Exciting visit August 12, 2021 Armin Laschet, Chairman of the CDU Germany, with GF Managing Director Dr. Manfred Horstmann and employees from our team at a press event in Fab 1 in Dresden. During his summer tour at our site today, the candidate for chancellor found out more about semiconductor production and the expansion plans for our factory.
Joint press release: TU Dresden, University of Manchester and GlobalFoundries achieve breakthrough in AI cloud systems July 27, 2021 Source: TU Dresden TU Dresden, University of Manchester, Racyics GmbH and Globalfoundries (GF) today announced the tapeout of the SpiNNaker2 chip – a new artificial intelligence chip inspired by the human brain. Based on the SpiNNaker infrastructure developed by the University of Manchester, the hybrid AI architecture realized at the TU Dresden, the adaptive body-bias IP platform ABX by Racyics and using the 22FDX solution by Globalfoundries, SpiNNaker2 is a neuromorphic AI Real-time processor with unprecedented efficiency and sub-millisecond latency for event-based systems. SpiNNaker2 is designed to scale up to a cloud system with 70,000 chips under real-time operation, making it a key building block for real-time AI at extremely high data rates. SpiNNaker2 will have a disruptive impact on AI applications such as smart cities, 5G, tactile internet and autonomous driving because no other current hardware meets the simultaneous requirements of low latency, high throughput and energy efficiency. The complete 10 million processor machine SpiNNaker2, called “SpiNNcloud,” is used at the TU Dresden for research purposes. At the same time, the startup “SpiNNcloud Systems GmbH” wants to make SpiNNaker2 commercially available. Artificial intelligence is having an ever-increasing impact on our daily lives. However, current AI hardware and algorithms are only partially inspired by the human brain. Even the best AI hardware currently is a far cry from the 20-watt power consumption, low latency, and unparalleled high-throughput processing power offered by the human brain. SpiNNaker2 is a multiprocessor system for event-based real-time processing of both classic AI and future event-based calculation paradigms inspired by the brain’s holistic, efficiency-optimized and demand-oriented processing. SpiNNaker2 was developed as part of the EU research project “Human Brain Project.” The backbone of the system is a bespoke, lightweight communications infrastructure that scales from edge devices to large server cloud applications without suffering the inherent slowdown typically associated with scaling computations to cloud size. Prof. Steve Furber (University of Manchester): “There is still a lot to learn from biology if we want to exploit the full potential of AI in the future. SpiNNaker2 is designed to bridge the gap between realistic brain models and AI so that both can increasingly benefit from each other.” With the SpiNNaker2 chip, a SpiNNcloud with 70,000 chips and 10 million cores is to be set up at the TU Dresden, which, together with local initiatives such as the CeTI Cluster of Excellence and other national and international partners, is to research applications ranging from autonomous driving to data processing in real time in a smart city, tactile internet applications to biomedical processing. “Our holistic, economy-optimized system design, combined with a unique hybrid AI framework, enables real-time AI on an unprecedented scale. We will use the SpiNNaker2 machine at the TU Dresden to conduct cutting-edge research on novel machine learning, but we are also proud to be able to offer this unique AI commercially through our startup SpiNNcloud Systems,” explains Prof. Christian Mayr, Chair of Highly Parallel VLSI -Systems and Neuromicroelectronics at the Faculty of Electrical Engineering and Information Technology at the TU Dresden. SpiNNaker2 was realized in the 22FDX ecosystem using Racyics GmbH’s Adaptive Body Biasing IP (ABX) platform to leverage the full potential of 22FDX. This IP platform enables SpiNNaker2 to operate at the minimum power point of the processing units at 0.50V with additional support for dynamic voltage and frequency scaling for high performance on demand. SpiNNaker2 thus uses the advanced power-saving properties of 22FDX, Globalfoundries Dresden’s flagship technology. The complete chip design was performed by the TU Dresden team using makeChip, a design environment for 22FDX provided by Racyics. This approach was crucial for the academic group, 22FDX™, GlobalFoundrie’s unique 22nm FD-SOI technology, proves to be the ideal basis for modern AI chips directly inspired by the human brain with its worldwide unique low power consumption and optimized transistor performance. GF’s 22FDX™ technology, manufactured in Dresden, enables highly efficient neuromorphic real-time calculations with a latency of less than one millisecond, as required for AI applications such as smart cities, 5G, tactile internet, autonomous driving. The 22FDX-based SpiNNaker2 chip shows the synergies that are possible when European cutting-edge AI research meets European semiconductor technology: For the first time, the existing gap between AI optimized purely for numerical performance and real brain-inspired AI is closed. “As the world’s leading specialty foundry, Globalfoundries enables world-class teams to achieve commercial breakthroughs. SpiNNaker2 is tangible proof of the outstanding performance achieved by combining the latest advances in brain-inspired artificial intelligence and our high-performance 22FDX technology,” says Dr. Manfred Horstmann, head of Globalfoundries Dresden. The tapeout was financially supported by ERDF and the Free State of Saxony in the ‘SpiNNcloud’ project (application number: 100373652). We thank ARM for IP use. Information for journalists: Globalfoundries Karin Rath’s email: [email protected] TU Dresden Prof. Christian Mayr Email: [email protected] University of Manchester Jordan Kenny Email: [email protected] Racyics GmbH Holger Eisenreich Email: [email protected] SpiNNcloud Systems GmbH Christian Eichhorn Email: [email protected]
