Building greener, smarter cities with GF’s IoT innovation September 29, 2025 By Anand Rangarajan, Director End Markets, GlobalFoundries As urban populations grow and infrastructure demands intensify, cities around the world are turning to the Internet of Things (IoT) to become smarter, more sustainable and more responsive to our residential needs. IoT technologies enable real-time data collection and analysis, allowing city systems to operate more efficiently and adaptively. What defines a smart city in the age of IoT? Smart cities integrate digital technologies into urban systems to improve the quality of life for residents, optimize resource use and enhance public services. This transformation is part of a broader shift in line with Industry 4.0 that combines cyber-physical systems, automation, and real-time data exchange. At the heart of this transformation is IoT—networks of connected devices that share data with each other for informed decision-making and automation. Top IoT applications powering smart cities today Smart cities are not just about technology; they’re about using data and connectivity to make cities more livable, resilient and sustainable. IoT enables this by embedding intelligence into everyday systems: traffic lights, water meters, waste bins and even streetlights become data sources that inform real-time decisions and long-term planning. Below are five key areas that are made possible through advancements in IoT technology to promote resource circularity and optimization: Smart transportation & traffic management IoT sensors embedded in traffic lights and roadways collect data that can be used to manage congestion, thereby reducing emissions and improving commute times. Real-time data enables dynamic traffic routing and predictive maintenance of infrastructure. Waste management IoT-enabled bins and collection systems can enable optimized pickup routes and schedules to reduce fuel consumption and improve sanitation services. Energy efficiency Smart grids and connected meters allow for better energy distribution and usage tracking, helping cities reduce consumption and integrate renewable sources. Water & air quality monitoring Sensors can monitor pollution levels and water quality, enabling timely interventions and policy adjustments to protect public health. Using real-time data to identify anomalies, monitoring water flow and pressure enables predictive maintenance and automated responses. Public safety & emergency response IoT devices such as surveillance cameras, gunshot detectors and connected emergency systems can enhance situational awareness and reduce response times. These technologies can be used to enable faster data sharing and automated alerts, helping first responders act more quickly and effectively in critical situations. The sustainability impact of IoT in smart cities Through the role of IoT in smart cities, these technologies contribute significantly to sustainability goals by reducing resource consumption (e.g., water and energy), lowering greenhouse gas emissions and improving public health outcomes. The convergence of IoT, AI, and Big Data enables real-time decision-making and policy development through data-driven insights that enhance a city’s infrastructural integrity. As highlighted in a comprehensive review published in Energy Informatics, smart cities are increasingly leveraging these technologies to optimize energy systems, transportation networks, waste management, and building operations, all of which are critical to achieving environmental sustainability. In addition to supporting sustainability goals, IoT also plays a vital role in advancing climate adaptation strategies within smart cities. By enabling real-time environmental monitoring—such as tracking temperature fluctuations, air quality and flood risks—IoT systems help cities anticipate and respond to climate-related challenges more effectively. These technologies support early warning systems, guide infrastructure upgrades and inform urban planning decisions that enhance resilience against extreme weather events and slong-term climate shifts. As a result, cities can better protect vulnerable populations, reduce recovery costs and maintain continuity in essential services. Key challenges in scaling smart city IoT infrastructure While the vision of smart cities is compelling, the path to realization is complex. Cities face several technological and infrastructural challenges that must be addressed to scale smart solutions effectively. 1. Always-on devices need ultra-low power Smart city infrastructure relies on IoT devices that operate continuously, such as traffic sensors, air quality monitors, and smart lighting systems. Many of these devices are battery-powered and in hard-to-reach locations, making energy efficiency critical to minimize maintenance and extend operational life. These devices also require low-power communication capabilities to transmit data reliably without draining energy reserves. GF’s Solution: 22FDX+ is designed for ultra-low power operation, enabling devices to run longer on less energy. Ideal for battery-powered, always-on applications, it supports low-power communication protocols, so devices stay connected while conserving energy. The platform’s Active Body Biasing feature further reduces the overall power envelope, enhancing real-time responsiveness and minimizing the need for frequent servicing, making it ideal for scalable smart city deployments. 