Ayar Labs Demonstrates First Ultra-Dense Optical Interconnect Solution on GLOBALFOUNDRIES’ Next Generation Silicon Photonics Manufacturing Process December 22, 2020Collaborative partnership accelerates commercialization of in-package optical I/O for applications in artificial Intelligence, cloud architectures, aerospace and 5G communications. Company launches 2021 sampling program
Mentor: GLOBALFOUNDRIES and Mentor Launch a New Innovative DRC+ Hotspot Solution using Machine Learning in Calibre December 9, 2020By Shelly Stalnaker I recently had the chance to attend an on-demand webinar introducing the new GLOBALFOUNDRIES DRC+ hotspot solution that incorporates machine learning in the Calibre toolsuite. Presented by Sriram Madhavan (GLOBALFOUNDRIES) and Michael White (Mentor, a Siemens Business), the webinar walks through the new DRC+ DFM solution, and explains how the addition of machine learning expands and improves both the capabilities and results. Click here to read the full blog post, on the site of our ecosystem partner Mentor.
GF Partners with Leading Researchers on 6G Technologies November 30, 2020 Through its University Partnership Program, GF benefits from the expertise of academic researchers while providing them with access to the technology to demonstrate innovative designs by Gary Dagastine It may seem premature to talk about 6G wireless communications just as 5G technology is beginning to be deployed in earnest, but the R&D community is already hard at work investigating the technologies needed to make 6G a practical and commercial reality later this decade. GLOBALFOUNDRIES (GF) is taking steps to establish a leadership position in 6G by collaborating with top researchers at leading universities to leverage the unparalleled benefits of its FD-SOI, RF-SOI and SiGe platforms, which already have been proven in 5G and other wireless applications to deliver industry-leading performance and cost-effectiveness. Wireless connectivity is a major focus for GF, along with artificial intelligence (AI), edge-to-cloud computing and automotive solutions, because the company’s strategy is to be a leading supplier of the differentiated, feature-rich technologies needed to help shape the digital transformation of our world. 6G is the sixth generation of wireless communications technology. It will be significantly faster than 5G, capable of transmitting huge amounts of data at speeds that may reach or exceed 100 gigabytes per second (Gb/s) with little or no effective latency, or lag time. That level of performance will open up entirely new applications and ways of doing things. “One example is holographic telepresence, in which a virtual ‘digital twin’ of a person or object – a highly realistic 3D image in full motion, in real-time, and with related audio – could be projected anywhere within a 6G network,” said Peter Gammel, Ph.D., vice president and chief technical officer of GF’s Mobile & Wireless Infrastructure strategic business unit. “It would be as if the person is physically present – there will be no more Zoom fatigue!” Peter Gammel, Ph.D. Gammel said there are countless other ways 6G technology will help change the world. “We’ve gotten familiar with the concept of telemedicine during the Covid-19 pandemic, and 6G could raise it to new heights. In robotic surgery, for instance, lifelike 3D images not only could guide a surgeon through an especially challenging operation, but the surgeon using the robot could be located thousands of miles away from the patient,” he said. “6G also will facilitate the use of AI everywhere in a network from the edge, to the customer, to the core, for greater efficiencies, speed and reduced costs.” 6G Technical Challenges & Opportunities Technical standards for 6G systems haven’t been developed yet, but the initial 6G frequency range is likely to be from about 50 GHz to 200 GHz, with initial applications expected at the low end, near the top end of the 5G range. This is a blazingly fast and uncongested part of the RF spectrum, but these millimeter-wave (mmWave) frequencies have certain characteristics that make the technical development and economics of 6G systems challenging. One major technical challenge is the need for power-efficient LNA amplifiers (a key component of wireless systems) to amplify low-power 6G signals without significantly degrading the signal-to-noise ratio, which is key to error-free performance. Another is the need for accurate mmWave device simulations and models, along with hardware-validated process design kits, or PDKs, for successful, cost-efficient semiconductor design and production. This is a huge unmet need at high frequencies. Perhaps the biggest issue, though, is that mmWaves suffer high propagation losses because they are absorbed by water vapor and oxygen molecules in the atmosphere, so finding ways to increase the over-the-air output power of transceivers is critical. Another propagation challenge is that mmWaves are easily blocked by walls, trees and other objects. These propagation challenges mean that 6G networks will require many base stations and small cell sites located in fairly close proximity to one another to relay signals. Given the large number of semiconductors that will be needed for these dense networks, economic considerations will be critical. Gammel said all of these challenges play to GF’s strengths, which include: 22FDX™ and 22FDX+ FD SOI solutions, which combine RF, analog, embedded