GREENWAVES TECHNOLOGIES Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution

October 15, 2020

GreenWaves’ GAP9 hearables platform enables state-of-the-art features such as scene-aware active noise cancellation and neural network-based noise reduction with no compromise in area, cost or energy

Grenoble, France, and Dresden, Germany, October 15, 2020 – GreenWaves Technologies today announced a next-generation hearables platform based on its GAP9 IoT application processor using GLOBALFOUNDRIES® (GF®) 22FDX® solution. The announcement was made at GF’s annual Global Technology Conference (GTC).

Targeting the fast-growing hearables market, which is forecasted to be over one billion units in 20241, GAP9’s unified and easy-to-program architecture enables state-of-the-art sound quality and user experience. It does this by significantly reducing the energy required for normal activities such as music playback, active noise cancellation and voice commands, and freeing up power to improve audio quality through neural network-based features including deep noise reduction and acoustic scene detection. It does this with no compromises in area, cost or energy versus competitor solutions.

GAP9 uses two innovative features of GF’s 22FDX solution – adaptive body bias (ABB) and eMRAM. GAP9 uses ABB to narrow the sign-off window, which contributes significantly to its ultra-low power consumption. GAP9 processes neural networks with a power efficiency of 330µW/GOP, at the same time providing market-leading energy performance for low-power, low-latency digital signal processing (DSP) operations such as audio filtering.

“What is really exciting our GAP9 partners is the unprecedented room for innovation that we are offering them,” said Loic Lietar, CEO of GreenWaves. “Processing a music stream with active noise cancellation consumes less than 10 percent of GAP9 resources, leaving plenty of headroom for dramatically improving the audio comfort or other new cutting-edge features, at the same time simplifying their development. GF’s 22FDX platform, with its incredible performance, ultra-low power capability, low-leakage, and flexibility, was instrumental for enabling us to hit our performance targets.”

In addition to ABB, GAP9 also takes advantage of 2MB of GF’s advanced embedded non-volatile memory (eMRAM) feature of its 22FDX solution, which has allowed GreenWaves to reduce by 3.5 times the energy used for transfers of neural network parameters.

“What GreenWaves has accomplished with its new hearables platform based on the GAP9 application processor, by realizing significant efficiency gains and redirecting that windfall of power to support the architecture’s innovative features that provide great sound for users, is incredible,” said Mike Hogan, senior vice president and general manager of Automotive, Industrial and Multi-market at GF. “GreenWaves’ achievement showcases, loud and clear, why GF’s feature-rich 22FDX platform has become the solution of choice for innovative companies working at the forefront of IoT, hearables, wearables, and edge AI.”

With its high performance, ultra-low power requirements, and broad integration capabilities, GF’s industry-leading 22FDX platform has realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world. 22FDX solutions deliver the industry’s lowest operating voltage, with the ability to operate at 0.4 volt ultralow power and at 1 pico amp per micron for ultralow standby leakage. 22FDX solutions are manufactured on GF’s state-of-the-art 300mm production line at Fab 1 in Dresden, Germany.

GAP9’s architecture combines an autonomous, intelligent peripheral controller and streamer capable of processing data on the fly, with a trans-precision compute cluster capable of energy scaled performance from a few MOPs up to 150 GOPs. The level of performance provided enables real-time, ultra-low power processing of state of the art recurrent and convolutional neural networks (NN). With GAP9, hearable and wearable products can now provide voice pickup features that were up to now only feasible in cloud-assisted applications.

The intelligent peripheral controller in GAP9 includes a revolutionary new building block for digital filtering: the smart filter unit (SFU). The SFU is an application specific stream processor designed to perfectly blend ultra-low latency, ultra-low power filtering with the flexibility of traditional cores. The SFU’s data is streams, its instructions are filters and its program is a graph of filters. The SFU revolutionizes Audio Filter development for Active Noise Cancellation, Spatial Sound and other general music and voice stream filtering, blending microsecond latency with AI based filter adaptation at market leading energy levels.

The combination of the intelligent peripheral controller and streamer and the cluster delivers a single, unified architecture for control application, NN, DSP and filtering.

