Q&A with GF Master Inventor Yan Ping Shen

Photo of Yan Ping ShenAt GlobalFoundries, the title of Master Inventor is reserved for colleagues with at least 20 issued U.S. patents and who have a demonstrated track record of technical accomplishments and intellectual property (IP) asset creation. 

The program is a powerful platform for honoring prolific employees as well as motivating other employees who may have been thinking about submitting their inventions for patenting.

Along with inspiring and mentoring their colleagues, Master Inventors serve as advisors and are a resource for GF’s technology leaders and legal team on a range of technical, strategic, and IP topics.

We spoke with GF Master Inventor Yan Ping Shen, on our Malta team, to learn about the process of inventing and get a closer look at the spirit of innovation at GF.

Q: Yan Ping, please give a brief introduction about yourself. 

Yan Ping: I am currently a Senior Member of the Technical Staff with the Integration Team. I have been with GlobalFoundries for 16 years.  I started with GF in Singapore in 2005. I moved to Dresden for a one-year training and then came to Malta in 2011. Since being with GF, I have always been in Process Integration.

How did you feel when you found out about becoming a Master Inventor?

It is my honor to be one of the Master Inventors! It certainly motivates me to work harder.

What role does patenting play in your career?  How has it changed you?

My technical leadership. It motivates me to think more about generating more ideas. I am also a patent reviewer on GF’s FinFET Patent Development Committee.  Since joining, I think about why and how submitters come up with these ideas.  Different people have different and brilliant ideas to resolve the same issue.

How do you come up with ideas?

I am actively involved in discussions with fellow inventors and think about alternative technical solutions. We find issues, and form a team to discuss alternative solutions.

What do you think is a critical component of being an inventor?

Having novel ideas, willing to have active discussions with peer inventors, encouraging others to participate in discussions. Everyone needs to be involved. The more experienced inventors can encourage juniors to be involved also.

What advice would you give to new inventors?

No matter what stage of your career you are in, don’t be afraid to speak up, lack of experience doesn’t mean anything.  Be involved, no matter what. Take an active role in discussions. Also, it helps to do lots of article research, to try to solve a problem.

When you are not submitting patents or reviewing patents, what do you do for fun?

I enjoy marathon running.  I train every day and look forward to being able to race in marathons again.

22FDX Technology Brings Real Change to Augmented Reality

Strategic partnership between GF and Compound Photonics will lead to more powerful, smaller, lighter and more energy-efficient AR/MR glasses.

by Gary Dagastine

Augmented- and mixed-reality (AR/MR) technology is at an historic inflection point, and the strategic partnership recently announced by GLOBALFOUNDRIES (GF) and Compound Photonics (CP, also known as CP Display) is driving it forward.

The two companies will work together to transform the workings of near-eye microdisplays, which are at the heart of AR/MR systems. CP’s IntelliPix™ platform will be manufactured using GF’s best-in-class 22FDX™ semiconductor solution, creating the world’s first real-time AR/MR specific single-chip microdisplay enabling pixels as small as 2.5µm. The result will be the industry’s most advanced light modulation agnostic backplane/video pipeline with the ability to span a roadmap of current amplitude liquid-crystal-on-silicon (LCoS) thru microLED all the way to holographic while providing the required performance for real-time AR/MR systems.

IntelliPix

The scalable and flexible single-chip solution will support CP’s existing LCoS technology as well as CP’s forthcoming microLED display technology.

With IntelliPix, the idea is to turn on only the pixels which need to be active in order to render the desired image, rather than to continually refresh all of the pixels in a display. This not only conserves power in the inactive pixel regions, it also results in higher image quality and brightness, faster refresh rates and, ultimately, AR glasses with more advanced features and performance, smaller and lighter form factor and which last much longer on a single charge.

The IntelliPix architecture integrates CP’s proprietary video pipeline that reacts in real-time compensating for head motions and other environmental conditions; a software-programmable backplane to control the pixels dynamically; and driver circuitry to deliver the necessary power. Until now this has required multiple chips, but the next generation of AR glasses requires a single-chip design that is simpler, higher-performance, smaller and less power-hungry.

A Natural Choice

“GF’s industry-leading 22FDX solution is a natural choice for many reasons,” said Ed Kaste, Vice President of Industrial and Multi-Market at GF. “Its ultra-low power capabilities are a major advantage, but that’s only the beginning. 22FDX technology has a higher SRAM density than other planar technologies, and SRAM density correlates directly with pixel density, enabling IntelliPix to significantly shrink the pixel size. This results in a high performance, highly integrated solution which helps enable sleeker, lighter AR glasses. Also, the ability to turn pixels on and off, while leveraging body bias control, leads to far better on and off states, so that when a pixel is on, it’s brighter and when it’s off, it’s really off, further conserving power and reducing thermal effects.”

Ed KasteThe adaptive body bias (ABB) feature of 22FDX technology affords designers significantly more precision when fine-tuning the transistor threshold voltage of a circuit, enabling them to more effectively optimize the performance, energy efficiency, area, and reliability of a chip to meet the needs of a specific application.

“22FDX technology also enables CP to easily integrate intellectual property (IP) specific to its customers into the design, as well as higher-voltage devices that some microdisplay architectures require. Our existing reference designs and ecosystem resources make this development process far less challenging than it would be with other technologies,” Kaste said.

Tapeout is anticipated by the end of this year, with samples delivered to CP’s customer in the first quarter of 2022.

