Flex Logix EFLX eFPGA In Design For GLOBALFOUNDRIES 22FDX

Enables customers to design power-sensitive applications to take advantage of embedded FPGA (eFPGA) reconfigurability for IoT, MCUs and mixed signal devices

U.S. Department of Defense Partners with GlobalFoundries to Manufacture Secure Chips at Fab 8 in Upstate New York

Now fully ITAR compliant, GF’s most advanced manufacturing facility will produce semiconductor solutions for the nation’s most sensitive defense and aerospace applications

Malta, N.Y., February 15, 2021 – GlobalFoundries® (GF®), the world’s leading specialty foundry, today announced a strategic partnership with the U.S. Department of Defense (DoD) to provide a secure and reliable supply of semiconductor solutions manufactured at GF’s Fab 8 in Malta, New York — the company’s most advanced semiconductor manufacturing facility. These semiconductor chips will be used in some of the DoD’s most sensitive applications for land, air, sea, and space systems.

Under the agreement, GF will provide a supply of chips built at Fab 8 on its differentiated 45nm SOI platform. The agreement is made possible by Fab 8’s compliance with U.S. International Traffic in Arms Regulations (ITAR) and highly restrictive Export Control Classification Numbers under the Export Administration Regulations (EAR). 

The new supply agreement builds upon the longstanding partnership between the DoD and GF to provide chips for defense, aerospace, and other sensitive applications. GF currently supplies the DoD with chips manufactured at GF’s other on-shore facilities, Fab 10 in East Fishkill, New York, and Fab 9 in Burlington, Vermont.

“GLOBALFOUNDRIES is a critical part of a domestic semiconductor manufacturing industry that is a requirement for our national security and economic competitiveness,” said Senate Majority Leader Chuck Schumer, who successfully passed new federal semiconductor manufacturing incentives in last year’s National Defense Authorization Act (NDAA). “I have long advocated for GLOBALFOUNDRIES as a key supplier of chips to our military and intelligence community, including pressing the new Secretary of Defense, Lloyd Austin, to further expand the Department of Defense’s business with GLOBALFOUNDRIES, which will help expand their manufacturing operations and create even more jobs in Malta.”

In a supporting statement from the U.S. Department of Defense, “This agreement with GLOBALFOUNDRIES is just one step the Department of Defense is taking to ensure the U.S. sustains the microelectronics manufacturing capability necessary for national and economic security. This is a pre-cursor to major efforts contemplated by the recently passed CHIPS for America Act, championed by Senator Charles Schumer, which will allow for the sustainment and on-shoring of U.S. microelectronics capability.” 

“GLOBALFOUNDRIES thanks Senator Schumer for his leadership, his ongoing support of our industry, and his forward-looking perspective on the semiconductor supply chain,” said Tom Caulfield, CEO of GF. “We are proud to strengthen our longstanding partnership with the U.S. government, and extend this collaboration to produce a new supply of these important chips at our most advanced facility, Fab 8, in upstate New York. We are taking action and doing our part to ensure America has the manufacturing capability it needs, to meet the growing demand for U.S. made, advanced semiconductor chips for the nation’s most sensitive defense and aerospace applications.”

The first chips from this new agreement are targeted to begin delivery in 2023. GF is in ongoing discussions with the DoD regarding Trusted Accreditation for Fab 8.

GF employs nearly 3,000 people at Fab 8, and has invested more than $13 billion in the facility. The company recently announced a land purchase option to provide additional flexibility to expand Fab 8’s footprint to support growing demand from the U.S. government and industry customers. In total, GF employs more than 7,000 people across the U.S., and over the past 10 years has invested $15 billion in U.S. semiconductor development.

About GF

GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its customers to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

Contact

Michael Mullaney 
+1-518-419-2199
[email protected]

格芯技术之年:2020年十佳报道

撰文:Michael Mullaney

今年,格芯®(GLOBALFOUNDRIES®)分享了许多科技新闻。值此挥别2020年之际,我们汇总了格芯年度最佳技术报道。

从开拓人工智能(AI)和物联网(IoT)技术领域,到加快汽车半导体的发展,再到利用硅光技术发挥光速传输的优势,格芯今年为行业带来了一系列变革,继续引领改变我们的世界。

10. PDK倍受瞩目

Wafer汽车、航空、智能手机和其他应用领域的计算机芯片必须保持超高的可靠性,提供符合预期的性能。要开发和制造符合要求的芯片,就必须能够精确地对设计进行建模、仿真和验证。对此,工艺设计套件(PDK)可助一臂之力。

本不起眼的PDK在2020年一跃成为倍受瞩目的焦点。我们的博客文章《PDK:实现硅晶设计一次性成功的关键要素》阐述了格芯PDK如何帮助客户基于我们的22FDX™、12LP以及其他众多差异化平台来有效创建设计。

2020年,我们还宣布了对格芯PDK进行的一些新的改进和增强。其中一项是宣布我们的22FDX平台将支持基于Open-Access的可互操作PDK(也称为iPDK)。随着22FDX平台能够支持iPDK,我们为客户提供了更高的灵活性,方便客户选用心仪的设计套件工具。有关PDK的另外一项重大举措是格芯与生态系统合作伙伴Mentor开展合作,为12LP+解决方案的PDK增加机器学习增强功能

9. 2020 GTC线上会议举行

格芯的标志性年度系列活动,即全球技术大会(GTC),今年以线上方式举行。此次线上大会吸引了数千名与会者,还有将近125名演讲嘉宾,其中包括一些知名的行业前瞻者、领导者和技术专家,他们分享了有关5G、人工智能、物联网和其他主题的见解和观点,对于格芯和半导体行业而言,GTC大会都取得了丰硕成果。

