GlobalFoundries Announces Closing of Initial Public Offering November 1, 2021Malta, NY, November 1, 2021 – GlobalFoundries® (Nasdaq: GFS) (GF®), a global leader in feature-rich semiconductor manufacturing, today announced the closing of its initial public offering of 55,000,000 ordinary shares, 30,250,000 of which were offered by GF and 24,750,000 of which were offered by GF’s existing shareholder, Mubadala Investment Company PJSC, at an initial public offering price of $47.00 per share. The shares are listed on the Nasdaq Global Select Market and trade under the ticker symbol “GFS.” Morgan Stanley, BofA Securities, J.P. Morgan, Citigroup and Credit Suisse acted as active book-running managers for the offering. Deutsche Bank Securities, HSBC and Jefferies acted as additional book-running managers for the offering. Baird, Cowen, Needham & Company, Raymond James, Wedbush Securities, Drexel Hamilton, Siebert Williams Shank and IMI – Intesa Sanpaolo acted as co-managers for the offering. A registration statement relating to these securities was declared effective as of October 27, 2021 by the U.S. Securities and Exchange Commission. The offering was made only by means of a prospectus. Copies of the final prospectus relating to the offering may be obtained from: Morgan Stanley & Co. LLC, Attention: Prospectus Department, 180 Varick Street, 2nd Floor, New York, New York 10014; BofA Securities, Inc., NC1-004-03-43, Attention: Prospectus Department, 200 North College Street, 3rd Floor, Charlotte, NC 29255 or by email at [email protected].; J.P. Morgan Securities LLC, c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717, by telephone at 866-803-9204 or by email at [email protected]; Citigroup Global Markets Inc., c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717, by telephone at (800) 831-9146 or by email at [email protected]; or Credit Suisse Securities (USA) LLC, Attn: Prospectus Department, 6933 Louis Stephens Drive, Morrisville, NC 27560, by telephone at 800-221-1037 or by email at [email protected]. This press release does not constitute an offer to sell or the solicitation of an offer to buy these securities, nor shall there be any sale of these securities in any state or jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction. Forward-Looking Statements This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. About GF: GlobalFoundries Inc. (GF) is one of the world’s leading semiconductor manufacturers. GF delivers feature-rich solutions that enable its customers to develop innovative products for pervasive chips for high-growth markets. GF provides a broad range of feature-rich process technology solutions with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its customers across the globe. Investor Contact: Investor Relations [email protected] Media Contact: Laurie Kelly VP Global Communications [email protected]
GlobalFoundries Announces Pricing of Initial Public Offering October 27, 2021Malta, NY, October 27, 2021 – GlobalFoundries® (GF®), a global leader in feature-rich semiconductor manufacturing, today announced the pricing of its initial public offering of 55,000,000 ordinary shares, 30,250,000 of which are being offered by GF and 24,750,000 of which are being offered by GF’s existing shareholder, Mubadala Investment Company PJSC, at an initial public offering price of $47.00 per share. In connection with the offering, Mubadala has granted the underwriters a 30-day option to purchase up to an additional 8,250,000 ordinary shares at the public offering price, less underwriting discounts and commissions. The shares are expected to begin trading on the Nasdaq Global Select Market on October 28, 2021 under the ticker symbol “GFS.” The offering is expected to close on November 1, 2021, subject to customary closing conditions. Morgan Stanley, BofA Securities, J.P. Morgan, Citigroup and Credit Suisse are acting as active book-running managers for the offering. Deutsche Bank Securities, HSBC and Jefferies are acting as additional book-running managers for the offering. Baird, Cowen, Needham & Company, Raymond James, Wedbush Securities, Drexel Hamilton, Siebert Williams Shank and IMI – Intesa Sanpaolo are acting as co-managers for the offering. A registration statement relating to these securities was declared effective as of October 27, 2021 