GAP9 simplifies hearables development through a homogeneous design, which provides DSP, Neural Network acceleration and ultra-low latency audio streams processing with a RISC-V based core architecture combined with a complete development flow for integrated neural network and audio filter design.

GreenWaves is partnering with leaders in the audio algorithmic and tools industry to offer our customers the state of the art in sound quality and user experience.

GAP9 is already enjoying strong customer traction and will be in volume production in Summer 2021.

¹ Strategy Analytics, MOBILE ACCESSORIES: Global Bluetooth Headset Sales Forecast to 2025, July 2020

About GreenWaves Technologies

GreenWaves Technologies, a fabless semiconductor company, designs disruptive ultra-low power embedded solutions for interpreting and transforming rich data sources such as images, sounds, radar signatures and vibrations using AI and signal processing in highly power-constrained devices such as hearables, wearables and IoT sensors. Founded in 2014, GreenWaves’ mission is to revolutionize the market for next generation hearable devices and intelligent sensors. The company is headquartered in Grenoble, France. For more information, visit www.greenwaves-technologies.com.

About GF

GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its customers to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

Contacts:

Martin Croome
GreenWaves Technologies
+33 6 07289900
[email protected]

Michael Mullaney
GLOBALFOUNDRIES
+1 518-305-1597
[email protected]

CSEM Joins Forces with GLOBALFOUNDRIES to Deliver Best-in-Class Bluetooth Dual-Mode Silicon IP for Next Generation Portable Audio

October 15, 2020

CSEM announced today at the GF Global Technology Conference EMEA that it has released its Bluetooth Dual-Mode silicon IP on GF’s 22FDX platform for next generation of portable audio devices …

GF’s AutoPro™ Solutions Drive Automotive Electronics Forward

October 6, 2020

by Gary Dagastine

Today, “4D” on a car’s window sticker means it’s a four-door model, but that designation soon may come to mean something else, too. At least that’s the hope of GLOBALFOUNDRIES’ customer Arbe, a world leader in automotive-grade chipset for so-called 4D imaging radar systems. 4D radar enables higher levels of safety and autonomous driving capability, because unlike existing automotive radar systems, it doesn’t just alert the vehicle about an object in the lane ahead. Instead, it actually sees hundreds of objects in the vehicle’s environment in great detail, including vehicles, pedestrians and stationary objects. It detects their movements in real-time, providing dynamic, free-space mapping of the vehicles’ surroundings.

Arbe’s 4D imaging radar chipset, enabled by GF’s 22FDX^TM platform, is only the latest example of the fundamental changes taking place in the brave new world of automotive electronics. It’s a fast-growing, compelling end-market for semiconductors because chips are essential to the industry’s efforts to differentiate vehicles from one another for competitive reasons, and to make all cars and trucks more connected, efficient, and autonomous in general.

That’s why the average semiconductor content related to safety and electrification in a mid-range car continues to grow, from $410 in 2018 to an estimated $643 in 2025, and an estimated $1,097 in 2030, representing an annual growth rate of around 8.5 percent, according to a recent IHS Markit report.

How quaint the first automotive use of a microprocessor now seems – a modified Motorola 6820 which ran a dashboard mileage display in the 1978 Cadillac Seville¹ – compared to the diverse semiconductor technologies used in today’s vehicles.

This growth in automotive applications could hardly be more favorable for GF, though, because as the world’s leading specialty foundry, GF’s broad portfolio of differentiated solutions and its AutoPro™ Solutions service package uniquely support all automotive technical, packaging/testing, sourcing and quality requirements.

For example, the 22FDX platform is not only ideal for many short- and long-range radar applications, it also offers outstanding signal processing capabilities for cameras, and low-power, real-time functionality for ADAS (advanced driver assistance system) applications. Its high power-added efficiency (PAE) reduces the thermal budget, making it versatile for uses in vehicle chassis and bodies where thermal performance is key, such as for radar sensors embedded in foam bumpers.

GF’s HP SiGe platform, meanwhile, is the gold standard for image quality in long-range automotive radar, and offers unparalleled response times for LIDAR (light-based) sensors. GF’s 12LP FinFET solutions, on the other hand, provide the ultra-fast, high-performance compute power needed for autonomous driving, AI inferencing and sophisticated in-vehicle infotainment capabilities.