今年的GTC是在线上会议中心举行的。当然,线上会议与面对面会议仍然有所不同,但它提供的沉浸式环境实现了丰富的交互和通信功能。我们收到了与会者的正面反馈,他们对100多场讨论会和线上场景给予了高度评价。

点击此处阅读顶级技术分析师Patrick Moorhead的2020年GTC北美会议回顾。

8. 格芯启动盾牌计划

众所周知,半导体产品的信息安全是一个非常敏感的话题,而在保护涉及到客户专有知识产权及产品的信息方面,格芯一直深受客户信赖。 

今年,我们启动了格芯盾牌计划。这个全面的平台充分利用了格芯多年来积累的丰富经验,包括为美国政府、国防、航空航天行业制造安全的半导体解决方案,以及根据国际通用标准制造符合要求的产品。 

格芯盾牌计划将为我们的所有客户提供世界一流的安全功能。从启动会议到开发、设计、制造、交付甚至废料处理,在所有这些环节中,格芯盾牌计划都能确保客户的产品和敏感信息的安全。点击此处阅读有关格芯盾牌计划的更多信息。

7. 5G芯片业务强势增长

Person on Phone大众所喜爱的智能手机特性,包括可靠的连接、优良的音质、清晰的显示等,很多都是通过格芯芯片实现的。移动性和5G始终是我们关注的焦点,今年也不例外。正如格芯的Bami Bastani博士所说:“ 

当今市场上每十部智能手机中就有八部采用了格芯制造的芯片,随着行业向5G演进,对我们的差异化射频解决方案的需求会持续飙升……如果没有格芯和我们业界领先的专业射频解决方案,5G革新将无法实现。”

2020年,我们在博客中提到格芯是全世界唯一具有内部毫米波测试的晶圆厂,另外还阐述了我们的各种后端交钥匙服务如何帮助客户更快速、更经济高效地将产品推向市场,从而加快5G时代的到来。 

我们还非常荣幸地宣布推出22FDX+,它是我们的下一代FDX平台,旨在满足互联设备对更高性能和超低功耗的日益增长的需求。22FDX RF+将是首个在22FDX+平台上推出的专业解决方案,它经过优化,可提升5G智能手机的前端模块(FEM)设计的性能。

请观看格芯首席执行官Tom Caulfield与5G客户Anokiwave的首席执行官Robert Donahue的对话。

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6. 加快AutoPro解决方案的应用

2018年,每辆中型汽车中平均包含价值410美元的半导体产品。到2030年,这一数字预期将达到每辆汽车大约1,100美元。格芯在支撑和加快汽车半导体产品增长方面独具优势,这要归功于我们在汽车领域具备的丰富经验和专业知识,以及22FDX平台的优良性能和可靠性。

格芯推动了车用半导体器件的增长,我们的博客文章《格芯的AutoPro™解决方案推动汽车电子向前发展》详细阐述了我们丰富多样的差异化解决方案和AutoPro解决方案服务包如何满足汽车的所有技术、封装/测试、采购和质量要求。

格芯的Michael Brucker表示:

“AutoPro让我们能够通过集成的方式,从我们组织的所有相关领域获取资源,以确保设计具有足够强大的功能和可靠性,能够在要求的时间期限内生产,制造出高质量的部件。”如果不能做到,我们将依托为汽车客户服务十余年的经验,与客户合作来改变不利的现状。”

5. 提升人工智能的智能化水平

AI Brain2020年,在所有的行业和技术领域,人工智能的应用范围、复杂性和良好前景都成为倍受瞩目的焦点。正如我们在博客文章《人工智能处理器功耗降低带来的挑战与机遇》中概述的那样,人工智能的功耗要求对于它未来的发展至关重要。

格芯秉持“构建更智能而非只是更小的芯片”的理念,主动应对这种挑战和机遇。The Linley Group在题为《构建更好的AI芯片》的白皮书中阐述了这一战略。在我们七月的案例中,这一战略也体现得非常明显,我们宣布新型AI芯片在合作创新中心Imec开发成功,该芯片基于22FDX平台构建,采用具有良好前景的新架构,展现出令人惊叹的能效。 

今年,我们在AI领域的最重大新闻是宣布格芯的12LP+解决方案已完成技术认证,准备投入生产作为格芯最先进的FinFET解决方案,12LP+针对AI加速器应用进行了优化,基于成功的12LP平台构建。 

格芯的范彦明(Amir Faintuch)对此作了精辟的总结:

“人工智能正成为我们一生中最具颠覆性的技术……越来越清楚的是,AI系统的能效,也就是每瓦特功率可进行的运算次数,将成为公司投资数据中心或边缘AI应用时的关键考虑因素。” 

范彦明表示,我们的新型12LP+解决方案就直面这一挑战,以AI为出发点,并经过了优化。

4. 物联网继续突破界限

IoT City很多人可能并未意识到我们在日常生活中有多么依赖物联网(IoT)。你是否曾向智能扬声器询问天气情况?或者通过智能摄像头查看谁在家门口?或许你曾使用 App 控制的恒温器来调节供热?使用智能腕带来检查心率?如果你曾有过以上体验,那么物联网已与你密不可分。

格芯实现了物联网设备的连接,利用我们在射频、5G和人工智能领域的专业知识,让物联网设备更高效地处理数据,而无需耗费电能将数据发送至网络,从而帮助延长它们的电池续航时间。