Lessons Learned from Nature

CP started to focus its microdisplay development effort in AR/MR and heads-up displays since 2016 by leveraging its wealth of IP portfolios in LCoS display and advanced electronic drive architecture. Based on its current generation platform, CP’s displays have been known in the industry for the smallest pixel pitch, highest optical efficiency, lowest display latency and highest frame rate performance compared with other display providers. 

“We had the industry’s best microdisplay sub-system – light modulator, backplane and driver – at that point, which served us well to gain traction,” said Edmund Passon, CP’s co-CEO. “But more recently, I began to think about how our optical system functions given we feed directly into it. The optical signal from the retina is split into multiple channels and is pre-processed there before it reaches the brain, The processing is similar to compression without the need to resend information the brain already has received,” he said. “I realized that to achieve the performance we were seeking for next-generation AR/MR glasses, we’d need to do something similar in reverse to reduce bandwidth and associated power consumption while maintaining performance. It allows us to send only data that is changing, while providing high performance to active objects/pixels, all at the lowest power consumption possible.”

The IntelliPix architecture feature set partitions the processing between the SOC and the display sub-system, he said. CP’s customers who build compatible rendering pipelines can take full advantage of the feature set completely optimizing for real-time AR/MR systems. But the 28nm semiconductor technology CP initially turned to wasn’t up to the task for IntelliPix’s breakthrough design using smart pixels, which can be achieved with 22FDX technology.

“Our current, multi-chip backplane architecture consisted of a one-bit pixel with an appetite for bandwidth. We started our work at 28nm, but to achieve the desired pixel size with the amount of logic IntelliPix required under the smart pixel, we needed GF’s 22FDX solution with its best-in-class high-performance, power efficiency and broad feature integration capability,” Passon said. “Also, looking toward the future, while our pixel size is 3.015µm right now, we’ve found that the IntelliPix architecture will enable us to get it down to as small as 2.5µm depending on the feature set. That opens up the possibility of designing microLED-based displays with a bayer like pixel grid that supports fewer required pixels. and again partitioning properly between the microdisplay and SOC video pipeline/rendering will result in the optimal power/performance balance. So the scalability of any single-chip solution is critical, and 22FDX technology fits the bill.”

A Unique Partnership

Ruby Yan“We chose to partner with CP not only because they are technically innovative with respect to both hardware and software, but because they’ve been around a while as a company and have demonstrated the value of what they offer through an extensive network of corporate relationships,’ said Ran (Ruby) Yan, GF product manager for wearables, smart home and machine vision products.

 “What we especially like about CP is that they always target the most difficult challenges, and it is exciting and rewarding to be involved in such endeavors, which can bring about not only industrial progress but significant positive change in our daily lives,” she said.

Yan said GF brings to the partnership a great deal of experience with display drivers, both integrated with backplanes and as standalone ICs, for applications including smartphones, automotive and medical devices. “We are using the baseline 22FDX platform for this work and it is also an extension of what we are already doing,” she said. “For example, the required customization will impact the backend of the line process, to add some unique features to the optical interconnect.”

The Future of Display

Kaste said that displays overall are a key focus for GF because they span a growing number of applications across all of the company’s business units. The demonstrated performance and lessons learned from this engagement could revolutionize display technology and the display value chain going forward, he said, and he asked CP’s Passon what he thinks 22FDX technology can bring to applications beyond AR/MR glasses.

Enabled by GF’s 22FDX platform, IntelliPix's backplane designs provide the flexibility options to support different  light modulation technologies.

“It’s a great question,” Passon said. “Ever since we started to work with 22FDX technology, new ideas just seem to pop out of the woodwork. For example, we can see how it would be possible to use 22FDX technology to make improved performance video walls. The size of the LEDs is quite different, but their care and feeding is the same with the ability to reach the highest duty cycles that IntelliPix can provide – you could put together any number of display tiles to make a wall-based television of any size.”

“Also, over the years we’ve done a lot of work with holography, and the IntelliPix platform along with the high performance capabilities of 22FDX technology serves this very well” Passon continued. “We think there’s a fantastic opportunity in automotive AR heads-up displays to place holographic objects in 3D space for better driver awareness and responsiveness. In fact, the automotive sector is particularly appealing for holographic applications in the near term, given the current computer-generated hologram (CGH) compute/power required. Work in the CGH algorithm area is showing promise to reduce this power, and IntelliPix will be ready to integrate easily with those systems to produce the highest fidelity holograms.”

Passon said that while the future holds many new and exciting opportunities, there are still technical challenges that must be overcome on an industry-wide basis to get there. “For microLED-based displays to become truly practical both technically and economically, the industry must find ways to commercialize the pixelated epitaxial fabrication processes currently used in manufacturing. For holography, meanwhile, we must find ways to reduce the required compute power,” he said.

Nonetheless, right now AR/MR technology is on the brink of major change, and the partnership between CP and GF is playing a key role in making it happen.