2. Complex power management across diverse systems From EV charging stations to automated traffic controls, smart cities integrate a wide range of systems, each with unique voltage and reliability requirements. Managing power across these systems efficiently is a major challenge. GF’s Solution: BCDLite enables robust mixed-signal designs by integrating low- and high-voltage components on a single chip. With proven automotive-grade reliability, it supports compact, scalable power management for critical infrastructure like smart streetlights and EV chargers. 3. Data security & always-on connectivity With millions of connected devices transmitting data, smart cities must ensure secure, low-power memory solutions that support continuous operation and protect sensitive information. GF’s Solution: GF’s embedded RRAM and eMRAM technologies offer secure, ultra-low power memory for always-on devices. These platforms enable on-chip integration of memory, improving energy efficiency and supporting secure storage for credentials and cryptographic keys. 4. Real-time urban intelligence from sensor fusion Smart cities require real-time situational awareness from diverse sensor inputs—audio, imaging, radar—to support public safety, traffic management, and environmental monitoring. GF’s Solution: GF’s 22FDX+ platform supports multimodal sensor fusion and edge AI, enabling real-time interpretation of complex urban environments. Its full SoC integration and RF capabilities make it ideal for smart infrastructure applications like gunshot detection and autonomous traffic systems. Together, these platforms empower cities to deploy intelligent infrastructure that reduces energy consumption, enhances mobility, and supports long-term sustainability goals. The future of smart cities: IoT, AI, and edge computing The convergence of IoT, AI and edge computing is accelerating the smart city agenda. For industry stakeholders, this means new opportunities in infrastructure, analytics and services. For sustainability advocates, it means actionable insights and measurable progress toward climate goals. To learn more about how GF is shaping the future of smart cities through sustainable technology, explore the latest insights in our Sustainability Report and discover how our platforms are driving tech-for-humanity solutions. Anand Rangarajan is Director, End Markets, at GlobalFoundries with a focus on edge AI and compute, which includes a range of segments such as smart home, wearables, augmented reality headsets and eyeglasses, asset tracking, sensor fusion, and health monitoring. He collaborates with customers and other stakeholders to enhance GF’s value proposition for these innovative applications in the edge and AI compute space. Prior to GF, he served as a product manager at Microchip.
GlobalFoundries and Corning Collaborate To Deliver Detachable Fiber Connector Solutions to Scale Next-Generation Optical Connectivity September 29, 2025 Glass-waveguide based detachable fiber connector solutions enabling co-packaged optics will be demonstrated at ECOC 2025 and GF’s Technology Summit MALTA, N.Y., September 29, 2025 – GlobalFoundries (NASDAQ: GFS) (GF) today announced a collaborative effort with Corning Incorporated (NYSE: GLW) to develop detachable fiber connector solutions for GF’s silicon photonics platform. Corning’s GlassBridge™ solution, a glass-waveguide based edge-coupler compatible with the platform’s v-grooves, is designed to meet the growing demands of AI datacenters for high bandwidth and power-efficient optical connectivity. Other coupling mechanisms are also being developed, including a vertically-coupled detachable fiber-to-PIC (Photonic Integrated Circuit) solution—demonstrating GlobalFoundries and Corning’s combined ability to produce multiple forms of co-packaged PIC-to-fiber connectivity. The collaboration leverages Corning’s world-leading innovation in glass, optical fiber and connectivity technologies. This includes a broad portfolio of special glass compositions, glass wafer, IOX, and laser processing, and Fiber Array Units (FAUs), leveraging fibers with ultra-precise core alignments minimizing insertion loss for the most demanding data center and high-performance computing applications. Built on GF’s comprehensive silicon photonics platform that supports co-packaged optics solutions for scale-out and scale-up networks, this collaboration will pair Corning’s well established supply chain and leadership in optical interconnect technologies with GF’s high volume manufacturing capabilities and leadership in silicon photonics. “Our collaboration with Corning marks a significant step forward in delivering next-generation connectivity solutions for AI and machine learning,” said Kevin Soukup, senior vice president of GF’s silicon photonics