我们的22FDX平台提供出色的性能和超低功耗,非常适合物联网应用。(该平台刚推出了下一代产品22FDX+,将让格芯在未来保持物联网领域的领先地位。)2020年,我们宣布两种基于22FDX平台构建的令人兴奋的新物联网应用问世。 

首先,格芯与Movano Inc.开展合作,推动Movano的可穿戴式无创连续血糖监测仪的商用,该产品目前正在开发中。此外,GreenWaves Technologies发布了新型可穿戴音频设备平台,该平台实现了众多先进功能,例如场景感知的主动降噪功能和基于神经网络的降噪功能。

在有关22FDX的独特自适应体功能的另一个案例中,格芯IoT/AI客户Perceive的首席执行官Steve Tieg说道:

“格芯22FDX平台拥有大量的功率,具备功率优势、低泄漏和自适应体偏置功能,非常适合我们这样的物联网应用。”

有关此主题的更多信息,请观看本系列视频,聆听Tieg与格芯的Mike Hogan的对话。

3. 科技企业回报社会

今年,全社会遭遇了前所未有的挑战,科技和半导体行业齐心协力,在社区中发挥切实有效的积极影响。

通过GlobalGives计划,格芯为最需要防护的人群捐赠了至关重要的口罩、手套和其他个人防护设备。在全球范围内,格芯在我们的社区中捐赠了超过130,000个口罩。在美国,我们员工发起的口罩捐赠计划满足了超过1,750个请求,将85,000个口罩发给医护工作者、急救人员以及其他高风险人员。我们的8号晶圆厂物流团队为此次捐赠活动做出了重大贡献。

另外,格芯公司捐款160万美元,格芯员工也合计捐款500,000美元,提供给11家格芯工厂当地的慈善机构。其中大多数慈善机构都是本地/地区慈善机构,经过我们员工的专门挑选,能够真正在本地社区中产生影响。

为了在这场疫情中保持高昂的精神状态,一群格芯员工创作并表演了以下这首歌曲,与全球各地的同事共勉。

 

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2. 矢志创新

创新对半导体行业的重要意义无论如何强调都不为过。对于不同的公司,创新可能有着不同的含义。对于格芯而言,创新意味着制造更智能的芯片,提供丰富的功能,针对特定应用进行优化,尽可能提高能效。正如格芯公司首席执行官Tom Caulfield在GTC 2020会议上所说,我们正在全力推动加快正在进行的数字化转型:

“格芯一直以来都致力于构建创新解决方案,使能耗曲线趋平,并显著降低数字化基础设施的功耗……我们正在重新定义创新的前沿。”

在格芯公司内部,我们倡导鼓励创新和创造性的企业文化。我们的博客文章《“发明大师”推动格芯的创新和差异化发展》深入探讨了格芯发明大师计划的重要性和影响。通过该计划,格芯为一些经过遴选的同事授予了“发明大师”荣誉头衔,这些员工至少拥有20项美国授权专利,并且在技术成就和知识产权资产创造方面拥有出色的过往记录。截至目前,已有50名以上的格芯工程师被授予“发明大师”荣誉头衔。

6G Logo格芯开展创新的另一种方式是与全球众多领先学术研究机构进行合作。 

通过“大学合作计划”,格芯受益于学术研究人员和试验人员的丰富专业知识,同时也为研究人员提供实现创新设计所需的技术。我们在博客文章《格芯携手领先研究机构共同推动6G技术研发》中介绍了有关6G技术研发的内容。

1. 专业化成为主流

我们在今年宣布了许多令人振奋的消息,而要缩小范围,专注于我们精心选择的领域,这对我们是一大挑战。下面我们快速浏览一下今年的几则好消息: 

格芯已悄然进入硅光制造业“通过战略性收购……和富有成效的合作……格芯很快成为硅光领域的生力军。目前,硅光产品已占据晶圆厂业务10%的份额——如果继续以这样的速度发展下去,硅光产品将成为一股不可忽视的力量。”

22FDX平台大获成功“迄今为止,格芯的22FDX平台已经实现了45亿美元的设计创收,向全球客户交付了超过3.5亿枚芯片。”

28HV解决方案加速奠定格芯在移动设备OLED显示驱动器领域的领导地位“格芯28HV解决方案已向领先智能手机供应商供货超过7500万单元,其经过优化的性能可实现更加快速、明亮、清晰、节能的OLED显示屏。”

55 BCDLite解决方案帮助格芯进一步巩固在移动设备音频放大器领域的领先地位“格芯55 BCDLite解决方案的出货量超过30亿单位,目前市场上7款领先的高端智能手机中就有5款采用了该解决方案。”

格芯面向IoT和汽车应用推出业界首款基于22FDX平台且可投入生产的eMRAM“格芯的eMRAM帮助设计人员扩展现有物联网和微控制器单元架构,以实现28nm以下技术节点的功率和密度优势。”

A Year of GF Tech: Top 10 Stories from 2020

By Michael Mullaney

10. PDKs Get the Spotlight

Computer chips in automotive, aviation, smartphones, and other applications must be unquestionably reliable and perform exactly as expected. Developing and manufacturing these chips requires the ability to accurately model, simulate, and verify their designs. The process design kit (PDK) makes this possible.

Wafer

The humble PDK found itself in the spotlight in 2020. Our blog post, PDKs: Powerful Enablers of First-Pass Silicon Success tells the story of how GF PDKs help our customers effectively create designs on 22FDX™, 12LP, and our many other differentiated platforms.