 

22FDX技术为增强现实带来真正的改变

格芯与Compound Photonics之间展开战略合,使AR/MR眼镜变得功能更强大、体积更小、重量更轻,并且能效更高。

撰文:Gary Dagastine

增强现实和混合现实(AR/MR)技术正处在一个关键转折点,为推动该技术向前发展,格芯®(GLOBALFOUNDRIES®)与Compound Photonics(CP,又称CP Display)最近宣布达成了战略合作关系。

CP Display

双方将携手变革AR/MR系统的核心技术——近眼微显示方式。CP的IntelliPix™平台将采用格芯出色的22FDX™半导体解决方案进行生产,以打造业界首款实时AR/MR专用单芯片微显示器,最小像素可达2.5µm。最终将得到光调制不限的业界先进背板/视频管道,技术路线图覆盖当前的振幅硅基液晶显示芯片(LCoS)、microLED,乃至全息技术,同时能够为实时AR/MR系统提供所需的性能。

该单芯片解决方案兼具可扩展性和灵活性,支持CP现有的LCoS技术以及即将推出的microLED显示技术。

IntelliPix的设计理念是,仅开启渲染目标图像所需激活的像素,而不是持续刷新显示器中的所有像素。这样不仅可在非活跃像素区域节省功耗,还可以提高图像质量和亮度,加快刷新率,最终使得AR眼镜变得功能更先进、性能更出色、体积更小、重量更轻,并且单次充电工作时间更长。

IntelliPix架构集成CP专有的视频管道,可响应头部运动和其他环境条件,进行实时补偿;背板具有软件可编程功能,用于进行动态像素控制;驱动器电路用来提供必要的功率。到目前为止,该实现仍需要多个芯片,但下一代AR眼镜要求采用更简单、性能更高、尺寸更小且功耗更低的单芯片设计。

水到渠成的选择

格芯工业和多市场业务部副总裁Ed Kaste表示:“格芯业界领先的22FDX解决方案是水到渠成的选择,理由有很多。超低功耗能力是其一个主要的优势,但这只是个开始。22FDX技术具有比其他平面技术更高的SRAM密度,而SRAM密度与像素密度直接相关,因此IntelliPix能够显著缩小像素尺寸。这样可以打造出高性能、高度集成的解决方案,有助于使AR眼镜更小巧、更轻便。此外,由于能够在充分利用体偏置控制的同时,开启和关闭像素,因此可实现更好的导通和关断状态,即像素开启时变得更亮,而像素关闭时会真正进入关断状态,从而进一步节省功耗并降低热效应。”

Ed Kaste22FDX技术的自适应体偏置(ABB)功能使设计人员在微调电路的晶体管阈值电压时获得更高的精度,更有效地优化芯片的性能、能效、面积和可靠性,以满足特定应用的需求。

Kaste表示:“22FDX技术还使CP能够轻松地将其客户专有的IP集成到设计中,以及某些微显示架构所需的高压器件中。我们现有的参考设计和生态系统资源使得该开发过程的挑战性远低于其他技术。”

预计将于今年年末流片,样品将于2022年第一季度交付CP的客户。

从实践中自然汲取的经验

自2016年开始,CP利用其在LCoS显示器和先进电子驱动架构中的丰富IP组合,将其微显示器的研发重点放到AR/MR和平视显示器上。与其他显示器供应商相比,CP基于当前一代平台的显示器已经因其具有最小像素间距、最高光学效率、最低显示延迟和最高帧率性能而在业内享有盛誉。

Ed PassonCP联合首席执行官Edmund Passon表示:“我们拥有当时业界最出色的微显示器子系统(光调制器、背板和驱动器),因此深受青睐。但最近,我开始思考当我们直接向光学系统馈入信号时,其工作方式如何。来自视网膜的光学信号被分割到多个通道,并在到达大脑之前进行预处理。该过程类似于压缩,使得无需重新发送大脑已经收到的信息。我认识到,要实现我们所追求的下一代AR/MR眼镜性能,我们需要进行一些类似的反向处理,以在保持性能的同时减少带宽和相关功耗。我们需要能够仅发送发生变化的数据,同时为活跃对象/像素提供高性能,并以尽可能低的功耗执行所有操作。”

他表示,IntelliPix架构功能集在SOC和显示子系统之间对处理进行了分区。CP的客户通过构建兼容的渲染管道,就可以充分利用针对实时AR/MR系统完全优化的功能集。但是,CP最初采用的28nm半导体技术并不能满足IntelliPix利用智能像素的突破性设计任务,而这可以通过22FDX技术实现。

Passon表示:“我们目前的多芯片背板架构由一个对带宽有很高要求的1位像素组成。我们的研发工作始于28nm,但是要在智能像素条件下达到理想的像素尺寸和IntelliPix所需的逻辑量,则需要格芯的22FDX解决方案,因为该解决方案具备出色的性能、功效和广泛的功能集成能力。此外,展望未来,虽然我们当前的像素尺寸为3.015μm,但我们发现IntelliPix架构将使我们能够根据功能集将像素尺寸缩小到2.5µm。这使得设计microLED显示器成为可能,该显示器采用拜尔式像素网格,支持更少的所需像素。同样地,在微型显示器和SOC视频管道/渲染之间进行适当的分区,将可实现功率/性能的出色平衡。因此,任何单芯片解决方案的可扩展性都至关重要,而22FDX技术恰好符合这一要求。”

独特的合作关系

格芯可穿戴设备、智能家居和机器视觉产品业务部产品经理Ran(Ruby)Yan表示:“我们之所以选择与CP合作,不仅是因为其在硬件和软件方面的技术创新,还因为CP公司成立已有一段时间,并且拥有广泛的企业关系网络,展示了他们所提供产品的价值。

Ruby YanCP最让我们看重的一点是,他们始终以应对最困难的挑战为目标,能够参与其中是件令人兴奋的事情,让人很有成就感,这不仅可以带来产业进步,还可以给我们的日常生活带来重大的积极变化。”

