Post-fab Services

Post-fab services are part of a GF collaborative supply chain model that utilizes both in-house and partner expertise for 2D, 2.5D and 3D interconnect. Drive limitless innovation with expert services that are tightly integrated into the overall manufacturing flow provided by OSAT (Outsourced Semiconductor Assembly and Test) and memory partners. Discover a quick, high-quality and cost-effective path to production for your design.

Key Features of GF Post-fab Services:
  • "A La Carte" or complete full turnkey manufacturing services ➞ faster time to market
  • In-house bump and probe capabilities ➞ fast yield feedback
  • Advanced packaging and test solutions ➞ differentiated end products
"A La Carte" or Complete Turnkey Manufacturing Services

GF manufacturing services are offered in "A La Carte" or complete turnkey options for faster time to market. Customers choose the flow that best fits their design and capabilities. This successful supply chain model is based on:


A collaborative model with more than 15 years of experience and success

Meet
Assembly and test co-development with leading-edge OSATs

Integrate
Development and validation of design flow, rules and tool alignment with EDA, IP and design vendors at the front end

Turnkey manufacturing services include:

  • Package design
  • Package and supplier selection
  • Custom tooling
  • Pricing negotiation
  • Quality/capacity/project management
  • Operations management
  • Supplier audit
Managed Turnkey Services

GF also provides a full, global turnkey flow from wafer tape-out to delivery of fully tested and packaged products. Turnkey service advantages include:

Cost

Single Purchase Order (PO) concept with a simplified billing system for the complete and customized silicon-to-package value chain

Meet
Optimized cycle time from planned and aligned process milestones in the value chain

Purpose
Dedicated turnkey Operations, Engineering/New Process Development, Quality, Accounts and Planning teams ensure seamless integration, exceptional quality, competitive cost and on-time delivery

In-house Bump and Probe Capabilities

With internal bump and probe capabilities, GF provides the fastest path to entitlement yields. Capabilities include:

Bump

  • High capacity – up to 60k/month
  • Lead free and Cu pillar in production
  • uBump in qualification
  • Fast prototype cycle times

Sort

  • Wide array of test platforms (190 testers in production)
  • Fully automated data transaction and handling
  • In-house probe card maintenance and repair
Advanced Packaging and Test Solutions

GF advanced packaging and test solutions provide a direct path to power, performance, cost and form-factor optimized solutions. Capabilities include:

- Novel wafer-level fan-out solutions (HD-FO)

- Non-monolithic integrated solutions (2.5/3D)

  • 2.5D silicon interposers
  • High bandwidth memory
               - Advanced memory integration with stacked memories
               - Integrated on interposer, parallel interface
               - Hybrid memory cube (standalone memory, serial interface)
  • 3D TSV at advanced nodes

Advanced test development and capabilities include:

  • RF, analog, embedded memory and mmWave applications
  • Expertise in test insertion for complex 2.5D and 3D solutions