by the U.S. Securities and Exchange Commission. The offering is being made only by means of a prospectus. Copies of the final prospectus relating to the offering, when available, may be obtained from: Morgan Stanley & Co. LLC, Attention: Prospectus Department, 180 Varick Street, 2nd Floor, New York, New York 10014; BofA Securities, Inc., NC1-004-03-43, Attention: Prospectus Department, 200 North College Street, 3rd Floor, Charlotte, NC 29255 or by email at [email protected].; J.P. Morgan Securities LLC, c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717, by telephone at 866-803-9204 or by email at [email protected]; Citigroup Global Markets Inc., c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717, by telephone at (800) 831-9146 or by email at [email protected]; or Credit Suisse Securities (USA) LLC, Attn: Prospectus Department, 6933 Louis Stephens Drive, Morrisville, NC 27560, by telephone at 800-221-1037 or by email at [email protected]. This press release does not constitute an offer to sell or the solicitation of an offer to buy these securities, nor shall there be any sale of these securities in any state or jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction. Forward-Looking Statements This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. About GF: GlobalFoundries Inc. (GF) is one of the world’s leading semiconductor manufacturers. GF delivers feature-rich solutions that enable its customers to develop innovative products for pervasive chips for high-growth markets. GF provides a broad range of feature-rich process technology solutions with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its customers across the globe. Investor Contact: Investor Relations [email protected] Media Contact: Laurie Kelly VP Global Communications [email protected]
格芯宣布IPO定价 October 27, 2021纽约马耳他, 2021年10月27日 – 格芯®（GF®），全球领先的功能丰富的半导体制造商今日宣布其首次公开发行5千5百万股普通股的定价，其中3千零25万股由格芯发行，2千4百75万股由格芯的现有股东穆巴达拉投资公司PJSC发行，首次公开发行价格为每股47美元。 就本次发行而言，穆巴达拉预计将授予承销商30天的选择权，以IPO发行价格减去承销折扣和佣金再购买最多8百25万股普通股。这些股票预计将于2021年10月28日在纳斯达克全球精选市场开始交易，股票代码为“GFS”。根据惯例收盘条件，本次发行预计将于2021年11月1日结束。 摩根士丹利、美国银行证券、J.P.摩根、花旗集团和瑞士信贷（Credit Suisse）担任发行的主承销商。德意志银行证券（Deutsche Bank Securities）、汇丰银行（HSBC）和杰弗里斯银行（Jefferies）将担任拟议发行的附属承销商。Baird, Cowen, Needham & Company, Raymond James, Wedbush Securities, Drexel Hamilton, Siebert Williams Shank and IMI – Intesa Sanpaolo 将担任联合管理人。 美国证券交易委员会宣布与这些证券相关的招股说明书已于2021年10月27日生效。本次发行仅通过招股说明书进行。最终招股说明书的副本可从以下机构获取（在可提供时）：Morgan Stanley & Co. LLC，关涉部门：Prospectus Department，180 Varick Street，2nd Floor，New York，New York 10014；BofA Securities, Inc.，NC1-004-03-43，相关部门：Prospectus Department，200 North College Street，3rd Floor，Charlotte，NC 29255，或者通过电子邮件：[email protected]；J.P. Morgan Securities LLC，c/o Broadridge Financial Solutions，1155 Long Island Avenue，Edgewood，NY 11717，电话：866-803-9204，或通过电子邮件：[email protected]；Citigroup Global Markets Inc，c/o Broadridge Financial Solutions，1155 Long Island Avenue，Edgewood，NY 11717，电话：(800) 831-9146，或者通过电子邮件：[email protected]；或 Credit Suisse Securities (USA) LLC，相关部门：Prospectus Department，Eleven Madison Avenue，3rd Floor，New York，NY 10010，电话：800-221-1037，或者通过电子邮件：[email protected]。 本新闻稿不构成出售这些证券的要约或购买这些证券的要约邀请，如果任何州或司法辖区的证券法规定了证券的要约、邀请或销售在当地注册或获得资质之前为不合法，那么，这些证券也不可在这些州或司法辖区销售。 前瞻性声明 本新闻稿可能包含前瞻性声明，这些声明涉及风险和不确定性。请读者注意，切勿过度依赖这些前瞻性声明中的任何内容。这些前瞻性声明仅表述截至本新闻稿发表之日的内容。除非法律要求，否则，格芯没有义务更新这些前瞻性声明中的任何内容，以反映本新闻稿发布日期之后的事件或情况，或者反映实际结果。
GlobalFoundries Announces Launch of Initial Public Offering October 20, 2021Malta, NY, October 19, 2021 – GlobalFoundries® (GF®), a global leader in feature-rich semiconductor manufacturing, today announced the commencement of its initial public offering of 55,000,000 ordinary shares, 33,000,000 of which are being offered by GF and 22,000,000 of which are being offered by GF’s existing shareholder, Mubadala Investment Company PJSC, pursuant to a registration statement on Form F-1 filed with the U.S. Securities and Exchange Commission (“SEC”). The initial public offering price is currently expected to be between $42.00 and $47.00 per share. In connection with the offering, Mubadala expects to grant the underwriters a 30-day option to purchase up to an additional 8,250,000 ordinary shares at the public offering price, less underwriting discounts and commissions. GF has applied to list its ordinary shares on the Nasdaq Global