In 2020, we also announced some new ways in which we’re improving and enhancing GF PDKs. One is launching support of Open-Access based Interoperable PDKs, or iPDKs, for our 22FDX platform. Expanding our support to iPDK provides customers greater flexibility to use the design suite tools of their choice. Another great story highlighting PDKs was working with our ecosystem partner Mentor to add machine learning enhancements to the PDK of our 12LP+ solution.

9. GTC 2020 Goes Virtual

GTC 2020 Logo Design

GF’s signature annual series of events, the Global Technology Conference (GTC), went virtual this year. With thousands of attendees, and nearly 125 guest speakers – including renowned visionaries, leaders, and technologists – sharing their unique insight and perspective on 5G, AI, IoT, and other topics, GTC was a big win for GF and for the semiconductor industry.

This year’s GTC was held in a virtual conference center. While of course not the same as a face-to-face conference, the immersive environment allowed for rich interaction and communications. We received great feedback from attendees both on the content of our 100+ sessions, as well as the virtual setting.

Click here to read top technology analyst Patrick Moorhead’s recap of GTC 2020 North America.

8. GF Raises a SHIELD

GFShield

It’s no secret that semiconductors are highly sensitive, and GF is trusted every day with information regarding our customers’ proprietary intellectual property and products. 

This year, we launched GF SHIELD. The comprehensive platform embraces GF’s years of experience manufacturing the world’s most secure semiconductor solutions for the U.S government, the defense and aerospace industry, as well as manufacturing in accordance with the international Common Criteria standard. 

GF SHIELD extends these world-class security capabilities to all of our customers. From the initial meeting, through development, design, fabrication, delivery, and even disposal of scrap – and every step between – GF SHIELD is in place to ensure a customer’s products and sensitive information remain secure. Click here to read more about GFShield.

7. 5G Gets a Boost

Man on phone in the park

So much of what you love about your smartphone – reliable connectivity, great sound, sharp display, and more – is enabled by GF silicon. Mobility and 5G are always on our minds and this year was no exception. As our very own Dr. Bami Bastani said: 

“Eight out of ten smartphones on the market today include GLOBALFOUNDRIES manufactured silicon, and the demand for our differentiated RF solutions continues to skyrocket as the industry transitions to 5G … The 5G revolution would not be possible without GLOBALFOUNDRIES and our industry-leading specialty RF solutions.”

In 2020, we blogged about GF being the world’s only foundry with in-house mmWave testing capabilities, and how this and other post-fab turnkey services are accelerating 5G by helping customers bring their products to market faster and more cost-effectively. 

We were also excited to announce the arrival of 22FDX+, the next generation of our best-in-class FDX platform, to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices. The first specialty solution to be available on the 22FDX+ platform will 22FDX RF+, optimized to boost the performance of front-end-module (FEM) designs for 5G smartphones.

Check out this video of GF CEO Tom Caulfield having a conversation with Robert Donahue, CEO of 5G customer Anokiwave.

6. Accelerating AutoPro

In 2018, mid-sized cars contained an average $410 worth of semiconductors. By 2030, that figure is forecast to be nearly $1,100 per car. GF is uniquely positioned to support and accelerate this growth, thanks to our rich experience and expertise in the auto space, and the peerless performance and flexibility of our 22FDX platform.

We are pedal-to-the-metal on auto at GF, and our blog post, GF’s AutoPro™ Solutions Drive Automotive Electronics Forward, details how our broad portfolio of differentiated solutions and our AutoPro Solutions service package uniquely support all automotive technical, packaging/testing, sourcing and quality requirements.

A car speeding down the road

Said GF’s Michael Brucker:

“AutoPro enables us to pull resources from every relevant area of our organization in an integrated fashion to ensure that the design is capable and robust enough for the intended use, producible on the required timeline, and that it will lead to a quality part. If not, we work with the customer to change it, based on our decade-plus experience serving automotive customers.”

5. Making AI Smarter

Across all industries and technologies, the scope, complexity, and promise of artificial intelligence, or AI, increasingly came into focus in 2020. As outlined in our blog post, The Challenge and Opportunity of Reducing Power on AI Processors, the power requirement of AI is central to shaping its future.

AI Picture of data coming out of head

GF has embraced this challenge as an opportunity, with the credo “build smarter, not smaller chips.” This strategy was captured in a white paper by The Linley Group, titled Building Better AI Chips. It was also evident in our July story announcing a new AI chip created in partnership innovation hub Imec, built on 22FDX using a promising new architecture, which demonstrates incredible power efficiency. 

Arguably our biggest AI story of the year was the announcement that GF’s 12LP+ solution completed technology qualification is ready for production. GF’s most advanced FinFET solution, 12LP+ is optimized for AI accelerator applications, and builds upon our successful 12LP platform. 

GF’s own Amir Faintuch sums it up artfully:

“Artificial intelligence is on a trajectory to become the most disruptive technology of our lifetime … It is increasingly clear that the power efficiency of AI systems – in particular how many operations you can wrest from a watt of power – will be among the most critical factors a company considers when deciding to invest in data centers or edge AI applications.” 

Our new 12LP+ solution, Faintuch said, tackles this challenge head-on and is optimized, “obsessively so,” with AI in mind.

4. IoT Continue to Push the Edge

Many of us may not realize how much we rely on the Internet of Things, or IoT, on a daily basis. Have you ever asked your smart speaker about the weather? Or checked who was at your front door with your smart camera? Maybe adjusted the heat with your app-controlled thermostat, or checked your heart rate with your smart wristband? Then you’re connected with the IoT.

GF enables the connectivity of IoT devices and our expertise in RF, 5G and AI helps improve the battery life of IoT devices, by allowing them to process data efficiently, without the need for spending power to send that data to a network or the web. 

