SiFive Joins FDXcelerator™ Program to Bring RISC-V Core IP to GLOBALFOUNDRIES’ 22FDX® Process Technology November 28, 2017SiFive announced today that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, and will be making RISC-V CPU IP including SiFive’s E31 and E51 RISC-V cores available on GF’s 22FDX® process technology.
SiFive加入FDXcelerator™项目，将RISC-V核心IP引入格芯的22FDX®工艺技术 November 28, 2017SiFive announced today that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, and will be making RISC-V CPU IP including SiFive’s E31 and E51 RISC-V cores available on GF’s 22FDX® process technology.
AutoPro™: Helping to Make Connected, Autonomous Cars a Reality November 16, 2017By: Mark Granger The automotive market for semiconductors is shifting into high gear. Right now the average car has about $350 worth of semiconductor content, but that is projected to grow another 50 percent by 2023 as the overall automotive market for semiconductors grows from $35 billion to $54 billion. This strong growth is being driven by the need to develop what we are calling the ‘connected car.’ The term refers to the multiple electronic systems in a vehicle that collectively take data from wired and wireless sensors and combine it with high-performance processors and analog/power semiconductors, to provide the vehicle with semi-autonomous and ultimately fully autonomous capabilities. These capabilities include Advanced Driver Assistance Systems (ADAS) such as collision and blind spot warnings, sophisticated infotainment and telecommunications options, and precise electrical control of major vehicle subsystems like the powertrain, among many others. The move toward the connected car is driving fundamental change in the automotive supply chain, which is presenting GF with a unique opportunity. Traditionally, there have been separate and distinct tiers of automotive suppliers. At the top of the supply chain are the automobile manufacturers themselves, known as the original equipment manufacturers, or OEMs. Tier 1 suppliers such as Bosch, Continental, Delphi, etc. supply automotive-grade parts and systems directly to the OEMs. Tier 2 is where we have always fit in. Tier 2 suppliers such as semiconductor companies have traditionally supplied the Tier Ones with parts for automotive systems, and have tended not to work directly with the OEMs. However, this is changing. As more electronics-based systems are used in automobiles and as they become more complex, there is a greater need to understand system architectures and networks, and to bring complex IP and quality standards to the design and manufacture of the SoCs and other chips that meet those needs. That is exactly what we do here at GF. It’s why we recently announced a platform called AutoPro™ that provides OEMs and other automotive customers with a broad set of technology solutions, design and manufacturing services that help them implement connected intelligence while minimizing certification efforts and speeding time to market. AutoPro is built on our 10 years of automotive-industry experience and leverages GF’s diverse technologies for automotive customers. It includes our silicon germanium (SiGe), FD-SOI (FDX™), RF and advanced CMOS FinFETs, packaging and intellectual property (IP) technologies. Importantly, it also includes system-level architects who work directly with OEMs. In recent years GF has hired many people with extensive automotive SoC experience, such as myself, and the networking system designers in our industry-leading ASIC business from the IBM Microelectronics acquisition are unparalleled. AutoPro solutions support the full range of AEC-Q100 quality grades from Grade 2 to Grade 0, and, in addition, we ensure technology readiness, operational excellence and a robust automotive-ready quality system through our AutoPro Service Package. This gives customers access to the latest technologies designed to meet strict automotive quality requirements defined in the ISO, International Automotive Task Force (IATF), Automotive Electronics Council (AEC), and VDA (German) standards. Although AutoPro was only recently introduced, we are already at work with automotive OEMs. One that we can mention is Audi, which has called our automotive offerings essential for delivering next-generation car electronics faster and with high reliability. It’s early days, but the road is open before us. About Author Mark Granger GLOBALFOUNDRIES’ Vice President of Automotive, Mark Granger, has been in charge of high performance SoC product design and product management for about 20 years, most recently at NVIDIA where he led the company’s efforts to provide leading-edge application processors for autonomous vehicles.