A New GF Brand for a New Era of More July 19, 2021by Michelle Leyden Li, Vice President and Head of Global Brand and Marketing People around the world rely on semiconductor chips every day, throughout the day, and most don’t even know it. Chips are everywhere – inside everything from appliances to thermostats, smartphones to automobiles, and industrial equipment to medical devices. In fact, just one automobile may have as many as 1,500 chips. These incredibly complex feats of human ingenuity power our world, fuel the global economy and enrich our lives. At GlobalFoundries (GF), we know that our role as one of the world’s leading semiconductor chip manufacturers is vital to humanity, and we don’t take that role lightly. In fact, over the last few years we’ve transformed our company to ensure that our customers can rely on us to deliver innovative, feature-rich process technology solutions for manufacturing chip designs, used in the most demanding and in-demand applications. For example, if you have a 5G-enabled smartphone, chances are that 5G signal passes through a chip manufactured by GF. Reliable access to semiconductor chips has also become imperative to countries’ economic and national security. GF is one of only five companies in the world that can manufacture chips at scale for these increasingly complex and vital supply chains, and it’s the only one with a global footprint, providing our customers with unimpeded access to a trusted technology source. Today, we’ve reached an exciting point in our journey as we introduce a new GF brand. Our new brand is the culmination of our transformation journey and the embodiment of the new GF. I’m excited to share it with you. Delivering a new era of more Four essential components make our company and brand story uniquely ours: First, we are redefining innovation and semiconductor manufacturing. We believe that semiconductor manufacturing innovation is about making chips smarter, not just smaller. That’s why we work hand in hand with our customers, collaborating to develop and manufacture feature-rich solutions that provide the leadership performance vital to many growing markets. Unlike compute-centric chips, feature-rich chips enable specific features such as touchscreens, streaming movies and secure pay, and new generations of these chips will require greater security and lower power consumption even as they enable our customers to push the envelope of innovation. GF innovation and semiconductor manufacturing expertise makes that possible. Second, our global manufacturing footprint advantage. GF’s manufacturing facilities are geographically dispersed with large manufacturing centers in North America, Europe and Asia. Our global footprint provides a level of flexibility and accessibility that no other semiconductor manufacturer can offer its customers. Third, collaboration and partnership with our customers. We’ve reinvented the customer-supplier dynamic in the semiconductor industry to enable a more tightly aligned partnership. We are leading the transformation to a more evolved “fabless/foundry” model that is predicated on long-term collaboration. It makes it possible for our customers to focus on chip design innovations that advance critical applications, while we focus on process technology feature innovations ensuring that those designs can be manufactured in high volume and within critical time-to-market windows. This new model ensures predictability, repeatability, and sustainability for GF and our customers, which is now more vital than ever. Fourth, diversity throughout our company. We have the most diverse workforce in the global semiconductor manufacturing industry, which increases our ability to innovate and enables better collaboration with our customers worldwide. GF would not be one of the world’s leading semiconductor companies without the diversity of ideas, thought and backgrounds that the approximately 15,000 members of our global workforce bring to meeting and exceeding the needs of our customers each and every day. A new visual identity that represents the new GF while honoring our heritage GF’s new visual identity captures the essence of who we are as a company, and what and how we contribute to society, while honoring our heritage: Our logo: our new brand logo is the combination of a logomark and a word mark. The logomark is a reductive design of our two-letter GF name and the reductive nature of the design represents our brand story. The left-hand side of the “g” in the logomark is fashioned using a half circle and a quarter circle. The circle shapes are representative of a globe highlighting our global footprint as well as a semiconductor wafer. The middle shape is shared between the “g” and the “f,” signifying partnership and collaboration, core indicators of the relationships we have with our customers. Two squares that define the remainder of the “f” signify the chips, and stacked one on top of the other, make an equal sign that we use to communicate our brand story. Our colors: our new visual identity retains use of the color orange, allowing GF to retain our earned brand equity in that color, while reflecting our bold personality as well as our optimism and warmth. We have added yellow and purple to our color palette to communicate our warmth and our boldness. Our visual imagery: our new brand steers away from the industry norm of techie and graphic abstract images, and instead focuses on the scope and humanity of GF. These global, people-centric, inspired images reiterate our global footprint and presence. Overall, GF’s new visual identity has been meticulously crafted to be bold, innovative, inviting and simple. Our brand reflects who we are, highlighting the vital role we play in the world. In fact, at the very moment you are reading this, it’s likely you’re just a few feet away from a chip manufactured by GF. That’s a true story, and it’s our story.
GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing July 19, 2021 Malta, New York, July 19, 2021 – GlobalFoundries (GF), the global leader in feature-rich semiconductor manufacturing, today announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years. These plans include immediate investments to address the global chip shortage at its existing Fab 8 facility as well as construction of a new fab on the same campus that will double the site’s capacity. The announcement was made as the company convened leaders from government and industry to progress the national discussion around solving U.S. semiconductor supply chain challenges. CEO Tom Caulfield was joined by U.S. Senate Majority Leader Chuck Schumer, U.S. Secretary of Commerce Gina M. Raimondo, former Pentagon officials, and executives from leading companies throughout the semiconductor supply chain. GF will invest $1 billion to immediately add an additional 150,000 wafers per year within its existing fab to help address the global chip shortage. Following that, GF plans to construct a new fab that will create more than 1,000 new direct high-tech jobs and thousands more indirect jobs including high-paying construction jobs for the region. Following the successful investment model of Fab 8, GF is planning to fund the new facility through private-public partnerships including customers, federal and state investments. This new capacity will serve the growing demand for secure, feature-rich chips needed by high-growth markets including automotive, 5G connectivity and the Internet of Things. The facility will also support national security requirements for a secure supply chain. These investments to expand GF’s U.S. manufacturing footprint are part of the company’s broader global expansion plans that include the recently announced new fab in Singapore and $1 billion planned investment to expand in Germany, all to meet the growing demand from customers worldwide. “Our expansion and job creation in Malta requires a new economic model, based on the bold public-private partnerships being championed in Washington by visionary leaders Senator Schumer and Secretary Raimondo, as well as close collaboration with our customers,” said GF CEO Tom Caulfield. “Our industry is expected to grow more in the next decade than it did in the past 50 years and GF is stepping up to do its part as we work together to address the growing demand for technology innovation for the betterment of humanity. We are honored to be joined by government and automotive leaders, national security experts, and our valued customers to continue the critical discussions needed to create a reliable supply of American-made chips to support the U.S. economy and national security.” “I’ve led the fight to establish historic federal incentives for semiconductor manufacturing and R&D to strengthen the domestic semiconductor supply chain that is critical to our national security and global competitiveness, including addressing the chip shortage impacting industries across the economy, all in hopes of bringing us to announcements like this today,” said Sen. Schumer. “As Majority Leader, I worked hard with companies like GlobalFoundries to craft and pass the bipartisan U.S. Competition and Innovation Act, providing $52 billion to expand the domestic semiconductor industry and supercharge the GlobalFoundries expansion of Fab 8 and building a new fab in Malta. Today’s announcement is a win-win-win: a win for jobs in the