BAE Systems and GlobalFoundries Collaborate to Strengthen Supply of Essential Semiconductors for National Security Programs June 20, 2024 Collaboration to focus on U.S. chip manufacturing and joint research and development for advanced chip technologies MALTA, N.Y., June 20, 2024 — BAE Systems (LON: BA) and GlobalFoundries (Nasdaq: GFS) (GF) today announced a new collaboration to strengthen the supply of critical semiconductors for national security programs. Under the strategic agreement, the companies will align technology roadmaps and collaborate on long-term strategies for increasing U.S. semiconductor innovation and manufacturing, with the joint goal of advancing the ecosystem for domestic fabrication and packaging of secure chips and solutions for use in aerospace and defense systems. Together, the companies will engage in long-term planning for emerging technologies and collaborate on research and development in a range of areas, including advanced semiconductor packaging and integration, gallium nitride on silicon chips, silicon photonics and advanced technology process development. The new non-exclusive collaboration builds upon the longtime relationship between BAE Systems and GF, and further brings together BAE Systems’ expertise in microelectronics for critical defense systems with GF’s expertise as one of the world’s leading high-volume semiconductor manufacturers and the most advanced supplier of secure, essential chips to the U.S. Department of Defense (DoD). Both BAE Systems and GF were recently named as recipients of planned direct funding from the U.S. government as part of the CHIPS and Science Act. “Our leadership in microelectronics for critical defense systems is predicated on a reliable and secure supply chain and the availability of trusted, uncompromised semiconductors,” said Terry Crimmins, president of BAE Systems’ Electronic Systems sector. “This new collaboration with GlobalFoundries, with its expertise in secure chip manufacturing, is imperative for BAE Systems to advance the overmatch thresholds of technologies, stay ahead of the increasingly complex defense environment, and enable creative solutions to mitigate the growing challenges to both the integrity of microelectronics and their associated supply chains.” “GF is committed to strengthening the semiconductor supply chain for national security and innovating to meet the future needs of the aerospace and defense sector,” said Dr. Thomas Caulfield, president and CEO of GF. “We are proud to deepen our strategic relationship with BAE Systems, and further strengthen supply chain resiliency. Together, we will accelerate the research and development of a new generation of essential technologies and securely manufacture essential chips for a diverse range of critical defense applications.” A recent example of successful collaboration between the two companies, BAE Systems leveraged GF’s 12LP and 12S0 technology platforms for custom radiation-hardened by design semiconductor solutions for sensitive space applications. These highly differentiated U.S.-made chips enable electronic systems to withstand the harsh environment of space, while offering power efficiency, area benefits, and a robust design ecosystem to enable cost-efficient and quick-turn prototyping. These chips deliver the performance, reliability and yield of GF’s high-volume commercial sector offerings, tailored to the needs of the aerospace and defense industry by BAE Systems, and manufactured by GF with the right level of security – up to the DoD’s highest security level, Trusted Supplier Category 1A. GF’s U.S. manufacturing facilities have Trusted Foundry accreditation from the U.S. government to securely manufacture chips in partnership with the DoD Defense Microelectronics Activity (DMEA) for use in some of the nation’s sensitive national security and critical infrastructure systems on land, air, sea and in space. In 2023, the DoD awarded GF a new $3.1 billion, 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications. The new contract was the third sequential 10-year contract of its kind between the DoD and the Trusted Foundry business team at GF. About BAE Systems BAE Systems, Inc. and its nearly 41,000 people are part of a global defense, aerospace, and security company with approximately 100,000 employees worldwide. We deliver products and services for air, land, sea, and space, as well as advanced electronics, intelligence, security, and IT solutions and support services. Our dedication shows in everything we design, produce and deliver— to protect those who protect us in a high-performance, innovative culture. We push the limits of possibility to provide a critical advantage to our customers where it counts. About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers. GF is redefining innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. GF offers a unique mix of design, development, and fabrication services. With a talented and diverse workforce and an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its worldwide customers. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-looking Information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contacts: BAE Systems Paul Roberts [email protected] GlobalFoundries Michael Mullaney [email protected]
