Marvell to Acquire Avera Semi, Creating an Infrastructure ASIC Powerhouse May 20, 2019 Brings World-class ASIC IP and Development Capabilities for Wired and Wireless ApplicationsLeverages Significant System-level Expertise and Design Capacity with Deep IBM HeritageExtends Marvell’s Reach in 5G Base StationsIncludes Substantial Revenue Stream Santa Clara, Calif. (May 20, 2019) – Marvell (NASDAQ: MRVL) today announced it has entered into definitive agreements to purchase Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GLOBALFOUNDRIES. This acquisition brings together Avera Semi’s leading custom design capabilities with Marvell’s advanced technology platform and scale, creating a leading ASIC supplier for wired and wireless infrastructure. The agreements include transfer of Avera’s revenue base, strategic design wins with leading infrastructure OEMs, and a new long-term wafer supply agreement between GLOBALFOUNDRIES and Marvell. Marvell is focused on becoming the world’s leading supplier of infrastructure semiconductor solutions. Avera’s ASIC capabilities will accelerate this transformation. Specifically, Avera’s advanced full custom development capabilities complements Marvell’s standard and semi-custom product portfolio. Previously part of IBM’s Microelectronics business, Avera has successfully executed more than 2,000 complex designs in its 25-year history and built a significant business, supported by approximately 800 talented technologists. Avera brings highly innovative design competencies in analog, mixed-signal and SoCs as well as a rich IP portfolio including high-speed SerDes, high-performance embedded memory and advanced packaging technology. They have built strong relationships with blue-chip wired and wireless networking OEMs, having delivered custom solutions for multiple generations of switches, routers and base stations. More recently, Avera has started to address emerging opportunities in next generation cloud data centers with multiple programs in development today. As a leading supplier of standard and semi-custom products into these same markets, Marvell has also seen an expanding opportunity pipeline for custom solutions utilizing its leading IP and technology platform. For example, within 5G infrastructure, Marvell offers complete silicon platforms that enable a wide range of digital processing including baseband, processors, Ethernet switches and PHYs. As these products have gained traction in the marketplace, Marvell’s opportunity set has recently expanded to encompass a number of custom SoCs addressing a broader portion of the base station. Several of these new products are designed to replace FPGAs with purpose-built optimized silicon. At the same time, Avera has provided custom products to be deployed in the radio head of a leading wireless infrastructure OEM for multiple generations. These solutions expand Marvell’s addressable market and are indicative of the broader opportunity for custom ASICs within both wired and wireless infrastructure. The addition of Avera’s talented team and extensive ASIC design expertise will accelerate Marvell’s ability to address these opportunities and capture significantly more content in the broader infrastructure market. “Our acquisition of Avera enables us to offer the complete spectrum of product architectures spanning standard, semi-custom to full ASIC solutions,” said Matt Murphy, president and CEO of Marvell. “With their highly experienced design team and Marvell’s leading technology platform, we will be better positioned to capitalize on our expanding opportunity in wired and wireless infrastructure, starting immediately in the fast growing 5G base station market. In addition, we are looking forward to furthering our successful partnership with GLOBALFOUNDRIES in the coming years and beyond.” “This transaction is another example of our commitment to focus on our core business of providing differentiated foundry offerings as a manufacturing service provider, while establishing deeper relationships with customers who are leaders in their respective sectors,” said Tom Caulfield, CEO at GLOBALFOUNDRIES. “With this deal and our growing strategic partnership with Marvell, we will forge new opportunities for the teams of both companies to leverage GF’s broad set of offerings to capitalize on the 5G infrastructure market as well as other opportunities. We look forward to becoming a strategic provider for Marvell for decades to come.” Under the terms of the agreement, Marvell will pay GLOBALFOUNDRIES $650 million in cash at closing plus an additional $90 million in cash if certain business conditions are satisfied within the next 15 months. The transaction is expected to close by the end of Marvell’s fiscal year 2020 pending receipt of regulatory approvals and other customary closing conditions. The acquisition is expected to be accretive to Marvell’s non-GAAP earnings per share in the first full year following the close. Call/Webcast to Discuss Transaction Interested parties may join a conference call Monday, May 20, 2019 at 5:00 p.m. Eastern Time to discuss the transaction by dialing 1 (844) 647-5488 in the U.S. or +1 (615) 247-0258 internationally, with the conference ID 8955899. A webcast of the call can be accessed by visiting Marvell’s investor relations website. A replay will be