Capital Region, a win for GlobalFoundries, and a win for U.S. government, automakers, and other critical industries that desperately need chips.” GF employs more than 15,000 worldwide with 7,000 people across the U.S., and nearly 3,000 at its headquarters in Malta, New York. GF has invested more than $15 billion in its Fab 8 facility over the last decade to support innovation and increase manufacturing capacity. As an accredited supplier of advanced semiconductors to the U.S. government, GF delivers secure and reliable semiconductor solutions at Fab 8, which is compliant with the U.S. International Traffic in Arms Regulations (ITAR). Moreover, GF offers the highest industry, customer and government criteria for secure manufacturing, worldwide, through its GF Shield program. About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop innovative products for high-growth markets. GF provides a broad range of feature-rich process technology solutions with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.gf.com. ### Media Contacts Erica McGillGlobalFoundries(518) 795-5240[email protected] Michael MullaneyGlobalFoundries(518) 305-1597[email protected]
全新的格芯品牌，开创更加广阔的新纪元 July 19, 2021全球各地的人们每天都在依赖半导体芯片，而且大多数人甚至没有意识到这一点。芯片无处不在，从电器到恒温器、从智能手机到汽车、从工业设备到医疗设备，都要使用芯片。事实上，仅仅一辆汽车就可能使用多达1500个芯片。这些令人难以置信的复杂芯片是人类智慧的壮举，它成就了我们的世界，为全球经济提供了动力，也丰富了我们的生活。作为全球领先的半导体芯片制造商之一，格芯®（GLOBALFOUNDRIES®）清楚地知道，我们的角色对人类至关重要，我们不会轻视这一角色。 事实上，在过去的几年里，我们已经对公司进行了转型，确保我们的客户可以依赖我们提供功能丰富的创新工艺技术解决方案，用于芯片设计制造，满足要求最严格、需求量最大的应用。举例而言，如果您有一部5G智能手机，那么里面很可能会使用格芯制造的芯片来接收5G信号。 半导体芯片的可靠供应也成为各国经济和国家安全的当务之急。芯片供应链变得日益复杂，同时也变得愈加重要，而格芯是世界上仅有的五家能够为这些供应链规模化.生产芯片的公司之一，也是唯一一家拥有全球生产足迹的公司，能够为我们的客户提供了畅通可靠的技术来源。 今天，我们迎来了一个激动人心的时刻——我们推出了一个全新的格芯品牌。我们的新品牌是我们转型之旅的巅峰，也是新格芯的化身。我很高兴与大家分享这个消息。 开创更加广阔的新纪元 四个基本要素构成了我们公司和品牌独特的故事： 首先，我们正在重新定义创新和半导体制造。我们认为，半导体制造的创新是让芯片更智能，而不仅仅是尺寸更小。这就是为什么我们与客户携手合作，共同开发和制造功能丰富的解决方案，为许多不断增长的市场提供至关重要的领先性能。与以计算为核心的芯片不同，功能丰富的芯片能够实现一些特定的功能，如触摸屏、流媒体电影和安全支付，这类新一代芯片虽然使我们的客户能够推动创新，但也将需要更高的安全性和更低的功耗。格芯的创新和半导体制造专长让这一切成为可能。 第二，我们的全球制造规模优势。格芯的生产设施分布在全球各地，在北美、欧洲和亚洲都有大型的生产中心。我们的全球布局为客户提供了其他半导体制造商无法提供的灵活性和便利性。 第三，与客户的密切协作和合作。我们重塑了半导体行业的客户与供应商动能，以实现更紧密的伙伴关系。我们正在引领行业向一种更先进的“无晶圆厂/代工厂”模式演进，这种模式建立在长期合作的基础上。在这种模式下，我们的客户能够专注于推进关键应用的芯片设计创新，而我们则专注于工艺制程功能创新，确保这些设计可以在关键的问市窗口期实现大批量生产。这种新模式确保了格芯和我们客户合作的可预测性、可重复性和可持续性，这几点现在比以往任何时候都更加重要。 第四，公司的多元化。我们拥有全球半导体制造业最多元化的员工队伍，这提高了我们的创新能力，使我们能够更好地与全球客户合作。我们在全球各地共有约15000名员工，他们拥有多元化的想法、思想和背景，每天帮助我们满足和超越客户的需求。没有这些他们，格芯就不可能成为世界领先的半导体公司之一。 新的形象标识代表了新的格芯，同时也致敬了我们的传统 格芯的新形象标识反映了我们作为一家公司的本质，体现了我们对社会的贡献以及贡献的方式，同时也致敬了我们的传统： 我们的企业标识：我们的新品牌徽标是一个图标和一个文字标志的结合。图标是我们公司名中两个字母“GF”的简化设计，设计的简化本质代表了我们的品牌故事。 图标中“g”的左半部分采用了一个半圆和一个四分之一圆。这两个圆形代表地球，突出了我们的全球布局，同时也代表了半导体晶圆。 中间的形状由“g”和“f”共用，象征着伙伴关系和协作，是我们与客户关系的核心指标。 “f”的剩余部分由两个正方形堆叠而成，表示芯片，同时两个正方形构成了一个等号，用来传达我们的品牌故事。 我们的色彩：我们的新形象标识保留了原来的橙色，使格芯保留了我们在使用该颜色时积累的品牌资产，同时反映了我们大胆的个性以及我们的乐观和温暖。我们还加入了黄色和紫色来表达我们的热情和大胆。 我们的视觉形象：我们的新品牌摆脱了技术和图形抽象图像的行业惯例，转而关注格芯的眼界和人性化。这些充满灵感的图像寓意全球并以人为中心，重申了我们的全球布局和业务。 总体而言，格芯的新形象标识经过精心设计，兼具大胆和创新，同时简洁又引人注目。我们的品牌反映了我们是谁，突出了我们在全球扮演的重要角色。 事实上，就在您阅读这篇文章的这一刻，格芯生产的芯片可能就陪伴在您的左右。这是一个真实的故事，也是我们的故事。