Bits in Space: Connecting the World with Satellite Technology June 18, 2024 Alexandros Margomenos, GlobalFoundries Director RF Product Management As recently as just a few decades ago, the idea of delivering broadband and cellular connectivity from space was a futuristic dream. Fast forward to today, and this dream is rapidly becoming a reality. Advances in satellite technology are revolutionizing global connectivity. These types of advancements are powered by essential innovations in semiconductor technology, like those we are pioneering here at GlobalFoundries, which are helping to bring high-speed communication to every corner of the globe, even the most remote areas. These innovations are essential for creating immersive user experiences and transforming industries. So, How Does It Work? You may be asking, what do all these satellites mean, and how does it impact me? Let’s break it down. There are two main types of satellites used for communication: Geosynchronous (GEO) and Low Earth Orbit (LEO) satellites. GEO Satellites: These orbit 36,000 km above the Earth and stay fixed over one spot. They can cover large areas with just a few satellites but have higher latency (delay) because of their distance. LEO Satellites: These orbit much closer to Earth, between 500 to 1,200 km. They provide lower latency (less delay) and faster internet speeds but require many more satellites to cover the globe because they move quickly across the sky. LEO satellites travel at nearly 25 times the speed of sound, enabling significantly lower latency (<20 milliseconds). Connecting the Dots: How Satellites Communicate Satellite networks include four types of communication links. In all cases, the downlink from the satellite is at a lower frequency compared to the uplink to optimize the power amplifiers on the satellite. User Link: Connects the satellite to your home or mobile device. This is how you receive data from the satellite. Feeder Link: Connects the satellite to ground stations (gateway terminals), linking the satellite network to the terrestrial internet. Telemetry, Tracking, and Command (TT&C) Link: Manages the satellite’s operations, ensuring they stay on course and function correctly. Intersatellite Links (ISL): Allow satellites to talk to each other, transferring data and coordinating handoffs as they orbit. Typically, user, feeder, and TT&C links use RF and millimeter-wave frequencies, while ISL links can utilize both millimeter-wave frequencies and optical communications. To put it simply, think of it as a relay race. The user link is like the baton passed from the satellite to your device. The feeder link is the baton passed from the satellite to the ground station, connecting you to the wider internet. The TT&C link ensures the satellites stay on course, much like a coach guiding the runners. Finally, ISLs are like runners passing the baton between each other to ensure seamless coverage as they orbit the Earth. The Evolution of Satellite Antennas Imagine those old satellite systems: giant, rigid dish antennas—like the ones you might see in old movies. These large dishes were excellent for sending focused signals but lacked flexibility. They could only point in one direction at a time and needed to be physically moved to change their focus. Today, the game has changed with the advent of phased array antennas. Instead of one big dish, think of these antennas as being made up of thousands of tiny elements, each capable of steering a part of the signal. These elements work together to create a powerful, flexible system that can direct beams electronically, without any moving parts. This technological leap means that modern satellites can connect to multiple places at once, seamlessly switching between different targets. It’s like having a spotlight that can instantly shine in any direction, or even multiple directions at once, without physically moving. Choosing the Right Technology Creating these advanced satellite systems requires selecting the right semiconductor technology. Key considerations include the type of beamforming (analog, digital, or hybrid), system design (placing amplifiers close to antennas vs. integrating them with beamformers) and achieving a low noise figure (NF) for better performance. Lower NF means fewer required elements, simplifying design and reducing costs, making the system more efficient overall. Powering the Future of Connectivity At GF, we offer a wide range of technologies supporting all the components necessary for creating any possible configuration of satellite communication phased arrays. Here are some of our key technologies: 130NSX: Perfect for ground terminals, offering excellent performance for smaller phased arrays. High-Performance SiGe: Efficient power amplifiers and low noise for high-volume manufacturing. 9SW and 45RFSOI: Advanced RF SOI technologies optimized for beamformers, ensuring high efficiency and low noise. 22FDX: Combines high-density logic and memory, ideal for digital beamformers and integrated systems. By leveraging these essential technologies, we are helping to create satellite systems that are more efficient, cost-effective, and capable of bringing high-speed connectivity to every corner of the globe. Significant progress has been made to expand access and adoption of broadband services. The number of internet users doubled between 2010 and 2020, reaching over 4 billion users worldwide. As we continue to innovate and develop these technologies, the dream of connecting the next 4 billion people is closer than ever.