Yan表示,格芯为此次合作带来了丰富的显示驱动器经验,适合智能手机、汽车和医疗设备等应用,既可与背板集成,又可作为独立IC。她表示:“我们使用22FDX基准平台进行此项目,这也是我们现有研发工作的扩展。例如,所需的可定制化将影响生产线流程的后端,以便为光学互连增加一些独特的功能。”

显示器的未来

Kaste表示,总的来说,显示技术是格芯的一个重点,因为它们的应用范围越来越广泛,横跨公司的所有业务部。他还表示,从此次合作中获得的性能和经验可能会彻底改变显示技术和未来的显示价值链。他曾问过CP的Passon,22FDX技术可以为AR/MR眼镜以外的应用带来什么。

vDrive vs. iDrive

Passon回答道:“这是一个很好的问题。自从开始采用22FDX技术以来,我们就不断涌现出新想法。例如,我们发现可以使用22FDX技术来制作性能更高的视频墙。LED的尺寸差异很大,但借助IntelliPix可提供的最高占空比能力,它们的工作条件相同,因此您可以将任意数量的显示片拼接在一起,制造出任何尺寸的电视墙。”

Passon继续说道:“此外,多年来,我们在全息技术方面做了大量努力,搭载高性能22FDX技术的IntelliPix平台可很好地满足这一要求。我们认为在汽车AR平视显示器中存在一个绝佳的机会,即将全息对象置于3D空间中,以增强驾驶员的感知和响应能力。实际上,结合考虑目前计算机生成全息图(CGH)所需的计算/功耗,全息应用在短期内对汽车行业特别有吸引力。CGH算法领域的研究显示该功耗有望降低,IntelliPix将准备好与这些系统轻松集成,以生成高保真度的全息图。”

Passon表示,尽管未来令人兴奋的新机遇众多,但要实现这一目标,仍需在全行业范围内克服一些技术挑战。他表示:“要使microLED显示器在技术上和经济上更具实用性,业界必须找到方法,将当前生产中的像素化外延制造工艺商业化。同时,对于全息技术,我们必须找到方法来降低所需的计算功耗。”

不管怎样,AR/MR技术目前正处于重大变革的边缘,CP与格芯之间的合作关系正为实现这一变革发挥重要作用。

Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature

Adaptive Body Bias feature on GF’s 22FDX platform and Cadence digital full flow enable power efficiency and optimal PPA for IoT, voice processing and always-on sensor fusion SoCs

GLOBALFOUNDRIES and Cadence Add Machine Learning Capabilities to DFM Signoff for GF’s Most Advanced FinFET Solutions

Highlights:

  • Cadence Litho Physical Analyzer with ML technology qualified for GF 12LP/12LP+ solutions, providing up to 33% greater detection efficiency with less than 10% runtime impact
  • Collaboration between Cadence and GF enables signoff engineers to speed production of chip designs on GF’s 12LP and 12LP+ solutions for the AI, data center, hyperscale, and aerospace and industrial markets

SAN JOSE and SANTA CLARA, Calif., March 23, 2021—GLOBALFOUNDRIES® (GF®), the global leader in specialty semiconductor manufacturing, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration to facilitate design for manufacturing (DFM) signoff with machine learning (ML) prediction capabilities. As part of the collaboration, the Cadence® Litho Physical Analyzer, a DFM pattern analysis tool integrated with GF-developed ML models, has been qualified for GF’s 12LP and 12LP+ solutions. 

The ML-enhanced Cadence Litho Physical Analyzer, optimized for GF’s 12LP and 12LP+ solutions, provides customers with in-design automated DFM hotspot detection and fixing capabilities to speed implementation and time to market. The ML-based enhancement delivers up to 33% greater detection efficiency versus traditional pattern-matching checks with less than 10% runtime impact. 

GF has released a corresponding ML-enhanced DFM kit as an update to 12LP process design kits (PDKs), with the 12LP+ version scheduled for release in the second quarter of 2021, providing customers with a simple path to speed design and production of chips optimized for the artificial intelligence (AI), data center, internet of things (IoT) and other markets. 

GF’s most advanced FinFET solution, 12LP+ is optimized for AI training and inference applications and offers chip designers an efficient development experience and a fast time-to-market. 12LP+ builds upon GF’s established 14nm/12LP platform, of which GF has shipped more than one million wafers. 12LP and 12LP+ deliver a superior combination of AI power, performance and area (PPA) benefits without the need to migrate to smaller and much costlier geometries.

“By incorporating ML capabilities into the Cadence Litho Physical Analyzer, customers using GF’s 12LP platform and 12LP+ solution can verify signoff quality during implementation, thereby achieving better silicon quality,” said Jim Blatchford, vice president of technology enablement at GLOBALFOUNDRIES. “Our collaboration with Cadence also allowed the swift enablement and seamless integration with our customers’ design flows through the delivery of this new capability in our 12LP and 12LP+ PDKs.”

The Cadence Litho Physical Analyzer enhanced with ML seamlessly integrates with the Cadence Innovus™ Implementation System and Cadence Virtuoso® custom IC design platform, providing customers with a smoother design experience through a common, familiar interface. The Litho Physical Analyzer is part of the broader Cadence digital full flow, which supports Cadence’s Intelligent System Design™ strategy, enabling system-on-chip (SoC) design excellence.