Select Market under the ticker symbol “GFS.” Morgan Stanley, BofA Securities, J.P. Morgan, Citigroup and Credit Suisse are acting as active book-running managers for the proposed offering. Deutsche Bank Securities, HSBC and Jefferies are acting as additional book-running managers for the proposed offering. Baird, Cowen, Needham & Company, Raymond James, Wedbush Securities, Drexel Hamilton, Siebert Williams Shank and IMI – Intesa Sanpaolo are acting as co-managers for the proposed offering. The proposed offering will be made only by means of a prospectus. Copies of the preliminary prospectus, when available, may be obtained from: Morgan Stanley & Co. LLC, Attention: Prospectus Department, 180 Varick Street, 2nd Floor, New York, New York 10014; BofA Securities, Inc., NC1-004-03-43, Attention: Prospectus Department, 200 North College Street, 3rd Floor, Charlotte, NC 29255 or by email at [email protected].; J.P. Morgan Securities LLC, c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717, by telephone at 866-803-9204 or by email at [email protected]; Citigroup Global Markets Inc., c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717, by telephone at (800) 831-9146 or by email at [email protected]; or Credit Suisse Securities (USA) LLC, Attn: Prospectus Department, Eleven Madison Avenue, 3rd Floor, New York, NY 10010, by telephone at 800-221-1037 or by email at [email protected]. A registration statement relating to these securities has been filed with the SEC but has not yet become effective. These securities may not be sold, nor may offers to buy be accepted, prior to the time the registration statement becomes effective. This press release does not constitute an offer to sell or the solicitation of an offer to buy these securities, nor shall there be any sale of these securities in any state or jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction. Forward-Looking Statements This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. About GF: GlobalFoundries Inc. (GF) is one of the world’s leading semiconductor manufacturers. GF delivers feature-rich solutions that enable its customers to develop innovative products for pervasive chips for high-growth markets. GF provides a broad range of feature-rich process technology solutions with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its customers across the globe. Investor Contact: Investor Relations [email protected] Media Contact: Laurie Kelly VP Global Communications [email protected]
格芯宣布首次公开发行股票 October 19, 2021纽约马耳他, 2021年10月19日 –格芯®（GF®），全球领先的功能丰富的半导体制造商，今日宣布开始首次公开发行5千5百万股普通股，根据向美国证券交易委员会（“SEC”）提交的F-1表格中的上市申请书，其中3千3百万股由格芯发行，2千2百万股由格芯的现有股东穆巴达拉（Mubadala）投资公司PJSC发行。目前，IPO发行价格预计在每股42.00美元至47.00美元之间。就本次发行而言，穆巴达拉预计将授予承销商30天的选择权，以IPO发行价格减去承销折扣和佣金再购买最多8百25万股普通股。格芯已申请在纳斯达克全球精选市场（Nasdaq Global Select Market）以股票代码“GFS”上市其普通股。 摩根士丹利、美国银行证券、J.P.摩根、花旗集团和瑞士信贷（Credit Suisse）担任拟议发行的主承销商。德意志银行证券（Deutsche Bank Securities）、汇丰银行（HSBC）和杰弗里斯银行（Jefferies）将担任拟议发行的附属承销商。Baird, Cowen, Needham & Company, Raymond James, Wedbush Securities, Drexel Hamilton, Siebert Williams Shank and IMI – Intesa Sanpaolo 将担任联合管理人。 此次拟议发行将只通过招股说明书的方式进行。初步招股说明书的副本可从以下机构获取（在可提供时）：Morgan Stanley & Co. LLC，关涉部门：Prospectus Department，180 Varick Street，2nd Floor，New York，New York 10014；BofA Securities, Inc.，NC1-004-03-43，相关部门：Prospectus Department，200 North College Street，3rd Floor，Charlotte，NC 29255，或者通过电子邮件：[email protected]；J.P. Morgan Securities LLC，c/o Broadridge Financial Solutions，1155 Long Island Avenue，Edgewood，NY 11717，电话：866-803-9204，或通过电子邮件：[email protected]；Citigroup Global Markets Inc，c/o Broadridge Financial Solutions，1155 Long Island Avenue，Edgewood，NY 11717，电话：(800) 831-9146，或者通过电子邮件：[email protected]；或 Credit Suisse Securities (USA) LLC，相关部门：Prospectus Department，Eleven Madison Avenue，3rd Floor，New York，NY 10010，电话：800-221-1037，或者通过电子邮件：[email protected]。 与这些证券有关的招股说明书已提交至 SEC，但尚未生效。在注册声明生效之前，这些证券不可销售，也不可接受购买要约。本新闻稿不构成出售这些证券的要约或购买这些证券的要约邀请，如果任何州或司法辖区的证券法规定了证券的要约、邀请或销售在当地注册或获得资质之前为不合法，那么，这些证券也不可在这些州或司法辖区销售。 前瞻性声明 本新闻稿可能包含前瞻性声明，这些声明涉及风险和不确定性。请读者注意，切勿过度依赖这些前瞻性声明中的任何内容。这些前瞻性声明仅表述截至本新闻稿发表之日的内容。 除非法律要求，否则，格芯没有义务更新这些前瞻性声明中的任何内容，以反映本新闻稿发布日期之后的事件或情况，或者反映实际结果。 关于格芯 格芯全球领先的半导体制造商之一，也是唯一一家真正拥有全球生产部署的半导体制造商。格芯提供功能丰富的解决方案，赋能我们的客户为高增长的市场领域开发创新产品，提供无处不在的芯片。格芯提供了广泛的功能丰富的制程技术，并提供独特的融合设计、开发和生产为一体的服务。格芯的规模生产足迹跨域美国、欧洲和亚洲，是全球客户信赖的技术来源。格芯为穆巴达拉投资公司所有。更多信息，请访问www.gf.com/cn。 投资者联系: Investor Relations [email protected] 媒体联络: Laurie Kelly VP Global Communications [email protected]