Alan Shaffer Joins GlobalFoundries Government Security Committee July 14, 2021 High-ranking, former Pentagon official further strengthens the company’s commitment to the U.S. government and national security needs Malta, New York, July 14, 2021 – GlobalFoundries® (GF®) today announced that the Honorable Alan Shaffer has joined the company’s Government Security Committee (GSC), effective immediately. The GSC, formed six years ago, is an integral component of GF’s long-standing program for the secure production of the U.S. Government’s most sensitive semiconductor products. Complementary to GF SHIELD, GF’s comprehensive program for safeguarding governmental and commercial customers’ most confidential and valuable information and products, the Committee advises GF’s leadership and board of directors on key issues of security, government and political affairs. “Over the last months, a chip shortage has put an intense spotlight on our industry and on just how critical U.S. semiconductor manufacturing is to ensure long-term supply to meet exploding demand,” said Saam Azar, senior vice president of Corporate Development, Legal and Government Affairs. “Secretary Shaffer brings a wealth of experience to GF’s GSC, further expanding our expertise in security and intelligence matters, and increasing GF’s reach across industries and the national security community.” Shaffer has had wide ranging leadership roles in the Department of Defense (DoD), most recently serving as the Deputy Under Secretary of Defense for Acquisition and Sustainment (A&S). His accomplished and impactful career as a government leader, public official, and respected authority has earned Shaffer both the Distinguished and the Meritorious Presidential Rank Awards for “sustained extraordinary accomplishment.” On the GSC, Shaffer joins a distinguished group of former senior government officials and semiconductor industry leaders advising GF from a unique set of perspectives and diverse expertise. The committee is chaired by Ken Krieg, former Under Secretary of Defense for Acquisition, Technology and Logistics; and includes Tim Hutchinson, former U.S. Senator from Arkansas; Lou Lupin, former Qualcomm Executive Vice President and General Counsel; and Mike Cadigan, GF’s senior vice president of Customer Design Enablement and long-time IBM executive. As an accredited supplier of advanced semiconductors to the U.S. government, GF is supporting secure government programs to deliver chips for defense, aerospace, and other applications vital to the national interest. In 2021, GF announced a new agreement with the DoD to provide a secure and reliable supply of semiconductor solutions manufactured at GF’s most advanced semiconductor manufacturing facility in Malta, New York. The Malta fab is also compliant with the U.S. International Traffic in Arms Regulations (ITAR). GF is convening a distinguished group of leaders from industry and government to continue the national discussion around solving semiconductor supply chain and national security challenges on Monday, July 19 at GF’s Fab 8 facility in Malta, New York. As a part of the event, GSC advisors, Ken Krieg, Al Shaffer and Mike Cadigan will participate in a panel discussion with other government and industry experts providing insight on national security needs for semiconductor supply chains. About GlobalFoundries GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
Western Digital Appoints Dr. Thomas Caulfield and Miyuki Suzuki to Its Board of Directors July 8, 2021Western Digital Corp. (NASDAQ: WDC) today announced that Dr. Thomas (Tom) Caulfield and Miyuki Suzuki have been appointed to its board of directors effective July 6, 2021. Caulfield, currently CEO of GLOBALFOUNDRIES® and Suzuki, a Japanese-based, Fortune 100 business leader, bring semiconductor and global operating experience that complements Western Digital’s growth and innovation strategy.