memory, and advanced logic in one chip, with dynamic voltage scaling and unmatched design flexibility for peak performance and energy-efficiency. Customers use FDX for such tasks as integrating front-end module (FEM) elements like data converters, LNAs, power amplifiers (PAs) and switches with the transceiver.GF’s family of RF SOI solutions, used in integrated FEMs and beamformers in 5G base stations and smartphones.GFs family of silicon germanium (SiGe) BiCMOS solutions for Wi-Fi and mmWave FEM’s “6G gives us a vision for solutions based on merged technologies in which GF already has undisputed leadership,” Gammel said. “What’s great about these proven, cost-effective solutions is that they are nowhere near the limit of their capabilities. Their performance can be extended in step with the wireless industry as it evolves, moving past the upper reaches of the 5G spectrum and extending into the 6G frequency range. Customers will not have to turn to new technologies and exotic materials to get the performance they need; they will be able to get it from well-understood, production-ready and cost-effective silicon-based technology.” Partnerships with Leading 6G Researchers GF is actively promoting 6G circuit and system research via the company’s University Partnership Program, through which GF provides access to technology to select university teams who collaborate with GF’s R&D team and share their research results. The program is large and impactful. “Worldwide, we work with over 35 universities in various areas of technology, including 6G,” said Bika Carter, Sr. Manager and Deputy Director of External R&D Management for GF. “Peer-reviewed published papers are a key measure of the quality of our academic partners, and their publishing output is large and growing. In 2019 and 2020, there have been over 200 publications from our professors across our technologies. We have active university programs in 22FDX, 45RFSOI, silicon germanium (SiGe) and silicon photonics technologies.” Ned Cahoon, Senior Director in GF’s Mobile and Wireless Infrastructure CTO office, works closely with many of the professors affiliated with GF’s University Partnership Program who are working on 6G technology. “We are technology leaders in mmWave, so we look for professors and academic programs that are tackling what we see as key 6G circuit and system issues that can be addressed by GF’s differentiated technology, such as FE, or front-end, circuits, at frequencies above 100GHz,” he said. “The professors we work with are renowned in their field, with great track records, and we work with them as partners. They share their research with us, and we help further their work by giving them access to our silicon on multi-project wafers.” No Doubts About Silicon One of GF’s academic partners is Gabriel Rebeiz, Ph. D., Distinguished Professor and the Wireless Communications Industry Endowed Chair at the University of California San Diego. Professor Rebeiz is a Member of the National Academy of Engineering and an IEEE Fellow. He is a pioneer of integrated phased arrays for communications and defense systems, and was the first to introduce MEMS and micromachining to the RF/microwave field. At UC-San Diego, his group has led the development of complex RFICs for phased-array applications. His phased-array work is now used by most companies developing complex communication and radar systems, and he has graduated some 100 Ph.D. students and post-doctoral fellows. At present his students are working on a broad set of research projects ranging from wideband systems in 45RFSOI to 140GHz phased arrays. “Before 6G comes along, there’ll be 24 GHz, 28 GHz, 39 GHz and 46 GHz chips used in 5G communications, so we’re working on a lot of wideband chips using the same processes and techniques that we will extend to 6G devices,” he said. “These are high-risk, high-payoff types of projects, and we push the limits of technology. GLOBALFOUNDRIES has been a great partner as we do this. We cover a large technical area and they support our innovative work.” Prof. Rebeiz said he is convinced silicon is the solution for the higher reaches of the 5G band and for 6G applications up to about 220 GHz. For example, using GF’s technologies in a forward path transmit module (FPTM), his team recently achieved 12dBm of output power at 140GHz with 11-12 percent efficiency. “That’s a phenomenally good figure for point-to-point communications, given that the current figure-of-merit is 6dBm, but also, we’re doing it at 140GHz!” he said. “As the number of elements needed in dense 6G networks increases so much, the power needed per element must necessarily decrease if these systems are to be practical, and instead of the 20dBm per element we now have at 28 GHz, we might need only 3-6dBm,” Rebeiz said. “So, without any doubt power-efficient silicon technologies like 22FDX will be dominant above 100GHz for any array application.” Many challenges remain, of course – Prof. Rebeiz said packaging and testing are critical needs: “What are we going to do to make test affordable in the future? Nobody’s going to test up to 140GHz because it is so difficult and expensive, but we can’t make progress without it” – but this work represents a great opportunity for his students. “My students and I are hardware people,” he said. “We like building stuff. What my students are doing is vitally important for the world, and as such, this is truly a golden age for them.”