GlobalFoundries Files Registration Statement for Proposed Initial Public Offering October 4, 2021Malta, NY, October 4, 2021 – GlobalFoundries® (GF®), a global leader in feature-rich semiconductor manufacturing, today announced that it has publicly filed a registration statement on Form F-1 with the U.S. Securities and Exchange Commission (the “SEC”) relating to the proposed initial public offering of its ordinary shares. The number of ordinary shares to be offered and the price range for the proposed offering have not yet been determined. GF has applied to list its ordinary shares on the Nasdaq Global Select Market under the ticker symbol “GFS.” Morgan Stanley, BofA Securities, J.P. Morgan, Citigroup and Credit Suisse are acting as active book-running managers for the proposed offering. Deutsche Bank Securities, HSBC and Jefferies are acting as additional book-running managers for the proposed offering. Baird, Cowen, Needham & Company, Raymond James, Wedbush Securities, Drexel Hamilton, Siebert Williams Shank and IMI – Intesa Sanpaolo are acting as co-managers for the proposed offering. The proposed offering will be made only by means of a prospectus. Copies of the preliminary prospectus, when available, may be obtained from: Morgan Stanley & Co. LLC, Attention: Prospectus Department, 180 Varick Street, 2nd Floor, New York, New York 10014; BofA Securities, Inc., NC1-004-03-43, Attention: Prospectus Department, 200 North College Street, 3rd Floor, Charlotte, NC 29255 or by email at [email protected].; J.P. Morgan Securities LLC, c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717, by telephone at 866-803-9204 or by email at [email protected]; Citigroup Global Markets Inc., c/o Broadridge Financial Solutions, 1155 Long Island Avenue, Edgewood, NY 11717, by telephone at (800) 831-9146 or by email at [email protected]; or Credit Suisse Securities (USA) LLC, Attn: Prospectus Department, Eleven Madison Avenue, 3rd Floor, New York, NY 10010, by telephone at 800-221-1037 or by email at [email protected]. A registration statement relating to these securities has been filed with the SEC but has not yet become effective. These securities may not be sold, nor may offers to buy be accepted, prior to the time the registration statement becomes effective. This press release does not constitute an offer to sell or the solicitation of an offer to buy these securities, nor shall there be any sale of these securities in any state or jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction. Forward-Looking Statements This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. About GF: GlobalFoundries Inc. (GF) is one of the world’s leading semiconductor manufacturers. GF delivers feature-rich solutions that enable its customers to develop innovative products for pervasive chips for high-growth markets. GF provides a broad range of feature-rich process technology solutions with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its customers across the globe. Media Contact: Laurie Kelly VP Global Communications [email protected]
格芯技术助力打造高效可持续发展的世界 October 4, 2021撰文：Gary Dagastine 从智能手机、可穿戴式设备、汽车电子系统，到适用于学校和医院的各种技术，数字技术已经渗透到现代生活的方方面面。这些技术为我们的工作、学习、旅行、医疗及至整个生活带来了前所未有的变化。 半导体是数字技术的重要组成部分，它让用户能够开发比以往功能更强大、能效更高、资源消耗更少的创新产品。因此，个人和社会的健康、安全、繁荣都与功能丰富的半导体技术密不可分。 格芯(GF)是全球领先的半导体制造商，在美国、德国和新加坡设有先进的制造工厂。格芯提供了功能丰富的工艺技术解决方案，它们在我们的生活中得到普遍应用，对于创新至关重要，助力打造更环保、更加可持续、连接更紧密、更健康的世界。 一种对人类至关重要的资源 全球各地的公司都在开发更清洁、更高效、更有利于环保的技术，应用于智能移动设备、车载系统、计算和人工智能(AI)、通信和数据中心基础设施，以及大量物联网(IoT)应用。 虽然这些应用在功能要求上差异很大，但它们的共同之处是都需要芯片，芯片不仅要提供高性能和专门的功能，还要具备高效、可靠、节省资源的特点。 格芯提供一系列功能丰富的高性能、高能效半导体平台及相关服务，帮助客户构建满足以上需求的系统。格芯提供差异化技术平台，例如RF-SOI（绝缘体上硅）、FD-SOI和硅光，并结合设计实现方案和特定应用功能，例如模拟/RF、嵌入式存储器和先进封装，创造针对客户特定需求和市场量身定制的解决方案。 快速了解一下格芯的三大核心市场就会发现，格芯的现有平台和开发工作旨在帮助客户达到可持续发展目标，将让所有设备高能效运行作为关键目标。 在所有目标市场上，格芯半导体平台都在加快创新，从而对人类产生积极影响。 面向移动和无线应用的更高效技术 几乎所有无线呼叫、文本、电子邮件、社交媒体帖子和流媒体视频都要通过格芯制造的芯片传输。格芯公司的领先RF平台对于广泛普及远程办公和远程教育至关重要，释放了5G网络和未来6G网络的强大力量。 格芯移动和无线基础架构业务部(MWI)副总裁兼首席技术官Peter Gammel表示，格芯适用于移动和无线系统的成像、显示、安全和电源管理平台是很好的范例，证明格芯致力于帮助客户通过更有利于可持续发展的方式来开发产品。 “对于成像功能而言，在减少需要处理的数据量方面做得越多，操作就会执行得越快，需要的能耗也越少。通过从模拟成像架构迁移到数字架构，有可能将数据量减少100,000倍。我们正在研究如何使用格芯的22FDX™平台来实现这个目标，因为它能够在高性能运行与高能效运行之间切换，具有独特的优势，”他指出，“22FDX平台将能够实现堆叠式图像信号处理器，以提供性能更高的低功耗、低泄漏超小型存储器位单元。