GlobalFoundries Joins CHIPS Women in Construction Framework June 18, 2024 GF commits to framework of U.S. Commerce Secretary Gina Raimondo’s “Million Women in Construction” Initiative MALTA, N.Y., June 18, 2024 — GlobalFoundries announced today a commitment to the U.S. Department of Commerce’s CHIPS Women in Construction Framework, a set of five best practices intended to increase representation of women and economically disadvantaged individuals in the construction workforce. The Framework is part of U.S. Secretary of Commerce Gina Raimondo’s ongoing Million Women in Construction initiative that aims to expand the American construction workforce by doubling the number of women in construction over the next decade. GF Chief People Officer Pradheepa Raman announced the company’s commitment at the “CHIPS Women in Construction Roundtable” event at the White House. In voluntarily committing to the Framework, GF is agreeing to work with contractors, trade unions, and other community and workforce partners to implement best practices that will expand the construction workforce by increasing the participation of women and economically disadvantaged individuals. These recruitment and retention best practices will help support on-time and successful completion of CHIPS program-funded projects. “At GlobalFoundries, we celebrate our diversity and are steadfast in our commitment to shaping the future of the semiconductor industry. Every day, our talented team is pushing the boundaries of innovation to shape essential technologies that are making the world a better place,” Raman said. “We applaud the leadership of Secretary Raimondo in taking action to diversify our nation’s workforce. GlobalFoundries is proud to commit to the Department of Commerce’s CHIPS Women in Construction Framework. A more diverse construction workforce benefits all of us, strengthening our industry and our communities.” The five best practices GF is committing to adopt are: Set goals and monitor progress towards increasing the participation of women on CHIPS-funded construction projects. Build community partnerships with community organizations with a track record of increasing women and economically disadvantaged individuals’ exposure to and recruitment into the construction industry. Develop training pathways such as training investments, apprentice utilization goals, or apprentice readiness program partnerships that serve women and economically disadvantaged individuals. Provide access to supportive services such as child care or transportation that will increase retention of women and economically disadvantaged individuals in the workforce. Maintain healthy, safe, and respectful workplaces and prevent and address harassment, discrimination, retaliation, and violence through workplace training, policy and practice. In the coming months, GF will work with the CHIPS Program Office (CPO), the Department of Commerce, and collaborate with local partners, such as contractors, trades unions and community-based organizations to develop and implement activities carrying out the best practices. GF’s support of CHIPS Women in Construction framework is the company’s latest effort to support workplace diversity and build a critical talent pipeline for the current and future workforce. In May, GF announced a partnership with Micron Technology and the U.S. National Science Foundation to invest in workforce development at Minority Serving Institutions (MSI) to help meet the growing workforce needs of the U.S. semiconductor ecosystem and help develop the next generation of talent for the industry. In November 2023, the company announced a new student loan repayment program to help U.S.-based employees and eligible new recruits pay up to $28,500 in student loan debt, tax-free, to help ease the financial burden of higher education and training. GF also offers tuition reimbursement for employees pursuing undergraduate and graduate degrees, fully paid parental leave, employee fitness stipend to promote good health and childcare subsidy towards dependent care. GF’s first-of-its-kind apprenticeship program provides opportunities for individuals with no prior experience or training in the semiconductor industry, offering full-time paid positions and cost-free college courses to high school graduates. GF has established strategic partnerships nationwide with top universities and strong regional engagements with community colleges in New York and Vermont as well as access to worldwide talent through its global footprint to help build a diverse workforce and semiconductor talent pipeline. To help inspire younger children, GF has a robust STEM outreach program to engage with regional middle schools and high schools, including Early College High School and Career and Technical Education programs, to bring industry awareness and hands-on experiences to students. About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers. GF is redefining innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. GF offers a unique mix of design, development, and fabrication services. With a talented and diverse workforce and an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its worldwide customers. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-looking Information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contact: Michael Mullaney [email protected]