GlobalFoundries Appoints Jack Lazar to its Board of Directors June 24, 2021 Seasoned financial and technology executive with strong track record joins board to help accelerate next phase of growth Malta, New York, June 24, 2021 – GlobalFoundries® (GF®) today announced the appointment of Jack Lazar as an independent director to the company’s board of directors, effective July 1, 2021. With his addition, the board will be comprised of 11 members, including four independent directors. “We are delighted to have Jack join our board and audit committee, given his more than 30 years of executive and board experience with fast growing, innovative technology companies,” said Ahmed Yahia Al Idrissi, chairman of GF’s board of directors. “As we accelerate GF’s growth trajectory and continue to push the boundaries of the semiconductor industry forward, Jack’s contributions will be extremely valuable.” “Jack is a highly strategic technology executive known for delivering outstanding results in executive and board roles,” said Tom Caulfield, CEO of GF. “As we expand our critical role in delivering feature-rich solutions to manufacture semiconductors that are becoming more and more pervasive and vital to humankind. Jack’s guidance and experience will be an outstanding addition to our world-class board of directors.” “Semiconductors are the foundation of the technology industry,” said Jack Lazar. “GF is a transformational global semiconductor manufacturer, and now is an exciting time to be joining the company’s board of directors. I look forward to working with a great team to further accelerate the company’s growth trajectory in the industry.” Lazar brings more than 30 years of experience in operational and finance roles at various growth-oriented public and private companies, most recently as chief financial officer of GoPro. Prior to that, he served in leadership roles at Qualcomm, Atheros Communications, NetRatings, Apptitude and Electronics for Imaging (EFI). Lazar began his career at Price Waterhouse, is a certified public accountant (inactive) and currently holds both public and private board and advisory roles at various technology and consumer companies. About GlobalFoundries GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGlobalFoundries(518) 795-5240[email protected]
GlobalFoundries Breaks Ground on New Fab in Singapore June 22, 2021 New Singapore facility is the first step of GLOBALFOUNDRIES’ plan to expand its global manufacturing footprint to meet increasing worldwide customer demand Malta, N.Y., and Singapore, June 22, 2021 –GlobalFoundries® (GF®), the global leader in feature-rich semiconductor manufacturing, today announced it is expanding its global manufacturing footprint with the construction of a new fab on its Singapore campus. In partnership with the Singapore Economic Development Board and with co-investments from committed customers, GF’s more than US $4B (S$5B) investment will play an integral role in meeting the growing demand for the company’s industry-leading manufacturing technologies and services to enable companies worldwide to develop and scale their business. In a virtual groundbreaking ceremony, Singapore Minister for Transport and Minister-in-charge of Trade Relations S. Iswaran and Mubadala Investment Company Managing Director and Group CEO H.E. Khaldoon Khalifa Al Mubarak, were joined by: UAE Ambassador to Singapore H.E. Jamal Abdulla Al Suwaidi; Singapore Ambassador to the UAE H.E. Kamal R Vaswani; Singapore Economic Development Board Managing Director Chng Kai Fong; GF Board Chairman Ahmed Yahia Al Idrissi; along with GF executives including CEO Tom Caulfield; CFO David Reeder; SVP and Head of Global Operations KC Ang; SVP of Global Sales Juan Cordovez; VP of Human Resource for APAC and International Fabs Janice Lee; and VP of Technology Development in Singapore Dr. Soh Yun Siah. The global demand for semiconductor chips is growing at an unprecedented rate, with worldwide semiconductor revenue projected to increase 2.1 times in the next eight years1. To meet that demand, GF has planned capacity expansions at all its manufacturing sites in the U.S., Germany and, starting with the construction of phase one of its 300mm fab expansion, Singapore. When complete, GF will add capacity for 450,000 wafers per year, bringing GF’s Singapore campus up to approximately 1.5 million (300mm) wafers per year. The new fab will be the most advanced semi manufacturing facility in Singapore and will further enhance GF’s ability to provide its feature-rich RF, analog power, non-volatile memory solutions. GF is adding 250,000 square feet (23,000 square meters) of cleanroom space and new administrative offices. The new fab will create 1,000 new high-value jobs such as technicians, engineers and more. With construction already underway, the Fab is planned to ramp in 2023. “GF is meeting the challenge of the global semiconductor shortage by accelerating our investments around the world. Working in close collaboration with our customers and the Government of Singapore is a recipe for success that we are pioneering here and looking forward to replicating in the U.S and Europe,” said GF CEO Tom Caulfield. “Our new facility in Singapore will support fast-growing end-markets in the automotive, 5G mobility and secure device segments with long-term customer agreements already in place.” “We are committed to partnering industry leaders such as GlobalFoundries to address the global demand for semiconductors, especially in growth areas such as artificial intelligence and 5G. The semiconductor industry is a key pillar of Singapore’s manufacturing sector, and GlobalFoundries’ new fab investment is testament to Singapore’s attractiveness as a global node for advanced manufacturing and innovation. It will help GlobalFoundries’ customers to strengthen the resilience of their supply chains, and