22FDX还将实现近数据计算和成像对应操作（而不是像素）架构，减少接口的功耗，进而降低传感器中的功耗。” 在显示方面，Gammel表示，22FDX平台能够让显示架构尽可能长时间保持100,000:1的数据压缩比，以此提高效率，直至数据解压，与人眼视觉系统相匹配。他还描述了格芯技术如何能够用于microLED（发光二极管），这是一种新兴的平板显示技术。他说：“MicroLED可以采用格芯的GaN（氮化镓）技术实现，这种技术目前正在开发中，与22FDX背板集成在一起。这种组合将实现低泄漏、低功耗运行，使用堆叠解决方案减小尺寸，还可实现模拟和数字电路功能的协同设计，目的是在计算、功耗、亮度之间达到最佳的平衡。” Gammel表示，为了增强移动和无线系统的安全性以保护用户隐私，格芯的55 BCD Lite®平台实现了硅基LED和SPAD（单光子雪崩二极管）在同一芯片上的集成。这样可以构建采用量子随机数生成方法的低功耗、超小形、移动设备量子密码学解决方案，以提高数据安全性。格芯正在与麻省理工学院和洛桑联邦理工学院(EPFL)协作开发这些解决方案。 格芯的55 BCD Lite平台还实现了高能效的管理电路，以延迟移动和无线设备的电池使用寿命，减少废弃的电池数量。 创新的汽车连接、电气化、安全和自动化解决方案 从用于辅助驾驶的雷达到连接，再到提高电动汽车效率，格芯半导体技术让汽车客户能够生产比以往更加安全高效的汽车。 除了加快更高能效的智能工厂和工业物联网应用之外，格芯半导体平台还让客户能够开发更复杂的物联网设备并将其推向市场，这些设备不仅更具创意，还提供更高的能效，电池续航时间更长。 格芯汽车、工业和多市场(AIM)战略业务部副总裁兼首席技术官Pirooz Parvarandeh表示，格芯的BCD技术提供了领先的品质，在汽车、智能工厂和数据中心应用中提高了供电和配电效率。他表示：“这种特性可以减少功率损耗和发热，让客户能够减小产品尺寸和重量，从而节省散热成本和电能。” 同时，格芯的22FDX平台实现了行业领先的汽车雷达解决方案，为用户和环境带来了诸多优势。“利用22FDX平台，客户能够构建在特定性能水平下功耗更低的雷达系统，还能降低汽车的整体能耗，增加汽车的成像距离和分辨率，”Parvarandeh说道，“这种特性可以提高汽车安全性水平，有可能挽救生命，减少碰撞事故。通过减少死伤，我们可以创造无可估量的社会价值。” 格芯汽车团队还在寻求开发针对电池管理系统优化的独特技术。在汽车中，这些系统可以优化电池储能的利用，从而实现更高能效的驾驶。此外，客户还利用格芯技术来提高汽车中致动器的能效。 借助电池管理系统，电池供电的汽车、机械和机器人等系统能够在充电之后工作更长时间，并提供比当前更多的功能。Parvarandeh说道：“我们还在寻求为其他一系列电池供电的设备开发超低功耗技术，面向物联网、计算/控制、人机接口和其他应用。” 从更长远的眼光来看，格芯团队专注于开发各种其他可持续发展技术，包括针对LED驱动器电路优化的平台，目的是减少在家庭、城市、汽车的照明应用中消耗的电量，例如能源收集解决方案，它能够从热量、振动和其他环境输入收集能量，适用于无法采用电池供电的远程应用，例如物联网传感器。这些能源收集解决方案能够延长电池寿命，需要消耗的电能较少，随着物联网设备数量的快速增长，它们具备大幅提升能效的潜力。 计算和数据中心的能效 格芯半导体平台可以直接解决妨碍人工智能迅猛发展的“电能瓶颈”问题，让客户能够达到行业和社会要求的能效目标。格芯还是下一代硅光技术的行业领导者，该技术必将显著减少数据中心用电量的增长。 格芯计算和有线基础架构(CWI)业务部门副总裁兼首席技术官Ted Letavic着重强调了计算和数据中心应用的能效，将它视为格芯的一个关键可持续发展目标。Letavic指出，格芯为了提高数据中心能效付出了多方面的努力，数据中心在全球的电能消耗非常庞大，而且还在快速增长。他谈到：“我们使用只有少量电压逻辑器件和存储器的格芯12LP+ FinFET和22FDX平台，来开发人工智能加速器，它能够显著减少数据中心的工作负载所需的电量。”此外，格芯还在应用55 BCD Lite和22FDX平台来满足异构计算解决方案对下一代供电系统的需求。 Letavic还表示，格芯正在为数据中心开发其他解决方案，让客户能够提供更具可持续性的产品，在可持续发展的道路上向前迈进。45SPCLO硅光技术平台就是一个例子，它使用光子而不是电子来快速高效地传输数据，包括在芯片之间传输，以及在数据中心网络之间传输。借助硅光技术，客户能够对数据中心进行重新配置，提高数据传输的整体能效。Letavic说，格芯实现了全新的超低功耗光子计算范式，包括晶圆级光子神经网络处理器和光子量子计算。这两种范式都可为计算类任务节省大量电能，促使我们在传统计算系统的基础上向外扩展。 实现可持续发展的解决方案 格芯的差异化半导体平台为客户及至整个社会提供了颇具吸引力的优势。此外，格芯在可持续性制造实践方面的投入切实证明了我们致力于让世界变得更加美好。 点击此处阅读有关格芯的可持续性制造和运营的更多内容。
GF Technologies Enable a More Sustainable, More Efficient World October 4, 2021By Gary Dagastine From smartphones, wearable devices and automotive electronics to technology for schools and hospitals, digital technologies now are pervasive in virtually all aspects of modern life. They have brought unprecedented change to how we work, learn, travel, access healthcare and otherwise live our lives. Semiconductors, as the building blocks of digital technologies, enable users to create innovative products which are more functional and energy-efficient, and less resource-intensive, than ever before. As a result, the health, safety and prosperity of individuals and society is tightly tied to feature-rich semiconductor technologies. GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers, with advanced manufacturing facilities in the United States, Germany, and Singapore. GF delivers the feature-rich process technology solutions that are pervasive in our lives and vital to the innovations leading to a greener, more sustainable, better connected, and healthier world. A Critical Resource for Humanity Companies worldwide are striving to develop cleaner, more efficient and more environmentally preferable technologies for smart mobile devices; automotive systems; computing and artificial intelligence (AI); the communications and data center infrastructures; and a multitude of Internet of Things (IoT) applications, among others. While these applications differ greatly in their functional requirements, what they all have in common is a need for chips that not only provide the high performance and specialized features required, but do so in an efficient, reliable and resource-sensitive manner. GF offers an array of feature-rich, high-performance and power-efficient semiconductor platforms and related services that help customers build such systems. GF’s differentiated technology platforms such as RF-SOI (silicon-on-insulator), FD-SOI and silicon photonics – coupled with design enablement and application-specific features like analog/RF, embedded memory and advanced packaging – create solutions tailored to customers’ specific needs