product line. “Corning’s cutting-edge fiber technology, integrated with our silicon-proven platform, delivers the performance and flexibility required for enabling scalable, high-density optical packaging for AI datacenters.” “Our collaboration with GlobalFoundries is helping to shape the future of AI infrastructure and accelerate the progress needed to meet the demands of an increasingly data-driven world,” said Dr. Claudio Mazzali, vice president, global research, Corning. “There’s something truly powerful in combining GlobalFoundries’ and Corning’s expertise in silicon process and optical connectivity—together, we’re enabling new possibilities for the AI-powered industries of tomorrow.” Demonstrations of the GlassBridge™ edge-coupled glass-waveguide based detachable fiber connector solution will be showcased at the upcoming ECOC Exhibition in Copenhagen, Denmark (in the Corning booth #2118) and GF Technology Summit in Munich, Germany. About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit www.gf.com. About Corning Incorporated Corning (www.corning.com) is one of the world’s leading innovators in materials science, with a 170-year track record of life-changing inventions. Corning applies its unparalleled expertise in glass science, ceramic science, and optical physics along with its deep manufacturing and engineering capabilities to develop category-defining products that transform industries and enhance people’s lives. Corning succeeds through sustained investment in RD&E, a unique combination of material and process innovation, and deep, trust-based relationships with customers who are global leaders in their industries. Corning’s capabilities are versatile and synergistic, which allows the company to evolve to meet changing market needs, while also helping our customers capture new opportunities in dynamic industries. Today, Corning’s markets include optical communications, mobile consumer electronics, display, automotive, solar, semiconductors, and life sciences. Forward-looking information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contacts: GF Stephanie Gonzalez [email protected] Corning Alexis Abbott [email protected]
VeriSilicon Introduces FD-SOI Wireless IP Platform for Diverse IoT and Consumer Electronics Applications September 24, 2025
GlobalFoundries and Egis Partner to Develop Next-Generation Smart Sensing Technology for Mobile and IoT Applications September 23, 2025 New solution available for production enables low power, highly integrated, direct time-of-flight sensors MALTA, N.Y., September 25, 2025 – Today at its annual Technology Summit in Shanghai, China, GlobalFoundries (Nasdaq: GFS)(GF) announced its collaboration with Egis Technology to deliver a new direct time-of-flight (dToF) sensors on GF’s 55nm platform. This new solution supports smart sensing technologies for new and emerging applications in smart mobile, IoT and automotive end markets. GF’s first-generation FSI (front-side illuminated) SPAD (single-photon avalanche diode) device features best-in-class Dark Count Rate and Near-Infrared Photon Detection Probability for high-SNR dToF sensing. The SPAD device, available as a p-cell, is integrated on GF’s feature-rich 55nm platform which delivers a fully integrated dToF SoC, including high-voltage bias, VCSEL driver, MCU and ranging core, on single, smaller chip. When combined with the broad IP portfolio for GF’s 55nm platform, designers can develop next-generation, application-optimized intelligent sensors with best-in-class size, weight, power and cost advantages at a faster time to market. Egis, a leading display fingerprint sensor provider, first partnered with GF in 2022 as a strategic move to enter the emerging 3D sensor market. Applications of the new FSI SPAD technology include laser-assisted auto focus for smart mobile devices, laptops and projectors, presence detection for smart appliances and buildings to enable power saving features and collision avoidance in robots and drones. “GF is committed to enabling the future of smart sensing technologies with solutions like our FSI SPAD device that delivers significant performance and design advantages for next-generation, intelligent sensors,” said Kamal Khouri, senior vice president of GF’s feature-rich CMOS product line. “Through our partnership with Egis, we are excited to bring these advanced direct time-of-flight sensors to the growing marketplace of devices that rely on precise data capture in our increasingly automated world.” “Egis is proud to partner with GlobalFoundries to develop novel sensor solutions tailored for essential applications,” said Steve Lo, Chairman at Egis. “By leveraging GF’s advanced FSI SPAD technology, we continue our commitment to innovating and simplifying intuitive user experiences.” 55nm SPAD is available for mass production at GF’s high-volume manufacturing facility in Singapore. A process design kit and dedicated shuttle runs through GF’s GlobalShuttle multi-project wafer (MPW) program are available for designers to start prototyping. About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit www.gf.com. About Egis Technology Inc. Egis Technology Inc. (Egis) is a one-stop partner for sensing solutions—spanning capacitive, optical, and ultrasonic technologies and deployed across mobile, PC, automotive, and industrial applications. Beyond sensors, Egis is a global fabless semiconductor group providing connectivity IP and turnkey chiplet design services. With hundreds of patents worldwide, we deliver innovative, forward-looking solutions and intuitive user experiences that create superior value for our customers. Forward-looking Information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contact: GlobalFoundries Stephanie Gonzalez [email protected]
