Celebrating GF’s Julio Costa, IEEE Fellow Class of 2025
GlobalFoundries (GF) is thrilled to celebrate the accomplishment of Julio Costa, our vice president of RF technology, being named among the IEEE Fellow Class of 2025. This prestigious recognition, the highest level of membership in the world’s largest technical professional organization, was awarded for his significant contributions to the development of RF silicon-on-insulator (SOI) technologies and circuits for mobile applications.
Julio’s journey in the semiconductor industry spans nearly three decades, marked by groundbreaking innovations and a relentless pursuit of excellence. His work has not only advanced RF technology but has also helped position GF as the leading global manufacturer and design solutions provider of essential RF chips.
Foundry Files sat down with Costa to discuss his thoughts on being named an IEEE Fellow, his journey with RF SOI technology, the challenges he faced, advice for aspiring inventors, and his vision for the future of RF chips.
Q: Thank you for taking the time to meet! What was your initial reaction upon learning that you were elected an IEEE Fellow?
Costa: I was extremely honored and just really humbled by the award. It’s something that every researcher in the electronic semiconductor area aspires to achieve. This recognition represents the culmination of over 20 years of hard work and dedication. It’s a testament to the pioneering contributions made in the development of RF SOI technology, which was virtually non-existent until the early 2000s.
Can you explain the significance of RF SOI technology and its impact on the industry?
RF SOI technology has been a game-changer for the mobile wireless industry. When we started this journey in the early 2000s, the industry relied on gallium arsenide switches, which were bulky, expensive and limited in performance. We set out to develop a silicon-based solution that would overcome these limitations. Today, RF SOI technology is a multi-billion-dollar market, and its switches and tuners are ubiquitous in modern cell phones, tablets and other devices. It’s hard to imagine life in 2025, with all of the gadgets we rely on, without RF SOI technology!
What were some of the speed bumps along the path of RF SOI technology’s journey from the early 2000s to today?
The development of RF SOI technology was not without its challenges, for everyone in the industry. For example, we discovered that having substrates with too high resistivity negatively impacted performance. It was a very subtle issue, but through perseverance and dedication, we were able to overcome these setbacks and achieve significant advancements. Linearity and power handling required the invention of specific SOI layers to overcome some very fundamental issues.
Where are GF’s RF chips making a difference today?
GF has established itself as a leader in the RF SOI market through innovation and excellence. Our RF chips are critical components in a wide range of end-markets, including smart mobile devices, communications infrastructure, automotive, Internet of Things (IoT), and aerospace and defense.
For example, GF has led the way for 5G adoption in the cellular industry with our 7SW and 8SW RF SOI platforms that can be found in approximately 80% of all smartphones on the market. Our 9SW RF SOI platform, which we launched in 2024, is positioned for leadership in 5G and beyond. Not to mention our low power 22FDX platform, which delivers superior power efficiency and performance to RF devices across the world, from your smartphone to satellites and every stop between.
You are a prolific inventor with more than 60 patents. What advice would you offer to young engineers aspiring to innovate and make an impact in the semiconductor industry?
Perseverance is key. Find an area that you love and that you believe has potential for significant improvement and really dedicate yourself to it. Building strong relationships with experts in the field and being open to learning from them is also crucial. There will be setbacks, but it’s important to hold on, believe in the technology, and keep pushing forward.
What is your approach to leadership?
I consider myself a hands-on leader who enjoys getting involved in the technical aspects of projects while also focusing on strategic thinking. I value approachability and encourage open communication within my team.
What’s next for RF?
The future of RF technology is very exciting. We are facing challenges such as the increasing demand for high data rates, lower latency, and increasing congestion of existing frequency bands. New frequency bands between 6 GHz and 15 GHz will be crucial in meeting this demand. Additionally, AI will drive the need for higher data rates, and we are developing innovative solutions to address these emerging needs. Technologies like 3D heterogeneous engineering and RF gallium nitride will play a significant role in the future of RF technology.
When you’re not in the lab or the office, what do you enjoy doing?
Outside of work, I enjoy playing the piano, scuba diving and traveling. These hobbies provide me with a sense of relaxation and fulfillment outside of my professional life.
Thank you again for taking the time, and congratulations again on your well-deserved honor!
My pleasure, thank you!