For vehicle control, GF’s various BCD/BCDLite^® solutions for analog, power, mixed-signal and RF applications enable state-of-the-art powertrain control and battery management, among other functions. Rounding out the offerings, GF’s 130/55/40nm CMOS solutions, some of which incorporate rugged embedded nonvolatile memory (eNVM), are used in a wide range of applications, from short-range radar and LIDAR to all manner of vehicle controls (e.g. windows, mirrors, seat adjustments, etc.).

However, the raw performance of any semiconductor technology is only part of what automakers need. Automotive electronics also require much higher levels of quality, reliability and documentation than traditional applications, because vehicles must operate properly and reliably in all weather, road, and traffic conditions over long service lives.

Suppliers must certify that their chips will withstand the temperature extremes, shocks/vibrations, and other harsh conditions found in many of the operating environments within a vehicle, such as the engine compartment, because, as Michael Brucker, GF’s Senior Manager of Automotive Systems, put it: “Let’s face it, in a car the best-case outcome for part failures would be that you’d have to spend money on repairs, but the worst case outcome could be fatal.”

Brucker leads GF’s automotive-related corporate policies and programs, which involve all GF fabs and business units so that the company’s automotive policies, systems and procedures are coordinated, implemented properly and continually improved.

GF’s AutoPro Solutions Manage Complexity

A cornerstone of this effort is GF’s AutoPro Solutions service package, which since its introduction in 2017 has evolved into a major corporate effort to manage the complexities that come with serving the automotive marketplace.

Under the AutoPro umbrella, GF works to meet customer performance requirements, manages the design and manufacturing process, provides turnkey assembly and test services, and takes any and all actions needed to meet required AEC (Automotive Electronics Council) quality standards from Grade 3 to Grade 0, which encompass all present requirements plus evolving ones that call for more autonomous vehicle capabilities.

AutoPro grew out of the realization that the automotive industry expects deeper partnerships with its suppliers than commercial customers do. For example, Brucker described a meeting in Dresden which GF hosted a couple of years ago with representatives of the AEC and OEMs, including BMW, Renault, Volkswagen, GM (by phone) and others. “One fellow pulled me off to the side and said he was concerned that there are a lot of Johnny-Come-Lately chip suppliers in the automotive market, who’ve maybe had success in traditional data processing applications but who’ve never worked in automotive before and see it as a fertile market.

“He said that these suppliers may meet IATF 16949 and other standards, and so they think they’re all set, but he said was worried, because companies like GF that have been in the market for a while know there’s a lot more to it, such as how to handle outsourced assembly and test effectively. I think his comments describe in a nutshell the need for our AutoPro Solutions package,” said Brucker.

AutoPro is a customer relations management framework built on GF’s technology readiness, quality systems and the operational controls running through all GF fabs. “Say a customer comes to us with a design,” Brucker said. “Maybe that design is robust enough to meet all necessary automotive quality requirements, maybe it isn’t. AutoPro enables us to pull resources from every relevant area of our organization in an integrated fashion to ensure that the design is capable and robust enough for the intended use, producible on the required timeline, and that it will lead to a quality part. If not, we work with the customer to change it, based on our decade-plus experience serving automotive customers.”

Differing Needs Demand Different Solutions

Brucker’s comments are echoed by Matthias Klude, GF’s Account Manager for EMEA (Europe, the Middle East and Africa), based in Dresden. “The automotive industry is conservative in how it chooses suppliers, which means it isn’t sufficient just to create great applications. Suppliers also need to have the customer’s mindset – the drive for zero emissions in production and zero defects in the product and so on,” he said.

That’s hard to achieve, though, because the various industry players have different viewpoints and needs. The automakers, or original equipment manufacturers (OEMs), he explained, have two core concerns. One is how to differentiate their vehicles from the competition. “Some 90 percent of new automotive features are driven by electronics, and, in fact, some OEMs have found that trying to develop these solutions by going through their Tier One suppliers sometimes simply takes too long, so they are working directly with us,” he said. “The other core concern of automotive OEMs is quality, because they are the ones who’ll suffer the most from quality lapses.”