“Not only does our Litho Physical Analyzer tool include ML capabilities, but the entire Cadence implementation platform has ML capabilities as well, which let us provide customers with a highly sophisticated solution,” said Michael Jackson, corporate vice president, R&D in the Digital & Signoff Group at Cadence. “Through our latest collaboration with GF, customers can leverage our tools with the added boost of ML capabilities to achieve design success using GF’s 12LP/12LP+ solutions. Furthermore, our Litho Physical Analyzer with ML capabilities enhances GF’s DRC+ capabilities and improves yield based on the tool’s ability to effectively catch more hotspots and repair previously undetected hotspot patterns.”

The Cadence Litho Physical Analyzer supports Cadence’s broader Intelligent System Design™ Strategy, enabling SoC design excellence. For more information on the Cadence advanced-node solutions, visit www.cadence.com/go/advnodesols.

About GF

GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its customers to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For six years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com

Contacts:

Michael Mullaney
GLOBALFOUNDRIES
518-305-1597
[email protected]

Cadence Newsroom
408-944-7039
[email protected]

 

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格芯®(GLOBALFOUNDRIES®)22FDX射频解决方案为下一代毫米波汽车雷达提供了基础

基于格芯22FDX射频解决方案的下一代汽车雷达技术,将帮助车辆变得更加智能,让道路交通比现在更安全。

加利福尼亚州圣克拉拉,2021年3月11日 – 全球领先的特殊工艺半导体制造商格芯®(GLOBALFOUNDRIES®)与博世将合作开发和制造下一代汽车雷达技术。

博世选择格芯作为其合作伙伴,并采用格芯22FDX™射频解决方案,开发制造了用于先进驾驶辅助系统(ADAS)应用的毫米波汽车雷达片上系统(SoC)。ADAS应用通过保持车辆行驶在正确车道上、发出碰撞警告、启动紧急制动、辅助泊车等,帮助驾驶员实现安全驾驶。

博世之所以选择格芯作为下一代毫米波汽车雷达的合作伙伴,是因为格芯在射频和毫米波特殊工艺半导体代工解决方案方面处于领先地位。格芯22FDX射频解决方案具备出色的性能、功耗和广泛的功能集成能力,是汽车雷达的理想半导体解决方案。

格芯高级副总裁兼汽车、工业和多市场战略业务部总经理Mike Hogan表示:“我们很荣幸能与博世合作开发新一代汽车雷达,帮助车辆变得更加智能,让道路交通比现在更安全。博世作为汽车行业高品质OEM解决方案的创新者和供应商,其领导地位毋庸置疑。格芯将汽车半导体技术的卓越布局作为核心战略,我们的22FDX可以提供出色的高性能、低功耗解决方案。此外,格芯是唯一具有内部毫米波测试能力的晶圆厂。”

博世高级副总裁兼集成电路部门负责人Oliver Wolst表示:“可靠的雷达和ADAS系统对全球各地的驾驶员和汽车制造商来说都至关重要。我们之所以选择与格芯合作,是因为他们不仅在射频和毫米波技术方面处于公认的领先地位,并且在汽车市场拥有深厚的专业知识。我们仔细审查了各种现有的半导体解决方案,最终发现对于我们下一代高效安全的汽车雷达来说,格芯22FDX射频解决方案是当今最有吸引力、最合适的平台。”

格芯22FDX芯片在其德国德累斯顿Fab 1晶圆厂生产。

作为合作关系的一部分,博世将利用格芯汽车统包解决方案进行毫米波测试和封装开发,这将有助于提高设计效率并加快产品上市。这些后端与统包服务将在格芯德累斯顿Fab 1晶圆厂和佛蒙特州伯灵顿附近Fab 9晶圆厂中格芯世界一流的毫米波测试实验室中提供。

首批基于22FDX的雷达SoC将用于进一步测试博世新一代汽车雷达,计划于2021年下半年交付。

迄今为止,格芯22FDX解决方案已经实现了45亿美元的设计营收,向全球客户交付了超过3.5亿枚芯片。

关于格芯

格芯®(GLOBALFOUNDRIES®)是全球领先的特殊工艺半导体代工厂,提供差异化、功能丰富的解决方案,赋能我们的客户为高增长的市场领域开发创新产品。格芯拥有广泛的工艺平台及特性,并提供独特的融合设计、开发和生产为一体的服务。格芯拥有遍布美洲、亚洲和欧洲的规模生产足迹,以其灵活性与应变力满足全球客户的动态需求。格芯隶属Mubadala Investment Company。如需了解更多信息,请访问www.globalfoundries.com/cn

媒体联系人

格芯

Michael Mullaney
+1-518-419-2199
[email protected] 

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Compound Photonics Partners with GLOBALFOUNDRIES to Manufacture World’s First Monolithic Microdisplay for Real-Time AR

Compound Photonics Product Image

Compound Photonics partners with GLOBALFOUNDRIES to manufacture IntelliPix, the world’s first monolithic microdisplay that provides backplane design options to enable microLED or Liquid Crystal on Silicon. (Image Source: CP Display)

Chandler, Ariz., and Santa Clara, Calif., March 10, 2021 Compound Photonics US Corporation (CP, also known as CP Display), a leader in microdisplay solutions for Augmented/Mixed Reality (AR/MR), and GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced a strategic partnership to manufacture IntelliPix™, CP’s microdisplay technology platform. IntelliPix enables a truly real-time holographic consumer AR experience by enabling smaller and lighter AR glasses that last longer on a single charge. IntelliPix provides a real-time video pipeline, coupled with a fully integrated digital backplane and driver for pixels as small as 2.5µm, for the first time in a single-chip solution. CP’s proprietary IntelliPix technology is realized on GF’s best-in-class 22FDX™ specialty semiconductor platform.

