reputation for easy and reliable integration into advanced SOCs. Our products include precision clocking macros such as PLLs, Sensors, programmable interconnect solutions such as multi-protocol SERDES and programmable I/O’s as well as specialized memories such as high-speed SRAMs and TCAMs. With billions of IP cores fabricated in customer silicon, from 0.35- micron to 7nm processes, Analog Bits has an outstanding heritage of “first-time-working” with foundries and IDMs. About Aragio Solutions Aragio is an industry leading provider of I/O library solutions focused on robust ESD and LU immunity. Our I/O library solutions enable dependable high-performance operation. We provide uniform I/O pad sets for a wide range of CMOS process technologies and applications, and our I/O library solutions feature unique macro cell designs as well as general-purpose and specialty I/O libraries. Aragio Solutions is the registered tradename of Solid Silicon Technology, LLC. To learn more about the company, please visit: www.aragio.com About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications September 24, 2019Enhanced transistor performance, greater RF-centric enablement and comprehensive turnkey testing/packaging services provide a truly differentiated solution that more than 20 clients are using for 5G/mmWave applications Santa Clara, Calif., September 24, 2019 – GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, announced today at its annual Global Technology Conference (GTC) that since its launch in 2017, more than 20 clients representing more than $1 billion in design win revenue are now working with GF’s enhanced 45RFSOI solution for 5G/mmWave mobile and wireless infrastructure applications. Among the enhancements to GF’s 45RFSOI solution are two new features, which add to the inherent advantages of SOI technology to deliver optimized, unparalleled RF performance: An enhanced power amplifier (PA) field-effect transistor (FET) feature provides 2X higher PA output power, resulting in a lower number of phased array antenna elements needed to achieve the system Effective Isotropic Radiated power (EIRP). The enhanced PA FET feature also enables users to integrate the PA, low-noise amplifier (LNA) switch and phase shifters for a 5G beamformer application on a single chip using the same technology. The result is a more compact design at lower cost resulting from fewer components and less board space for 5GmmWave fixed wireless and mobility applications. Compact design coupled with cost efficiency is an extremely important requirement for slim and sleek smartphone designs. A higher level of IP and RF-centric enablement including the Virtuoso RelXpert Reliability Simulator, a simulation tool from Cadence Design Systems, Inc., which is used to analyze potential FET device degradation across a user-defined set of use cases to ensure that specified performance and reliability targets are met for these critical applications. The result is fewer design cycles, thus lowering engineering costs and enabling faster time-to–market, as well as achieving increased device reliability confidence. GF’s 45RFSOI PDK models are now qualified on this tool. “Meeting tight design schedules while keeping development costs down is no easy task when it comes to exceedingly complex 5G/mmWave requirements,” said Wilbur Luo, vice president, product management in the Custom IC & PCB Group at Cadence Design Systems, Inc. “We take a holistic approach to integrated circuit design enabling SoC design excellence, and we’re very focused on providing differentiated solutions that truly benefit our customers. Cadence provides the Virtuoso RelXpert Reliability Simulator, which is used by GF for reliability model development, and Spectre native reliability, which is used for circuit design and verification for reliability analysis. Both of these tools are now tightly integrated with the PDK for GF’s 45RFSOI solution.” GF has a long history of high-frequency RF wafer and module test development and implementation experience. This experience, along with the industry’s most differentiated RF technology platform spanning advanced and established technology nodes, helps clients develop 5G connectivity solutions for next-generation products. For example, through GF’s turnkey testing and packaging services, GF can perform accurate phase measurements between antenna ports for phased array multi-RF channel designs of 16, 32, 64 or more antenna elements, enabling clients to rapidly ramp and deploy radio access infrastructure necessary for high-bandwidth 5G cellular systems. Moreover, GF’s engagement model provide clients with comprehensive package design, thermal and electrical modeling services, in partnership with leading outsourced assembly and test companies (OSAT). “At GF, we continue our commitment to providing differentiated RF platforms, feature sets and solutions that allow our clients to build innovative products for evolving high-growth wireless applications,” said Dr. Bami Bastani, senior vice president and general manager of Mobile and Wireless Infrastructure, SBU at GF. “The numerous design wins we’ve received for our enhanced 45RFSOI solution early in its lifecycle reflect the high value our clients place on our RF solutions.” About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