Sofics joins GlobalFoundries’ GlobalSolutions Ecosystem to Enhance Chip Robustness, Performance and Design Efficiency September 19, 2025
GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence September 16, 2025 GlobalFoundries’ Singapore Fab recognized by the World Economic Forum for advancing and scaling Industry 4.0 technologies, harnessing AI and Machine Learning to drive digital transformation across its global operations SINGAPORE, September 16, 2025 — GlobalFoundries (Nasdaq: GFS) (GF) today announced that the World Economic Forum (WEF) has designated its 300mm fab in Singapore as part of the Global Lighthouse Network (GLN) of advanced manufacturers. This prestigious title recognizes GF’s leadership in deploying and scaling Fourth Industrial Revolution (4IR) technologies to drive enterprise-wide operational transformation. GF continuously strives to leverage digital capabilities to improve safety, cost, quality, and productivity. By harnessing AI and machine learning, GF is transforming its manufacturing operations and driving smarter, more sustainable production across fabs in the U.S., Europe, and Asia. By deploying over 60 smart manufacturing solutions since 2020 leveraging AI, machine learning, IoT, and advanced analytics, GF has demonstrated significant breakthroughs in cost, quality, and productivity in manufacturing. In parallel, GF is strengthening the broader ecosystem through strategic partnerships with academia, solution providers, and government agencies. These collaborations are building a robust pipeline of digital talent and enabling the co-development of innovative, future-ready solutions. Meanwhile, GF engineers are upskilling in automated, data-driven environments and transitioning into roles to lead smart manufacturing initiatives and drive innovation. As part of the GLN, GF will continue to cross-learn and progress our innovation across the ecosystem with other global Lighthouse sites. “Our digital transformation is instrumental in accelerating GF’s ability to deliver differentiated, essential chips that power AI growth and adoption, while meeting the demands of fast-evolving markets such as mobile, automotive and IoT,” said Niels Anderskouv, president and chief operating officer at GF. “By re-engineering operations through digital innovation, we lead with agility, delivering trusted, high-quality semiconductors with speed and reliability. This strategic evolution unlocks scalable growth and long-term value for our stakeholders.” “The organizations that will shape the future are those driving holistic transformation today, embedding digital innovation, resilience, sustainability, talent development, and customer centricity into everything they do,” said Kiva Allgood, Managing Director and Head of the Centre for Advanced Manufacturing and Supply Chains, World Economic Forum. “Congratulations to the new Lighthouse cohort that demonstrates how forward-thinking companies across industries and segments are putting this vision into action, setting a new global standard for operational excellence and impact.” “This milestone signifies GF Singapore’s critical role in GF’s global manufacturing footprint, alongside our world-class facilities in the U.S. and Dresden,” said Yew Kong Tan, senior vice president and general manager, APAC Manufacturing and Singapore Site at GF. “At GF’s AI Centre of Excellence in Singapore, we are advancing the adoption of Industry 5.0 from 4.0, reshaping our workforce with the latest digital solutions for the current and next-generation talent, and building a robust digital ecosystem to fuel innovation through strategic partnerships. Through continued investment in cutting-edge technologies and people, GF champions Singapore’s leadership in advanced manufacturing, reinforcing its position as a key global semiconductor manufacturing site.” About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented and diverse team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-looking information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contact:Luana Low [email protected] +65-9106-3469