and markets. A quick look at GF’s three core markets shows how GF’s existing platforms and development work are aimed at helping customers achieve their sustainability goals, with power efficiency running through all of the units as a key objective. In each target market, GF semiconductor platforms are accelerating innovation and leading to a positive impact on humanity. More Efficient Technologies for Mobile and Wireless Nearly every wireless call, text, email, social media post, and streaming video passes through chips manufactured by GF. The company’s leading RF platforms were vital to making possible widespread telework and remote education, and are unlocking the power of 5G and future 6G networks. Peter Gammel, VP and CTO GF’s Mobile and Wireless Infrastructure Business Unit (MWI), said that GF’s platforms for imaging, displays, security and power management in mobile and wireless systems are good examples of the company’s commitment to help customers build products in a more sustainable fashion. “For imaging functions, the more you can do to reduce the amount of data needing to be processed, the faster an operation can be carried out and the less power required. By going from an analog imaging architecture to a digital one, the potential exists to reduce the amount of data by 100,000x. We are investigating how to do that using GF’s 22FDX™ platform because its ability to toggle between high-performance and energy-efficient operation offers unique advantages,” he said. “The 22FDX platform will make possible stacked image signal processors for higher performance, and low-power, low-leakage and ultra-small memory bitcells. 22FDX will also lead to reduced power consumption in sensors by enabling compute-near-data and imaging-to-action (rather than to pixels) architectures, and by reducing interface power consumption.” In displays, Gammel said the 22FDX platform will also enable display architectures that keep the 100,000:1 data compressed as much as possible for as long as possible for higher efficiency, until it is expanded to match the human visual system. He also described how GF’s technologies can be used for microLEDs (Light Emitting Diodes), an emerging flat-panel display technology. “MicroLEDs can be enabled by GF’s GaN (gallium nitride) technology, currently in development, integrated with an 22FDX backplane. The combination will enable low-leakage, low-power operation, small size using stacking solutions, and co-design of analog and digital circuit functions to achieve the best compute/power/brightness tradeoff,” he said. For enhanced security for mobile/wireless systems to protect user privacy, Gammel said that GF’s 55 BCD Lite® platform makes possible the integration of silicon LEDs and SPAD (Single-photon Avalanche Diode) sensors on the same chip. This may lead to quantum random-number-generating, low-power, ultra-small form-factor mobile quantum cryptography solutions to keep data safer and more secure. GF is developing these in collaboration with Massachusetts Institute of Technology and the Swiss Federal Institute of Technology (EPFL). GF’s 55 BCD Lite platform also enables highly efficient power management circuits that lead to longer battery lifetimes in mobile/wireless devices, reducing the amount of batteries sent to landfills. Novel Automotive Connectivity, Electrification, Safety and Automation From radars for assisted driving, to connectivity, to boosting the efficiency of electric vehicles, GF semiconductor technology enables automotive customers to produce vehicles that are safer and more efficient than ever before. In addition to accelerating more energy-efficient smart factories and industrial IoT applications, GF semiconductor platforms are enabling customers to develop and bring to market increasingly complex IoT devices that are more innovative, more energy-efficient, and can run longer between charging. Pirooz Parvarandeh, VP and CTO of GF’s Automotive, Industrial and Multi-market (AIM) strategic business unit, said that GF’s BCD technologies offer state-of-the-art figures of merit leading to increased efficiency in the supply and distribution of power in automotive, smart factory and data center applications. “This performance reduces power loss and dissipated heat, enabling customers to reduce the size/weight of their products and