GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC Family June 19, 201755nm LPx RF-enabled platform, with SST’s highly reliable embedded SuperFlash®, provides low power and cost for IoT and “Connected” Health and Wellness Devices Singapore and Santa Clara, Calif., June 19, 2017 – GLOBALFOUNDRIES and ON Semiconductor (Nasdaq: ON) today announced the availability of a System-on-Chip (SoC) family of devices, on GF’s 55nm Low Power Extended (55LPx), RF-enabled process technology platform. ON Semiconductor’s new RSL10 products are based on a multi-protocol Bluetooth 5 certified radio SoC capable of supporting the advanced wireless functionalities in IoT and “Connected” Health and Wellness markets. “Bluetooth low energy technology continues to advance as the key enabler for connecting IoT devices, especially with low power consumption requirements,” said Robert Tong, vice president of ON Semiconductor’s Medical and Wireless Products Division. “GF’s 55LPx platform – with its low power logic and highly reliable embedded SuperFlash® memory combined with proven RF IP – was an ideal match. The RSL10 family offers the industry’s lowest power consumption in Deep Sleep Mode and Peak Receiving Mode, enabling ultra-long battery life, and supporting functionalities like Firmware Over the Air updates. ON Semiconductor’s new RSL10 SoCs use these advanced features to address a wide range of applications including wearables and IoT edge-node devices such as smart locks and appliances.” “GF’s 55LPx platform, combined with ON Semiconductor’s design, has delivered wearable SoC technology at 55nm, with industry leading energy efficiency,” said David Eggleston, vice president of embedded memory at GF. “This is another proof point that 55LPx is becoming the preferred choice for SoC designers that are seeking cost effective performance, low power consumption, and superior reliability in extreme environments.” GF’s 55nm LPx RF-enabled platform provides a fast path-to-product solution that includes silicon qualified RF IP and Silicon Storage Technology’s (SST) highly reliable embedded SuperFlash® memory featuring: Very fast read speed (<10ns) Small bitcell size Superior data retention (> 20 years) Superior endurance (> 200K cycles) Fully qualified for Auto Grade 1 operation (AEC-Q100) GF’s 55LPx eFlash platform has been in volume production at the foundry’s 300mm line in Singapore since 2015. The 55LPx eFlash platform is a cost effective solution for a broad range of products, ranging from wearable devices to automotive MCUs. Customers can start optimizing their chip designs with GF’s process design kits, enabling designers to develop differentiated eFlash solutions that require cost effective performance, low power consumption, and superior reliability in extreme environments. For more information on GF’s mainstream CMOS solutions, contact your GF sales representative or go to www.globalfoundries.com. To learn more about the RSL10 product family, visit the product page and read the “Bringing Industry’s Lowest Power to Bluetooth Low Energy Technology” blog . To request samples or order an evaluation board, please contact your local ON Semiconductor sales representative. About ON Semiconductor ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient, power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace and defense applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance and ethics program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions. For more information, visit https://www.onsemi.com. About GLOBALFOUNDRIES GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. GLOBALFOUNDRIES® and the GLOBALFOUNDRIES logo and sphere design are trademarks and/or service marks of GLOBALFOUNDRIES Inc. in the United States and other jurisdictions. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected] Brittany BaguioON Semiconductor408) 822-2196[email protected]