Driving Automotive Innovation on the Semiconductor Superhighway June 11, 2024 GlobalFoundries’ Next-Generation Technology Will Shape What’s Essential in the Auto Industry Today’s vehicles are marvels of integrated technology—an intelligent edge device on wheels. Look under the hood, and it’s likely you’ll find a semiconductor born in one of GF’s global manufacturing facilities. The shift from traditional combustion engines to autonomous, connected, and electrified (ACE) vehicles—and eventually to Software Defined Vehicles (SDVs)—is a giant technological stride. And GF’s 12LP+ AutoPro150 platform is precisely engineered to fuel this transition. The Evolution of Automotive Performance From self-driving features to efficient power management and central controls, the modern car is experiencing an explosion of advancements in user experience, safety, and connectivity—all while moving toward zero emissions. With 15 years of expertise in automotive solutions, GF has been pivotal in this evolution. 12LP+ AutoPro150 not only meets these complex demands but is built to withstand the rigors of automotive operation—engineered to perform reliably even at the high temperatures of up to 150 degrees Celsius. Power, Performance, Area: The Core of 12LP+ AutoPro150 In automotive electronics, three factors are crucial: power, performance, and the area—or PPA. 12LP+ AutoPro150 excels in all three, offering a 16% boost in performance and slashing power consumption by 32% over our prior 12LP models. This puts it miles ahead of older 16nm technologies, packing more power into a smaller space with enhanced efficiency. Unleashing Performance with Precision Future-ready vehicles require compact, powerful semiconductors. Enter 12LP+ AutoPro150, with its logic Contacted Poly Pitch (CPP) of just 84nm—fine electrical paths for a more potent chip. “What’s a logic Contacted Poly Pitch?” you might wonder. It’s the measure of space between the transistors on a chip, determining how many can fit in a given area. The smaller the CPP, the more transistors we can pack in, and the more powerful the semiconductor. The Heart of Automotive Evolution: Efficiency It’s not just about miles per gallon; efficiency extends to the silicon that powers every electronic process in your vehicle. 12LP+ AutoPro150 marks a significant step toward sustainability, reducing power usage by up to 32% and improving overall vehicle performance. A History of Excellence and Innovation Our Malta, New York fab has dispatched more than 2 million wafers globally, embodying our relentless pursuit of innovation and dedication to quality. 12LP+ AutoPro150 builds on this heritage, robust enough to withstand the intense conditions of modern driving and GF’s long-standing mission to enhance automotive security and safety. Wiring the Future, Layer by Layer 12LP+ AutoPro150’s intricate multi-layer copper wiring facilitates swift, efficient data transfer, essential for enhanced autonomous driving and vehicle connectivity—akin to an urban grid designed for optimal traffic flow. Customization at its Core Offering four voltage threshold options, 12LP+ AutoPro150 tailors to the nuanced needs of various vehicles. This adaptability allows automakers to fine-tune system performance, whether it’s for a family SUV or a high-octane sports car, without complicating the manufacturing process. The Road Ahead For drivers, this translates to a vehicle that’s smarter, safer, and perfectly aligned with your lifestyle—transforming every journey with unparalleled technology, comfort, and efficiency. As we forge ahead, GF is excited to introduce several new features as part of this platform in the development pipeline: Ultra Low Leakage (ULL) – We are enhancing the digital logic and memory components of our semiconductors to ensure they perform optimally even in extreme automotive environments. This development is crucial for supporting connectivity functions that need to be continuously active, helping the modern vehicle transition into an always-connected, AI-enhanced platform. ZG 3.3V – This innovation involves the introduction of higher voltage devices that can manage a wider array of signals from complex automotive sensors. These sensors are vital for enhancing vehicle safety and responsiveness by providing more accurate real-time data. eMRAM – We are deploying a differentiated non-volatile memory (eMRAM) that offers high endurance, high density, and low power consumption. It is designed to meet the increased code and data storage needs of advanced microcontrollers used in cars, facilitating more sophisticated AI and machine learning applications. GF Customers will find these