Through the industry-leading partnership, CP and GF are kicking off development of a series of cutting-edge custom solutions on GF’s 22FDX platform to enable IntelliPix’s flexible architecture that provides a software-defined and scalable feature set. The overall advancement in IntelliPix supports up to 100 times faster modulation while consuming 4 to 12 times less system power across the video pipeline, compared to CP’s previous platforms, while unlocking the real potential for amplitude liquid crystal on silicon (LCoS), emerging microLED and future phase-based holographic systems.

By intelligently focusing only on changing pixels, IntelliPix is directed to pixels that are active, while conserving power in inactive pixel regions, resulting in high image quality and brightness, while significantly lowering the overall display subsystem power (OnDemand Pixels™). By leveraging the high-performance, ultra-low power, and broad feature integration capability of GF’s 22FDX platform, CP is able to deliver IntelliPix’s smart pixel digital backplane integrated with its proprietary real-time video pipeline at high frame rates and low latency all in one single chip with no compromises in display area, cost or power consumption to meet the critical requirements for widespread consumer AR.

“GF is an ideal partner for IntelliPix, our next-generation monolithic display,” said Ian Kyles, vice president of engineering at CP. “Their industry-leading 22FDX platform offers the low-power benefits, density, and interconnect features that enable our latest set of innovations, and their willingness to customize additional features for our display simplifies our manufacturing flow.”

To date, GF’s 22FDX solutions have realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world.

“We are proud to partner with Compound Photonics, and leverage our world-class technology to help bring their game-changing IntelliPix platform to volume production,” said Mike Hogan, senior vice president and general manager of Automotive, Industrial and Multi-market at GF. “The breakthrough design of IntelliPix, which only activates the pixels that need refreshing, is a natural match with our 22FDX platform, which is unrivaled in the industry as an ultralow-power solution with excellent memory density and integration capabilities to support a range of future-forward applications.”

For emerging microLED pixel technology, IntelliPix-iDrive™ can be configured with a constant current pixel drive optimized to deliver pixel to pixel uniformity supported with a software-defined drive scheme and a MIPI interface. IntelliPix also provides an IntelliPix-vDrive™ configuration as a voltage/charge driven pixel optimized for driving LC based pixels for both amplitude and phase/holographic light modulation. The OneChip™ physical design of IntelliPix eliminates traditional distinctions between display pixel drive (backplane) and display driver IC (DDIC) functions to reduce the overall physical volume and power consumption while enabling cutting-edge features. The partnership between CP and GF enables a customized Intellipix architecture based on a vDrive or iDrive modulated backplane/display configured to customer specifications.

The IntelliPix microdisplay technology platform is customizable for resolutions up to 2048 x 2048 and beyond. Expect the first commercial products featuring CP’s IntelliPix to be on the market in 2023. 

During SPIE ARVRMR in March 28-31, 2021, CP will present IntelliPix™ at the Industry Talk session and discuss about how the technology platform presents the opportunities for the industry to accelerate the mainstream AR adoption.

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About Compound Photonics

Compound Photonics (CP), also known as CP Display, is a leading provider of compact high resolution microdisplay technologies. CP’s microdisplay solutions are optimized to serve the augmented reality and mixed reality markets where high performance, small form factor, and low power consumption are most critical. Compound Photonics’ microdisplays enable engineers to innovate and create game-changing consumer and industrial products that can greatly enhance people’s productivity and lifestyle.

Media Relations Contact:

Sherry Li | +1 (360) 993-6707| [email protected]

About GLOBALFOUNDRIES

GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its customers to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

Media Relations Contact:

Michael Mullaney | +1-518-419-2199 | [email protected]

 

Compound Photonics与格芯®合作携手为实时AR制造全球首款单芯片微显示技术平台

亚利桑那州钱德勒和加利福尼亚州圣克拉拉,2021年3月10日 – 增强/混合现实(AR/MR)微显示解决方案领域的领先企业Compound Photonics US Corporation(CP,也称为CP Display)与全球领先的特殊工艺半导体代工厂格芯®(GLOBALFOUNDRIES®)今日宣布建立战略合作关系,携手制造CP微显示技术平台IntelliPix™。借助IntelliPix,AR眼镜可以变得体积更小、重量更轻,并且单次充电可工作更长时间,从而带来真正的实时全息消费电子AR体验。IntelliPix首次在单芯片解决方案中提供了实时视频管道,并搭载了完全集成的数字背板和驱动器,最小像素可达2.5µm。CP的专有IntelliPix技术采用格芯出色的22FDX™特殊工艺半导体平台来加以实现。

CP和格芯都是其各自行业的领先企业,通过这次合作,他们希望着手采用格芯22FDX平台开发一系列先进的定制解决方案,以实现IntelliPix的灵活架构来提供软件定义的可扩展功能集。与CP之前的平台相比,IntelliPix性能整体提升,调制速度加快多达100倍,并且整个视频管道的系统功耗降低至四分之一到十二分之一,同时释放了振幅硅基液晶显示芯片(LCoS)、新兴microLED和未来相位全息系统的真正潜力。