available until Monday, May 27, 2019 by dialing 1 (855) 859-2056, replay ID 8955899. Forward-Looking Statements Except for the historical information contained herein, the statements in this press release, including those concerning the acquisition, the expected benefits of the acquisition and the timing of the closing of the acquisition, are “forward-looking statements” within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements speak only as of the date of this press release. Actual results or events could differ materially from those anticipated in those forward-looking statements as a result of certain risks including: the risk that the proposed acquisition will not be completed, the risk that Marvell may not realize the anticipated benefits of the acquisition including the benefits related to opportunities in the 5G infrastructure market, or that such benefits may take longer to realize than anticipated, and other risks associated with the acquisition, such as the ability to successfully integrate the acquired technologies and operations, the potential for unexpected liabilities, Marvell’s ability to retain customer relationships and key employees, and Marvell’s ability to invest in the business on a going forward basis. Marvell undertakes no obligation to update the forward-looking information in this press release. Other important factors that could cause actual results to differ materially are contained in the Company’s 10-Qs and 10-Ks that are on file with the Securities and Exchange Commission. About Marvell Marvell first revolutionized the digital storage industry by moving information at speeds never thought possible. Today, that same breakthrough innovation remains at the heart of the company’s storage, processing, networking, security and connectivity solutions. With leading intellectual property and deep system-level knowledge, Marvell’s semiconductor solutions continue to transform the enterprise, cloud, automotive, industrial, and consumer markets. To learn more, visit: www.marvell.com. About GF GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF, and power/analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Marvell and the Marvell logo are registered trademarks of Marvell and/or its affiliates. For further information, contact: Ashish SaranMarvell408-222-0777[email protected] Erica McGill GLOBALFOUNDRIES(518) 795-5240[email protected]
To Climb the Ranks, Women Engineers Need “A Little Push” May 20, 2019By: Dave Lammers What business these days doesn’t have a big “Now Hiring!” sign outside its doors? With Google and others competing for technically skilled workers, the semiconductor industry has its own help wanted signs out, with a “Women Welcome!” tagline added. While attending the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2019) and associated Women in Semiconductors program in early May, I felt some of the energy behind the work being done to hire, retain, and promote more women at GLOBALFOUNDRIES, when I spoke to two executives: Deb Leach and Christine Dunbar. Leach, vice president of procurement at the Fab 8 site, got her E.E. degree from the University of Vermont, and moved from IBM Microelectronics to GF in 2014 about a year before the two companies merged. Before moving into supplier management at GF, she managed three process modules: CVD, PVD, and CMP. In short, she has street smarts in both technology and business positions, and plays a leading role in GF’s GlobalWomen initiative as her side job. I asked Leach if GF’s management had set targets for the number of women it hoped to hire this year, and learned right off the bat what a realist she is. “I think it is a negative if we start to set quotas. It doesn’t put our people in the right frame of mind. What we want to do is nurture the environment for women to be successful, once they are at GF. Of course, we would like to see more hiring (of women), but it is less about that than creating a better environment,” she said. Creating a better environment for women at GF has many facets, and one of them comes very soon: to bring about 300 women together for the Global GlobalWomen Conference, planned for May 23rd in Saratoga Springs, N.Y., not far from the Fab 8 site in Malta, N.Y. About 50 women will attend from the Bangalore, Dresden, and Singapore sites, a travel expense which, to my mind, underlines the commitment GF has to its women employees and potential hires around the world. Here in the United States, we have moved well beyond the time when it was surprising to meet a woman holding a management job. That said, I must confess that when I meet a female engineer I have a vestigial curiosity about how this person managed the jump into a field that has been so thoroughly dominated by men. We’ll Make It Work Christine Dunbar ran GF’s RF business unit this past February, when she took on the role of vice president of U.S. sales. Dunbar, who graduated from Cornell University’s engineering program, was lucky. Her father was a math teacher who encouraged her to attend a summer camp for girls interested in engineering. “When I was 16, I met all these girls who were really like me. I didn’t have to pretend not to be smart. I loved it.” Dunbar worked for IBM at its Essex Junction fab, prior to joining GF. When she was in early 30s her manager at the time, John DiToro, asked Dunbar to throw her hat into the ring for an IBM executive position at the Vermont site. “I remember this moment because it was so pivotal to me. I was five months pregnant with my second child. John pulled me in to his office and said, ‘Christine, this role has become available and I think you are the right person to take it.’ I spread my hands out to remind him that I was five months pregnant, and told him that I was planning on taking four months off. He said ‘Christine, we’ll work through that. Four months is a short time in an entire career, and we’ll make it work.’” I thought about Dunbar’s story quite a bit on my way back from Saratoga Springs to the Austin airport. How many companies have created an equal-opportunity environment where a manager such as DiToro could provide encouragement to a talented-but-pregnant woman? How many managers would feel confident enough, encouraged enough, to offer that promotion? As Dunbar put it: everyone needs “that little push. We all need someone who tells you that ‘you can do this.’ As I mentor people or sponsor my employees, especially women, I think about the fact that we all need that little push.” Over-Mentored and Under-Sponsored I went to Saratoga Springs primarily to attend SEMI’s ASMC 2019, but an interesting part of my four days there was the preceding Women in Semiconductors program, a Monday afternoon affair organized by SEMI. One of the speakers was Karen Hammons, a program manager in Microsoft’s Azure Networking cloud service operation, who earlier served as a captain in the U.S. Air Force. Hammons distinguished between mentors, who include various people such as teachers who can provide helpful advice, and sponsors, who can guide a person toward opportunities within the company or organization. Women enjoy talking to each other, Hammons told the 128 women engineers who participated in the Women in Semiconductors program, and that can result in young female employees being “over-mentored and under-sponsored.” She credited a senior officer in the Air Force who “saw something in her” and recommended Hammons for further responsibilities and introduced her to helpful people “in the leadership chain.” While sponsors can help identify opportunities, Hammons said women need to remember that they “are not playing a game here” during their work lives, and that women need to advocate for themselves within their organizations. When they see an opportunity, women need to tell their bosses, “I want to lead that project.” The majority of the women at the Monday event were female engineers working at GF’s Malta site, and I talked to several of them that day. It was encouraging to meet women who proudly talked about their jobs as an etch engineer, or a yield analysis engineer, among others. And there were graduate engineering students from the area who were getting to know some of these GF engineers, forming mentorship bonds. Attendees listen to presentations and panel discussions on leadership skills and the importance of promoting diversity in the workplace at Women in Semiconductors (WiS) program held in conjunction with ASMC 2019. Source: SEMI ASMC The goal, of course, is to overcome any and all barriers, so that women feel that they can balance family and work, just as men need to do. The idea that husbands need to work sixty or eighty hours a week so mothers can stay home or work part-time is fine for some families. But as a society we need to move beyond that, a tall order in an industry that has become totally globalized, with the accompanying long flights across the oceans. Dave Anderson, president of SEMI Americas, described the challenge well: the semiconductor industry needs young talent. No company can afford not to promote its deserving women. As one GF woman remarked, the goal is: “Don’t genderize me. I’m an engineer. I’m an executive. The question we are facing is: ‘Do women have an equal shot, when they have the skills?’” A lot of it comes down to having support from senior management, and all the people I talked to credited GF CEO Tom Caulfield as being extremely supportive. The GlobalWomen events are testimony to that. As an industry, we’ve made a good start, but we certainly do need “that little push” to keep moving forward. About Author Dave Lammers Dave Lammers is a contributing writer for Solid State Technology and a contributing blogger for GF’s Foundry Files. Dave started writing about the semiconductor industry while working at the Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry. He joined E.E. Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave received a master’s in journalism at the University of Missouri School of Journalism.
ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility April 22, 2019 Acquisition optimizes cost structure, increases manufacturing capacity, and positions both companies for future growth Key Transaction Highlights: Technology team with extensive 300mm manufacturing and development experienceDefined multi-year transition period with 300mm operating partner enabling strong factory loadingPath for high volume MOSFET and IGBT turnkey capacity, along with advanced CMOS capability PHOENIX, Ariz. and SANTA CLARA, Calif. – April 22, 2019 – ON Semiconductor Corporation (Nasdaq: ON) (“ON Semiconductor”) and GLOBALFOUNDRIES today announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300mm fab located in East Fishkill, New York. The total consideration for the acquisition is $430 million, of which $100 million has been paid at signing of the definitive agreement, and $330 million will be paid at the end of 2022, after which ON Semiconductor will gain full operational control of the fab, and the site’s employees will transition to ON Semiconductor. Completion of the transaction is subject to regulatory approval and other customary closing conditions. The agreement allows ON Semiconductor to increase its 300mm production at the East Fishkill fab over several years, and allows for GLOBALFOUNDRIES to transition its numerous technologies to the company’s three other at-scale 300mm sites. Under the terms of the agreement, GLOBALFOUNDRIES will manufacture 300mm wafers for ON Semiconductor until the end of 2022. First production of 300mm wafers for ON Semiconductor is expected to start in 2020. The agreement also includes a technology transfer and development agreement and a technology license agreement. This provides a world-class, experienced 300mm manufacturing and development team to enable conversion of ON Semiconductor wafer processes from 200mm to 300mm. ON Semiconductor will also have immediate access to advanced CMOS capability including 45nm and 65nm technology nodes. These processes will form the basis for future technology development at ON Semiconductor. “We are pleased to welcome the GLOBALFOUNDRIES Fab10 team to ON Semiconductor’s team. The acquisition of 300 mm East Fishkill fab is another major step in our progress towards leadership in power and analog semiconductors,” said Keith Jackson, president, and chief executive officer of ON Semiconductor. “The acquisition adds additional capacity over the next few years to support growth in our power and analog products, enables incremental manufacturing efficiencies, and accelerates progress towards our target financial model. I am very excited about the opportunity this acquisition creates for customers, shareholders, and employees of the two companies and look forward to a successful partnership with GLOBALFOUNDRIES in the coming years.” “ON Semiconductor is an ideal partner for GLOBALFOUNDRIES and this agreement is a transformative step in our journey to build GLOBALFOUNDRIES into the world’s leading specialty foundry,” said Tom Caulfield, CEO at GLOBALFOUNDRIES. “This partnership enables GLOBALFOUNDRIES to further optimize our assets globally and intensify our investments in the differentiated technologies that fuel our growth while securing a long-term future for the Fab 10 facility and our employees.” “We are excited to support ON Semiconductor’s expansion to the Mid-Hudson Region, which will keep high-paying manufacturing jobs in New York State and support the company’s plan for future growth and development,” said Howard Zemsky, president and CEO at Empire State Development. Teleconference ON Semiconductor will host a conference call for the financial community at 9:00 a.m. Eastern Standard Time (EST), on April 22, 2019, to discuss this announcement. ON Semiconductor will also provide a real-time audio webcast of the teleconference on the Investors page of its website at https://www.onsemi.com. The webcast replay will be available at this site approximately one hour following the live broadcast and will continue to be available for approximately one year following the conference call. Investors and interested parties can also access the conference call through a telephone call by dialing (877) 356-3762 (U.S./Canada) or (262) 558-6155 (International). In order to join this conference call, you will be required to provide the Conference ID Number – which is 7881834. About ON Semiconductor ON Semiconductor (Nasdaq: ON) is driving energy-efficient innovations, empowering customers to reduce global energy use. The Company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy-efficient power management, analog, sensors, logic, timing, connectivity, discrete, SoC, and custom devices. The Company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace, and defense applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance, and ethics program, and a network of manufacturing facilities, sales offices, and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit https://www.onsemi.com. ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the Company references its website in this news release, information on the website is not to be incorporated herein. About GLOBALFOUNDRIES GLOBALFOUNDRIES is a leading specialty foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GLOBALFOUNDRIES provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog mixed-signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com Cautions regarding Forward-Looking Statements This document contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements include, but are not limited to statements related to the consummation and benefits of the acquisition by ON Semiconductor of the East Fishkill fab from GLOBALFOUNDRIES, including statements about 300mm wafer production, transfers of technology, the benefits of technology transfer and license agreements, anticipated optimization of manufacturing, and progress towards ON’s previously announced