GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications August 28, 2025 Industry’s first high-performance complementary BiCMOS technology delivers performance and power advantages for essential markets and applications SANTA CLARA, Calif., August 28, 2025 – Today at its annual Technology Summit in California, GlobalFoundries (GF)(Nasdaq: GFS) announced the production release of its 130nm complementary Bi-CMOS (CBIC) platform, the company’s highest-performance silicon germanium (SiGe) technology to date. Now available for design with a process design kit (PDK), 130CBIC delivers unmatched performance with NPN transistors exceeding 400 GHz ft/fmax and PNP transistors surpassing 200 GHz—making it the only high-performance SiGe platform capable of addressing multiple key markets including smartphones, wireless infrastructure, optical networking, satellite communications and industrial IoT. Developed and manufactured at GF’s facility in Burlington, Vermont, 130CBIC is optimized to push the limits of RF performance in connected applications while reducing cost. For cellular smartphones, the platform enables low-noise amplifiers (LNAs) that reduce current consumption while maintaining ultra-low noise figure, helping to reduce battery drain. In the datacenter, the platform’s high-performance PNP transistors enable innovative amplifier topologies that deliver high gain-bandwidth at lower power for high-speed analog and optical networking. The platform also supports advanced mmWave industrial radar applications exceeding 100GHz, enabling high resolution sensing and distance ranging in a reduced form factor. “130CBIC represents a major milestone in our SiGe roadmap, setting a new benchmark for performance for the broad spectrum of high-growth markets that rely on advanced RF technologies for high-speed, energy-efficient connectivity,” said Shankaran Janardhanan, senior vice president of GF’s RF product line. “By combining industry-leading transistor performance with a low-mask count process, we’re opening new avenues of RF innovation to our customers across the board and enabling them to ramp new technologies to market faster.” 130CBIC is available for prototyping through GF’s GlobalShuttle multi-project wafer program, with shuttles scheduled through 2025 and 2026. RF reference designs are available through GF’s self-service GF Connect portal to help jumpstart the design process. About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit www.gf.com. Forward-looking information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contact: Stephanie Gonzalez [email protected]
GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications August 28, 2025 Latest technology in GF’s embedded memory portfolio is now available for prototyping SANTA CLARA, Calif., August 28, 2025 – Today at its annual Technology Summit in California, GlobalFoundries (Nasdaq: GFS)(GF) announced the availability of its 22FDX+ with Resistive RAM (RRAM) technology, marking a significant advancement in the company’s portfolio of embedded non-volatile memory (eNVM) solutions. The new RRAM technology, when combined with the high-performance, ultra-low power 22FDX® platform, delivers secure, low-latency, high-density embedded memory for code storage for wireless microcontrollers and AI IoT applications. Designed with industry-proven OxRAM technology, GF’s embedded RRAM offers cost-effective memory with low power read/write, high endurance and excellent retention. On-chip integration with GF’s enhanced 22FDX platform delivers improved data retention, reliability, security and power efficiency, creating compact and versatile system-on-chip (SoC) solutions for intelligent, connected devices. RRAM’s high density and scalability are ideal for AI-enabled, IoT devices that rely on high-performance intelligence at the edge, such as sensors, wearables and industrial systems. 22FDX+ RRAM also enables weight storage for neural networks, enabling more effective and complex networks. “We are pleased to add 22FDX+ RRAM to GF’s growing portfolio of differentiated technologies with the advanced features needed for power-efficient, connected intelligence at the edge,” said Ed Kaste, senior vice president of GF’s ultra-low power CMOS product line. “Our latest solution offers a compelling combination of density, performance and power efficiency, making it well-suited to tackle the challenges of next-generation, AI-enabled and connected devices.” “GlobalFoundries is an important partner for Nordic Semiconductor as we push the boundaries of ultra-low power wireless solutions for the next generation of connected products and AI-enabled devices,” said Oyvind Strom, EVP Short-Range at Nordic Semiconductor. “We welcome GF’s introduction of embedded RRAM as a significant advancement that enables secure, scalable, and power-efficient edge intelligence. This kind of innovation – delivered through a resilient global supply chain – is essential to meeting growing demands for performance, reliability, and sustainability in connected systems.” A macro preliminary design kit for 22FDX+ RRAM is available through GF’s self-service GF Connect portal to help jumpstart the design process. Volume production is slated for 2026, driven by several key customer engagements. Future generations of embedded RRAM technology and deployments to other platforms are in development. About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit www.gf.com. Forward-looking information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contact: Stephanie Gonzalez [email protected]
GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity August 28, 2025 Strategic collaboration across the semiconductor value chain ensures a secure, reliable supply of essential chips for the next generation of consumer IoT SANTA CLARA, Calif., August 28, 2025 – Today at its annual Technology Summit in California, GlobalFoundries (Nasdaq: GFS) (GF) announced a milestone for its 40nm process technology through its partnership with Silicon Labs, the leading innovator in low-power wireless, with the shipment of more than 10 million Silicon Labs Wi-Fi units built on GF’s 40LP platform. This scaled production of wireless SoCs on 40LP, including Silicon Labs’ SiWX917 Wi-Fi 6 chip, is enabling the next generation of high-performance, energy efficient connected devices. Central to this partnership is GF’s expansive portfolio of cost-effective, feature-rich Complementary Metal-Oxide-Semiconductor (CMOS) solutions that deliver the right features for next-generation edge devices. GF’s silicon-proven 40LP process technology offers low leakage in standby mode to support power-efficient, always-on intelligent devices. The 40LP platform is an integral part of GF’s portfolio of advanced technologies for sensing applications, delivering an exceptional noise-to-signal ratio and ensuring accurate data capture for real-time monitoring. The Silicon Labs SiWX917 is a single-chip solution engineered to solve the most critical challenges for battery-powered IoT devices: extending battery life while maintaining a persistent, secure connection. This purpose-built IoT Wi-Fi 6 chip enables Silicon Labs to connect the entire IoT value chain by combining GF’s manufacturing excellence with the most prevalent wireless network in the world. This partnership showcases how high-performance wireless technology enables both the expansion of the IoT ecosystem and the creation of the intuitive, consistent user experiences that consumers have come to expect. “Our commitment is to provide the foundational manufacturing technology that allows innovators to push the boundaries of what’s possible in high-growth markets like consumer IoT,” said Kamal Khouri, senior vice president, feature-rich CMOS product line at GF. “We are proud to see our differentiated platforms empower Silicon Labs to deliver the cost-effective, high-performance solutions that top-tier brands depend on.” “For too long, device makers have had to choose between robust Wi-Fi connectivity and long battery life. Our mission is to eliminate that compromise,” said Irvind Ghai, vice president, Silicon Labs. “Our collaboration with GlobalFoundries is making it possible for us to deliver secure, reliable Wi-Fi connectivity at scale for the next generation of connected devices. This empowers innovators to focus on both painless onboarding, and a smooth user experience their customers expect, while getting their products to market faster.” About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity and sustainability. For more information, visit www.gf.com. Media contact: Stephanie Gonzalez [email protected] About Silicon Labs Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power connectivity, building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the world’s most highly integrated SoCs, Silicon Labs provides device makers the solutions, support, and ecosystems needed to create advanced edge connectivity applications. Headquartered in Austin, Texas, Silicon Labs has operations in over 16 countries and is the trusted partner for innovative solutions in the smart home, industrial IoT, and smart cities markets. Learn more at silabs.com. Note to editors: Silicon Labs, Silicon Laboratories, the “S” symbol, the Silicon Laboratories logo and the Silicon Labs logo are trademarks of Silicon Laboratories Inc. All other product names noted herein may be trademarks of their respective holders. For further information: CONTACT – [email protected]
GaN-on-Silicon: The scalable future of wireless infrastructure August 27, 2025 By Mark Cuezon Director, Wireless Infrastructure & SATCOM at GlobalFoundries Global mobile network data traffic continues to rise, driven by 5G expansion and high-demand applications like video streaming, gaming, and IoT connectivity. The latest Ericsson Mobility Report indicates mobile network data traffic rose 19% from the first quarter of 2024 to the first quarter of 2025, and with Fixed Wireless Access (FWA) traffic included, it is projected to nearly triple to 420 exabytes per month by 2030 [1]. This surge is due to more connected devices and higher average user data consumption, further fueled by better streaming quality, cloud gaming, AI apps, and Extended Reality. Expanding spectrum, especially above 6 