格芯和安森美半导体提供业界最低功耗的蓝牙®低能耗SoC系列 June 19, 201755nm LPx RF功能平台，SST高可靠性的嵌入式SuperFlash®，为IoT和“连接”健康与健康设备提供低功耗和低成本的优势。 新加坡和加利福尼亚州圣克拉拉，2017年6月19日 – 格芯和安森美半导体（纳斯达克股票代码：ON）今天宣布，在格芯55nm低功耗扩展（55LPx）上提供了片上系统（SoC）系列器件，支持格芯的制程技术平台。安森美半导体的新RSL10产品基于多协议蓝牙5认证无线电SoC，能够支持物联网和“连接”健康与健康市场中的先进无线功能。 安森美半导体医疗和无线产品部副总裁罗伯特·汤（Robert Tong）表示：“蓝牙低功耗技术能够作为连接物联网设备的关键推动因素，并能满足低功耗的需求，这种技术将会继续进步。格芯的55LPx平台采用低功耗逻辑和高度可靠的嵌入式SuperFlash®存储器，与经过验证的射频IP结合，和将成为非常理想的匹配组合。RSL10系列在深度睡眠模式和峰值接收模式下可以提供业界最低的功耗，实现超长的电池寿命，并支持类似固件的升级更新功能。安森美半导体的新型RSL10 SoC使用这些高级功能来处理各种应用，包括可穿戴式和物联网边缘节点设备，如智能锁和电器。” “ 格芯的嵌入式存储部的副总裁David Eggleston表示：“格芯的55LPx平台与安森美半导体的设计相结合，在55nm上提供了可穿戴式SoC技术，并且具有行业领先的能源效率。“这是另一个可靠的证明，可以证明55LPx正在成为SoC设计师的首选。这些设计师一直都在追求高性价比，低功耗，以及在极端环境中卓越的可靠性。” 格芯的55nm LPx 射频功能平台提供了快速的到达产品解决方案的途径，其中包括硅验证合格的射频IP和硅存储技术（SST）高度可靠的嵌入式SuperFlash®内存，其特点如下： 读取速度非常快（<10ns） 较小的位单元面积 优异的数据保留（> 20年） 卓越的耐力（> 200K周期） 完全符合汽车1级操作（AEC-Q100） 格芯的55LPx eFlash平台自2015年起在新加坡的300mm生产线上批量生产。55LPx eFlash平台是一款具有性价比的解决方案，适用于从穿戴式设备到汽车MCU的广泛产品。 客户可以通过格芯的工艺设计套件来开始优化其芯片设计，使设计人员能够开发差异化的eFlash解决方案，这些解决方案在极端环境中需要具有高性价比，低功耗和卓越的可靠性表现。 有关格芯主流CMOS解决方案的更多信息，请联系您的格芯销售代表或访问 www.globalfoundries.com. 要了解有关RSL10产品系列的更多信息，请访问产品页面，并阅读“带来业界最低工行的蓝牙低功耗技术”博客。要求样品或订购评估版，请联系您当地的安森美半导体销售代表。 关于安森美半导体 安森美半导体（纳斯达克股票代码：ON）正在推动节能创新，使客户能够减少全球能源消耗。该公司是半导体解决方案的领先供应商，提供全面的节能，电源管理，模拟，传感器，逻辑，时序，连接，离散，SoC和定制设备。该公司的产品帮助工程师解决其在汽车，通信，计算，消费，工业，医疗，航天和国防应用中的独特设计挑战。安森美半导体在北美，欧洲和亚太地区的主要市场运营着可靠的世界级供应链和质量项目，强大的合规和道德项目，以及制造设施，销售办事处和设计中心网络。欲了解更多信息，请访问https://www.onsemi.com. 关于格芯 格芯是提供全方位服务的领先半导体晶圆制造商，为世界上最具创新意识的科技公司提供独特的设计，开发和制造服务。格芯的生产制造业务遍布全球三大洲。格芯使技术和系统转型成为可能，并且帮助客户拥有塑造市场的力量。 格芯是Mubadala Development Company旗下公司。欲了解更多信息，请访问公司官方网站 https://www.globalfoundries.com. GLOBALFOUNDRIES®和GLOBALFOUNDRIES徽标和球形设计是GLOBALFOUNDRIES Inc.在美国和其他司法管辖区的商标和/或服务标志。 联系人: Erica McGill 格芯 (518) 795-5240S [email protected] Brittany Baguio 安森美 (408) 822-2196 [email protected]
eFPGA Replaces Crystal Ball June 15, 2017By: Timothy Saxe Most electrical engineers are familiar with FPGAs, and many have had experience using standalone FPGAs. eFPGA (embedded FPGA) technology allows a semiconductor company to embed an FPGA in an SoC or ASIC. The industry knows from bitter experience (40 defunct FPGA startups and counting) that programmable logic is not easy. The main stumbling block for FPGA startups has been the design environment, not the silicon. The simple fact is that the silicon is only as good as the tools that support it – they must be straightforward, robust, easy-to-use, and deliver excellent quality of results. As if that were not challenging enough, eFPGA products also exist in the ASIC design environment which uses a different tool flow. Thus a successful eFPGA must have an excellent silicon implementation, excellent ASIC tool support, and an excellent FPGA tool flow. Fortunately there are major benefits to embedding FPGA: lower power, higher performance, lower cost, improved future proofing and design flexibility. QuickLogic started life 29 years ago producing standalone FPGAs. 15 years ago we saw that the economics had changed to favor mixing ASIC cores with programmable logic, and we started down the road of developing embedded FPGA solutions. At that time, various FPGA startups were trying to sell eFPGA technology, but there was no uptake. The reason there was no uptake was economic: masks were cheap, ASIC gates were cheap and FPGA logic was expensive. Roll the clock forward 15 years, and now things have changed: masks are expensive, ASIC gates are cheaper and FPGA logic is also cheaper. Our latest device, the EOS™ S3 System-on-Chip (SoC) targets the smartphone, wearable, and hearable markets. These are very price sensitive and power sensitive products. Fortunately the GLOBALFOUNDRIES 40nm cost structure allows us to meet the price requirements with a product that has enough eFPGA to be really useful. This enabled us to have a cost effective product where the hardware can be adapted for different markets without incurring mask costs. In addition, having eFPGA allows us to move critical tasks from software into hardware to save power, which is critical for power sensitive applications. A small digression on the meaning of power sensitive: everyone claims to be power sensitive. To server designers using a 25Watt FPGA to offload a 90Watt CPU is being power sensitive. In the wearable market where people want six months from a CR2450 battery the average system power must be 410uW, and in the IoT market where people want three years from two AA batteries, the average system power must be 318uW. Our focus is on the wearable and IoT markets, where designers expect the compute unit to use only 25% of the system power: 100uW for wearables, and 80uW for IoT. Since we operate in markets that require low power, we see GLOBAFOUNDRIES 22FDX® process as the workhorse of the future for power sensitive markets. The economics are better, and dynamic back-bias should enable designers to reduce average system power by 25% to 50% compared to 40nm. Particularly important to IoT, the eMRAM, coming soon to 22FDX, enables both single chip devices as well as ultra-low power sleep states more cost effectively than flash memory. Why now? What has changed in the past 15 years? First, the bets are getting bigger: the combination of mask costs and software costs have soared. Second, markets are more fragmented, which means lower volumes per design. Finally, future growth lies in IoT, which seems to mean a lot of different things. Now if you have a crystal ball that accurately predicts the future, you can simply produce an ASIC that meets those needs. But if you don’t, including a QuickLogic ArcticPro™ eFPGA block in your design will let you: Update your hardware when standards update or evolve Update your features when you discover new market needs Create multiple product variants from a single mask set Get to market more quickly, and stay in market longer by evolving product features Over the years, we have found that this is the hardest point to grasp. Talk to the ASIC team and they will tell you, correctly, to just tell them what you need and they can implement it better. The disconnect is that they are not responsible for defining what is required. Now you have another option. Include a small block of eFPGA – you will find it surprisingly economical in 22FDX. QuickLogic has been doing this for 15 years, so we understand what it takes for a successful integration – our methodology makes it no harder than adding any other hard macro. We also understand what a production quality FPGA design flow looks like – we’ve been supplying them to the most quality and reliability-conscious markets in the world – aerospace, defense, and instrumentation & test markets for 30 years. We understand really low power – we’ve been doing that for five years, and FD-SOI is the perfect complement to the ArcticPro architecture. Finally, eco-system is vital to the diverse needs of IoT, and the GLOBAFOUNDRIES FDXcelerator™ brings together a diverse collection of proven IP, such as our ArcticPro eFPGA, that enables silicon architects to rapidly develop high value, low power systems-on-a-chip. About Author Timothy SaxeSenior VP of Engineering and CTO Timothy Saxe (Ph.D) has served as our Senior Vice President and Chief Technology Officer since November 2008. In August 2016, he expanded the role to include Senior Vice President of Engineering. Mr. Saxe has been with QuickLogic since May 2001 and during the last 15 years has held a variety of executive leadership positions including Vice President of Engineering and Vice President of Software Engineering. Dr. Saxe was Vice President of FLASH Engineering at Actel Corporation, a semiconductor manufacturing company. Dr. Saxe joined GateField Corporation, a design verification tools and services company formerly known as Zycad, in June 1983 and was a founder of their semiconductor manufacturing division in 1993. Dr. Saxe became GateField’s Chief Executive Officer in February 1999 and served in that capacity until GateField was acquired by Actel in November 2000. Mr. Saxe holds a B.S.E.E. degree from North Carolina State University, and an M.S.E.E. degree and a Ph.D. in electrical engineering from Stanford University.