financial model. These forward-looking statements are based on information available to ON Semiconductor as of the date of this release and current expectations, forecasts, and assumptions and involve a number of risks and uncertainties that could cause actual results to differ materially from those anticipated by these forward-looking statements. Such risks and uncertainties include a variety of factors, some of which are beyond our control. In particular, such risks and uncertainties include, but are not limited to the risk that one or more closing conditions to the transaction may not be satisfied or waived, on a timely basis or otherwise, and the risk that the transaction does not close when anticipated, or at all, including the risk that the requisite regulatory approvals may not be obtained. Information concerning additional factors that could cause results to differ materially from those projected in the forward-looking statements is contained in ON Semiconductor’s Annual Report on Form 10-K, Quarterly Reports on Form 10-Q, Current Reports on Form 8-K, and other of ON Semiconductor’s filings with the Securities and Exchange Commission. These forward-looking statements are as of the date hereof and should not be relied upon as representing our views as of any subsequent date, and we do not undertake any obligation to update forward-looking statements to reflect events or circumstances after the date they were made, except as may be required by law. For additional information, visit ON Semiconductor’s corporate website, www.onsemi.com, or for official filings visit the SEC website, www.sec.gov. Contacts Erica McGill Corporate Communications / Media RelationsGLOBALFOUNDRIES (518) 795-5240 [email protected] Kris Pugsley Corporate Communications / Media Relations ON Semiconductor (312) 909-0661 [email protected] Parag Agarwal Vice President Investor Relations and Corporate DevelopmentON Semiconductor(602) 244-3437[email protected]
格芯与安森美半导体建立战略合作，转让其纽约州东菲什基尔的300mm工厂所有权 April 22, 2019 收购将优化成本结构、提高生产能力以实现双方未来的发展 关键交易重点： 拥有丰富的300mm 制造和开发经验的技术团队 与300mm运营合作伙伴确认多年过渡期，实现强大的工厂生产能力 大容量MOSFET和IGBT交钥匙容量的路径，以及先进的CMOS能力 亚利桑那菲尼克斯，加利福尼亚圣克拉拉 – 2019年4月22日 -安森美半导体股份有限公司（ON Semiconductor Corporation，纳斯达克代码：ON）（以下简称为“安森美”）与格芯（GLOBALFOUNDRIES）于今日宣布，已就安森美半导体收购格芯位于美国纽约州东菲什基尔的300mm工厂达成最终协议。收购总价为4.3亿美元，其中1亿美元在签署最终协议时支付，剩余的3.3亿美元将在2022年底支付。此后安森美将获得该工厂的全部运营控制权，该工厂的员工将转移到安森美。交易的完成须经监管部门批准且满足其他常规的交割条件。 该协议将使安森美在几年内增加其在东菲什基尔工厂的300mm产量，也将使格芯将其众多技术转移至其他三个300mm规模化核心工厂。根据协议条款的规定，格芯将生产用于半导体的300mm芯片，直至2022年底。安森美首批300mm芯片的生产预计将于2020年启动。 该协议还包括技术转让、发展协议以及技术授权协议，将会提供一个经验丰富的世界级300mm制造和开发团队，使安森美的晶圆工艺从200mm转变为300mm。安森美也将即刻获得先进的CMOS产能，其中包括45nm 和65nm两个技术节点。这些工艺将为安森美未来的技术发展奠定基础。 “我们十分欢迎格芯Fab 10厂加入安森美的团队。收购格芯300mm东菲什基尔工厂是我们在电源和模拟半导体领域取得领导地位的又一重要举措，”安森美半导体总裁兼首席执行官Keith Jackson表示，“在未来几年里，此项收购将进一步提升我们的额外产能，进而为电源和模拟领域的产品发展提供支持，提升我们的生产效率，并加速我们财务模式的进展。此次收购为双方公司的客户、股东和员工创造的机会令我备受鼓舞，我也十分期待在未来几年及更远的将来与格芯建立成功的合作关系。” “安森美是格芯理想的合作伙伴，此项协议是我们为将格芯建设成全球领先的专业晶圆厂所作出的重要变革”，格芯首席执行官汤姆·嘉菲尔德（Tom Caulfield）表示，“此次合作将使格芯进一步优化全球资产，加强我们对促进增长的差异化技术的投资，同时确保为Fab 10厂及其员工带来长远发展。 ” “我们很高兴能为安森美在哈得逊中部地区的扩张提供支持，此次扩张将在纽约州继续创造制造业的高薪就业机会。我们也将为安森美未来的增长和发展计划提供支持”，纽约州经济发展厅总裁兼首席执行官Howard Zemsky表示。 电话会议 安森美半导体将于2019年4月22日东部标准时间上午9:00举行金融电话会议，就该公告进行讨论。此外，安森美半导体还将在投资者网页上提供一个电话会议实时音频网络广播，网址： https://www.onsemi.com。在现场直播后大约一小时在本网站上将播放网络重播，同时在电话会议后的大约一年内均可播放该视频。投资者和利益相关人员人士也可以通过拨打(877) 356-3762（美国/加拿大）或(262) 558-6155（国际）接通电话会议。如需参加此次电话会议，您必须提供会议ID号，即7881834。 关于安森美半导体 安森美半导体（纳斯达克股票代码：ON）致力于推动高能效电子的创新，使客户能够减少全球的能源使用。安森美是半导体解决方案的领先供应商，提供全面的高能效电源管理、传感、模拟、逻辑、时序、分立和定制器件阵容。公司的产品帮助工程师解决他们在汽车、通信、计算机、消费电子、工业、医疗、航空及国防应用中面对的独特设计挑战。安森美半导体在北美、欧洲和亚太地区的主要市场运营着敏锐、可靠、世界一流的供应链和品质项目，以及制造设施、销售办事处和设计中心网络。如需更多信息，请登录https://www.onsemi.com. 安森美半导体和安森美半导体logo是Semiconductor Components Industries, LLC.的注册商标。本文件中出现的所有其他品牌和产品名称均为其各自持有者的注册商标或商标。虽然公司在本新闻稿中引用其网站，但网站上的信息概不纳入本文件之中。 关于格芯 格芯（GF）是全球领先的全方位服务半导体代工厂，为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务, 其创新的知识产权和功能多样的系列产品包括FinFET、FDX™、RF以及模拟混合信号。伴随着全球生产基地横跨三大洲的发展步伐，格芯促进了改变行业的技术和系统的出现，并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉投资公司（Mubadala Investment Company）所有。 前瞻性陈述的注意事项 本文件载有1995年《私人证券诉讼改革法案》所载含义范围内的前瞻性陈述。此类前瞻性陈述包括但不限于与安森美半导体向格罗方德半导体进行东菲什基尔工厂收购案的达成及其收益有关的陈述，包含关于300mm晶圆厂生产、技术转让、技术转让和许可协议的收益、预期的生产优化，以及安森美此前宣布的财务模型的进展等相关陈述。此类前瞻性陈述是根据截至本文件发布日期安森美半导体可获得的各项资料以及目前的期望、预测和假设制定的，并涉及可能导致实际结果与前瞻性陈述所预期的结果产生重大差别的若干风险和不确定因素。此类风险和不确定情况包括多种因素，而其中一部分因素是我们无法控制的。尤其是，此类风险和不确定性包括但不限于交易的一个或多个完结条件可能无法及时满足或被放弃的风险，以及交易未能在预期之时完成或根本没有完成的风险，包含无法获得必要的监管批准的风险在内。针对其他可能导致实际结果与预测结果产生重大差异的因素，相关信息载于安森美半导体表10-K的《年度报告》、表10-Q的《季度报告》、表8-K的《当期报告》以及安森美半导体向证券交易委员会提交的其他文件中。此类陈述自本文发布之日起生效，并在此后的任何日期均不得将此类前瞻性陈述视为代表我方观点，且我方也概不承担任何更新前瞻性陈述以反映除发生在此类陈述日期后的各项事件或情况的义务，但法律要求作出更新的情况除外。其他信息可登录安森美半导体的网站www.onsemi.com查看，或如需查看正式备案的文件，可登陆美国证券交易委员会（SEC）的网站www.sec.gov。 媒体垂询： 杨颖（Jessie Yang）(021) 8029 6826[email protected] 邢芳洁（Jay Xing）86 18801624170[email protected]
Sonnet Suites Qualified for GLOBALFOUNDRIES Advanced FinFET Process Technology April 2, 2019Sonnet Software, Inc. announced today that its electromagnetic (EM) simulation suite, utilizing their industry leading analysis engine, em, has been qualified on GLOBALFOUNDRIES (GF) 12nm FinFET (12LP) process technology. Designers can take advantage of Sonnet’s trademark accuracy for EM simulation while working with today’s demanding manufacturing processes, ensuring a faster design to market timeline.