IntelliPix通过以智能方式仅聚焦于变化像素来定向至活跃像素,同时可在非活跃像素区域节省功耗,从而提高了图像质量和亮度,并显著降低了整个显示子系统的功耗(OnDemand Pixels™)。通过利用格芯22FDX平台的高性能、超低功耗和广泛的功能集成能力,CP成功地在单芯片中提供集成其专有实时视频管道的高帧率和低延迟IntelliPix智能像素数字背板,同时又不影响显示面积、成本和功耗方面的性能,能够满足广泛消费电子AR的关键需求。

CP工程部副总裁Ian Kyles表示:“格芯是我们下一代单芯片显示技术IntelliPix的理想合作伙伴。其业界领先的22FDX平台提供了低功耗优势、密度优势和互连功能,这些特性使我们能够做出一系列的最新创新,并且他们愿意为我们的显示产品定制更多功能,从而简化我们的制造流程。”

迄今为止,格芯的22FDX解决方案已经实现了45亿美元的设计营收,向全球客户交付了超过3.5亿枚芯片。

格芯高级副总裁兼汽车、工业和多市场战略业务部总经理Mike Hogan表示:“我们很荣幸能与Compound Photonics合作,利用我们的先进技术帮助他们将颠覆性的IntelliPix平台转入量产。IntelliPix采用突破性的设计,仅会激活需要刷新的像素,而我们的22FDX平台是业界领先的超低功耗解决方案,具有出色的存储密度和集成能力,可支持一系列面向未来的应用。这两者简直就是天生的搭档。”

对于新兴的microLED像素技术,IntelliPix-iDrive™可以使用恒定电流像素驱动进行配置,它经过优化,能够在软件定义的驱动方案和MIPI接口的支持下,提供像素与像素

之间的一致性。IntelliPix还提供了IntelliPix-vDrive™配置来用作电压/电荷驱动像素,针对驱动基于LC的像素进行了优化,以便实现振幅和相位/全息光调制。IntelliPix的OneChip™物理设计消除了显示像素驱动器(背板)和显示驱动器IC(DDIC)功能之间的传统区别,从而在实现先进特性的同时,减小了总体物理体积和功耗。通过双方合作,CP和格芯基于vDrive或iDrive调制背板/显示器,打造了可根据客户规范进行配置的定制Intellipix架构。

IntelliPix微显示技术平台支持定制,分辨率可达2048 x 2048或更高。预计首批采用CP IntelliPix的商业产品将于2023年投放市场。 在2021年3月28日至31日举行的SPIE ARVRMR上,CP将在行业对话环节中介绍IntelliPix™,并讨论该技术平台如何为行业带来加速采用主流AR的机遇。

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关于Compound Photonics

Compound Photonics(CP)也称为CP Display,是领先的紧凑型高分辨率微显示技术供应商。CP的微显示解决方案经过优化,旨在满足高性能、小尺寸和低功耗特性至关重要的增强现实和混合现实市场。Compound Photonics的微显示技术让工程师能够创新打造颠覆性的消费和工业产品,大幅提高人们的生产力并改善他们的生活方式。

媒体关系联系人: Sherry Li | +1 (360) 993-6707| [email protected]

About GLOBALFOUNDRIES

GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its customers to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

Media Relations Contact:

Michael Mullaney
+1-518-419-2199
[email protected]

GlobalFoundries 22FDX RF Solution Provides the Basis for Next-Gen mmWave Automotive Radar

Next-generation auto radar technology, based on GF’s 22FDX RF solution, will help make vehicles smarter and roads even safer than today

Santa Clara, Calif., March 9, 2021 – GlobalFoundries® (GF®), the global leader in specialty semiconductor manufacturing, and Bosch will partner to develop and manufacture next-generation automotive radar technology.

Bosch chose GF as its partner to develop a mmWave automotive radar system-on-chip (SoC) for Advanced Driver Assistance Systems (ADAS) applications, manufactured using GF’s 22FDX™ RF solution. ADAS applications help drivers stay safe by keeping a vehicle in the correct lane, warning of collisions, initiating emergency braking, assisting with parking, and more.

Bosch’s choice of GF as the partner for its next-gen mmWave automotive radar is based on GF’s leadership in specialty foundry solutions for RF and mmWave. GF’s 22FDX RF solution, with its best-in-class performance, power consumption, and broad feature integration capability, is the semiconductor solution of choice for automotive radar. 

 “We are proud to partner with Bosch to develop a new generation of automotive radar, and to help make vehicles smarter and roads even safer than they are today,” said Mike Hogan, senior vice president and general manager of Automotive, Industrial and Multi-market at GF. “Bosch’s leadership, as an innovator and provider of top-quality OEM solutions to the auto industry, is unquestionable. At GF, we have embraced excellence in automotive semiconductors as a core strategy, and our 22FDX is unbeatable as a high-performance, low-power solution. In addition, GF is the only foundry with in-house mmWave test capability.”

“Dependable radar and ADAS systems are of paramount importance to drivers and automakers around the world,” stated Oliver Wolst, senior vice president heading Bosch’s Integrated Circuit division. “We chose to partner with GlobalFoundries for their proven leadership in RF and mmWave technology, which is reinforced by their deep expertise in the automotive market. We carefully scrutinized the universe of available semiconductor solutions, and GF’s 22FDX RF solution proved to be today’s most attractive and most appropriate platform for our next generation of highly efficient and safe automotive radars.”

GF’s 22FDX chips are manufactured at its Fab 1 facility in Dresden, Germany.