By contrast, he said, Tier One suppliers such as Bosch, Continental, Delphi and others, who supply automotive-grade parts and systems to the OEMs, face huge cost pressures and also are risk-averse. “They have a great need for custom solutions but this becomes increasingly difficult when traditional silicon suppliers want to sell their standard platforms. There is no perfect match and thus you pay extra for something you do not need but still could be an additional potential source of failure,” Klude said.

Meanwhile, newer, smaller, innovative fabless chip suppliers such as Arbe need entirely new and soup-to-nuts solutions for new applications such as 4D imaging radar, and GF must meet these needs as well. Avi Bauer, Arbe’s Vice President of R&D, said, “On the one hand, we need to reach high levels of reliability and quality, but on the other, our solutions must remain affordable, and the cost should be competitive and provide the highest value proposition”

“GF’s experience in the automotive market has enabled the creation of a silicon process for us that meets both goals, with cost-effective digital content and the highest millimetric-wave RF performance,” he said. “At the same time, as a close partner of Arbe, GF supports both our silicon manufacturing and our post-silicon activities. We get significant field support for design-related process handling, and GF acts as Arbe’s supply-line management focal point. In that role, GF is responsible for our packaging, testing, supply management, and RMA (warranty) management.”

“Having GF as our silicon supplier helps us to deliver our differentiation and eases our market penetration path to major automotive players,” Bauer said.

The Road Ahead Looks Good

Sudipto Bose, GF’s Senior Director & Business Unit Leader for Radar and Automotive Sensors, said that semiconductors will continue to bring vastly greater capabilities and features to transportation systems, and in the process make our world a better and safer place.

“Electronics has brought about many significant societal transformations, such as the pervasive connectivity that benefits our lives. One of the next ones, alongside the Green Revolution, is mobility. I tell my kids that if you can participate in something that can change the way you live in 20 years for the better, that’s a good thing to do. And we here at GLOBALFOUNDRIES are helping to make it happen.”

[¹] https://www.embedded.com/motoring-with-microprocessors/

GLOBALFOUNDRIES Announces New 22FDX+ Platform, Extending FDX Leadership with Specialty Solutions for IoT and 5G Mobility

September 24, 2020

22FDX+ platform builds upon the success of GF’s industry-leading

22FDX platform, with more than 350 million chips shipped

Santa Clara, Calif., September 24, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, announced today at its Global Technology Conference the next generation of its FDX^TM platform, 22FDX+, to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices. GF’s industry-leading 22FDX® (22nm FD-SOI) platform has realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world.

GF’s new 22FDX+ builds on the company’s 22FDX platform, offering a broader set of features that provide high performance, ultra-low power, and specialty features and capabilities for the newest generation of designs. The differentiated offering will further empower customers to create chips that are specifically optimized for Internet of Things (IoT), 5G, automotive, and satellite communications applications.

“Dialog creates highly integrated, energy-efficient SoCs and specialty memory devices optimized for connecting the Internet of Things,” said Jalal Bagherli, CEO of Dialog Semiconductor. “GLOBALFOUNDRIES’ 22FDX+ platform, with its advanced RF performance, low power capabilities, and comprehensive platform features, is a key enabling technology that allows us to stay at the forefront of our industry for the next generation of these IoT products.”

“We are proud to partner with Dialog, and work together to leverage both companies’ ultra-low power, high performance RF capabilities, and embedded memory to advance the frontier of connectivity into the ever-growing IoT market,” said Mike Hogan, senior vice president and general manager of Automotive, Industrial, and Multi-Market at GF. “The launch of GF’s differentiated 22FDX+ platform will strengthen our collaboration with Dialog, and accelerate the incredible advancements in IoT that are already changing our lives.”

The first specialty solution to be available on GF’s new 22FDX+ platform will be 22FDX RF+. With digital and RF enhancements, the new 22FDX RF+ solution is optimized to boost the performance of front-end-module (FEM) designs. The 22FDX RF+ specialty solution will be available in Q1 2021, and manufactured on GF’s state-of-the-art 300mm production line at Fab 1 in Dresden, Germany.