格芯及复旦微电子团队交付下一代双界面智能卡 November 16, 2017格芯 55LPx 平台内含嵌入式非易失性存储器和集成射频，助力复旦微电子打造中国最先进的 CPU 银行卡。 美国加利福尼亚州圣克拉拉及中国上海，（2017年11月15日）——格芯（GLOBALFOUNDRIES）及上海复旦微电子集团股份有限公司今日宣布，已通过使用格芯55纳米低功率扩展(55LPx) 技术平台，制造出下一代双界面 CPU 卡芯片。格芯 55LPx 平台能够将多种功能集成到单芯片上，从而提供安全、低功耗且具成本效益的解决方案，该解决方案尤其适合中国银行卡市场，包括金融、社会保障、交通、医疗和移动支付等应用。 复旦微电子集团股份有限公司的双界面 CPU 卡 FM1280，支持接触式和非接触式通信模式，采用低功耗 CPU 以及经过格芯硅验证的 55LPx 射频 IP。FM1280 使用了 Silicon Storage Technology（SST) 基于 SuperFlash 内存技术的嵌入式 EEPROM 存储器，以充分保障用户代码和数据的安全性。 “随着智能银行卡的使用日益广泛，为保持我们在该市场的领导地位，低功耗解决方案十分关键。”复旦微电子集团技术工程副总裁沈磊表示，“我们的 FM1280 卡功耗更低，可靠性更强，并使用了先进工艺节点。格芯先进的 55LPx 平台，具有低功耗逻辑电路和高度可靠的嵌入式非易失性存储器，是我们下一代银行卡的理想选择。复旦微电子集团非常高兴能与格芯继续保持长期合作关系，生产行业领先的产品。” 55nm LPx 平台提供让产品快速量产的解决方案，包括 SST 的 SuperFlash® 内存技术，该技术已经在消费、工业和汽车应用领域完全被认证通过了。格芯 55LPx 平台 SuperFlash® 内存技术实现了极小尺寸的存储单元、超快的读取速度、优越的数据保持性和可擦写次数。 “格芯非常高兴能与中国智能卡行业公认领导者——复旦微电子集团开展合作。”格芯嵌入式存储器事业部副总裁 Dave Eggleston 表示，“复旦微电子集团加入格芯客户群快速增长的 55LPx 平台，该平台为智能卡、可穿戴物联网、工业微程序控制器（MCU）及汽车市场提供优越的低功耗逻辑电路、嵌入式非易失性内存及射频IP的组合。” 格芯 55LPx 技术平台已在公司新加坡的300毫米工厂生产线上批量生产。格芯此前曾宣布， 安森美半导体及 Silicon Mobility 目前正分别将格芯 55LPx 平台运用于可穿戴物联网和汽车产品中。 工艺设计工具包（PDK）现已发布，经过硅验证的 IP 也已大量供应。更多关于格芯主流 CMOS 解决方案的信息，请联系您的格芯销售代表，或访问网站：www.globalfoundries.com/cn。 关于上海复旦微电子集团股份有限公司 上海复旦微电子集团股份有限公司是从事超大规模集成电路的设计、开发和提供系统解决方案的专业公司，也是国内集成电路设计行业最先上市的企业之一。 自 1998 年成立以来，复旦微电子已逐渐成长为中国领先的非接触式卡芯片制造商，累计交付了 4 亿颗非接触式/双界面 CPU 卡芯片。在中国交通卡领域，其客户遍布北京、上海、广州、深圳和几乎所有省会城市，占 50% 以上市场份额。此外，公司还每年交付 3000 多万颗非接触式读卡器芯片及 10 亿多颗非接触式逻辑安全卡，成为这两大领域的行业引领者。 关于格芯 格芯是全球领先的全方位服务半导体代工厂，为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务。伴随着全球生产基地横跨三大洲的发展步伐，格芯促生了改变行业的技术和系统的出现，并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉投资公司（Mubadala Investment Company）所有。欲了解更多信息，请访问 https://www.globalfoundries.com/cn。 媒体垂询： 杨颖（Jessie Yang） GLOBALFOUNDRIES (021) 8029 6826 [email protected] 刘枫（Liu Feng) (021) 6565 5050 [email protected]
GLOBALFOUNDRIES Demonstrates Industry-Leading 112G Technology for Next-Generation Connectivity Solutions November 15, 2017High bandwidth, low power SerDes IP portfolio enables ‘connected intelligence’ in data centers and networking applications Santa Clara, Calif., November 15, 2017 – GLOBALFOUNDRIES today announced it has demonstrated the next generation of 112Gbps SerDes capability. GF’s High Speed SerDes (HSS) solutions include best-in-class architecture for 112G to 56G, 30G and 16G SerDes IPs to enable connectivity for cloud computing, hyperscale data center, and networking applications. “GF’s demonstration of 112Gbps SerDes architecture establishes the capability of running extremely high, next-generation interconnect technology that can deliver long-reach capabilities to data center and enterprise applications,” said Mike Cadigan, senior vice president of global sales and business development at GF. “As a result, our customers will soon have access to design best-in-class ASIC solutions to meet the explosive bandwidth growth in data center and networking applications as the industry transitions to a new era of connected intelligence.” The 112G SerDes is designed in GF’s high-performance ASIC FX-14™ technology, and is capable of supporting several multi-level signaling schemes while targeting 25dB+ insertion loss interconnects. Flexibility has been built into the 112G SerDes platform in order to analyze the efficacy of a variety of higher level encoding schemes such as Forward Error Correction. The learning from this effort is being used to develop GF’s 112G SerDes IPs in FX-7™ technology and leverages the foundry’s leading-edge 7nm FinFET technology platform, 7LP, to enable high-speed connectivity and low-power solutions as well as optical variants, for current and future leading-edge networking, compute and storage applications. Customers are presently designing advanced ASIC solutions in the 14LPP and 7LP process technologies using the 56Gbps and other FX-14 SerDes cores. GF has demonstrated its ability to deliver a true long-reach SerDes solution by delivering a 56Gbps PAM4 signal on the company’s 