innovations particularly applicable in the design of: ADAS processors at the edge: These are crucial for features like automatic braking or lane-keeping, focusing on reliability while consuming less power. Digital Signal Processors: Enhancing the audio and infotainment systems inside your car, making your ride more enjoyable. High-Speed Connectivity devices: Essential for features that require fast data transfer, like downloading maps or streaming music. MRAM and ZG 3.3V technologies in 12LP+: Soon, these will help manage the car’s built-in sensors more effectively, improving performance and safety. The 12LP+ AutoPro150 platform is yet another milestone in GF’s journey to shape the future of the automotive. As cars increasingly resemble computers, our essential semiconductors are the heart—capable, efficient, and future-ready.
IMS 2025 June 15-20, 2025San Francisco, CA IMS is dedicated to all things microwaves and RF, including numerous sessions focused on GF technologies and solutions, developed under GF Labs. GF Technology Papers / Presentations Conference Session Technology Professor/Author University Title IMS We2H-4 22FDX Jinglong Xu, Mohamed Eleraky, Tzu-Yuan Huang, Chenhao Chu, Hua Wang ETH Zurich We2H-4: A Compact Doubly Neutralized Ku Band Power Amplifier with 39% Peak PAE and 23 dBm Output Power in 22FDX+ EDMOS for 6G FR3 IMS Th3F-3 22FDX Chenhao Chu, Jinglong Xu, Yuqi Liu, Jianping Zeng, Adam Wang, Takuma Torii, Shintaro SHINJO, Koji Yamanaka, Hua Wang ETH Zurich, Mitsubishi Electric Corp Th3F-3: AI-Assisted Template-Seeded Pixelated Design for Multi-Metal-Layer High-Coupling EM Structures: A Ku-Band 6G FR3 PA in 22nm FDX+ RFIC RTu4B-2 22FDX Vadim Issakov TU Braunschweig RTu4B-2: A 126–137GHz Regenerative Frequency Shifter in 22nm FDSOI RFIC Rtu4B-1 22FDX Vadim Issakov TU Braunschweig RTu4B-1: 110-to-140GHz Frequency Tripler with 13% Efficiency, 7.2dBm Psat Using Adaptive Biasing and 3rd Harmonic Boosting in 22nm FDSOI RFIC Rtu1C-5 22FDX Vadim Issakov TU Braunschweig RTu1C-5: Fully-Integrated Autonomous K-Band Complex Permittivity Sensor in 22nm FDSOI for Biomedical Body Parameter Monitoring Applications RFIC Rtu2A-5 HPSiGe Inchan Ju Ajou University RTu2A-5: A 5/6GHz Compact, Dual-Band, and Highly Linear Wi-Fi 6E SiGe HBT Power Amplifier Using Q-Modulated Switched Capacitor Interstage Matching Network and Optimized Output Stage RFIC RMo2C-3 22FDX Gabriel Rebeiz UCSD RMo2C-3: A Compact 25–32GHz Frequency Doubler with up to 32% Efficiency and >39 dBc Harmonic Rejection in 22nm FDSOI RFIC RMo4A-2 22FDX James Buckwalter UCSB RMo4A-2: A 110 to 122-GHz Four-Channel Oversampling Digital-to-Phase Transmitter for Scalable, Energy-Efficient Arrays RFIC RMo4A-3 HPSiGe Najme Ebrahimi Northeastern RMo4A-3: A 45Gb/s D-Band Hybrid Star-QAM-OOK Transmitter Using a Quad-Harmonic Modulator with Constant Impedance Balanced Architecture in 90nm SiGe BiCMOS RFIC RMo4B-2 22FDX Hua Wang ETHZ RMo4B-2: A 3.23dB Average NF and 2.32dB Minimum NF V-/E-Band Common-Gate/Common-Source Joint-Feeding LNA with Three-Line Coupler Input Matching for Simultaneous Noise/Power Matching RFIC RTu1A-1 45nm Ali Niknejad UC Berkeley RTu1A-1: A 10 to 40GHz Stacked Push-Pull Class-B Power Amplifier in 45-nm CMOS SOI with 20.4dBm PSAT and Continuously Supporting 72Gb/s 64-QAM and 10Gb/s 1024-QAM Signals RFIC RTu2B-2 22FDX Ken O UT Dallas RTu2B-2: 400-GHz Concurrent Transceiver Imaging Pixel with Improved Noise Performance and Increased Injection Locking Range RFIC RTu2C-2 45nm Harish Krishnaswamy Columbia RTu2C-2: Heterogeneous Integration of a 0.15µm GaN Circulator and a 45nm RF SOI Voltage-Boosted Clock Generation IC RFIC RTu3C-3 22FDX Sorin Voinigescu U of Toronto RTu3C-3: A 204GS/s 1-to-2 Analog Demultiplexer in 22nm FDSOI CMOS RFIC RTu4B-3 22FDX Omeed Momeni UC Davis RTu4B-3: A 200GHz Quasi-Circulator with a Widely Tunable Termination for >30dB Isolation and 8.3dB SNR Degradation in a 22nm FD SOI Process IMS Tu1B-1 HPSiGe Najme Ebrahimi Northeastern Tu1B-1: Double HOOK: A 140 GHz 15 Gb/s Reconfigurable 3-Level ASK Modulator with Constant Input Impedance for High-Speed Connectivity IMS Tu1C-4 22FDX Kamran Entesari Texas A&M Tu1C-4: A 22nm CMOS 15–25GHz Dual-Differential Driver for RF Silicon Photonic Front-End IMS Tu4B-2 8SW Gabriel Rebeiz UCSD Tu4B-2: A 2:1 Bandwidth 3–6GHz Dual-Polarized True-Time-Delay Based Reconfigurable Intelligent Surface (RIS) IMS Tu4C-4 22FDX Friedel Gerfers TU Berlin Tu4C-4: A Highly-Efficient 4.3GBaud Push-Pull LDMOS Based Pre-Driver with 6V Signal-Swing for GaN HEMTs in 22nm FDSOI IMS We2G-2 22FDX James Buckwalter UCSB We2G-2: A 110–130-GHz Frequency Quadrupler with 12.5% Drain Efficiency in 22-nm FD-SOI CMOS IMS We2H-4 22FDX Hua Wang ETHZ We2H-4: A Compact Doubly Neutralized Ku Band Power Amplifier with 39% Peak PAE and 23 dBm Output Power in 22FDX+ EDMOS for 6G FR3 IMS We3G-3 22FDX Frank Ellinger TU Dresden We3G-3: A 60GHz Super Harmonic Injection Locked Oscillator with Quadrature Outputs IMS Th1G-3 HPSiGe Sorin Voinigescu U of Toronto