also add to the vibrancy of our economy through the creation of good jobs for Singaporeans and business opportunities for our local enterprises,” said Dr. Beh Swan Gin, Chairman of the Singapore Economic Development Board. Semiconductor chips are more pervasive than ever, becoming one of humankind’s most vital resources. From smartphones and automobiles to technology in schools and hospitals, modern society can no longer survive without them. GF is a trusted provider to more than 250 customers worldwide and is investing, in partnership with these customers and regional governments, to expand the capacity of its global manufacturing footprint to help right the demand-supply imbalance. About GlobalFoundries GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Media Contacts GlobalFoundries Daniel Lin +65 9878 0858 [email protected] Erica McGill +1-518-795-5240 [email protected]
GF Drives Progress in Next-Generation Automotive Radar June 21, 2021Academic researchers use GlobalFoundries technologies to boost the range, resolution and visual field of automotive radar systems, a critical need for the industry. by Gary Dagastine Automotive radar has come a long way since 1999, when Mercedes-Benz “taught the car to see” as the company puts it. That’s when Mercedes introduced the first radar-based adaptive cruise control (ACC) system to be deployed commercially, its DISTRONIC system, initially available as an option on select models. Today, of course, ACC is standard on many new cars, but it’s far from the only automotive radar application and more are on the way. Modern vehicles may have several different radars for automatic emergency braking, blind-spot monitoring, lane-change assist and other advanced driver-assistance system (ADAS) functions. In the not-too-distant future, enhanced radar capabilities will enable more sophisticated safety systems and more autonomous vehicles. One of the world’s leading semiconductor manufacturers, GlobalFoundries (GF) delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments, including automotive radar. GF’s range of platforms for this application – 22FDX™, RF CMOS and SiGe BiCMOS – deliver unmatched RF/mmWave performance, outstanding digital processing/integration capabilities, and ultralow-power operation. They are supported by comprehensive end-to-end services that meet the automotive industry’s demanding requirements for performance, reliability, quality, packaging and testing. GF’s Automotive, Industrial and Multi-Market (AIM) business unit is its home for automotive radar solutions, as well as for Internet of Things and industrial radar applications like traffic monitoring and factory automation. (Motion-sensing radar for cell phones is a focus of GF’s Mobile and Wireless Infrastructure business unit.) Given the growth and importance of automotive radar, Foundry Files spoke with GF’s Pirooz Parvarandeh, Chief Technology Officer of AIM, and his colleague Farzad Inanlou, Chief Technology Officer for Radar and mmWave Systems within AIM, to discuss future technical requirements in this area. GF’s strategy to meet these requirements includes collaborations with key academic researchers through GF’s University Partnership Program. We recently told how this program is advancing 6G wireless communications technology. Now, to learn how GF solutions are driving progress in automotive radar, we also spoke with GF academic partner Sorin Voinigescu, a University of Toronto professor and one of the world’s leading experts in high-frequency electronics. Range, Resolution and Field-of-View are Key GF’s Inanlou said range, resolution and field-of-view are the main requirements for automotive radar systems, and that significant improvements must be made in all of them to reach the industry’s goals. “Range, or how far ahead of the car a radar can see, is a function of the car’s speed, and by the end of the decade we’ll need to have systems with a range of 300 meters, up from about 150 meters today, to meet the needs of proposed ADAS systems,” he said. “At the same time, we’ll also need higher resolution to better distinguish between objects, much as lidar does. Lidar is a complementary light-based system which right now can identify objects more realistically than radar, but it doesn’t work well in degraded visual environments such as in heavy rain or foggy conditions. Replacing lidar with radar is desirable because lidar technology tends to be bulkier, less power-efficient and more expensive,” he said. “Finally, in order to create a complete protective zone around the car, we will need to have a much greater field-of-view, or ability to look around the car in every direction. This will require perhaps as many as 10 different radars located throughout a vehicle.” Needed: Higher Levels of Integration Much more integration with CMOS devices is also needed, to create automotive radar that offers more functionality as well as being extremely reliable, highly power efficient, and physically small. Parvarandeh said greater integration will lead to entirely new capabilities and will open up new opportunities for automakers. “Say the car in front of you suddenly stops. The next technical milestone beyond automatic emergency braking is the ability to look around and calculate whether your car can swerve around it, taking into consideration the available time plus any traffic or other obstacles near your car,” he said. “This is important not only for safety, but also because it will give automakers a new feature they can use to attract customers.” Indeed, the importance of highly integrated automotive radar systems is illustrated by the recently announced agreement between GF and Tier One auto supplier Bosch, which selected GF as its partner for development of next-generation millimeter-wave (mmWave) automotive radar system-on-chip (SoC) in part because of the broad feature