GHz, is crucial to support this data growth and improve wireless capacity and coverage. With rising demand for high-performance wireless connectivity, efficient and scalable RF technologies are essential for keeping costs down. As networks move from 5G to 6G, infrastructure must handle higher frequencies, more bandwidth, and higher density, requiring solutions that optimize both performance and cost. Enter Gallium Nitride on Silicon (GaN-Si)—a technology that combines GaN’s high-power efficiency with silicon’s scalable manufacturing, paving the way for widespread adoption in next-generation radio access networks by lowering costs and speeding up deployment. While GaN-on-Silicon Carbide (GaN-SiC) has been favored for sub-6GHz 5G power amplifiers (PA) due to its high efficiency, outstanding thermal conductivity, and high-power density, GaN-Si is now positioned as a cost-effective, high-volume solution for RF applications. GF is driving the next wave of wireless infrastructure by positioning GaN-Si not merely as an alternative, but as a key enabler for next-generation wireless communications innovations. The RF challenge: Higher frequency, wider bandwidth, high efficiency As wireless infrastructure evolves from 5G to 6G, complexity rises. Mobile network operators (MNOs) and OEMs now face demands to support higher frequencies, broader bandwidths, and denser networks while needing to cut costs and power consumption for profitable deployment. According to an August 2024 report from Samsung, radios operating in FR1 n104 (6.425–7.125 GHz) and FR3 (7.125–24.25 GHz) bands are expected to at least double in number of antenna elements compared to today’s 5G sub-6GHz radios [2]. More antenna elements for the same radio total output power lower each antenna’s output power needs, favoring cost-effective solutions like GaN-Si over GaN-SiC. Higher frequencies allow closer antenna spacing, fitting more individual antenna elements into existing footprints but also raising the semiconductor count and BOM costs. This evolution in radio architecture enables the use of GaN-Si due to reduced power amplifier output requirements and establishes GaN-Si as a leading replacement for GaN-SiC for cost reduction. GaN-Si: Driving performance and scalability GaN-Si enables the integration of GaN epitaxy on large-diameter, high-yield 200mm silicon wafers, leveraging the same manufacturing infrastructure used in advanced CMOS technologies. This unlocks key advantages: Lower cost per RF device through economies of scale, as mentioned above Higher production throughput from established silicon fabs Potential for integrating multiple circuit blocks through heterogeneous integration or 3D stacking Although SiC substrates offer better thermal conductivity, the lower material and processing costs of GaN-Si compared to GaN-SiC make it ideal for high-volume uses like massive MIMO and small cells, supporting cost-effective RAN expansion. GaN-Si also achieves comparable RF performance in the mid to upper 5G FR1 (3.3–7.125 GHz) and 6G FR3 (7.125–24.25 GHz) bands. At GlobalFoundries, we are enabling GaN-on-Si to support a wide range of infrastructure applications: C-band (n77/n78) and n79 Massive MIMO radios 5G small cell and Open RAN platforms 6G FR3 architectures requiring broadband, high-linearity and efficiency PAs With silicon-based scalability, GaN-Si is also ideal for co-packaged RF solutions and hybrid integration—all key to next-gen wireless infrastructure platforms. Partnering for the future: GF’s GaN-Si roadmap At GlobalFoundries, we’re building the foundation for the next decade of wireless innovation. Our GaN-on-Si RF platform on 200mm wafers is designed to accelerate time-to-market for wireless infrastructure providers. We’re collaborating with ecosystem partners to drive innovation in packaging, thermal management, and RF circuit design—ensuring that GaN-Si not only meets today’s 5G demands but is also ready for the frequency, bandwidth, power, and efficiency challenges of 6G. Through GlobalShuttle, GF’s multi-project wafer (MPW) program, customers are able to efficiently and cost-effectively evaluate the potential of RF GaN-Si technology, thereby accelerating their product development cycles and reducing time to market. As wireless networks continue to evolve, wireless infrastructure providers must adopt technologies that strike a balance between performance and manufacturability. While GaN-SiC remains relevant for niche, ultra-high-power applications, GaN-Si is the path forward for scalable, high-efficiency RAN deployments. By transitioning to GaN-Si, MNOs and OEMs can unlock the benefits of GaN technology—without the economic limitations of legacy substrate materials. GlobalFoundries is proud to be at the forefront of this transition—powering the wireless future with scalable, efficient RF technologies. [1]: Ericsson Mobility Report June 2025 [2]: Samsung Research Report August 2024 Mark Cuezon is the Director of Wireless Infrastructure and SATCOM End Markets at GlobalFoundries, where he drives strategic growth and customer engagement across next-generation wireless connectivity networks and platforms.