eFPGA,未来尽在掌握 June 15, 2017作者: Timothy Saxe 几乎所有电子工程师都对FPGA熟悉,而其中一大部分甚至对独特的FPGA具备经验. eFPGA (嵌入式 FPGA)技术让半导体公司可以将FPGA嵌入到SoC或ASIC中.。行业曾从经验中获得沉痛的经验(至此已失败的FPGA初创公司已有40家,并且数量仍不断增加),认为编译性逻辑是很困难的。初创公司最大的难题来自于设计环境，而不是硅技术本身。事实上，硅只有在拥有对应支持工具时才可发挥优势–工具必须直接浅显、可靠并易于使用，还必须提供卓越的品质和结果。如果这些还不够具备挑战性，ASIC设计环境还需要一套完全不同的工具设计流程。所以，成功的嵌入式FPGA必须拥有卓越的硅实操性、卓越的ASIC工具支持和卓越的FPGA工具流程。幸运的是, 嵌入式FPGA拥有显著的优势: 低功耗、高性能、低成本、良好的发展性和设计灵活度。 QuickLogic 在29年前成立并制造独特的FPGA。15年前我们看到了ASIC核心与可编程逻辑的技术结合趋势，并开始在发展嵌入式FPGA设计的道路上前进。在当时，多家FPGA初创公司企图开发eFPGA技术，可是都没有将其实现。原因是在当时，此技术的实现不符合经济效益，掩膜十分廉价，ASIC逻辑门很便宜，而FPGA非常昂贵。15年后，事情发生了改变：掩膜非常昂贵，而ASIC逻辑门愈发廉价，而FPGA的成本也下降了。我们最新的设备， EOS™ S3 SoC 主要针对智能手机、穿戴式设备和声音市场。此类市场对于成本和功耗十分敏感。所幸格芯40nm成本结构让我们可以满足成本需求的同时拥有十分实用的eFPGA产品。 我们的产品可以避免掩膜花销，为不同市场做出调整。此外， eFPGA让我们将难题在硬件层次上解决，节省了功耗。 此处引入有关功耗敏感性的题外话: 每个人都声称自己的产品是对功耗十分敏感的。对于服务器设计者来说,使用25瓦特的FPGA来超载一块90瓦特的CPU就是功耗敏感。在穿戴式设备市场，人们希望一块CR2450电池可以支撑6个月，那系统平均功耗必须是410微瓦，而对于物联网市场，大家希望AA电池可以支持3年，那系统平均功耗必须是318微瓦。我们的焦点在可穿戴式和物联网市场，设计者可以期待计算单元只占系统25%的功耗：可穿戴式设备为100uW；物联网为80uW。 因为我们的操作主要在低功耗领域，我们认为格芯22FDX® 制程是未来功耗敏感市场的出路。与40nm制程对比, 22FDX® 经济效应更好,而且动态背极偏置将使设计者将系统平均功耗降低25%到50%。这对于物联网市场尤为重要，将要使用22FDX® 的eMRAM技术，将实现单芯片设备和超低功耗睡眠模式，比闪存内存成本效率更高。 为什么是现在？这过去的15年来发生了什么？ 第一，投入更加大了：掩膜和软件成本已突破天际。 第二，市场分化更加严重了，意味着每个设计的产量将下降。最后，未来的物联网技术，看起来与各种不同的事物相关。 如果你手上有个水晶球，可准确预测未来，你可以直接制造符合所有要求的ASIC。可如果你没有水晶球，在你的设计中加入一个QuickLogic ArcticPro™ eFPGA模块，将使你可以： 当标准变化时更新你的硬件 当出现新的市场需求时更新产品的功能 从同一组掩膜组合中制造出不同的产品 更快进入市场，通过提升产品功能延续市场寿命 多年以来,我们发现这是最难把握的要点。与ASIC组联系，他们会让你直接告诉他们你的要求，他们将更好地实现。断层的原因是他们并不是定义需求的人。现在你有另一个选择。给自己的产品加入一个eFPGA模块，你会惊喜地发现，利用22FDX技术，这个模块非常经济。QuickLogic已有15年经验，我们了解成功的集成所需的要素，我们的方法让集成与加入其它硬件模块一样简单。我们也懂得高品质FPGA生产设计流程，我们已经对质量要求最高的航空市场、防御系统和工具及测试市场供应产品长达30年。我们懂得真正的低功耗，我们已经在此方向钻研5年，FDSOI是ArcticPro架构的完美补充。最后，生态系统对于物联网的多种需求是最重要的，而格芯的FDXcelerator™计划将多种经验证的IP，例如我们的ArcticPro，集中到了一起，让硅架构快速发展，成为高价值地功耗的芯片上系统。
格芯推出面向数据中心、机器学习和5G网络的7纳米专用集成电路平台 June 14, 2017 FX-7TM产品采用格芯7纳米FinFET工艺，提供业界一流的知识产权及解决方案 加利福尼亚，圣克拉拉（2017年6月14日）—— 格芯今日宣布推出其基于7纳米FinFET工艺技术的FX-7TM专用集成电路（ASIC）。FX-7是一个集成式设计平台，将先进的制造工艺技术与差异化的知识产权和2.5D/3D封装技术相结合，为数据中心、机器学习、汽车、有线通信和5G无线应用提供业内最完整的解决方案。 基于FX-14的持续成功，凭借业内领先的56G SerDes技术和专用集成电路专长，FX-7提供包括高速SerDes（60G, 112G）在内的全方位定制接口知识产权和差异化存储解决方案，涵盖低功耗SRAM、高性能嵌入式TCAM、集成式DACs/ADCs和ARM处理器，以及诸如2.5D/3D的先进封装选择。此外，FX-7产品组合可面向以超大型数据中心、5G网络、机器与深度学习应用为代表的低功耗和高性能应用，为其提供全新的设计方法和复杂的ASIC解决方案。未来，FX-7有望被运用于支持汽车ADAS及图像应用的解决方案。 格芯ASIC业务部高级副总裁Mike Cadigan 表示：“随着全球网络中数据流量和带宽的爆炸性增长，我们的客户不断提出新的需求。利用我们最先进的7LP FinFET工艺技术，FX-7产品能为面向诸如数据中心、深度计算、无线网络等新兴领域的客户，提供最先进的低功耗、高性能ASIC解决方案，从而不断提升我们为客户服务的领导者形象。” “得益于格芯在硅芯片的制造专长与IBM前半导体技术业务的有力结合，格芯的7纳米FinFET工艺技术展示了其先进科技和市场领导地位，”TIRIAS Research 创始人兼首席分析师Jim McGregor,表示，“通过其最新FX-7 ASIC产品，格芯将业务版图从传统代工客户拓展至新一代系统公司，这些公司正寻求将前沿芯片工艺应用于从人工智能的深度学习到下一代5G网络等广泛领域。” FX-7 ASIC产品设计套件现已就绪，预计在2019年实现量产。 ### 关于格芯 格芯是全球领先的全方位服务半导体代工厂，为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务。伴随着全球生产基地横跨三大洲的发展步伐，格芯促生了改变行业的技术和系统出现，并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉发展公司（Mubadala Development Company）所有。欲了解更多信息，请访问 https://www.globalfoundries.com。 联系方式 Erica McGill GF (518) 795-4250 [email protected] 杨颖（Jessie Yang） (021) 8029 6826 [email protected] 石燕 （Sherry Shi） 86 15900477699 [email protected]