The Challenge and Opportunity of Reducing Power on AI Processors November 13, 2020 By David Lammers “For the edge, it is all about consuming the least power while optimizing for the required performance.” Given the new reality of industry events going virtual during the pandemic, I was able to log in to half a dozen semiconductor conferences so far this year. A recurring theme was silicon for artificial intelligence (AI) and deep learning (DL), an evolving field which ranges across a broad spectrum of technologies and device types. One common vein running through them was a focus on memory optimization and solving the power/memory bottleneck. AI is a hot market. ABI Research estimates that the overall AI silicon market will hit $21 billion in 2024. A surprisingly large fraction of that is held by ASIC-based AI accelerators, predicted to triple in value to a $9 billion total available market (TAM) by 2024, with a 30 percent compound annual growth rate (CAGR). For both training and inference processing, companies are wracking their brains trying to come up with power-saving solutions. While machine learning is only part of total data center power consumption, it is expanding rapidly. Data centers consumed about 3 percent of all power in the United States in 2017, and that doubled to 6 percent in 2020. Proliferation of intelligent edge devices are accelerating as well. According to market research firm IDC, over the next decade 125 billion “things” will be connected to the internet, and by then close to 60 Zettabytes of data will be annually created, captured, copied, and consumed. It is crystal clear that our industry faces a major challenge: how to implement many intelligent devices at the edge, infer all of that data at the edge with very low power consumption, and manage, process, and train exponentially growing data in the cloud, while keeping energy under control. AI Reference Package Evolving Hiren Majmudar, vice president of the computing business unit at GLOBALFOUNDRIES, said “there is a power bottleneck in both inference and training” that plays well into GF’s technology offerings, both its FinFET-based 12LP (12nm FinFET) platform and 12LP+ solutions, as well as its fully depleted SOI-based planar 22FDXTM (22nm FD-SOI) platform. The FinFET-based technology has power and cost advantages for AI processors, either in the cloud or at the edge. The 12LP+ solution is capable of running AI cores at >1 Ghz, and features a new low-voltage SRAM and a standard cell library capable of 0.55V operation. GF’s most advanced FinFET solution, 12LP+ moved into production this year, and has a dual-work function FET delivering up to 20 percent faster logic performance or up to 40 percent lower power compared to the 12LP base platform. “Our customers have unique architectures that often depend on a limited set of standard cells,” he said. “We’ve worked hard on our DTCO (design technology co-optimization), and have developed an AI reference package, with a pre-packaged set of components to demonstrate the potential. Via a collaborative DTCO model our customers can quickly get their SoC goals to the market. The DTCO effort can include design analysis services based on the customer’s own architecture for optimized Performance, Power and Area (PPA).” Optimal PPA looks different depending on the specific application, Majmudar said. “All segments are cost conscious. For the cloud, it is about TOPS per Watt, getting the best performance at lowest power. For the edge, it is all about lowest cost and consuming the least power while optimizing for the required performance at the edge,” he said. The eMRAM offering for 22FDX has advantages for customers developing AI applications “looking for instant on, or always on,” Majmudar said. “There are many applications for eMRAM, with customers using it for better density and non-volatility. Another is analog compute in memory,” he added. AI workloads are broad