Picture of a smart city

Our 22FDX platform, with its incredible performance and ultralow power requirements, is perfectly suited for IoT application. (Its just-announced successor, 22FDX+, will extend this IoT leadership far into the future.) In 2020, we announced two exciting new IoT applications built on 22FDX. 

First, GF is partnering with Movano Inc. to advance the commercialization of Movano’s wearable, non-invasive continuous glucose monitor, which is currently in development. Additionally, GreenWaves Technologies announced its new hearables platform, which enables state-of-the-art features such as scene-aware active noise cancellation and neural network-based noise reduction.

In another story about 22FDX’s unique Adaptive Body feature, Steve Tieg, CEO of GF IoT/AI customer Perceive, said:

“GF’s 22FDX platform has a tremendous amount of horsepower, and its power advantages, low leakage, and adaptive body bias feature make it an excellent choice for IoT applications like ours.”

For more on this topic, check out this series of videos for a great conversation with Tieg and GF’s own Mike Hogan.

3. Tech Giving Back

GlobalGives logo

This year, with all of its unprecedented challenges, also saw the tech and semiconductor industry come together to make real impacts in their communities.

Through our GlobalGives initiative, GF donated critical masks, gloves, and other personal protection equipment to those who needed it most. Globally, GF donated more than 130,000 facemasks in our communities. In the U.S., our employee-driven facemask donation program fulfilled more than 1,750 requests, shipping out 85,000 masks to health care workers, first responders, and other high-risk individuals. Our tremendous Fab 8 logistics team went above and beyond to make this possible.

GF also gave $1.6 million in corporate donations, plus an additional $500,000 contributed by employees, to 27 charities across 11 GF sites. Most of these charities were local/regional, and chosen specifically by our employees for making an impact in the local community.

To keep spirits high amidst the pandemic, a group of GF employees wrote and performed this song to share with colleagues around the world.

2. Innovating Ahead

It is impossible to overstate the importance of innovation to our industry. While innovation may mean different things to different companies, for GF it means making smarter chips with rich features, optimized for specific applications, and as power-efficient as possible. As our CEO Tom Caulfield said at our GTC 2020 event, this is all on the path to accelerating the digital transformation that is already underway:

“GF has focused our entire company on building a number of innovative solutions that can flatten the curve and significantly lower the power consumption of the digital infrastructure … We are redefining the leading-edge of innovation.”

Within GF, we promote a culture of innovation and inventiveness. Our blog post, “Master Inventors” Driving Innovation and Differentiation at GLOBALFOUNDRIES, dives deep into the importance and impact of our Master Inventor program. Through the program, GF bestows the coveted title of Master Inventor upon a select colleagues with at least 20 issued U.S. patents and who have a demonstrated track record of technical accomplishments and IP asset creation. To date, more than 50 GF employees have been honored with the title Master Inventor.

6G Logo

Another way GF innovates is by collaborating with many of the world’s leading academic researchers. 

Through our University Partnership Program, GF benefits from the expertise of these thinkers and experimentalists, while providing them with access to our technology to demonstrate innovative designs. Read about some of our R&D on 6G technology in the blog post, GF Partners with Leading Researchers on 6G Technologies.

1. Specialty Goes Mainstream

With so many exciting announcements this year, it’s been a challenge to narrow them down into a curated selection. Here are a few final quick-hit pieces of good news: 

GlobalFoundries Has Quietly Become A Player In Silicon Photonics Manufacturing: “Through strategic acquisitions … and fruitful partnerships … GlobalFoundries quietly became a force in silicon photonics. It’s already captured 10% of the foundry business—if it continues at this rate, it will soon be impossible to overlook.”

22FDX For the Win: “To date, GF’s 22FDX platform has realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world.”

28HV Solution Accelerates GF Leadership in OLED Display Drivers for Mobile Devices: “With more than 75 million units shipped to leading smartphone suppliers, GF’s 28HV solution is optimized to enable faster, brighter, sharper, and more power-efficient OLED displays.”

55 BCDLite Solution Positions GF for Continued Leadership in Audio Amplifiers for Mobile Devices: “With more than 3 billion units shipped, GF’s 55 BCDLite solution is featured in five of seven of today’s leading top-tier premium smartphones.”

GLOBALFOUNDRIES Delivers Industry’s First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications: “GF’s eMRAM allows designers to extend their existing IoT and microcontroller unit architectures to access the power and density benefits of technology nodes below 28nm.”

Picture of a blue circuit board

Ayar Labs Demonstrates First Ultra-Dense Optical Interconnect Solution on GLOBALFOUNDRIES’ Next Generation Silicon Photonics Manufacturing Process

Collaborative partnership accelerates commercialization of in-package optical I/O for applications in artificial Intelligence, cloud architectures, aerospace and 5G communications. Company launches 2021 sampling program

Mentor: GLOBALFOUNDRIES and Mentor Launch a New Innovative DRC+ Hotspot Solution using Machine Learning in Calibre

By Shelly Stalnaker

I recently had the chance to attend an on-demand webinar introducing the new GLOBALFOUNDRIES DRC+ hotspot solution that incorporates machine learning in the Calibre toolsuite. Presented by Sriram Madhavan (GLOBALFOUNDRIES) and Michael White (Mentor, a Siemens Business), the webinar walks through the new DRC+ DFM solution, and explains how the addition of machine learning expands and improves both the capabilities and results.

Click here to read the full blog post, on the site of our ecosystem partner Mentor.