Synopsys and GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms September 4, 2025 Strategic Collaboration to Deliver Practical Chip Design Experience to Prepare the Next Generation of Engineering Talent Key Highlights · Launching a pilot ‘chip design to tapeout’ flow curriculum, enabling academic institutions with industry-aligned coursework. · Pilot testing underway at over 40 select worldwide universities with intent to scale. · Combination of access to Synopsys’ EDA solutions and GlobalFoundries’ technology solutions to provide students valuable, real-world experience. Sunnyvale, Calif. and Malta, N.Y., September 4, 2025 – Synopsys, Inc. (NASDAQ: SNPS) and GlobalFoundries (NASDAQ: GFS) (GF) announced today a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide. Aligned with both GFLabs’ and Synopsys Academic & Research Alliances’ (SARA) missions to advance semiconductor innovation through R&D and academic collaboration, this pilot initiative gives researchers, professors and students hands-on access to real-world chip design and manufacturing. By dramatically lowering the cost barrier to custom silicon, the program enables academic institutions to turn their design concepts into working silicon, expanding opportunities for education, research and workforce development. Forty universities worldwide are participating in the sponsored open-source 180MCU pilot launching this fall. Synopsys will provide comprehensive support including professional-grade electronic design automation (EDA) tools, training and design collateral leveraging the Synopsys Cloud design platform. Once designs are finalized, GF will manufacture the chips through its GlobalShuttle Multi-Project Wafer Program, which aggregates designs from multiple institutions onto a single wafer for fabrication. “Partnering with GlobalFoundries to bring a full ‘chip design to tapeout’ course to universities is a game changer,” said Dr. Patrick Haspel, executive director of SARA at Synopsys. “This collaboration will empower students with practical, hands-on experience using advanced tools and technologies – skills that are critical to drive innovation in the semiconductor industry. Together, we’re not just teaching design – we’re building the next generation of engineers who will shape the future of silicon.” As Synopsys and GF seek to evolve this workforce development initiative further, the next phase of the tapeout is focused on bringing these technologies directly into classrooms and embedding hands-on design and testing into academic course curriculum. With the goal of having students collaborate in a design class, Synopsys will provide training to professors on how to lead this course. Following a shuttle run, the second course will dive into classroom testing with chips returned for the next semester. “This program reflects our deep commitment to advancing semiconductor innovation and cultivating the next generation of talent,” said Bika Carter, director of external R&D at GF. “By giving students and researchers the opportunity to bring their designs from concept to silicon, we’re enriching chip design education and helping shape the future of our industry. We’re proud to partner with Synopsys to empower the talented minds driving tomorrow’s breakthroughs.” This design enablement collaboration is supported by Synopsys’ SARA program, which provides software, cloud environments, training and curriculum to equip students with latest technology and learning materials. The new Synopsys-GF collaboration exemplifies the SARA program’s commitment to partner on semiconductor workforce development initiatives and nurture talent pipelines worldwide. Along with providing participating universities with essential tools and cloud environment access, the SARA program will also offer comprehensive course content and training. The tapeout education pilot is just one aspect of GF’s University Partnership Program, which serves to close the prototyping gap in academia and expand access to new technologies to support technological innovation in the semiconductor industry. In its work with more than 80 universities, 110 professors and 600 students, the program selects projects aligned with GF’s R&D roadmap priorities to support research breakthroughs in areas including radio frequency, radar, quantum computing, silicon photonics, sensors and more. The combination of Synopsys and GlobalFoundries brings together industry-leading EDA design tools and advanced manufacturing, empowering academic institutions to offer students an integrated, real-world journey through the semiconductor process. Resources Learn more about the Synopsys Academic & Research Alliances (SARA) program. Learn more about GF’s University Network. About Synopsys Synopsys, Inc. (Nasdaq: SNPS) is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com. © 2025 Synopsys, Inc. All rights reserved. Synopsys, Ansys, the Synopsys and Ansys logos, and other Synopsys trademarks are available at https://www.synopsys.com/company/legal/trademarks-brands.html. Other company or product names may be trademarks of their respective owners. About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented and diverse team delivers results with an unyielding focus on security, longevity and sustainability. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Media contacts Cara Walker Synopsys, Inc [email protected] [email protected] Kassidy Berger GlobalFoundries [email protected]