EXTOLL collaborates with ERIDAN as a Key Partner for Lowest Power High-Speed SerDes IP on GlobalFoundries’ 22FDX August 25, 2025
Cirrus Logic and GlobalFoundries Expand Strategic Investment to Advance Next-Generation Mixed-Signal Semiconductor Manufacturing in the U.S. August 19, 2025 Austin, TX and Malta, NY – August 19, 2025 – Cirrus Logic (Nasdaq: CRUS), a leading provider of high-performance audio and mixed-signal semiconductor solutions, today announced the expansion of its long-standing relationship with GlobalFoundries (Nasdaq: GFS) (GF) – one of the world’s leading semiconductor manufacturers. These joint development efforts aim to accelerate the introduction of more efficient, powerful, and reliable chip technologies that will drive the next generation of everyday devices, from smartphones to automobiles. Together, the companies are advancing the development and commercialization of next-generation BCD (Bipolar-CMOS-DMOS) process technology, which allows different functions to be combined on a single chip, making devices more power efficient and compact. This technology will be capable of being manufactured at GlobalFoundries’ facility in Malta, New York, adding a U.S. based option to complement existing manufacturing in Singapore and Germany. The expanded collaboration is expected to support Cirrus Logic’s commitment to delivering cutting-edge mixed-signal products to its core markets while strengthening the resilience and geographic diversity of its customers’ semiconductor supply chains. Cirrus Logic and GF are also collaborating on accelerating innovation in Gallium Nitride (GaN) technology utilizing GF’s specialized manufacturing facility in Essex Junction, Vermont. With a high-power density and the ability to handle high voltages, GF’s GaN-on-silicon platform offers efficiency and power management benefits for consumer and industrial applications. This joint effort is expected to expand Cirrus Logic’s mixed-signal and power technology portfolio, unlocking new capabilities and market opportunities. “We are excited to deepen our long-standing relationship with GlobalFoundries and help accelerate cutting-edge mixed-signal chip manufacturing to the U.S.” said John Forsyth, Cirrus Logic President and Chief Executive Officer. “This collaboration expands the technology leadership of both companies, strengthens the U.S. semiconductor supply chain and reinforces our shared commitment to innovation and customer success.” “GlobalFoundries is proud to expand our partnership with Cirrus Logic, a company that shares our commitment to driving semiconductor innovation and strengthening domestic manufacturing capabilities that are vital to national competitiveness and economic resilience,” said Tim Breen, CEO of GlobalFoundries. “Together, we’re enabling the next generation of essential chip technologies that will power tomorrow’s devices and systems. This collaboration underscores the importance of resilient, geographically diverse supply chains for our industry.” About Cirrus Logic, Inc. Cirrus Logic is a leader in low-power, high-precision mixed-signal processing solutions that create innovative user experiences for the world’s top mobile and consumer applications. With headquarters in Austin, Texas, Cirrus Logic is recognized globally for its award-winning corporate culture. Cirrus Logic, Cirrus and the Cirrus Logic logo are registered trademarks of Cirrus Logic, Inc. All other company or product names noted herein may be trademarks of their respective holders. About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity and sustainability. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Media Contact Derrick Shannon Account Director, Touchdown PR [email protected] 512.599.4015 Julia Betts Director, Communications & Employee Experience, Cirrus Logic [email protected] 512.851.4147