About GF

Contact:

Michael Mullaney

GLOBALFOUNDRIES

518-305-1597

[email protected]

28HV Solution Accelerates GLOBALFOUNDRIES Leadership in OLED Display Drivers for Mobile Devices

September 24, 2020

With more than 75 million units shipped to leading smartphone suppliers, GF’s 28HV solution is optimized to enable faster, brighter, sharper, and more power-efficient OLED displays

Santa Clara, Calif., September 24, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced it has shipped more than 75 million units of its new 28HV specialized semiconductor solution for organic-light emitting diode (OLED) display drivers to suppliers of leading smartphone makers. The announcement was made at GF’s annual Global Technology Conference (GTC).

Built on GF’s 28nm platform, the new 28HV specialty solution is optimized to enable faster, brighter, and sharper OLED displays with more power-efficient variable refresh rates. The performance provided by 28HV’s area-efficient high-voltage design, optimized standard cells, and high-density memories position GF for further leadership in the display driver space, as mobile phone makers continue to transition from liquid crystal displays (LCDs) to lower power OLED displays.

GF’s 28HV solution entered volume production in Q4 2019. GF is the only pure play foundry in production today on 28nm technology for display applications.

“We are proud to be the leader in OLED display driver integrated circuits (OLED DDIC). Driven by our relentless pursuit of cutting-edge technology, we have consistently held the top position in the non-captive market for the last 13 years,” said YJ Kim, CEO of MagnaChip Semiconductor Corporation. “OLED technology will continue to expand into the global smartphone market driven by 5G ramp-up and will also further penetrate into new applications such as TV and automotive. We will continue to churn out more innovative products with our long-established design know-how and lowest power 28-nanometer technology, and we are encouraged by successive momentum for this growing product family. GLOBALFOUNDRIES is an important partner for us, as we continue along our trajectory of success in the OLED DDIC market.”

GF was the first pure-play semiconductor foundry to produce OLED display drivers, starting with its 55nm platform. The new 28HV solution is the latest milestone on GF’s OLED roadmap, which started with 55nm, and includes 40nm, and 28nm. To date, GF has shipped more than 135 million total units of its 55nm and 40nm OLED display driver solutions.

“GLOBALFOUNDRIES is the clear leader in specialty semiconductor solutions for the mobile phone market. GF silicon enables so much of what you love about and have come to expect from your smartphone – reliable connectivity, great sound, sharp display, and more,” said Bami Bastani, senior vice president of Mobile and Wireless Infrastructure at GF. “GF and MagnaChip have an unmatched heritage of developing and manufacturing analog and mixed-signal chips. GF’s new 28HV solution is a result of the close collaboration between our engineering teams to meet the demands of a new generation of mobile devices with smaller, more energy-efficient, ultra high definition displays.”

Several GF Ecosystem partners are approaching qualification of IP enhancements to the 28HV process design kit, which will provide designers an even more efficient design experience and faster time to market on 28HV.

GF’s 28HV solution is manufactured on GF’s state-of-the-art 300mm production line at Fab 1 in Dresden, Germany.

About GF

Contact:

Michael Mullaney

GLOBALFOUNDRIES

518-305-1597

[email protected]

GLOBALFOUNDRIES Announces Industry-Leading GF SHIELD Program to Further Safeguard Customer Data and IP

September 24, 2020

GF embraces experience of manufacturing the world’s most secure semiconductor solutions for the defense and aerospace industry, and extends these world-class security capabilities to all customers

Santa Clara, Calif., September 24, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, announced today at its Global Technology Conference the deployment of GF SHIELD, a comprehensive, company-wide platform to further safeguard and protect its customers’ intellectual property and products.

GF SHIELD builds upon GF’s industry-leading track record of success in protecting customer information, by bringing together and fortifying its policies, processes, and activities into a holistic, differentiated security platform. Undergirding these strengthened security efforts is a corporate culture of proactive vigilance, in which all of GF’s 16,000 employees around the world have undergone rigorous training to become certified in GF Shield.

The result is a platform that leverages and embraces GF’s experience as a Trusted Foundry and supplier of advanced semiconductor to the U.S. government and the aerospace and defense industry, as well as GF’s experience as a certified international Common Criteria standard (ISO 15408, CC Version 3.1) manufacturer, and extends those stringent security capabilities to all GF locations and customers.