Sonnet Suites Qualified for GLOBALFOUNDRIES Advanced FinFET Process Technology April 2, 2019Sonnet Software, Inc. announced today that its electromagnetic (EM) simulation suite, utilizing their industry leading analysis engine, em, has been qualified on GLOBALFOUNDRIES (GF) 12nm FinFET (12LP) process technology. Designers can take advantage of Sonnet’s trademark accuracy for EM simulation while working with today’s demanding manufacturing processes, ensuring a faster design to market timeline.
Attopsemi’s I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology April 1, 2019Attopsemi’s I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for AI, IoT, automotive, industry, and communication applications
Attopsemi’s I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology April 1, 2019Attopsemi’s I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for AI, IoT, automotive, industry, and communication applications
巴塞罗那世界移动通信大会：全速迈向5G March 26, 2019 作者: Gary Dagastine 如果想要寻找确凿证据证明5G网络革命的到来，就应该参加最近在巴塞罗那世界移动通信大会上由格芯发起的专题讨论会。 格芯的一位受邀专家在会上展示了一款已有的64单元28 GHz硅基天线，可用于毫米波(mmWave) 5G天线阵列。此外，会上还谈到了中国计划在今年就安装20万个5G基站，另有与会人士提到了目前已有多种半导体IP可以用于5G芯片设计，并基于格芯的差异化制造与封装技术进行制造。 资料来源：格芯 智能连接塑造数据驱动的未来（Intelligent Connectivity for a Data-Driven Future）是本次格芯专题讨论会的主题。智能连接是指数据中心、网络和客户端（或“边缘”）设备，如智能手机和物联网系统之间日益复杂紧密的相互关系。这些相互关系由数据驱动，并将日渐被AI赋能，进而重塑所触及的每一个行业，影响和改变我们生活的方方面面。 本次专题讨论会的目的是与世界移动通信大会的与会者分享5G专家的观点和意见，讨论内容包括市场分析、关键产品的供应、软件设计工具与服务的开发（用于创建和测试针对特定应用的创新型5G芯片）。 网络连接的爆炸式增长 本次讨论会由格芯全球销售、业务开发、客户和设计工程高级副总裁Mike Cadigan主持，格芯首席技术官兼全球客户解决方案副总裁Subi Kengeri作了开场发言。 Subi概述了全球无线连接的爆炸性增长及其带来的机遇和挑战。他强调，鉴于6GHz以下和毫米波5G应用的复杂性，网络运营商与设备、服务和IP提供商之间的密切合作至关重要。之后，他概述了格芯等半导体制造商的角色要如何发展才能实现所有这些目标，并介绍了格芯的差异化技术为5G应用带来的一些具体优势。 源自格芯的5G创新，新生代晶圆厂 资料来源：格芯 “我们现在生活在一个网络无处不在且日益增长的互联世界，这对任何人来说都不是新闻，但当前网络的速度和覆盖范围令人难以置信，”他说，“2017年，全球共有180亿台联网设备，相当于每人拥有2.4台联网设备，但到2022年，也就是三年以后，总数就将增加近一倍，达到约290亿台设备。” 此外，虽然目前移动数据流量每月约为27艾字节，但到2024年底，这一数字将达到大约136艾字节。“每个月的数据将达到136艾字节，而预计5G将占其中的25%，”他说，“换言之，届时全球超过40%的人口将使用5G，这将使5G成为有史以来在全球范围内推出的最快的无线网络。” 这种快速增长和全球覆盖范围对半导体设计和制造具有重大影响，而首当其冲的就是“创新”一词的含义，他谈到。 “过去，我们将创新描述为芯片技术的前沿发展，但今天，认为这种创新能够支持5G的大规模部署是天真的。特别是考虑到仅设计、验证、原型制作和生产一个5nm集成电路就可能花费超过五亿美元。” 他指出，5G领域的真正创新是打造出能够提供5G优化性能的设备，同时兼顾功耗、性能、射频和应用特定功能。“如今，功耗和每功能单位成本是关键指标，而不是特征尺寸。”他同时指出，一些既有的节点正在获得新生，因为现有流程正以新的方式将技术、特征、功能和支持相结合。 格芯正处于这一趋势的最前沿，拥有大量经过验证的支持5G的工艺。