Th1G-3: A 132GHz SiGe BiCMOS Sampler for Linear Front-Ends IMS Th1G-4 22FDX Friedel Gerfers TU Berlin Th1G-4: A >22GS/s, 44dB SNDR Wideband 4×4 Time-Interleaved Sampling Front-End with Bulk-Driven Mismatch Calibration in 22nm FDSOI IMS IF1-7 12LP Robert Weigel FAU IF1-7: A TSPC mm-Wave Frequency Divider with up to 50GHz Input Frequency in 12nm FinFET Bulk CMOS IMS Th3D-3 HPSiGe Marco Spirito / Steffan Lehman TU Delft Th3D-3: Characterization Approaches to Reduce Process Variation Dependencies for On-Wafer Power Calibration Transfer Devices in Bi/CMOS Technologies IMS Th3F-3 22FDX Hua Wang ETHZ Th3F-3: AI-Assisted Template-Seeded Pixelated Design for Multi-Metal-Layer High-Coupling EM Structures: A Ku-Band 6G FR3 PA in 22nm FDX+ IMS Th3G-4: 45RFSOI Harish Krishnaswamy Columbia Th3G-4: A 140 GHz Low-Noise Amplifier in 45 nm RFSOI Based on a Joint-Noise-and-Gain-Optimized Embedding Network IMS Tu4D-3: 22FDX Vadim Issakov TU Braunschweig Tu4D-3: A Compact 8.2mW Complementary Current-Reusing D-Band Frequency Quadrupler in 22nm FDSOI CMOS IMS Tu4D-4 22FDX Vadim Issakov TU Braunschweig Tu4D-4: Comparison of Wideband Low-Power H-Band Frequency Doublers with and without a Driving Stage in 22nm FDSOI CMOS IMS We2B-1 HPSiGe Inchan Ju Ajou University We2B-1: A 22–30GHz Ultra Low RMS Phase Error SiGe HBT BiCMOS Active Vector Modulator Phase Shifter with a Tunable Two-Section Lumped Element Differential Quadrature Hybrid Generated by wpDataTables
GF’s Essential Chips Enable Sustainability June 5, 2024 By Brian RaleyDirector of Corporate Environmental, Health, and Safety and Sustainability, GlobalFoundries In celebration of World Environment Day, and as I think about how GlobalFoundries (GF) continues to lean into our commitment to sustainability, I am excited about the ways the essential chips we manufacture enable our customers to create devices and technologies necessary for building a more resource-efficient and sustainable future. GF’s announcement last month of new goals to achieve net zero greenhouse gas (GHG) emissions and 100% carbon-neutral power by 2050 is a critical step in our Journey to Zero Carbon and our role as a responsible corporate steward of the environment. These goals reflect the all-hands-on-deck effort needed at every level of society to combat climate change. The benefits of the essential chips we manufacture go beyond environmental sustainability. In addition to more energy-efficient devices and shaping technologies from electric vehicles to smart devices to datacenters, the essential chips we make are also key for enabling improved medical diagnostics, safety, and health and fitness across a range of technologies and devices. Let’s look at three of our end-markets: Automotive Automotive, our fastest growing end market in 2023, is a prime example of GF chips enabling a more sustainable future. I am inspired to imagine a new era of electric transportation driven by GF’s BCD and BCDLite® CMOS platforms delivering differentiated power efficiency and management to the battery systems critical for (hybrid) electric vehicles. Automotive radar is another area where GF’s technology solutions support human needs. Radar is the basis for safety features like adaptive cruise control, automatic emergency braking, blind-spot monitoring and other advanced driver-assistance system (ADAS) functions. Data Center As society demands more from AI and other data center services, we continue to see unprecedented energy demands to support these services. GF technology is addressing these massive energy demands in several ways. First, GF’s products are used across the full range of power delivery systems to improve the efficiency of the delivery of energy to run data centers. Additionally, GF’s Fotonix™ platform is enabling the fundamental shift of communication from electrons to photons, delivering higher data bandwidth that is not possible with conventional chips to enable large language AI models to run efficiently across multiple processors within a server or across multiple servers. Internet of Things (IoT) The IoT devices GF’s technology supports range from retail tags that improve supply chain functionality to health and fitness trackers helping people better understand their health metrics. One of the most impactful examples of this is enabling life-changing continuous glucose monitoring for people with diabetes, a condition which impacts more than 500 million people around the world. These are just a few ways in which GF-made chips are helping to build a healthier, safer and more sustainable world. Read more on this topic here or in the “Technology for Humanity” section of our 2023 Corporate Responsibility Report. We’ll have even more examples in our forthcoming 2024 Report. Brian Raley is the Director of Corporate Environmental, Health, and Safety and Sustainability at GlobalFoundries. Based in Malta, New York, Brian has been with GF since its founding in 2009. He has focused on sustainability efforts in the semiconductor industry for 29 years.
