June 3, 2013 ARM and GlobalFoundries to Optimize Next-Generation ARM Mobile Processors for 28nm-SLP Process TechnologyNew ARM POP technology provides core-hardening acceleration for Cortex-A12 and Cortex-A7 processors Milpitas, Calif., and Cambridge, UK, June 3, 2013 […] Read Press Release
May 30, 2013 GLOBALFOUNDRIES Accelerates Adoption of 20nm-LPM and 14nm-XM FinFET Processes with Comprehensive Production-Ready Design FlowsJointly developed with leading EDA providers, flows address AMS challenges from specification to verification; complete flows for digital design for […] Read Press Release
May 30, 2013 GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC technologyCollaboration with leading EDA vendors supports complete range of steps required to create and verify advanced stacking implementations using TSV […] Read Press Release
May 21, 2013 GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC technologySTT-MRAM offers enhanced performance and scalability for embedded and standalone applications Leuven (Belgium) — May 21, 2013 — Imec and […] Read Press Release
May 6, 2013 GLOBALFOUNDRIES Singapore General Manager KC Ang Appointed As SEMI Singapore RAB ChairmanSingapore, May 6, 2013 — KC Ang, Senior Vice President and General Manager of GLOBALFOUNDRIES Singapore, has been appointed to […] Read Press Release
April 29, 2013 Infineon and GlobalFoundries Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process TechnologyNeubiberg / Dresden, Germany and Singapore — April 29, 2013 — Infineon Technologies (FSE: IFX / OTCQX: IFNNY) and GlobalFoundries […] Read Press Release
April 22, 2013 GLOBALFOUNDRIES Names Shigeru Shimauchi as New Country Manager For Japan Sales OfficeMilpitas, Calif., April 22, 2013 — GLOBALFOUNDRIES today announced that the appointment of a new country manager for its sales […] Read Press Release
April 3, 2013 GLOBALFOUNDRIES Helps Host National Academy of Sciences ConferenceGLOBALFOUNDRIES CEO Ajit Manocha welcomes national leaders with opening keynote for National Academy of Sciences Conference on “New York’s Nanotechnology […] Read Press Release
April 2, 2013 GLOBALFOUNDRIES Demonstrates 3D TSV Capabilities on 20nm TechnologyFab 8 in New York delivers functional 20nm silicon with Through-Silicon-Vias (TSVs) Milpitas, Calif., April 2, 2013 – GLOBALFOUNDRIES today […] Read Press Release
February 19, 2013 GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low Voltage55nm LPe 1V is optimized for ultra-low power, reduced cost and improved design flexibility MILPITAS, Calif., February 19, 2013 – […] Read Press Release