RFSOI, the key to addressing the challenges of cellular RF front-ends September 4, 2025 By Alex Margomenos Director, RF Product Management at GlobalFoundries Global data consumption is rising, in part due to the adoption of generative AI. The latest Ericsson Mobility report projects that worldwide mobile data traffic will grow by 2.3 times and reach 280 ExaBytes (1018 bytes) per month by 2030. To accommodate this growth, mobile operators, phone manufacturers, and standardization bodies must focus on expanding bandwidth, combining multiple data streams per channel, and improving data compression per symbol. These strategies have been implemented throughout the evolution of cellular standards and are expected to continue as technology advances towards 6G. For instance, 5G introduced additional frequency bands in the 3–6 GHz and millimeter wave frequency ranges, enhanced the implementation of MIMO spatial multiplexing, incorporated advanced beam steering techniques, and facilitated more sophisticated modulation schemes. Moreover, 5G increased the utilization of carrier aggregation, enabling both contiguous and non-contiguous bandwidth from single or multiple bands—including dual connectivity with 4G LTE bands—to be combined for greater data throughput. This approach, coupled with the standard’s inherent flexibility and scalability in numerology and waveforms (such as scalable subcarrier spacing, slot duration, and transmission bandwidths), delivers the improvements in spectral efficiency necessary to meet growing data demands. Providing all this functionality places significant demands on the RF front-ends, which are anticipated to increase as development advances toward 6G. These demands include: Supporting additional frequency bands requires more content in filters and RF components, making miniaturization and integration increasingly difficult while keeping the device form factor and size unchanged. More bands, closer together, reduce tolerance to interference, requiring improved filters and higher linearity components that generate lower harmonics in both the transmitter and receiver. New bands, flexible numerology and increased band combinations for carrier aggregation lead to more switches for band selection, antenna selection and antenna tuning. GF’s RFSOI technologies have been in the forefront for addressing these challenges for cellular switches and low noise amplifiers. In 2024, we introduced 9SW, our 4th generation RFSOI platform. Building upon its predecessor 8SW RFSOI technology, 9SW offers significant improvements in performance, integration and area advantages for front-end modules. 9SW is based on 90nm back-end-of-line lithography, offering significant opportunities for size reduction in digital circuits and switches. It offers enhanced Ron*Coff and improvements in power handling capabilities. In addition to switch and low noise amplifier devices, the platform includes a full suite of logic and analog FETs, circuit IP, large variety of capacitor and resistor options, and full RF design enablement. Finally, it includes 4 metal stack options with 3 to 5 levels of metal wiring including ultra-thick metal enabling high quality inductors and low loss transmission lines. In addition to the core offering, we are continuously updating the 9SW platform with new features intended to improve performance. In August, we introduced additional features offering analog circuit area compaction, low-leakage switch devices, and new passive elements. Beyond that we are planning future new feature releases on an annual basis to further improve switch power handling, Ron*Coff, and low noise amplifier performance. Supporting more frequency bands, which will only intensify as we start getting into 6G, increases the need for miniaturization and integration on a smartphone. To address this, we are introducing 9SW-SlateTM technology. Leveraging 9SW, our 9SW-SlateTM technology utilizes two bonded 9SW wafers to shrink the die size without compromising its performance. With this approach we fold large switch FETs in high-stack configurations, reducing the overall die area by up to 45% while maintaining the switch performance. In addition to releasing the technology and demonstrating its performance with reference designs, we are developing design enablement tools to help designers migrate two-dimensional circuits to three dimensions, accelerate prototyping and reduce design cycles. If you’re interested in learning more about 9SW and the rest of GlobalFoundries’ RF offerings in RFSOI, SiGe and RF GaN, please join us at the upcoming GF Technology Summits in Santa Clara, Shanghai and Munich, as well as our GlobalFoundries Technology Training for our Aerospace and Defense customers in Washington, D.C. Alex Margomenos oversees the product management of the RF Product Line at GlobalFoundries. The RF Product Line encompasses RFSOI, RF GaN, and SiGe technologies, which support cellular RF front-ends, satellite communications, aerospace and defense, and cellular infrastructure. He has been with GlobalFoundries for four years. Previously, he held managerial and individual contributor positions at Apple, Intel, Infineon, and HRL Laboratories.