to save on cooling costs and energy,” he said. GF’s 22FDX platform, meanwhile, enables industry-leading automotive radar solutions that bring many advantages to people and to the environment. “The 22FDX platform allows customers to build radar systems offering lower power for a given level of performance, along with lower overall vehicle energy consumption and increased automotive imaging range and resolution,” Parvarandeh said. “This performance enables higher levels of car safety, potentially saving lives and reducing the number of collisions. The societal value of reducing death and injury is incalculable.” The GF automotive team is also pursuing unique technologies optimized for battery management systems. In vehicles, these systems optimize the use of stored energy in the batteries, which leads to more power-efficient driving. Additionally, GF technologies are used for making the actuators in vehicles more energy efficient. Battery management systems will enable systems such as battery-operated vehicles, machinery and robots that operate longer on a charge and offer more functionality than at present. “We are also pursuing ultra-low-power technologies for a range of other battery-operated equipment for IoT, compute/control, human-machine interfaces and other applications,” Parvarandeh said. Longer-term, the GF team is focused on a variety of other sustainable technologies, including platforms optimized for LED driver circuits, with the goal of reducing the amount of power used in lighting applications in homes, cities, and vehicles. as are energy-harvesting solutions that draw power from heat, vibration and other environmental inputs, for remote applications where batteries are impractical, such as IoT sensors. These energy-harvesting solutions can prolong battery life – requiring less energy use – and hold the potential to become significant drivers of efficiency as the number of IoT devices continue to rapidly increase. Energy Efficiency for Computing, Data Centers GF semiconductor platforms are directly addressing the known “power bottleneck” hampering the explosive growth of AI, and enabling customers to meet the power efficiency targets demanded by the industry and society. GF is also the industry leader in next-generation silicon photonics technology, which is positioned to significantly reduce the unsustainable growth of electricity needed to power data centers. Ted Letavic, Vice President and CTO of GF’s Computing and Wireless Infrastructure (CWI) business unit, highlighted energy efficiency for computing and data center applications as a key sustainability goal for GF. Letavic pointed to GF’s multi-faceted efforts to increase energy efficiency in data centers, a huge and fast-growing consumer of the world’s electric power in the aggregate. “We’re using GF’s 12LP+ FinFET and 22FDX platforms with low voltage logic and memory to develop AI accelerators that can drastically reduce the amount of power required for data-centric workloads within data centers. Additionally, GF is applying the 55 BCD Lite and 22FDX platforms to address next-generation power delivery systems for heterogeneous compute solutions. Letavic also said GF is working on other solutions for data centers that will enable customers to offer more sustainable products, and to take the next step on the sustainability curve. One example is the 45SPCLO silicon photonics technology platform, which uses photons instead of electrons to move data rapidly and efficiently from chip-to-chip and across datacenter networks. Photonics enables the reconfiguration of data centers to increase total overall energy efficiency of data transport. GF is enabling new ultra-low-power photonic compute paradigms, Letavic said, including wafer-scale photonic neural network processors and photonic quantum computation. Both paradigms offer substantial energy reduction per compute task, he said, and fuel the scale-out of traditional compute systems. Solutions to Deliver Sustainability GF’s differentiated semiconductor platforms offer compelling advantages to customers and to society at large. Furthermore, our investments in sustainable manufacturing practices provide tangible evidence of our commitment to making the world a better place. Click here to read more about GF’s sustainable manufacturing and operations.