GF Partners with Leading Researchers on 6G Technologies

Through its University Partnership Program, GF benefits from the expertise of academic researchers while providing them with access to the technology to demonstrate innovative designs

by Gary Dagastine

It may seem premature to talk about 6G wireless communications just as 5G technology is beginning to be deployed in earnest, but the R&D community is already hard at work investigating the technologies needed to make 6G a practical and commercial reality later this decade.

GLOBALFOUNDRIES (GF) is taking steps to establish a leadership position in 6G by collaborating with top researchers at leading universities to leverage the unparalleled benefits of its FD-SOIRF-SOI and SiGe platforms, which already have been proven in 5G and other wireless applications to deliver industry-leading performance and cost-effectiveness.

Wireless connectivity is a major focus for GF, along with artificial intelligence (AI), edge-to-cloud computing and automotive solutions, because the company’s strategy is to be a leading supplier of the differentiated, feature-rich technologies needed to help shape the digital transformation of our world.

6G is the sixth generation of wireless communications technology. It will be significantly faster than 5G, capable of transmitting huge amounts of data at speeds that may reach or exceed 100 gigabytes per second (Gb/s) with little or no effective latency, or lag time.

That level of performance will open up entirely new applications and ways of doing things. “One example is holographic telepresence, in which a virtual ‘digital twin’ of a person or object – a highly realistic 3D image in full motion, in real-time, and with related audio – could be projected anywhere within a 6G network,” said Peter Gammel, Ph.D., vice president and chief technical officer of GF’s Mobile & Wireless Infrastructure strategic business unit. “It would be as if the person is physically present – there will be no more Zoom fatigue!”

Peter Gammel
Peter Gammel, Ph.D.

Gammel said there are countless other ways 6G technology will help change the world. “We’ve gotten familiar with the concept of telemedicine during the Covid-19 pandemic, and 6G could raise it to new heights. In robotic surgery, for instance, lifelike 3D images not only could guide a surgeon through an especially challenging operation, but the surgeon using the robot could be located thousands of miles away from the patient,” he said. “6G also will facilitate the use of AI everywhere in a network from the edge, to the customer, to the core, for greater efficiencies, speed and reduced costs.”

6G Technical Challenges & Opportunities

Technical standards for 6G systems haven’t been developed yet, but the initial 6G frequency range is likely to be from about 50 GHz to 200 GHz, with initial applications expected at the low end, near the top end of the 5G range. This is a blazingly fast and uncongested part of the RF spectrum, but these millimeter-wave (mmWave) frequencies have certain characteristics that make the technical development and economics of 6G systems challenging.

One major technical challenge is the need for power-efficient LNA amplifiers (a key component of wireless systems) to amplify low-power 6G signals without significantly degrading the signal-to-noise ratio, which is key to error-free performance.

Another is the need for accurate mmWave device simulations and models, along with hardware-validated process design kits, or PDKs, for successful, cost-efficient semiconductor design and production. This is a huge unmet need at high frequencies.

Perhaps the biggest issue, though, is that mmWaves suffer high propagation losses because they are absorbed by water vapor and oxygen molecules in the atmosphere, so finding ways to increase the over-the-air output power of transceivers is critical. Another propagation challenge is that mmWaves are easily blocked by walls, trees and other objects.

These propagation challenges mean that 6G networks will require many base stations and small cell sites located in fairly close proximity to one another to relay signals. Given the large number of semiconductors that will be needed for these dense networks, economic considerations will be critical.

Gammel said all of these challenges play to GF’s strengths, which include:

  • 22FDX™ and 22FDX+ FD SOI solutions, which combine RF, analog, embedded memory, and advanced logic in one chip, with dynamic voltage scaling and unmatched design flexibility for peak performance and energy-efficiency. Customers use FDX for such tasks as integrating front-end module (FEM) elements like data converters, LNAs, power amplifiers (PAs) and switches with the transceiver.
  • GF’s family of RF SOI solutions, used in integrated FEMs and beamformers in 5G base stations and smartphones.
  • GFs family of silicon germanium (SiGe) BiCMOS solutions for Wi-Fi and mmWave FEM’s

“6G gives us a vision for solutions based on merged technologies in which GF already has undisputed leadership,” Gammel said. “What’s great about these proven, cost-effective solutions is that they are nowhere near the limit of their capabilities. Their performance can be extended in step with the wireless industry as it evolves, moving past the upper reaches of the 5G spectrum and extending into the 6G frequency range. Customers will not have to turn to new technologies and exotic materials to get the performance they need; they will be able to get it from well-understood, production-ready and cost-effective silicon-based technology.” 

Partnerships with Leading 6G Researchers

GF is actively promoting 6G circuit and system research via the company’s University Partnership Program, through which GF provides access to technology to select university teams who collaborate with GF’s R&D team and share their research results.

The program is large and impactful. “Worldwide, we work with over 35 universities in various areas of technology, including 6G,” said Bika Carter, Sr. Manager and Deputy Director of External R&D Management for GF. “Peer-reviewed published papers are a key measure of the quality of our academic partners, and their publishing output is large and growing. In 2019 and 2020, there have been over 200 publications from our professors across our technologies. We have active university programs in 22FDX45RFSOI, silicon germanium (SiGe) and silicon photonics technologies.”

Ned Cahoon, Senior Director in GF’s Mobile and Wireless Infrastructure CTO office, works closely with many of the professors affiliated with GF’s University Partnership Program who are working on 6G technology. “We are technology leaders in mmWave, so we look for professors and academic programs that are tackling what we see as key 6G circuit and system issues that can be addressed by GF’s differentiated technology, such as FE, or front-end, circuits, at frequencies above 100GHz,” he said. “The professors we work with are renowned in their field, with great track records, and we work with them as partners. They share their research with us, and we help further their work by giving them access to our silicon on multi-project wafers.”