“GF SHIELD is the culmination of our unique experience, gained through our Trusted Foundry status and Common Criteria certification, of manufacturing the world’s most secure semiconductor solutions for the world’s most security-minded customers,” said Saam Azar, senior vice president of Corporate Development, Legal and Government Affairs at GF. “With GF SHIELD, we are embracing this world-class capability as a core competency, and extending it to all of our customers, across all industries. In addition to being the world’s leading specialty semiconductor foundry, we have embraced our role as the world’s most secure and trusted foundry.”

GF SHIELD integrates information security, product security, operational security, and cyber security into a comprehensive program that covers every aspect of the customer experience. From the initial meeting, through development, design, fabrication, delivery, and even disposal of scrap – and every step between – GF SHIELD is in place to ensure a customer’s products and sensitive information remain secure.

About GF

Contact:

Michael Mullaney

GLOBALFOUNDRIES

518-305-1597

[email protected]

GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities

September 24, 2020

New industry-leading ML-enhanced DFM solution for designing on GF 12LP+ platform can provide customers with a more efficient experience and contribute to a faster time to market

Santa Clara, Calif., September 24, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced at its annual Global Technology Conference (GTC) a significantly enhanced design for manufacturability (DFM) kit embedded with advanced machine learning (ML) capabilities. Developed in collaboration with Mentor, a Siemens business, the new industry-leading ML-enhanced DFM solution, built on Mentor’s Calibre® nmDRC platform, can provide customers with a more effective design and development experience and, ultimately, contribute to a faster time to market.

The new ML-enhanced DFM kit is launching as an update to the process design kit (PDK) for GF’s 12LP+ differentiated semiconductor solution. Built on a proven platform with a robust production ecosystem, 12LP+ is optimized for artificial intelligence (AI) training and inference applications, and is currently ready for production at GF’s Fab 8 in Malta, New York.

GF’s new ML-enhanced DFM solution is among the first of its kind in the industry. GF plans to roll out the capability to the PDKs of its 12LP and 22FDX® semiconductor platforms in Q4 2020.

“We are excited to launch this new enhancement, infused with advanced machine learning models, and provide our customers with a quicker overall DFM verification and an even more effective design experience – all toward the goal of successful prototyping and a faster time to market,” said Jim Blatchford, vice president of Technology Enablement at GF. “Our close partnership with Mentor helped enable the new enhancement to be seamlessly integrated into our 12LP+ PDK, and we look forward to rolling out additional machine learning-infused capabilities in the PDKs for our other specialty semiconductor solutions.”

“We are pleased to partner with GLOBALFOUNDRIES to incorporate machine learning based models into Calibre nmDRC for GF’s 12LP+ platform,” said Michael White, director of Physical Verification Product Management, Calibre Design Solutions, at Mentor. “Working together with GLOBALFOUNDRIES, we have incorporated machine learning into the design flow to help create a seamless transition for our mutual customers.”

Following its founding in 2009, GF has pioneered a DFM checking platform, called DRC+, which combines pattern-matching tools from electronic design automation (EDA) software suited with a proprietary library of yield detractor patterns. DRC+ enables chip designers to preventively detect defective patterns, or hotspots, in early designs that could lead to manufacturing defects.

GF and Mentor have partnered to integrate GF-developed ML models into DRC+, to help amplify the ability of DRC+ to recognize new and previously unseen hotspot patterns and improve production yield. Trained by GF on silicon data collected during its manufacturing operations, the new ML-enhanced DFM kit has been validated and qualified to enable chip designers to more successfully discover and mitigate potential problems early in the design process.

Catching and addressing these hotspots in the development phase is critical for designers as they progress toward successful prototyping and scale manufacturing.

GF 12LP+ Ready for Production

Engineered to meet the specific needs of the fast-growing AI market, GF’s 12LP+ offers best-in-class combination of performance, power, and area. Contributing to this are new features including an updated standard cell library, an interposer for 2.5D packaging, and a low-power 0.5V V_min SRAM bitcell that supports the low latency and power-efficient shuttling of data between the AI processors and memory.

12LP+ builds upon GF’s established 14nm/12LP platform, of which GF has shipped more than one million wafers. By partnering closely and learning from AI customers, GF developed 12LP+ to provide greater differentiation and increased value for designers in the AI space while minimizing their development and production costs.