格芯交付性能领先的7纳米FinFET技术在即 June 14, 2017 与原有的14纳米FinFET相比，全新的7LP技术将提升40%的性能 加利福尼亚，圣克拉拉（2017年6月14日）—— 格芯今日宣布推出其具有7纳米领先性能的（7LP）FinFET半导体技术，其40%的跨越式性能提升将满足诸如高端移动处理器、云服务器和网络基础设施等应用的需求。设计套件现已就绪，基于7LP技术的第一批客户产品预计于2018年上半年推出，并将于2018年下半年实现量产。 2016年9月，格芯曾宣布将充分利用其在高性能芯片制造中无可比拟的技术积淀，来研发自己7纳米FinFET技术的计划。由于晶体管和工艺水平的进一步改进，7LP技术的表现远优于最初的性能目标。与先前基于14纳米FinFET技术的产品相比，预计面积将缩小一半，同时处理性能提升超过40%。目前，在格芯位于纽约萨拉托加县的全球领先的Fab 8晶圆厂内，该技术已经做好了为客户设计提供服务的准备。 格芯CMOS业务部高级副总裁Gregg Bartlett先生表示：“我们的7纳米FinFET技术正在按计划进行开发。我们看到，格芯在2018年计划出厂的多样化产品对客户有着强大吸引力。在推动7纳米芯片于未来一年中实现市场化的同时，格芯正在积极开发下一代5纳米及其后续的技术，以确保我们的客户能够在最前沿领域内获取世界级的技术蓝图。” 格芯还将持续投资下一代技术节点的研究与开发。通过与合作伙伴IBM和三星的密切合作，2015年格芯便宣布推出7纳米测试芯片。此后，格芯又于近日宣布业内首款基于硅纳米片晶体管的5纳米的样片。目前，格芯正在探索一系列新的晶体管架构，以帮助其客户迈进下一个互联的智能时代。 格芯的7纳米FinFET技术充分利用了其在14纳米FinFET技术上的批量制造经验，该技术于2016年初2月8日在Fab 8晶圆厂中开始生产。自那时起，格芯已为广泛的客户提供了“一次成功”的设计。 为了加快7LP的量产进程，格芯正在持续投资最新的工艺设备能力，包括在今年下半年首次购进两个超紫外光（EUV）光刻工具。7LP的初始量产提升将依托传统的光刻方式，当具备批量生产条件时，将迁移至EUV光刻技术。 引言： “我们很高兴看到格芯先进的7纳米工艺所带来的领先技术。AMD与格芯的合作集中于创造高性能的产品，从而带来更沉浸式和更直观的计算体验。” —— Mark Papermaster，AMD高级副总裁兼首席技术官 “虽然晶体管结构并非技术成功的唯一重要因素，但仍然承担着极其关键的作用。这是7纳米芯片批量生产历程中的重要里程碑，证明了格芯的工艺流程已经成熟到足以开始进行真正的客户产品设计。同时，该公司已经在向5纳米及更精细的芯片市场迈进。目前世界上能驾驭此种领先创新技术的公司屈指可数，格芯无疑是这个精英团队中的重要一员。” —— Patrick Moorhead，Moor Insights & Strategy公司总裁兼首席分析师 “格芯不断展现了美国在前沿技术领域中的领先地位，如果能继续在7纳米芯片的研究中进步，格芯将成为第一个跨过该领域全部技术节点的公司。在过去，有很多人还没有走到格芯今天的这一步，便失败了。这是从摩尔定律中汲取价值而产生的一种全新战略方式，在艰难绕过10纳米领域后，格芯发力攻克7纳米领域。其他公司则是把资源分散，来进行半程或四分之一节点处的研发。” —— Dan Hutcheson，VLSI Research公司总裁兼董事长 ### 关于格芯 格芯是全球领先的全方位服务半导体代工厂，为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务。伴随着全球生产基地横跨三大洲的发展步伐，格芯促生了改变行业的技术和系统出现，并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉发展公司（Mubadala Development Company）所有。欲了解更多信息，请访问 https://www.globalfoundries.com。 联系方式 Erica McGill GF (518) 795-4250 [email protected] 杨颖（Jessie Yang） (021) 8029 6826 [email protected] 石燕 （Sherry Shi） 86 15900477699 [email protected]
GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology June 13, 2017New 7LP technology offers 40 percent performance boost over 14nm FinFET Santa Clara, Calif., June 13, 2017 – GLOBALFOUNDRIES today announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost to meet the needs of applications such as premium mobile processors, cloud servers and networking infrastructure. Design kits are available now, and the first customer products based on 7LP are expected to launch in the first half of 2018, with volume production ramping in the second half of 2018. In September 2016, GF announced plans to develop its own 7nm FinFET technology leveraging the company’s unmatched heritage of manufacturing high-performance chips. Thanks to additional improvements at both the transistor and process levels, the 7LP technology is