ElevATE Semiconductor and GlobalFoundries Partner on High-Voltage Chips for Commercial and National Security Applications June 5, 2024 Following demand from customers, collaboration will provide a new supply of chips on GF’s power efficient and feature-rich 7HV semiconductor platform SAN DIEGO and ESSEX JUNCTION, VT., June 5, 2024 — ElevATE Semiconductor and GlobalFoundries (Nasdaq: GFS) (GF) today announced a manufacturing partnership for high-voltage chips produced at GF’s facility in Essex Junction, Vermont. Designed by ElevATE and manufactured at scale by GF on its proven and power-efficient 7HV technology platform, the chips are vital to both commercial semiconductor testing equipment and critical applications for aerospace and defense systems. The agreement outlines GF’s supply of its 7HV chip technology to ElevATE and the marketplace. Manufactured on 200mm wafers at GF’s Vermont facility, the mature-node chips pair power management and wireless sensing capabilities, delivering the performance, design flexibility and power efficiency required by a range of electronics devices in national security systems. The 7HV platform is optimized for cost and performance, and offers a full suite of features and options with well-characterized design tools, as well as proven manufacturing reliability with robust yields. To meet the demands of commercial clients and the aerospace and defense industry, ElevATE and GF are collaborating to provide restart support and reestablish the production of 7HV chips. The renewed availability of the 7HV platform will save customers costs, time, and the challenge of redesigning their products using a different chip technology. The new supply will build upon the success of the millions of 7HV chips previously manufactured at GF’s Vermont facility. “This collaboration marks a significant transformation in ElevATE’s production strategy, transitioning its fabrication processes to GlobalFoundries,” said Anil Kodali, Vice President of Operations and Quality Assurance at ElevATE. “With GF as our manufacturing partner, we can be sure of a robust and reliable source of supply, enabling us to meet the escalating demands of our customers in terms of volume, quality and time-to-market.” “Our collaboration with ElevATE underscores GF’s commitment to ensuring the U.S. semiconductor and national security ecosystems have a reliable supply of secure, domestically manufactured chips,” said Nicholas Sergeant, vice president and head of the aerospace, defense and critical infrastructure business at GF. “As the leading supplier of essential chips for the U.S. aerospace and defense industry and a longstanding partner to the Department of Defense, GF goes above and beyond to ensure our national security customers have the chips they need, manufactured where they want them, with the right level of security.” GF’s facility in Essex Junction, Vermont, near Burlington, was among the first major semiconductor manufacturing sites in the United States. Today, around 1,800 GF employees work at the site. Built on GF’s differentiated technologies, these GF-made chips are used in smartphones, automobiles, and communications infrastructure applications around the world. The facility is a DMEA-accredited Trusted Foundry and manufactures secure chips in partnership with the U.S. government. Read more about GF’s aerospace, defense and critical infrastructure offerings at: https://gf.com/markets/aerospace-and-defense/ About ElevATE Semiconductor ElevATE Semiconductor is a leader in the global semiconductor manufacturing industry, offering cutting-edge semiconductor test and ATE solutions. The company is committed to supporting the semiconductor and system test community by providing advanced integrated circuits (ICs) that address the complex challenges of ATE. With a focus on designing efficient, high-density solutions, ElevATE Semiconductor aims to reduce the overall cost of testing for its customers, both now and in the future. Visit www.elevatesemi.com. About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers. GF is redefining innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. GF offers a unique mix of design, development, and fabrication services. With a talented and diverse workforce and an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its worldwide customers. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-looking Information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contacts: ElevATE Semiconductor Tim Bakken, Vice President of Global Sales [email protected] GlobalFoundries Michael Mullaney [email protected]
GlobalFoundries Recognized on USA Today’s “America’s Climate Leaders 2024” List May 30, 2024 MALTA, N.Y., May 30, 2024 — GlobalFoundries (Nasdaq: GFS) (GF) has been named to USA Today’s “America’s Climate Leaders 2024” list. GF’s inclusion on the list, announced today and viewable here, is the latest recognition of the company’s longstanding commitment to sustainability and corporate responsibility. “Our team works every day to find new efficiencies and innovate new ways to minimize our impact on the environment. It’s fundamental to who we are as a company,” said Brian Raley, director of sustainability at GF. “We are proud to have our efforts recognized by USA Today and to be included on its list of ‘America’s Climate Leaders 2024.’” The “America’s Climate Leaders 2024” list is based on independent research and analysis of submitted and publicly available information, including data from the Carbon Disclosure Project and independent reports. The final list recognizes 450 companies across multiple industries. Last month, GF announced it was furthering its commitment to sustainable operations and fighting climate change with new long-term goals to achieve net-zero greenhouse gas emissions and 100% carbon-neutral power by 2050. Aligned with Paris Agreement goals, GF’s new goals build upon the company’s Journey to Zero Carbon pledge in 2021 to reduce its greenhouse gas emissions by 25% from 2020 to 2030, even as the company continues to expand its global manufacturing capacity. GF is on track to meet this 25% reduction goal by 2030. Other recent recognitions of GF’s sustainability and corporate responsibility efforts include being named to Morningstar Sustainalytics’ “2024 Top-Rated ESG Companies,” maintaining a “Prime” corporate ESG performance rating in 2023 from ISS and being named to Newsweek’s 2023 and 2024 lists of “America’s Most Responsible Companies.” Learn more about sustainability and corporate responsibility at GF and see a full list of the company’s sustainability awards and recognitions at: https://gf.com/about-us/corporate-responsibility About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers. GF is redefining innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. GF offers a unique mix of design, development, and fabrication services. With a talented and diverse workforce and an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its worldwide customers. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-looking Information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contact: GlobalFoundriesMichael Mullaney[email protected]