格芯®（GLOBALFOUNDRIES®）为拟议首次公开募股（IPO）提交注册声明 October 4, 2021马耳他，纽约，2021年10月4日 – 全球领先的功能丰富的半导体制造商- 格芯®（GLOBALFOUNDRIES®，GF®）今日宣布，已向美国证券交易委员会（“SEC”）公开提交了F-1表格的注册声明，内容涉及其普通股的首次公开募股计划。拟议发行的普通股的数量和发行价格范围尚未确定。格芯已申请将其普通股在纳斯达克全球精选市场上市，股票代码为“GFS”。 摩根士丹利、美银证券、摩根大通、花旗集团和瑞士信贷担任此次拟议发行的主动承销商。德意志银行证券、汇丰银行和杰富瑞银行担任此次拟议发行的附加承销商。Baird、Cowen、Needham & Company、Raymond James、Wedbush Securities、Drexel Hamilton、Siebert Williams Shank和IMI – Intesa Sanpaolo作为此次拟议发行的共同管理人。 此次拟议发行将只通过招股说明书的方式进行。初步招股说明书的副本可从以下机构获取（在可提供时）：Morgan Stanley & Co. LLC，关涉部门：Prospectus Department，180 Varick Street，2nd Floor，New York，New York 10014；BofA Securities, Inc.，NC1-004-03-43，相关部门：Prospectus Department，200 North College Street，3rd Floor，Charlotte，NC 29255，或者通过电子邮件：[email protected]；J.P. Morgan Securities LLC，c/o Broadridge Financial Solutions，1155 Long Island Avenue，Edgewood，NY 11717，电话：866-803-9204，或通过电子邮件：[email protected]；Citigroup Global Markets Inc，c/o Broadridge Financial Solutions，1155 Long Island Avenue，Edgewood，NY 11717，电话：(800) 831-9146，或者通过电子邮件：[email protected]；或 Credit Suisse Securities (USA) LLC，相关部门：Prospectus Department，Eleven Madison Avenue，3rd Floor，New York，NY 10010，电话：800-221-1037，或者通过电子邮件：[email protected]。 与这些证券有关的注册声明已提交至 SEC，但尚未生效。在注册声明生效之前，这些证券不可销售，也不可接受购买要约。本新闻稿不构成出售这些证券的要约或购买这些证券的要约邀请，如果任何州或司法辖区的证券法规定了证券的要约、邀请或销售在当地注册或获得资质之前为不合法，那么，这些证券也不可在这些州或司法辖区销售。 前瞻性声明 本新闻稿可能包含前瞻性声明，这些声明涉及风险和不确定性。请读者注意，切勿过度依赖这些前瞻性声明中的任何内容。这些前瞻性声明仅表述截至本新闻稿发表之日的内容。除非法律要求，否则，格芯没有义务更新这些前瞻性声明中的任何内容，以反映本新闻稿发布日期之后的事件或情况，或者反映实际结果。
Elissa Murphy Joins GlobalFoundries Board September 17, 2021Executive with deep technology experience to help company accelerate growth Malta, New York, September 16, 2021 – GlobalFoundries (GF) today announced Elissa Murphy is joining the company’s board of directors with immediate effect as an independent director. Currently a vice president of Engineering at Google, Ms. Murphy previously served as the chief technology officer and executive vice president of Cloud Platforms at GoDaddy. “I’m delighted to welcome Elissa to GF’s board,” said Ahmed Yahia, board chair of GlobalFoundries. “The depth and breadth of her experience in cloud infrastructure, distributed systems, machine learning and cyber security will help guide GF’s technology and product roadmap. Elissa’s insights will be enormously valuable in helping to accelerate GFs long-term growth in these areas.” “As GF redefines innovation in semiconductor manufacturing, we need experienced technology leaders with the foresight and vision to guide our growth strategy,” said Tom Caulfield, CEO at GF. “Elissa is an accomplished engineer and Silicon Valley executive, with a proven record of leading teams that push the boundaries of technology. Her appointment will help us further position the company as an innovative manufacturer with a broad portfolio of feature-rich solutions.” Ms. Murphy has more than 25 years of technology leadership experience. Before her role with GoDaddy, she was vice president of Engineering at Yahoo!, where she oversaw the world’s largest private Hadoop cluster, a technology essential to the massive-scale computing that forms the basis of big data. Prior to this, Ms. Murphy spent 13 years with Microsoft, where she was part of the original team responsible for the company’s shift to the Cloud, leading to the creation of Azure. She began her technology career designing and building many of the best-selling computer security and system utilities with 5th Generation Systems, Quarterdeck and the Norton Group. Ms. Murphy has more than 30 U.S. patents issued, with several more pending. About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop innovative products for pervasive chips for high-growth markets. GF provides a broad range of feature-rich process technology solutions with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.gf.com. Contact: Erica McGill GlobalFoundries (518) 795-5240 [email protected]