As part of the partnership, Bosch will utilize GF’s automotive turnkey solutions for mmWave testing and packaging development, which will assist in increasing design efficiency and speeding time to market. These post-fab and turnkey services will take place at GF’s Fab 1 in Dresden and at GF’s world-class mmWave testing lab at Fab 9 near Burlington, Vermont.

The first 22FDX-based radar SoCs for further testing of Bosch’s new generation of automotive radars are targeted for delivery in the second half of 2021.

To date, GF’s 22FDX solutions have realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world.

About GF

GlobalFoundries (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its customers to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

Media Contact

GlobalFoundries
Michael Mullaney 
+1-518-419-2199
[email protected]

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Black History Month a Time of Celebration, Learning at GLOBALFOUNDRIES

By Emma Cheer
Global Diversity & Inclusion Leader, GLOBALFOUNDRIES

As Black History Month draws to a close, I would like to take this opportunity to reflect upon the incredible month of celebration, learning, and engagement we had at GLOBALFOUNDRIES (GF).

Dereca Blackmon

To kick off our celebration of Black History Month, GF was proud to welcome back Dereca Blackmon, CEO of Inclusion Design Group, to speak about the life of Dr. Martin Luther King, Jr., and how his life offers us a blueprint for unity and justice in building community.

In her amazing presentation, Dereca said:

“This conversation is about: how do we build something together that creates a space for everyone to be honored? That creates a space for a true meritocracy? Because meritocracy is based on the idea that there’s a level playing field for people to start … What we want to agree to is removing any obstacles that have ever been in place that create less opportunity for women in the workplace, or less opportunity for people of color, or less opportunity for people who spoke different languages or didn’t go to elite colleges. 

Whatever those barriers are that created less opportunity, well, then we really didn’t have a meritocracy. Now, as we remove those barriers, now everyone can start on a level playing field, and we can consciously create that playing field. That’s what I see happening at so many corporations now. 

That the consciousness has been raised to say, “Hey, maybe we have actually been giving preference to people who are like us … And here’s an opportunity for us to open up the doors, open up our mindset, and open up the possibility of engaging with folks who are different than us.

That’s what the legacy of the Civil Rights Movement is.”

One way GF fosters diversity and inclusion is through employee-led resource groups. Our newest group, Black Resource Affinity Group, or BRAG, is dedicated to promoting the recruitment, retention and professional advancement of Black employees. BRAG co-sponsored Dereca’s presentation in partnership with GF’s Diversity & Inclusion team. This month, BRAG also hosted an excellent and impactful mentorship panel discussion for GF employees, with several black colleagues and BRAG members sharing stories of how mentorship has played a positive role in their career journeys.

The Jackie Robinson Foundation Logo

Advancing Opportunity and Community

This month, GF announced a new partnership with the Jackie Robinson Foundation (JRF). This partnership focuses on advancing higher education opportunities for underrepresented minorities, by providing multi-year scholarship awards to highly motivated college students with an interest in STEM – science, technology, engineering, and math. In addition to scholarships, the JRF Scholars Program provides these talented young people with mentorship, networking, and leadership development opportunities.

GF is proud to support the JRF, a national nonprofit organization founded to perpetuate the memory of Jackie Robinson, a pioneer and civil rights activist, who broke the color barrier, becoming the first African American in professional baseball. As the JRF says:

“When we overlook the talent, skills, and efforts of some, we impede the progress of all of us. Jackie Robinson demonstrated the transformative power of inclusion.”

GF believes strongly in philanthropy, and our employees around the globe make a difference by volunteering their time and donating money and goods to support a wide range of causes. For Black History Month, GlobalGives and BRAG collaborated to showcase several nonprofit organizations that offer opportunities and resources for Black Americans in different aspects of their personal and professional lives. The nonprofits support programs include computer science education and training for young Black men; providing mental health support for women of color; and offering support to Black cancer patients.

Black Leadership at GF

At GF, we embrace diversity and inclusion as a competitive advantage. Leveraging the unique perspectives and talents of our employees allows GF to better compete in the global marketplace and better serve our customers. We are committed to expanding the diversity of our team, which will only lead to greater success.

Amin Glass

That is why, last year, GF partnered with McKinsey Black Leadership Academy. McKinsey’s program acknowledges the unique skills of Black leaders and the challenges they face. The Academy offers two programs, a three-month Black Executive Leadership Program with a focus on real-world challenges and driving transformation, and a six-month Management Accelerator to build foundational skills for early- to mid-career leaders.

So far, more than 30 outstanding Black leaders at GF have participated or are currently participating in these programs. One GF colleague, Amin Glass, senior section manager of Factory Automation Engineering, and a co-founder of BRAG, had this to say of his experience participating in the McKinsey Black Leadership Academy:

“The program has been great so far.  One area in particular is on the technical side regarding problem solving.  The class has taught and provided me with tools to approach and solve problems in a variety of different ways.”

Looking Ahead

Even as GF’s celebration of Black History Month draws to a close, our company’s commitment to diversity and inclusion is expanding. We are taking a bold approach to the recruitment, development, and advancement of minority professionals at our U.S. facilities, with a focus on growing representation both within GF and more widely in the semiconductor industry. We are investing in our team and our future.

At GF, one of our core values is “Embrace” — a reminder of the strength that comes from a culture of inclusivity, empathy, and respect. Our company and its culture are the sum of each and every employee. We are ONEGF, and the path before us is more diverse, more inclusive, and more successful than ever before.

Diversity Equity Inclusion