GlobalFoundries Announces Pricing of $950 Million Secondary Offering of Ordinary Shares, Including Concurrent $200 Million Share Repurchase May 22, 2024 MALTA, NY, May 22, 2024 – GlobalFoundries Inc. (“GlobalFoundries” or “GF”) (Nasdaq: GFS), today announced the pricing of a secondary public offering of $950 million of its ordinary shares at a price to the public of $50.75 per share (including a $200 million share repurchase, as described below). All of the shares in the offering are being offered by Mubadala Technology Investment Company (the “Selling Shareholder”). The Selling Shareholder is a wholly owned subsidiary of Mubadala Investment Company PJSC (which, together with its affiliates, is GlobalFoundries’ largest shareholder). The Selling Shareholder has also granted the underwriters a 30-day option to purchase up to an additional $112.5 million of GlobalFoundries’ ordinary shares (equal to 15% of the initial ordinary shares being sold to the public) at the public offering price minus underwriting discounts and commissions. The offering is expected to close on May 28, 2024, subject to customary closing conditions. GlobalFoundries is not selling any ordinary shares in the offering and will not receive any proceeds from the sale of the shares being offered by the Selling Shareholder. GlobalFoundries has agreed to concurrently repurchase from the underwriters $200 million of the Selling Shareholder’s ordinary shares that are subject to the offering at a price per share equal to the public offering price for the offering (the “Share Repurchase”). GlobalFoundries intends to fund the Share Repurchase with cash on its balance sheet. GlobalFoundries expects the closing of the Share Repurchase to occur substantially simultaneously with the closing of the offering. The closing of the Share Repurchase is conditioned on the closing of the offering. The closing of the offering is not conditioned on the closing of the Share Repurchase. The underwriters are not receiving any discount or commission with respect to the ordinary shares being repurchased by GlobalFoundries pursuant to the Share Repurchase. Morgan Stanley & Co. LLC and BofA Securities are acting as book-running managers for the offering. Citigroup, Goldman Sachs & Co. LLC and J.P. Morgan are acting as active book-running managers for the offering. Deutsche Bank Securities, Evercore ISI and HSBC Securities (USA) Inc. are acting as additional book-running managers for the offering. Baird, Needham & Company, Raymond James, Wedbush Securities, Drexel Hamilton and Siebert Williams Shank are acting as co-managers for the offering. The offering of these securities is being made only by means of a prospectus. A registration statement relating to these securities has been filed with the Securities and Exchange Commission (the “SEC”) and has become effective. A preliminary prospectus supplement and accompanying prospectus relating to the offering has been filed, and a final prospectus supplement and accompanying prospectus relating to the offering will be filed with the SEC. Copies of the final prospectus supplement and the accompanying prospectus relating to this offering may be obtained from: Morgan Stanley & Co. LLC, Attention: Prospectus Department, 180 Varick Street, 2nd Floor, New York, NY 10014, or by email at [email protected]; BofA Securities, Attention: Prospectus Department, NC1-022-02-25, 201 North Tryon Street, Charlotte, NC 28255-0001, or by email at [email protected]; or by accessing the SEC’s website at www.sec.gov. This press release shall not constitute an offer to sell or the solicitation of an offer to buy any securities, nor shall there be any sale of these securities in any state or jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such state or jurisdiction. About GlobalFoundries GlobalFoundries® (GF®) is one of the world’s leading semiconductor manufacturers. GF is redefining innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. GF offers a unique mix of design, development and fabrication services. With a talented and diverse workforce and an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its worldwide customers. GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners. Forward-Looking Statements This press release includes “forward-looking statements” that reflect our current expectations and views of future events. These forward-looking statements are made under the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995 and include but are not limited to, statements regarding the expected completion of the offering and the Share Repurchase. These statements are based on current expectations, assumptions, estimates, forecasts, projections and limited information available at the time they are made. Words such as “expect,” “anticipate,” “should,” “believe,” “hope,” “target,” “project,” “goals,” “estimate,” “potential,” “predict,” “may,” “will,” “might,” “could,” “intend,” “shall,” “outlook,” “on track,” and variations of these terms or the negative of these terms and similar expressions are intended to identify these forward-looking statements, although not all forward-looking statements contain these identifying words. Forward-looking statements are subject to a broad variety of risks and uncertainties, both known and unknown including regarding market conditions, our business and the Selling Shareholder. Any inaccuracy in our assumptions and estimates could affect the realization of the expectations or forecasts in these forward-looking statements. Recipients are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date such statements are made and should not be construed as statements of fact. Except to the extent required by federal securities laws, we undertake no obligation to update any information or any forward-looking statements as a result of new information, subsequent events, or any other circumstances after the date hereof, or to reflect the occurrence of unanticipated events. For a discussion of potential risks and uncertainties, please refer to the risk factors and cautionary statements in our 2023 Annual Report on Form 20-F, current reports on Form 6-K and other reports filed with the Securities and Exchange Commission. Copies of our SEC filings are available on our Investor Relations website, investors.gf.com, or from the SEC website, www.sec.gov. Investor Contact:[email protected] Media Contact:[email protected]