exceeding initial performance targets and expected to deliver greater than 40 percent more processing power and twice the area scaling than the previous 14nm FinFET technology. The technology is now ready for customer designs at the company’s leading-edge Fab 8 facility in Saratoga County, N.Y. “Our 7nm FinFET technology development is on track and we are seeing strong customer traction, with multiple product tapeouts planned in 2018,” said Gregg Bartlett, senior vice president of the CMOS Business Unit at GF. “And, while driving to commercialize 7nm, we are actively developing next-generation technologies at 5nm and beyond to ensure our customers have access to a world-class roadmap at the leading edge.” GF also continues to invest in research and development for next-generation technology nodes. In close collaboration with its partners IBM and Samsung, the company announced a 7nm test chip in 2015, followed by the recent announcement of the industry’s first demonstration of a functioning 5nm chip using silicon nanosheet transistors. GF is exploring a range of new transistor architectures to enable its customers to deliver the next era of connected intelligence. GF’s 7nm FinFET technology leverages the company’s volume manufacturing experience with its 14nm FinFET technology, which began production in early 2016 at Fab 8. Since then, the company has delivered “first-time-right” designs for a broad range of customers. To accelerate the 7LP production ramp, GF is investing in new process equipment capabilities, including the addition of the first two EUV lithography tools in the second half of this year. The initial production ramp of 7LP will be based on an optical lithography approach, with migration to EUV lithography when the technology is ready for volume manufacturing. Supporting Quotes “We are very pleased with the leading-edge technology that GF is bringing with its advanced 7nm process technology. Our collaborative work with GF is focused on creating high-performance products that will drive more immersive and instinctive computing experiences.” Mark Papermaster, CTO and senior vice president of technology and engineering, AMD. “IBM is committed to meeting the rising demands of cognitive systems and cloud computing. GF’s leading performance in 7LP process technology, reflecting our joint Research collaboration, will allow IBM Power and Mainframe systems to push beyond limitations to provide high-performance computing solutions while aggressively pursuing 5nm to advance our leadership for years to come.” Tom Rosamilia, Senior Vice President, IBM Systems “While not the only important factor in a successful technology, transistor geometry still plays a part. This is an important fab milestone on the journey to 7nm volume production, demonstrating that GF’s process is mature enough to start working on real customer product designs. At the same time, the company