其中包括22FDX，可为移动设备等许多应用带来优异的功耗、性能和射频功能；而8SW RF SOI技术可为移动应用带来出众的功耗和性能。格芯还提供一系列封装技术，鉴于5G端点功率的增加，保障散热至关重要。 专家谈毫米波领域 Subi发言后是与讨论嘉宾的问答环节： Mike Cadigan发起了讨论，他问Joe为什么电话公司等网络运营商会决定转向5G，以及5G部署速度方面的问题。“总体情况是，对于运营商而言，5G将大大降低数据传输成本，”他说，“2G网络出现后，每GB数据的传输成本从数千美元降到了数十美元。而如今，使用LTE和小型蜂窝，每GB的传输成本约为1美元，而使用毫米波后，每GB的成本不到10美分。因此，移动流量套餐在今后将趋向固定资费套餐，不限制流量。” 他指出，部署工作不会统一进行，需要一些时间才能发展完备。“一些国际网络运营商，特别是瑞士和中国的运营商，已经牢牢锁定了5G。例如，中国正在大力推进，计划在今年部署20万个5G基站，”他说，“但是，世界其他地区的部署情况不一，日本和韩国是早期采用者之一。” 在美国，运营商不会在全国范围内部署；而是利用现有的4G网络，建成一座座5G“岛屿”。“事实上，尽管大部分5G网络尚未部署，5G手机也正在推出。”他谈到。（在巴塞罗那世界移动通信大会之后不久，Verizon宣布很快将在芝加哥和明尼阿波利斯的部分地区开始提供5G服务，并且不限流量。） 然后Mike转向Alastair，询问他对5G技术要求的看法。Alastair拿着他带给观众看的28 GHz硅基阵列说，毫米波技术比6GHz以下的5G技术要复杂得多，而且在设备层面上非常需要更多的线性功率。“我们需要尽一切努力来提高硅的线性功率。”他说。 “此外，热管理在无线电传输中始终至关重要，而且今后也会是这样。不瞒你们说，几十年前，当相控阵雷达首次问世时，最初投入使用的一些雷达因为过热而起火了。因此，我们迫切需要在控制热量的同时提高电源效率，还要在此过程中降低每个发射器的成本。虽然可以通过电路技巧达到部分效果，但根本上还是要从硅入手。”他说。 “格芯为我们开发了一些非常好的器件选项，让我们能够选择不同的参数来定制适合特定应用的器件，这样我们就可以在工作中，提高工作电压并通过建模来衡量最终的可靠性。这非常有价值，是我们两家公司之间深度合作的产物。”他表示。 Joachim指出，设计复杂的片上系统(SoC)并非易事，而要确保产品达到设计目标也不容易。为此，Synopsys与格芯密切合作开发IP核心技术，如低功耗DDR内存接口(LPDDR)、高带宽内存接口(HBM)、PCI Express等，以提高SOC设计人员的生产力并降低项目风险。“除了可以利用Synopsys和其他IP提供商的许多IP核心技术之外，今天的设计人员还可以访问高级架构探索工具，基于将在SoC上执行的实际软件环境，在架构层面优化SoC。” Cadigan最后向每位讨论嘉宾询问了格芯还应该做些什么。Joachim说格芯应该做比现在更多的事情：“复杂性越来越高，而这需要更密切的协作。”Joe重申了提高功率的重要性。“现在没有人使用滤波器，但随着我们向前发展，附近的频段会有竞争的运营商，因此需要更多的功率。” Alastair表示，封装会变得更加重要，不仅仅是为了散热，更是为了提高集成度。此外，他回应Joachim说，建模功能将变得更加重要，特别是为了衡量可靠性。 关于作者 Gary Dagastine是一位职业撰稿人，主要为EE Times、Electronics Weekly和许多专业媒体撰写关于半导体行业的文章。他是NanocEEhip Fab Solutions杂志的特约编辑，也是IEEE国际电子器件大会(IEDM)（全球最具影响力的半导体技术大会）的媒体关系主管。加入General Electric Co.之后，他开始涉足半导体行业，在该公司工作期间，他负责为GE功率、模拟和定制IC业务提供沟通支持。Gary毕业于纽约斯克内克塔迪联合大学。
MACOM和格芯合作将硅光子技术扩展到超大规模云数据中心和5G网络构建 March 5, 2019 协作协议扩展了现有关系，可提供必要的成本、规模和容量，用以实现100G、400G及更高的主流L-PIC部署 多源供应链在新加坡和纽约利用格芯的全球制造业务 预计300mm晶圆的生产规模将使云数据中心和5G网络端口呈指数级增长 马萨诸塞州洛厄尔和加利福尼亚州圣克拉拉，2019年3月5日 – MACOM Technology Solutions Inc.(“MACOM”)和格芯(“GF”)今天宣布战略合作，使用格芯当前一代硅光子产品90WG升级MACOM的创新激光光子集成电路(L-PIC™)平台，以满足数据中心和5G电信行业的需求。此次合作将利用格芯的300mm硅制造工艺来提供必要的成本、规模和容量，以期为超大规模数据中心互连和100G、400G及以上的5G网络部署实现主流L-PIC部署。 格芯的90WG基于该公司使用300mm晶圆处理的90nm SOI技术，可将光学器件（如调制器、多路复用器和检测器）以低成本集成到单个硅衬底中。MACOM的L-PIC技术解决了将激光器与硅基光子集成电路(PIC)对准的剩余关键挑战。利用MACOM获得专利的蚀刻刻面技术(EFT)激光器和获得专利的自对准EFT (SAEFTTM)工艺，MACOM的激光器可以高速和高耦合效率直接对准并连接硅光子芯片，从而加速在真正的工业规模应用中采用硅光子。 该行业正在进入云数据中心及5G光学构建中的高速光学连接的漫长升级周期。