GLOBALFOUNDRIES Appoints Michael Hogan as SVP and General Manager to Support New Market Engagement Strategy September 24, 2019New business segments and leadership appointments further position the company for long-term growth and value creation Santa Clara, Calif., September 24, 2019 – Reinforcing its commitment to deliver specialized solutions to targeted market segments, GLOBALFOUNDRIES (GF) announced today, at its Global Technology Conference (GTC) in Silicon Valley, the appointment of Michael Hogan as senior vice president and general manager of the company’s newly established automotive, industrial and multi-market (AIM) strategic business unit (SBU). Hogan will be responsible for driving market strategy, defining GF’s roadmap for differentiated features and the resultant global expansion for the AIM SBU. Hogan is a 30-year semiconductor technology veteran and has successfully led premiere companies, including Cypress Semiconductor and Broadcom, in executive-level general manager and senior vice president roles. Most recently, Hogan was the senior vice president and general manager of the IoT, Compute & Wireless business unit at Cypress Semiconductor, where he shaped strategy for the company’s largest and fastest-growing business. “By aligning our leadership structure around the client experience, our team’s diverse talents and market insights will be leveraged to transform our go-to-market strategy and deliver specialized application solutions that provide real value to clients,” said Thomas Caulfield, CEO of GF. “The addition of Mike Hogan comes at a time when GF is positioned for strong growth and requires seasoned leaders to further enhance and scale our capabilities. Mike’s vast knowledge in the semiconductor space especially in automotive and wireless connectivity, as well as his proven track record of success, will bring great value that will drive growth today and into the future.” In conjunction with Hogan’s appointment, GF has established dedicated strategic business units around three core market groups, automotive, industrial and multi-market (AIM); mobile and wireless infrastructure (MWI); and computing and wired infrastructure (CWI) to grow market share in the large and growing $47 billion addressable foundry market for 12nm technologies and above. Hogan will work in close collaboration with Bami Bastani, who has been appointed senior vice president and general manager of the MWI SBU; and with Mike Mendicino, who has been appointed interim vice president for the company’s CWI SBU. These new strategic business units and leadership appointments position the company for greater scalability and growth, building upon the strategy that began in 2018 with the company’s pivot and continuing into this year with its transformational transactions. About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
格芯任命Michael Hogan为高级副总裁兼总经理，以支持新的市场深耕策略 September 24, 2019新的业务部门和领导层的任命将进一步推动公司的长期增长和价值创造 加利福尼亚州圣克拉拉，2019年9月24日 — 为加强其向目标市场提供专门解决方案的承诺，格芯今日在硅谷举办的2019格芯全球技术大会（GTC）上宣布，任命Michael Hogan为格芯新成立的汽车、工业和多市场（AIM）战略业务部门的高级副总裁兼总经理。Hogan将负责推动格芯市场战略，规划格芯的差异化功能路线图，以及汽车、工业和多市场（AIM）战略业务部门的全球扩张。 格芯汽车、工业和多重市场战略业务部门高级副总裁兼总经理Michael Hogan Hogan拥有30年的半导体技术经验，曾成功领导过包括赛普拉斯半导体（Cypress Semiconductor）和博通（Broadcom）在内的业内领先公司。加入格芯之前，Hogan是赛普拉斯半导体物联网、计算和无线业务部门的高级副总裁兼总经理，他在该部门为公司最大、增长最快的业务制定了战略。 “通过围绕客户体验来调整领导结构，格芯的多样化人才和市场洞察力将被用来转变我们的市场战略，并为客户提供差异化、功能丰富的解决方案。”格芯首席执行官汤姆·嘉菲尔德（Thomas Coulfield）表示，“Michael Hogan的加入正值格芯位于强劲增长之际，我们需要经验丰富的领导者进一步提升和扩展我们的能力。Michael在半导体领域，尤其是在汽车和无线连接领域的丰富知识以及成功经验，将带来巨大的价值，推动格芯今天和未来的发展。” 在Hogan就任的同时，格芯围绕三大核心市场（汽车、工业及多市场(AIM)、移动与无线基础设施(MWI)以及计算与有线基础设施(CWI)）成立了专门的战略业务部门，为在规模庞大且不断增长的12nm及以上芯片的代工市场中扩大市场份额。Hogan将与被任命为格芯移动与无线基础设施战略业务部门高级副总裁兼总经理的Bami Bastani以及被任命为格芯计算与有线基础设施战略业务部门代理副总裁的Mike Mendicino进行密切合作。 格芯新成立的战略业务部门及新领导层的任命，是基于自2018年开始的战略转型，并延续至今以实现更大的可扩展性和增长能力。 关于格芯： 格芯是全球领先的特殊工艺半导体代工厂，提供差异化、功能丰富的解决方案，赋能我们的客户为高增长的市场领域开发创新产品。格芯拥有广泛的工艺平台及特性，并提供独特的融合设计、开发和生产为一体的服务。格芯拥有遍布美洲、亚洲和欧洲的规模生产足迹，以其灵活性与应变力满足全球客户的动态需求。格芯为阿布扎比穆巴达拉投资公司(Mubadala Investment Company)所有。欲了解更多信息，请访问 https://www.globalfoundries.com/cn。 媒体垂询： 杨颖（Jessie Yang）(021) 8029 6826[email protected] 邢芳洁（Jay Xing）86 18801624170[email protected]