is already making solid progress toward delivering 5nm and beyond. There are only a handful of companies in the world capable of driving this type of leading-edge innovation, and GF is clearly staking its claim as a member of this elite group.” Patrick Moorhead, President & Principal Analyst, Moor Insights & Strategy “GF continues to demonstrate America’s leadership in advanced technology. If they continue this progress on 7nm, GF will be the first company to leapfrog a full node. Everyone that’s tried it in the past has failed well before this point in the process. It’s a completely new strategic approach for extracting value from Moore’s Law. By biting the bullet and skipping 10nm, GF opened up the technical bandwidth to attack 7nm head-on. Others have been dividing their resources and going for half- or even quarter-nodes.” Dan Hutcheson, CEO and Chairman of VLSI Research About GF: GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. Contacts: Erica McGillGF(518) 795-4250[email protected]
GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G Networks June 13, 2017FX-7TM offering leverages the company’s 7nm FinFET process to deliver best in class IP and Solutions Santa Clara, Calif., June 13, 2017 – GLOBALFOUNDRIES today announced the availability of FX-7 TM, an application-specific integrated circuit (ASIC) offering built on the company’s 7nm FinFET process technology. FX-7 is an integrated design platform that combines leading-edge manufacturing process technology with a differentiated suite of intellectual property and 2.5D/3D packaging to deliver the industry’s most complete solution for data center, machine learning, automotive, wired communications, and 5G wireless applications. Building on the continued success of FX-14, with industry-leading 56G SerDes and a legacy of ASIC expertise, FX-7 provides a comprehensive suite of tailored interface IPs including High Speed SerDes (60G, 112G), differentiated memory solutions including low-voltage SRAM, high-performance embedded TCAM, integrated DACs/ADCs, ARM processors, and advanced packaging options such as 2.5D/3D. In addition, the FX-7 portfolio enables new design methodologies and complex ASIC solutions for lower power and high-performance applications targeting hyper-scale data centers, 5G networking, and machine and deep learning applications. Future extensions are planned to support solutions for automotive ADAS and imaging applications. “The explosion of data traffic and bandwidth in global networks is driving a new set of demands for our customers,” said Mike Cadigan, senior vice president of the ASIC Business Unit at GF. “By leveraging our most advanced 7LP FinFET process technology, the FX-7 offering continues to extend our leadership in serving our customers by delivering the most advanced lower power and high performance ASIC solutions for new market paradigms such as data centers, deep