行业预测，2019年、2020年及以后将成为粗波分复用(CWDM)和PAM-4的强劲增长年，2019年整体需求量潜力将达到1000万台。凭借2016年实现160万个端口、2017年实现400万个端口和2018年实现600万个端口的记录，MACOM将与格芯合作以扩大L-PIC生产规模，旨在满足这一呈指数级增长的市场需求。 MACOM总裁兼首席执行官John Croteau表示，“随着每年数据中心内部带宽需求翻番，云服务提供商在迁移至100G及更高速率时供应受到限制。除此之外，电信运营商现在正为其5G网络构建采用相同的CWDM和PAM-4光学标准。高效扩展收发器容量和制造产能的能力至关重要。通过对齐格芯硅光子技术与MACOM的EFT激光器之间的产能扩充，以及迁移至300mm晶圆，我们相信，这种具有战略意义的合作将使我们能够满足行业需求，并使我们能够在未来几年继续为行业提供服务。” 格芯首席执行官汤姆∙嘉菲尔德表示，“作为硅光子解决方案和先进封装功能的领导企业，我们已经奠定了一个很好的基础，使我们的客户能够构建新一代高性能光互连。凭借我们深厚的制造专业知识，结合MACOM强大的技术，我们可以大规模提供差异化的硅光子解决方案，加快产品上市时间，并降低数据中心和新一代5G光学网络中客户端应用的成本。” 关于MACOM： MACOM通过为光学、无线和卫星网络提供突破性半导体技术，满足当今社会对信息不断增长的需求，从而实现更好的互联和更安全的世界。 今天，MACOM为基础设施提供支持，数百万人时刻通过该基础设施进行沟通交流、处理业务、旅行、了解资讯和娱乐。我们的技术提高了移动互联网的速度并扩大了覆盖范围，使光纤网络能够将以前难以想象的流量带到企业、家庭和数据中心。 为了保证我们的安全，MACOM技术将新一代雷达技术用于空中交通管制和天气预报，以及在现代网络战场上成功执行任务。 MACOM是领先的通信基础设施、航空航天和国防公司的理想合作伙伴，通过出色的团队和广泛的模拟RF、微波、毫米波和光子半导体产品组合，帮助解决网络容量、信号覆盖、能源效率和现场可靠性等领域的复杂挑战。 MACOM是半导体行业的支柱，通过为客户提供真正的竞争优势和为投资者提供出色价值的大胆技术进步，60多年来一直在努力改变世界。 MACOM的总部位于马萨诸塞州洛厄尔，已通过ISO9001国际质量标准和ISO14001环境管理标准认证。MACOM在北美、欧洲和亚洲设有设计中心和销售办事处。 MACOM、M/A-COM、M/A-COM Technology Solutions、M/A-COM Tech、Partners in RF & Microwave、The First Name in Microwave和相关徽标是MACOM的商标。所有其他商标均为其各自所有者的财产。有关MACOM的更多信息，请访问www.macom.com，在Twitter上关注@MACOMtweets，在LinkedIn和Facebook上加入MACOM或访问MACOM YouTube频道。 About GF: GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com. 关于前瞻性声明的特别说明： 本新闻稿包含基于MACOM的信念和假设以及MACOM目前可获得的信息的前瞻性声明。这些前瞻性声明反映了MACOM目前对未来事件的看法，并受可能导致这些事件或我们的实际活动或结果与任何前瞻性声明中所表达的内容产生重大差异的情况下的风险、不确定性、假设和变化的影响。尽管MACOM认为前瞻性声明中反映的预期是合理的，但它不能也不保证未来事件、结果、行动、活动水平、绩效或成就。请读者不要过分依赖这些前瞻性声明。许多重要因素可能导致实际结果与前瞻性声明所表明的结果大不相同，包括但不限于MACOM的10-K表上的年度报告、10-Q表上的季度报告和其他提交给美国证券交易委员会的文件的“风险因素”中描述的那些因素。无论是否出现新信息、未来事件或其他情况，MACOM均不承担公开更新或修订任何前瞻性声明的义务。 新产品免责声明： MACOM产品公告中的任何明示或暗示声明均不构成任何形式的保证或可保证的规范。对于任何产品销售，MACOM可能提供的唯一保证是MACOM与购买方之间关于此类销售的书面购买协议中包含的保证，并由正式授权的MACOM员工签署，或者，如果MACOM的采购订单确认如此指示，MACOM标准报价或销售条款和条件中包含的有限保修，其副本可在以下网址找到：https://www.macom.com/purchases 有关销售信息，请联系： North Americas — Phone:800.366.2266 Europe — Phone:+353.21.244.6400 India — Phone:+91.80.43537383 China — Phone:+86.21.2407.1588 媒体联系人： Ozzie Billimoria MACOM Technology Solutions Inc. 978-656-2896 [email protected] Colin Boroski Rainier Communications 508-475-0025 x142 [email protected] Anja-Maria Hastenrath embedded PR +49 (0)89 64913634-11 [email protected] Erica McGill GLOBALFOUNDRIES 518-795-5240 [email protected]