14nm FinFET process and is shipping development boards in customer channels. Enabling 112G communication solutions will allow customers to double chip bandwidth in next generation products. To learn more about GF’s high-performance ASIC solutions, go to www.globalfoundries.com/ASICs. About GF: GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card November 15, 2017GF’s 55LPx platform with embedded non-volatile memory and integrated RF enables Fudan to create China’s most advanced CPU bank card Santa Clara, Calif. and Shanghai, China, November 14, 2017 – GLOBALFOUNDRIES and Fudan Microelectronics Group today announced they have produced a next generation dual interface CPU card, using GF’s 55nm Low Power Extended (55LPx) technology platform. GF’s 55LPx platform has the capability to integrate multiple functions onto a single chip that results in a secure, low power, and cost effective solution uniquely suited for the Chinese bank card market, including financial, social security, transportation, healthcare, and mobile payment applications. Fudan’s dual interface CPU card, FM1280, supports both contact and contactless modes of communication, and shares a low power CPU that automatically selects the desired interface. The non-contact interface utilizes GF’s readily available and silicon-proven 55LPx RF IP. Fudan’s FM1280 also uses the embedded EEPROM-based on Silicon Storage Technology (SST) SuperFlash® memory technology to ensure user code and data security. “With the increasing usage of smart bank cards, and in order to maintain our leadership position in this market, a solution with low power consumption was critical,” said Shen Lei, VP of Technology Engineering at Fudan. “Our FM1280 card offers lower power consumption, enhanced reliability, and uses an advanced process node. GF’s advanced platform, 55LPx, with its low power logic and highly reliable embedded non-volatile memory, is ideal for our next generation bank card offering. Fudan is pleased to continue our long-standing relationship with GF to manufacture our industry leading products.” The 55nm LPx platform provides a fast path-to-product solution, and includes SST’s SuperFlash® memory technology, which is fully qualified for consumer, industrial and automotive applications. GF’s 55LPx implementation of SuperFlash offers a small bitcell size, very fast read speed, and superior data retention and endurance. “GF is delighted to expand our relationship with Fudan Microelectronics, who is the acknowledged leader in the Chinese smart card industry,” said Dave Eggleston, Vice President of Embedded Memory at GF. “Fudan joins our rapidly growing customer base for GF’s 55LPx platform, which offers a superior combination of low power logic, embedded non-volatile memory and RF IP for the smart card, wearable IoT, industrial MCU and automotive markets.” GF’s 55LPx-enabled platform is in volume production at the foundry’s 300mm line in Singapore. GF has previously announced that On Semiconductor and Silicon Mobility are currently using GF’s 55LPx platform for wearable IoT and automotive products. Process design kits, and an extensive offering of silicon proven IP, are available now. For more information on GF’s mainstream CMOS solutions, contact your GF sales representative or go to globalfoundries.com. About Fudan Shanghai Fudan Microelectronics Group Co., Ltd. is a company specialized in the design, development and system solution provision of super-large-scale integration, and also one of the earliest listed companies in integrated circuit design field of China. Since its establishment in 1998, Fudan has gradually grown into the leading manufacturer of contactless card chips in China, and delivered a cumulative total of 400 million contactless/dual-interface CPU card chips. In the transportation card field of China, its clients are widely distributed in Beijing, Shanghai, Guangzhou, Shenzhen and almost all the provincial capitals, with a 50%+ market share. It has also delivered more than 50 million contactless card reader chips and more than one billion contactless logic security cards annually, leading the industry in both cases. About GF: GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