ranging, including voice, vision, and imaging, on top of the requirements for training and inference. “We are a very specialized foundry, constantly innovating our IP offerings. We continue to invest in IP, die-to-die interconnect, memory, and interface IP. We have a well-defined roadmap that we continue to improve with inputs from customers,” he said. Innovative Startups In future blogs I plan to detail how GF is working with startups in this field, but one of them deserves brief mention here just to provide a glimpse of how much innovation is going on among GF’s customers in AI silicon. Fully depleted silicon-on-insulator platforms are well-adapted to support dynamic voltage, frequency scaling, and automatic clock gating. The result is ultra-low power consumption for signal processing and neural network algorithms that can run in battery-powered IoT devices. Perceive, a majority-owned subsidiary of Xperi Corp., is aimed at AI inference for sensor data in ultra-low- power consumer devices. Perceive’s “Ergo” edge inference processor is capable of processing large neural networks on the device with efficiency 20 to 100 times higher than seen on today’s inference-capable processors. The company is focused on security cameras, smart appliances, and mobile devices with integrated neural network processing, eliminating the need to send data to the cloud for inference processing. Please watch the short video below to hear Perceive CEO Steve Teig speak with GF SVP Mike Hogan about Perceive’s approach to AI and machine learning:
在高品质5G射频解决方案需求不断增长的趋势下,格芯与Soitec宣布达成RF-SOI晶圆供应协议 November 5, 2020战略供应协议使得格芯®(GLOBALFOUNDRIES®)能够满足市场对其先进的RF-SOI解决方案8SW不断增长的需求,主流FEM供应商在6 GHz以下5G智能手机上使用该方案 加利福尼亚州圣克拉拉、法国贝宁(格勒诺布尔),2020年11月5日 – 今日,全球领先的特殊工艺半导体代工厂格芯®(GLOBALFOUNDRIES®,GF®)与Soitec宣布,就300mm射频绝缘体上硅(RF-SOI)晶圆的供货,双方达成了一份为期多年的协议,后者在设计和制造创新半导体材料领域同样处于全球领先地位。基于双方的长期合作伙伴关系,这份战略协议确保了晶圆供应,从而使格芯能够在为下一代手机市场提供解决方案时进一步提升其关键作用。两家公司的领导人于本周早些时候通过虚拟签约仪式最终确定了该协议。 促成这份晶圆供应协议的主要因素是,市场对于格芯先进的RF-SOI解决方案8SW RF SOI的需求在不断增长。8SW RF-SOI作为一流射频前端模块(FEM)平台,具备性能出色的开关和低噪声放大器,并且经过了优化,在性能、功耗和数字化集成相结合方面与众不同,可满足当前和未来4G LTE及6 GHz以下5G智能手机设计人员和供应商的需求。这个新平台采用由Soitec开发的先进的RF-SOI衬底。 格芯的8SW RF-SOI的客户为6 GHz以下5G智能手机的主流FEM供应商。 格芯的移动和无线基础设施部高级副总裁兼总经理Bami Bastani博士表示:“当今市场上每十部智能手机中就有八部采用了格芯®制造的芯片,并且,随着行业向5G迁移,对我们与众不同的射频解决方案的需求会持续飙升。如果没有格芯®和我们业界领先的专业射频解决方案,5G革新将无法实现。确保来自我们长期合作伙伴Soitec的晶圆供应至关重要,这样就使格芯能够满足市场对我们5G解决方案不断增长的需求。” Soitec首席运营官Bernard Aspar博士表示:“我们设计生产的衬底为制造电子行业所需的高性能和高可靠性半导体器件奠定了基础。我们在法国和新加坡都有生产设施,因而在设计制造先进衬底方面,我们已经拥有了全球最大的产能,可满足快速增长的5G市场需求。通过这项多年度协议,我们与格芯®已经建立的合作伙伴关系能够得以持续,对此我们感到很欣慰。” 这份新协议建立在格芯与Soitec之间牢固的合作伙伴关系基础上。2017年,针对格芯22FDX®平台所需要的全耗尽绝缘体上硅(FD-SOI)晶圆,两家公司签订了为期五年的供货协议。制造于德国德累斯顿的格芯22FDX平台所获得的设计订单迄今已经实现了45亿美元营收,这些订单向全球客户交付了超过3.5亿枚芯片。 关于Soitec Soitec(泛欧交易所,法国巴黎Tech 40指数成分股)是全球领先的创新半导体材料设计和制造企业。该公司凭借其独特的技术和半导体领域的专长为电子行业市场提供服务。Soitec在全球拥有超过3,300项专利,其战略是以颠覆性创新满足客户对高性能、高能效和成本竞争力的需求。Soitec在欧洲、美国和亚洲设有制造厂、研发中心和办事处。Soitec和Smart Cut是Soitec的注册商标。如需了解更多信息,请访问www.soitec.com并在Twitter上关注:@Soitec_EN About GLOBALFOUNDRIES GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its customers to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com. Contacts: GLOBALFOUNDRIES Michael Mullaney 518-305-1597 [email protected] SOITEC 投资者关系: Steve Babureck +33 6 16 38 56 27 [email protected] 业务媒体联系人: Marie Cabrières +33 6 26 70 12 78 [email protected] 财经媒体联系人: Isabelle Laurent +33 1 53 32 61 51 [email protected]
eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications November 5, 2020eMemory announced its NeoFuse IP has been qualified on GF’s 28HV platform, in response to the rising demand for OLED display applications.
UniIC Announces Availability of Memory Controller + PHY IP on GLOBALFOUNDRIES 12LP Platform for High Performance Compute Applications November 5, 2020The new solution provides significant improvements in power, area and cost compared to current offerings and is set to serve the ever-growing demand for artificial intelligence (AI) and compute applications.