GlobalFoundries Completes Acquisition of MIPS August 14, 2025 Transaction expands IP offerings, strengthens portfolio differentiation and brings in engineering talent to accelerate AI and compute innovation MALTA, N.Y., Aug. 14, 2025 – GlobalFoundries (Nasdaq: GFS) (GF) today announced that it has completed its acquisition of MIPS, a leading supplier of AI and processor IP. The acquisition strengthens GF’s position as a global leader in differentiated semiconductor manufacturing and enhances its capabilities in AI, edge computing and other high-growth markets. The combination of GF and MIPS brings together decades of expertise in advanced semiconductor manufacturing and processor IP innovation, enabling GF to deliver more differentiated solutions to meet the growing demand for energy-efficient, high-performance computing at the edge and beyond. MIPS is expected to continue to operate as a standalone business within GF, maintaining its licensing model and focusing on serving a broad customer base across diverse technology sectors. About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity and sustainability. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-looking Information This news release contains forward-looking statements regarding the combination of GF with MIPS, which involve risks and uncertainties. Such risks and uncertainties include, but are not limited to, potential adverse effects or changes to relationships with customers, employees, suppliers or other parties resulting from the completion of the transaction, which could adversely affect GF’s or MIPS’ business, including current plans and operations. Readers are cautioned not to place undue reliance on any of these forward-looking statements and urged to review the risks and uncertainties discussed in our 2024 Annual Report on Form 20-F, current reports on Form 6-K and other reports filed with the Securities and Exchange Commission. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contact:Erica McGill[email protected]+1-518-795-5240
Cyientsemi Insights – Cyient Semiconductors Enters Strategic Channel Partnership with GlobalFoundries August 7, 2025
GlobalFoundries Expands Partnership with Apple to Advance Wireless Connectivity and Power Management, Reinforcing U.S. Chip Manufacturing Leadership August 6, 2025 MALTA, N.Y., August 6, 2025 — GlobalFoundries (Nasdaq: GFS) (GF) today announced it has entered into an agreement with Apple for a deeper collaboration that will advance semiconductor technologies and strengthen U.S. manufacturing. This partnership will enable GF to accelerate investments at its state-of-the-art semiconductor manufacturing facility in Malta, New York, underscoring a shared commitment to strengthen U.S.-based innovation and production of power-efficient, AI-enabling technologies that are essential to the future of mobile computing and intelligent devices. “Today’s announcement is a significant milestone in our decade-long partnership with Apple, as we work together to manufacture critical wireless connectivity technologies and power management solutions, key parts of next-generation AI-enabled devices,” said Tim Breen, CEO of GlobalFoundries. “This is a testament to GF’s technology differentiation, coupled with our unique secure and onshore capabilities, and the trust Apple has placed in GF to deliver and build the advanced chips that power its next-generation smart mobile technologies. This agreement builds on our prior announcements and reinforces our shared commitment to strengthening U.S. semiconductor manufacturing and building a more resilient onshore supply chain.” “With our new American Manufacturing Program, we’re proud to partner with companies like GlobalFoundries to create new jobs and bring even more manufacturing to America,” said Sabih Khan, Apple’s chief operating officer. “This is part of our $600 billion commitment to the US over the next four years, and we couldn’t be more excited about the future of American innovation.” In June, in collaboration with major technology partners, GF announced plans to invest $16 billion to expand semiconductor manufacturing and advanced packaging across its facilities in New York and Vermont. These efforts are supported by and aligned with the administration’s bold policies, which prioritize American leadership in AI, including domestic semiconductor manufacturing for national and supply chain security. About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity and sustainability. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners.