格罗方德任命胡维多为中国区总裁，助力本土业务拓展 August 31, 2025 半导体行业资深专家将推动公司在华业务发展与战略合作伙伴关系建设 中国，上海，2025年9月1日——格罗方德（GlobalFoundries）今日宣布，任命半导体行业资深人士胡维多（Victor Hu）为销售副总裁兼中国区总裁。胡维多拥有超过25年半导体及技术领域领导经验，他将负责公司在中国这一关键增长市场的战略规划、新业务拓展以及合作伙伴关系建设。 格罗方德的中国战略旨在满足中国原始设备制造商（OEM）、无晶圆厂客户以及服务中国市场的跨国公司对本地生产芯片日益增长的需求。为此，公司正逐步深化本地布局，包括：扩大办公规模，并在北京和广州开设新办公室；通过其在广州的制造生态系统合作伙伴增芯科技实现本地生产；丰富其设计服务提供商网络，提供针对格罗方德技术量身定制的增值服务。 胡维多在Qorvo、宏达国际电子（HTC）和博通（Broadcom）任职期间，展现了推动增长、优化运营及构建战略伙伴关系的卓越能力。在他最近担任Qorvo大中华区及亚太区销售副总裁期间，曾主导了一系列市场拓展项目，显著提升了该地区市场份额，并推动了业务的变革性拓展。胡维多兼具工程和商业背景，拥有深厚的商业和技术专业知识，这使他成为引领格罗方德在中国下一阶段增长的理想人选。 格罗方德总裁兼首席运营官尼尔斯·安德斯库夫（Niels Anderskouv）表示：「格罗方德始终致力于维持可靠且地域多元化的全球制造布局。中国是我们持续创新的关键地区，也是我们为客户提供安全、核心芯片的重要生产基地，满足客户在指定地点生产的需求。我们非常高兴欢迎胡维多加入格罗方德领导团队。他丰富的行业知识和领导经验，将助力我们继续加强客户关系，提升本地制造能力。」 格罗方德中国区总裁胡维多表示：「我很荣幸能在这样一个激动人心的时刻加入格罗方德。中国的半导体产业正迅速发展，我期待与我们的合作伙伴、客户以及本地团队紧密合作，延续公司的发展势头，加速格罗方德在中国市场的业务增长。」 此次人事任命、业务扩张以及本地制造合作，共同彰显了格罗方德深耕中国的承诺，以及其满足中国OEM和无晶圆厂客户对本地制造芯片需求增长的策略，同时通过为在中国的跨国客户提供高质量、成熟节点的制造服务，支持全球供应链的韧性发展。 关于格罗方德 格罗方德（GlobalFoundries）是全球领先的半导体制造商之一，致力于为人们的生活、工作和互联提供核心支持。我们通过创新与客户紧密合作，为汽车、智能移动设备、物联网、通信基础设施及其他高增长市场交付更高能效、更高性能的产品。我们的全球生产足迹跨越美国、欧洲和亚洲，是全球客户信赖的技术来源。格罗方德拥有一支才华横溢的全球团队，他们始终以安全、持久和可持续为核心目标，全力交付卓越成果。欲了解更多信息，请访问www.gf.com。 ©GlobalFoundries Inc.、GF、GlobalFoundries、GF徽标和其他格芯标记是 GlobalFoundries Inc. 或其子公司商标。所有其他商标均为其各自所有者的财产。