西安紫光国芯发布基于格芯12纳米低功耗工艺(GF 12LP)可用于高性能计算应用的存储控制器和物理接口IP November 5, 20202020年11月5日,西安紫光国芯半导体有限公司(紫光国芯)在格芯®(GLOBALFOUNDRIES®,GF®)22FDX®举办的全球技术大会中国峰会上正式发布了基于格芯12纳米低功耗工艺(GF 12LP)的GDDR6存储控制器和物理接口IP(GDDR6 MC/PHY IP)。与已有的方案相比,新方案在芯片功耗、面积和成本等方面均有明显的提升,并能满足在面向人工智能(AI)和计算应用等热点领域不断增长的需求。
Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement November 5, 2020Strategic supply agreement positions GLOBALFOUNDRIES to meet the growing demand for its most advanced RF-SOI solution, 8SW, used by top FEM providers to 5G sub-6 GHz smartphones Santa Clara, Calif., and Bernin (Grenoble), France, November 5, 2020 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, and Soitec, a world leader in designing and manufacturing innovative semiconductor materials, today announced a multi-year supply agreement for 300mm radio frequency silicon-on-insulator (RF-SOI) wafers. Building on the long partnership between the two companies, this strategic agreement secures the supply of wafers that will allow GF to further expand its critical role in providing solutions for the next-generation mobile phone market. The agreement was finalized earlier this week in a virtual signing ceremony with leadership from both companies. The primary driver of this wafer supply agreement is the growth of GF’s most advanced RF-SOI solution, 8SW RF SOI. The leading RF front-end-module (FEM) platform with best-in-class switches and low noise amplifiers, 8SW RF-SOI is optimized to deliver the differentiated combination of performance, power efficiency, and digital integration required by the designers and suppliers of current and future 4G LTE and sub-6 GHz 5G smartphones. This new platform is using the most advanced RF-SOI substrates developed by Soitec. GF’s 8SW RF-SOI customers include the top FEM providers for 5G sub-6 GHz smartphones. “Eight out of ten smartphones on the market today include GLOBALFOUNDRIES manufactured silicon, and the demand for our differentiated RF solutions continues to skyrocket as the industry transitions to 5G,” said Dr. Bami Bastani, senior vice president and general manager for Mobile and Wireless Infrastructure at GF. “The 5G revolution would not be possible without GLOBALFOUNDRIES and our industry-leading specialty RF solutions. Securing this critical supply of wafers, from our longstanding partner Soitec, enables GF to meet the ever-growing demand for our 5G solutions.” “Our engineered substrates provide the foundation for manufacturing high-performance and high-reliability semiconductor devices required by the electronics industry,” said Dr. Bernard Aspar, COO of Soitec. “With our manufacturing facilities both in France and in Singapore, we have put in place the largest worldwide capacity with the most advanced engineered substrates to meet the needs of this fast-growing 5G market. We are very pleased to continue our established partnership with GLOBALFOUNDRIES through this multi-year agreement.” The new agreement builds on the strong partnership between GF and Soitec. In 2017, the two companies entered into a five-year supply agreement for fully depleted silicon-on-insulator (FD-SOI) wafers for GF’s 22FDX® platform. Manufactured in Dresden, Germany, GF’s 22FDX platform has since realized $4.5 billion in design wins with more than 350 million chips shipped to customers around the world. About Soitec Soitec (Euronext, Tech 40 Paris) is a world leader in designing and manufacturing innovative semiconductor materials. The company uses its unique technologies and semiconductor expertise to serve the electronics markets. With more than 3,300 patents worldwide, Soitec’s strategy is based on disruptive innovation to answer its customers’ needs for high performance, energy efficiency and cost competitiveness. Soitec has manufacturing facilities, R&D centers and offices in Europe, the U.S. and Asia. Soitec and Smart Cut are registered trademarks of Soitec. For more information, please visit www.soitec.com and follow us on Twitter: @Soitec_EN About GLOBALFOUNDRIES GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its customers to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com. Contacts: GLOBALFOUNDRIES Michael Mullaney 518-305-1597 [email protected] SOITEC Investor Relations: Steve Babureck +33 6 16 38 56 27 [email protected] Business media contact: Marie Cabrières +33 6 26 70 12 78 [email protected] Financial media contacts: Isabelle Laurent +33 1 53 32 61 51 [email protected]
Arm: Accelerating Edge Computing with Arm Ethos-N78 and Artisan Physical IP on GLOBALFOUNDRIES’ 12LP+ Specialty Solution November 4, 2020by Lakshmi Jain The innovation that lies ahead on the road to a trillion connected devices is nothing short of astonishing, as we push compute and artificial intelligence (AI) and machine learning (ML) capabilities from the cloud to the edge. To get there, engineers are rethinking how to push the boundaries of design around device size, reliability, and efficiency. Nowhere is this transformation more vital than in edge computing, where most edge devices are small, ultra-low power and cost-constrained … Click here to read the full blog post, on the site of our ecosystem partner Arm.