No Doubts About Silicon

One of GF’s academic partners is Gabriel Rebeiz, Ph. D., Distinguished Professor and the Wireless Communications Industry Endowed Chair at the University of California San Diego. Professor Rebeiz is a Member of the National Academy of Engineering and an IEEE Fellow. He is a pioneer of integrated phased arrays for communications and defense systems, and was the first to introduce MEMS and micromachining to the RF/microwave field.

At UC-San Diego, his group has led the development of complex RFICs for phased-array applications. His phased-array work is now used by most companies developing complex communication and radar systems, and he has graduated some 100 Ph.D. students and post-doctoral fellows.

At present his students are working on a broad set of research projects ranging from wideband systems in 45RFSOI to 140GHz phased arrays. “Before 6G comes along, there’ll be 24 GHz, 28 GHz, 39 GHz and 46 GHz chips used in 5G communications, so we’re working on a lot of wideband chips using the same processes and techniques that we will extend to 6G devices,” he said. “These are high-risk, high-payoff types of projects, and we push the limits of technology. GLOBALFOUNDRIES has been a great partner as we do this. We cover a large technical area and they support our innovative work.”

Prof. Rebeiz said he is convinced silicon is the solution for the higher reaches of the 5G band and for 6G applications up to about 220 GHz. For example, using GF’s technologies in a forward path transmit module (FPTM), his team recently achieved 12dBm of output power at 140GHz with 11-12 percent efficiency. “That’s a phenomenally good figure for point-to-point communications, given that the current figure-of-merit is 6dBm, but also, we’re doing it at 140GHz!” he said.

“As the number of elements needed in dense 6G networks increases so much, the power needed per element must necessarily decrease if these systems are to be practical, and instead of the 20dBm per element we now have at 28 GHz, we might need only 3-6dBm,” Rebeiz said. “So, without any doubt power-efficient silicon technologies like 22FDX will be dominant above 100GHz for any array application.”

Many challenges remain, of course – Prof. Rebeiz said packaging and testing are critical needs:  “What are we going to do to make test affordable in the future? Nobody’s going to test up to 140GHz because it is so difficult and expensive, but we can’t make progress without it” – but this work represents a great opportunity for his students.

“My students and I are hardware people,” he said. “We like building stuff. What my students are doing is vitally important for the world, and as such, this is truly a golden age for them.”

The Challenge and Opportunity of Reducing Power on AI Processors

By David Lammers

“For the edge, it is all about consuming the least power while optimizing for the required performance.”

Given the new reality of industry events going virtual during the pandemic, I was able to log in to half a dozen semiconductor conferences so far this year. A recurring theme was silicon for artificial intelligence (AI) and deep learning (DL), an evolving field which ranges across a broad spectrum of technologies and device types. One common vein running through them was a focus on memory optimization and solving the power/memory bottleneck.

AI is a hot market. ABI Research estimates that the overall AI silicon market will hit $21 billion in 2024. A surprisingly large fraction of that is held by ASIC-based AI accelerators, predicted to triple in value to a $9 billion total available market (TAM) by 2024, with a 30 percent compound annual growth rate (CAGR).

For both training and inference processing, companies are wracking their brains trying to come up with power-saving solutions. While machine learning is only part of total data center power consumption, it is expanding rapidly. Data centers consumed about 3 percent of all power in the United States in 2017, and that doubled to 6 percent in 2020. Proliferation of intelligent edge devices are accelerating as well. According to market research firm IDC, over the next decade 125 billion “things” will be connected to the internet, and by then close to 60 Zettabytes of data will be annually created, captured, copied, and consumed.

It is crystal clear that our industry faces a major challenge: how to implement many intelligent devices at the edge, infer all of that data at the edge with very low power consumption, and manage, process, and train exponentially growing data in the cloud, while keeping energy under control.

AI Reference Package Evolving

Hiren Majmudar, vice president of the computing business unit at GLOBALFOUNDRIES, said “there is a power bottleneck in both inference and training” that plays well into GF’s technology offerings, both its FinFET-based 12LP (12nm FinFET) platform and 12LP+ solutions, as well as its fully depleted SOI-based planar 22FDXTM (22nm FD-SOI) platform.

The FinFET-based technology has power and cost advantages for AI processors, either in the cloud or at the edge. The 12LP+ solution is capable of running AI cores at >1 Ghz, and features a new low-voltage SRAM and a standard cell library capable of 0.55V operation. GF’s most advanced FinFET solution, 12LP+ moved into production this year, and has a dual-work function FET delivering up to 20 percent faster logic performance or up to 40 percent lower power compared to the 12LP base platform. 

Hiren Majmudar

“Our customers have unique architectures that often depend on a limited set of standard cells,” he said. “We’ve worked hard on our DTCO (design technology co-optimization), and have developed an AI reference package, with a pre-packaged set of components to demonstrate the potential. Via a collaborative DTCO model our customers can quickly get their SoC goals to the market. The DTCO effort can include design analysis services based on the customer’s own architecture for optimized Performance, Power and Area (PPA).”

Optimal PPA looks different depending on the specific application, Majmudar said. 

“All segments are cost conscious. For the cloud, it is about TOPS per Watt, getting the best performance at lowest power. For the edge, it is all about lowest cost and consuming the least power while optimizing for the required performance at the edge,” he said.

The eMRAM offering for 22FDX has advantages for customers developing AI applications “looking for instant on, or always on,” Majmudar said. “There are many applications for eMRAM, with customers using it for better density and non-volatility. Another is analog compute in memory,” he added.