integration capability of GF’s 22FDX RF platform. “Right now automotive radar operates at 80 GHz, higher than cellular frequencies, and you want to put these mmWave frequencies on the same chip with high-performance digital CMOS capabilities, so the 22FDX platform comes into play,” said Parvarandeh. “Low-power operation is also critical, not only because energy efficiency is desirable but because higher-power devices get hotter, and where these devices are located in a vehicle plays a major role in whether heat can be dissipated effectively,” he said. “Heat affects reliability, and in the future we anticipate there will be more electronics in car doors and other locations where it’s very difficult to get rid of the heat, so highly power-efficient solutions like 22FDX are a must.” While GF’s family of 22FDX solutions already offers high performance at low power, Inanlou said GF has technical roadmaps in place to achieve even higher performance, operating frequencies, and levels of integration, along with the highest possible Ft and Fmax performance in SiGe technology. That’s where the partnerships with Prof. Voinigescu and others come in. “Right now we’re working with eight professors globally who are doing important research into next-generation radars,” Inanlou said. “These collaborations are important because they result in overall reference designs and proof points for our technology which complement the work being done by our own internal teams, whose mmWave reference design work tends to be tailored to industry needs and specifications.” World Expert in High Frequency Electronics Professor Voinigescu has been involved with high-frequency electronics since the early 1980s when, as an undergraduate at Romania’s Polytechnic Institute, he assisted his professor on a project to develop a 10 GHz radio to connect computers at a distance. “Back then we were using microwave waveguides and discrete diodes rather than integrated circuits electronics. We placed these huge three-meter-wide antennas on the tops of buildings to transmit and receive the signals, and it seemed I was always up there trying to align them.” He continued, “I’ve always been interested in wireless and fiber optic technologies because I think they have been and are going to become even more necessary to the way we live. In fact, the way I look at it is that continuing to make progress in these areas is analogous to following Moore’s Law, except that unlike with Moore’s Law the technical and economic benefits of ongoing progress won’t come to an end.” Voinigescu received his Ph.D. from the University of Toronto and went to work at Nortel Networks, where he spearheaded state-of-the-art modeling approaches for wireless and broadband fiber optics transceivers built using emerging semiconductor technologies like SiGe. After leaving Nortel, he co-founded Quake Technologies Inc., which in 2001 became the world’s first company to commercialize a 10-Gb Ethernet transceiver. An IEEE Fellow and the recipient of numerous industry and Canadian awards, he’s been a professor at Toronto for nearly two decades, with a focus on mmWave and 100+Gb/s integrated circuits, atomic-scale semiconductor technologies, and more recently on quantum computing, where he uses 22FDX technology to manipulate qubits at up to 200 GHz. He has about a dozen Ph.D. students who have won numerous accolades for their own work, and one of academia’s most well-equipped laboratories for testing and characterizing devices and circuits at frequencies up to 750 GHz. “Without Silicon We Wouldn’t be Able to Do Anything” For many years Voinigescu worked with IBM on SiGe technologies, and that relationship not only continued but expanded when GF absorbed IBM’s semiconductor unit several years ago. A noteworthy benefit for GF is that Voinigescu has also had a long relationship with GF’s 22FDX platform partner Bosch. “My team has long worked with Bosch’s research group on SiGe BiCMOS devices for 80-240 GHz transceivers, a collaboration which continues to this day, among others,” he said. Voinigescu said that most of the sensor projects he takes on, such as automotive radar applications, are in the frequency range of 60-160 GHz, and he now almost exclusively works in the 22FDX technology. “FDX has a unique feature which lets us do things that otherwise would be very difficult or consume too much power,” he said. “The fact it has a back gate lets you either integrate new functions or increase the speed of the circuit without adding to the power burden, which extends device lifetimes because there’s less of a thermal issue.” “As things become more digital, a lot of signal processing is going to have to be done on one chip so if you go with a CMOS solution like 22FDX instead of using GaAs, InP or other technologies, you’ll enjoy more digital functionality and control, power advantages and the opportunity to retain these advantages while moving to still-higher frequencies.” As an example, he pointed to an automotive radar system he’s working on using the 22FDX platform. It’s an 80/160 GHz dual polarization transceiver that demonstrates better performance, to the tune of 6-10 dB higher phase noise, than competing designs. “Without silicon, we wouldn’t be able to do anything,” he said. A Fruitful Partnership Voinigescu said he appreciates the collaboration with GF on the 22FDX platform. GF provides him access to 22FDX technology and the necessary support and guidance. He and his students characterize the technology for different applications at greater than 100 GHz, and share the results with GF. “It isn’t easy to do this work, but we’ve verified our models at above 100 GHz,” he said. “When people look at our work they see that the 22FDX platform is an appealing technology. It’s win all around for my research team, GlobalFoundries, their customers, and the industry as a whole.”