Driving the enhanced performance of 12LP+ are features including a 20-percent SoC-level logic performance boost over 12LP, and a 10-percent improvement in logic area scaling. These advancements are achieved in 12LP+ through its next-generation standard cell library with performance-driven area optimized components, single Fin cells, a new low-voltage SRAM bitcell, and improved analog layout design rules.

Click here to learn more about GF’s 12LP+ specialized application solution.

About GF

Contact:

Michael Mullaney

GLOBALFOUNDRIES

518-305-1597

[email protected]

Note: A list of relevant Siemens trademarks can be found here.

GLOBALFOUNDRIES and Movano Inc. Partner to Advance Needle-Free Continuous Glucose Monitoring Technology

September 24, 2020

Manufactured on GF’s 22FDX platform, Movano’s radio frequency-enabled solution will help individuals to manage their glucose levels anywhere, anytime

Pleasanton and Santa Clara, Calif., September 24, 2020 – Movano Inc., a health-focused technology company developing non-invasive solutions to enhance the quality of life for people affected by chronic health conditions, today announced a strategic collaboration with GLOBALFOUNDRIES® (GF®) to advance the commercialization of Movano’s wearable, non-invasive continuous glucose monitor (CGM), which is currently in development. The announcement was made at GF’s annual Global Technology Conference (GTC).

Movano’s novel approach to glucose monitoring is based on its patent-pending radio frequency (RF) sensor platform, which is built on GF’s 22FDX® (22nm FD-SOI) solution, to enable the creation of high performance and small form-factor sensors that are low-power and cost-effectively manufactured at scale.

“The last few months have spurred a growing need for technology that supports virtual care to keep people with chronic conditions healthy and out of doctors’ offices and hospitals. For people with diabetes and prediabetes, this means we need to significantly bring down the costs and make CGMs much more appealing for people to use and wear,” said Michael Leabman, founder and CEO of Movano. “Building our CGM on GLOBALFOUNDRIES’ 22FDX platform will allow us to do just that. In addition to supporting what will be a cost-effective and very scalable production of our CGM, GF’s platform will be critical for ensuring that the performance and power efficiency of our device is second to none.”

Movano’s non-invasive CGM is made up of ultra-wideband multi-antenna RF technology, machine learning, and the cloud. Technology embedded in the wearable device leverages the best-in-class performance, power consumption, and broad feature integration capability of GF’s differentiated 22FDX platform, which is the solution of choice for designers and innovators working in Internet of Things (IoT), 5G mmWave, Edge AI, and other applications.

“Movano is an innovative startup, working at the forefront of digital care and the Internet of Things to help individuals manage chronic health conditions,” said Mike Hogan, senior vice president and general manager of Automotive and Industrial Multi-Market at GF. “This collaboration leverages GLOBALFOUNDRIES’ clear leadership in RF and world-class manufacturing expertise, and is the latest example of why designers across a range of industries and applications are turning to 22FDX for its differentiated performance, flexibility, and low-power benefits.”

GF’s 22FDX solutions, including the RF sensor for Movano’s CGM, are manufactured on GF’s state-of-the-art 300mm production line at Fab 1 in Dresden, Germany.

About Movano Inc.

Founded in 2018, Movano Inc. is a health-focused technology company using non-invasive technology that is simple, smart and invisible to enable individuals and their healthcare partners to measure and manage their health conditions, so that life-changing health objectives can be achieved via valuable feedback. For more information, visit www.movano.com.

About GF

Contacts:

Lauren Jaeger

Movano

847-271-8818

[email protected]

Michael Mullaney

GLOBALFOUNDRIES

518-305-1597

[email protected]

Cadence Announces Broad IP Collaboration with GLOBALFOUNDRIES on 12LP/12LP+ Solutions

September 24, 2020

IP addresses need for advanced SoC designs in hyperscale, industrial, and aerospace and defense markets

Synopsys and GLOBALFOUNDRIES Collaborate to Develop Broad Portfolio of DesignWare IP for 12LP+ FinFET Solution

September 24, 2020

DesignWare IP Delivers Significant Performance and Power Advantages for Cloud Computing and Edge AI SoCs on GF 12LP+ Solution