AI workloads are broad ranging, including voice, vision, and imaging, on top of the requirements for training and inference. “We are a very specialized foundry, constantly innovating our IP offerings. We continue to invest in IP, die-to-die interconnect, memory, and interface IP. We have a well-defined roadmap that we continue to improve with inputs from customers,” he said.

Innovative Startups

In future blogs I plan to detail how GF is working with startups in this field, but one of them deserves brief mention here just to provide a glimpse of how much innovation is going on among GF’s customers in AI silicon.

Fully depleted silicon-on-insulator platforms are well-adapted to support dynamic voltage, frequency scaling, and automatic clock gating. The result is ultra-low power consumption for signal processing and neural network algorithms that can run in battery-powered IoT devices.

Perceive, a majority-owned subsidiary of Xperi Corp., is aimed at AI inference for sensor data in ultra-low- power consumer devices. Perceive’s “Ergo” edge inference processor is capable of processing large neural networks on the device with efficiency 20 to 100 times higher than seen on today’s inference-capable processors.

The company is focused on security cameras, smart appliances, and mobile devices with integrated neural network processing, eliminating the need to send data to the cloud for inference processing.

Please watch the short video below to hear Perceive CEO Steve Teig speak with GF SVP Mike Hogan about Perceive’s approach to AI and machine learning:

在高品质5G射频解决方案需求不断增长的趋势下,格芯与Soitec宣布达成RF-SOI晶圆供应协议

战略供应协议使得格芯®(GLOBALFOUNDRIES®)能够满足市场对其先进的RF-SOI解决方案8SW不断增长的需求,主流FEM供应商在6 GHz以下5G智能手机上使用该方案

加利福尼亚州圣克拉拉、法国贝宁(格勒诺布尔),2020年11月5日 – 今日,全球领先的特殊工艺半导体代工厂格芯®(GLOBALFOUNDRIES®,GF®)与Soitec宣布,就300mm射频绝缘体上硅(RF-SOI)晶圆的供货,双方达成了一份为期多年的协议,后者在设计和制造创新半导体材料领域同样处于全球领先地位。基于双方的长期合作伙伴关系,这份战略协议确保了晶圆供应,从而使格芯能够在为下一代手机市场提供解决方案时进一步提升其关键作用。两家公司的领导人于本周早些时候通过虚拟签约仪式最终确定了该协议。

促成这份晶圆供应协议的主要因素是,市场对于格芯先进的RF-SOI解决方案8SW RF SOI的需求在不断增长。8SW RF-SOI作为一流射频前端模块(FEM)平台,具备性能出色的开关和低噪声放大器,并且经过了优化,在性能、功耗和数字化集成相结合方面与众不同,可满足当前和未来4G LTE及6 GHz以下5G智能手机设计人员和供应商的需求。这个新平台采用由Soitec开发的先进的RF-SOI衬底。

格芯的8SW RF-SOI的客户为6 GHz以下5G智能手机的主流FEM供应商。

格芯的移动和无线基础设施部高级副总裁兼总经理Bami Bastani博士表示:“当今市场上每十部智能手机中就有八部采用了格芯®制造的芯片,并且,随着行业向5G迁移,对我们与众不同的射频解决方案的需求会持续飙升。如果没有格芯®和我们业界领先的专业射频解决方案,5G革新将无法实现。确保来自我们长期合作伙伴Soitec的晶圆供应至关重要,这样就使格芯能够满足市场对我们5G解决方案不断增长的需求。”

Soitec首席运营官Bernard Aspar博士表示:“我们设计生产的衬底为制造电子行业所需的高性能和高可靠性半导体器件奠定了基础。我们在法国和新加坡都有生产设施,因而在设计制造先进衬底方面,我们已经拥有了全球最大的产能,可满足快速增长的5G市场需求。通过这项多年度协议,我们与格芯®已经建立的合作伙伴关系能够得以持续,对此我们感到很欣慰。”

这份新协议建立在格芯与Soitec之间牢固的合作伙伴关系基础上。2017年,针对格芯22FDX®平台所需要的全耗尽绝缘体上硅(FD-SOI)晶圆,两家公司签订了为期五年的供货协议。制造于德国德累斯顿的格芯22FDX平台所获得的设计订单迄今已经实现了45亿美元营收,这些订单向全球客户交付了超过3.5亿枚芯片。

关于Soitec

Soitec(泛欧交易所,法国巴黎Tech 40指数成分股)是全球领先的创新半导体材料设计和制造企业。该公司凭借其独特的技术和半导体领域的专长为电子行业市场提供服务。Soitec在全球拥有超过3,300项专利,其战略是以颠覆性创新满足客户对高性能、高能效和成本竞争力的需求。Soitec在欧洲、美国和亚洲设有制造厂、研发中心和办事处。Soitec和Smart Cut是Soitec的注册商标。如需了解更多信息,请访问www.soitec.com并在Twitter上关注:@Soitec_EN

About GLOBALFOUNDRIES

GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its customers to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

Contacts: 

GLOBALFOUNDRIES
Michael Mullaney
518-305-1597
[email protected]

SOITEC 

投资者关系:
Steve Babureck 
+33 6 16 38 56 27 
[email protected]

业务媒体联系人:
Marie Cabrières
+33 6 26 70 12 78
[email protected]

财经媒体联系人:
Isabelle Laurent
+33 1 53 32 61 51 [email protected]

eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications

eMemory announced its NeoFuse IP has been qualified on GF’s 28HV platform, in response to the rising demand for OLED display applications.