Andes 32-bit CPU IP Cores Implemented on GLOBALFOUNDRIES 22FDX® Process Technology October 24, 2017Andes Technology Corporation (TWSE: 6533) and GLOBALFOUNDRIES (GF) today jointly announced that Andes’ 32-bit CPU IP cores have been implemented on GF’s 22nm FD-SOI (22FDX®) technology.
Andes 32位CPU IP内核使用格芯22FDX®工艺技术 October 24, 2017Andes Technology Corporation (TWSE: 6533) and GLOBALFOUNDRIES (GF) today jointly announced that Andes’ 32-bit CPU IP cores have been implemented on GF’s 22nm FD-SOI (22FDX®) technology.
Menta Joins GLOBALFOUNDRIES’ FDXcelerator Partner Program October 23, 2017Menta today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program.
GTC Shanghai Highlights GF’s Momentum in China October 23, 2017Company shares details of technology roadmap and customer adoption in the world’s fastest-growing market for semiconductors Shanghai, October 23, 2017 – The 2017 GLOBALFOUNDRIES Technology Conference (GTC) was held today in Shanghai, with GF executives, customers, partners and leaders in the Chinese semiconductor industry gathering to discuss the technologies that will enable a new era of connected intelligence. At the event, GF senior executives shed light on the company’s innovative technologies, design solutions, and manufacturing services. The company also highlighted growing momentum around its differentiated 22FDX® technology, including customer adoption by several leading Chinese chip designers. Mike Cadigan, GF’s senior vice president for global sales and business development, delivered a keynote speech, emphasizing GF’s expectations to become a strong leader in the Chinese semiconductor market. “Along with the rapid growth of customers, markets and applications in this region of the world, we are also continuously developing new technologies for enabling connected intelligence,” Cadigan said. “China is definitely one of our most important markets, and we will keep bringing advanced and differentiated technologies here to help our customers grow and succeed.” At the event, GF revealed three Chinese customers that will be adopting its new 22FDX technology for next-generation wireless, battery-powered applications. Shanghai Fudan Microelectronics Group will adopt the 22FDX platform to design and develop highly reliable servers, AI and smart IoT intelligent products in 2018. Rockchip will apply 22FDX technology in the design of ultra-low power WiFi smart hardware SoC and high-performance AI processers. Hunan Goke Microelectronics is planning to adopt 22FDX in its next generation of IoT chips. China is a key region for GF’s future growth plans. The company is building an advanced 300mm semiconductor fab in Chengdu, where a “truss-hoisting” ceremony was recently held to commemorate a major milestone in the construction of the facility, which will be called Fab 11. The construction of the fab is progressing at a fast pace and is on track to be completed in early 2018. The company is also working closely with the Chengdu municipality to expand the FD-SOI ecosystem, with an investment of more than $100 million to make Chengdu a center of excellence for FDX IC design and IP development. Several leading semiconductor companies have already committed to supporting the ecosystem initiative, including Invecas, GF’s advanced IP development partner. Invecas has established a strong presence in China, including a recently expanded engineering team in Shanghai and Shenzhen and a commitment to set up an R&D center in Chengdu to develop and support advanced IP and designs for FD-SOI systems. About GF: GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit https://www.globalfoundries.com. Contact: Jessie Yang(021) 8029 6826[email protected]