computing, and wireless networking.” “GF’s 7nm FinFET technology demonstrates the technology and market leadership resulting from the combination of the silicon and manufacturing expertise of GF and IBM’s former semiconductor group,” said Jim McGregor, founder and principal analyst at TIRIAS Research. “With its new FX-7 ASIC offering, GF is extending its reach beyond traditional foundry customers to a new generation of systems companies who are looking to leverage bleeding-edge silicon processes for a wide range of applications, from deep learning for artificial intelligence to next-generation 5G networks.” Design kits for the FX-7 ASIC offering are now available to customers, with volume production expected in 2019. About GF: GF is a leading full-service semiconductor foundry providing a unique combination of design, development and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES offers the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. Contacts: Erica McGillGF(518) 795-4250[email protected]
22FDX® Revving up for Automotive Applications at CDNLive EMEA June 7, 2017 By: Gerd Teepe Recently, Cadence hosted its two-day European CDNLive event at a multi-purpose arena in Munich. The arena at the INFINITY Hotel & Conference Resort is also often a draw for ice-hockey tournaments, rock concerts and other high-profile events and visitors. In fact, the Bayern-Munich soccer team has gathered here before important games the last couple of years, bringing further glamour to the area. While the Bayern Munich players did not occupy the arena this year, there was another star attraction at the show—a technical innovation heralding a new era in image processing. Dream Chip Technologies GmbH of Hannover, Germany demonstrated a system with an image processing chip designed and manufactured with GLOBALFOUNDRIES’ 22nm FD-SOI (22FDX®) technology. Dream Chip’s ADAS SoC system platform is based on a quad ARM® A53 processor complemented with a dual ARM-R5 lock-step processor, making the chip suitable for enhanced ASIL-type security applications. The image workhorse of the chip is the Vision-P6 processor from Cadence. Source Dream Chip: Full system architecture of the image processing platform, soon to be implemented by Dream Chip. The Vision P6 architecture from Cadence is based on the Tensilica architecture and is targeted for Convolutional Neural Network computations (CNNs). Image objects are detected by correlation of video images with a database of known images. For applications in the car, like sign- and pedestrian-recognition, this application needs to run at real-time with 30 frames per second. In essence, it’s a massive computational comparison of pictures occurring in real-time. The prototype shown at CDNLive is the first-ever live system with an SoC implemented with GF’s 22FDX technology. The chip is 64mm2 and is mounted on a package substrate together with two LPDDR4 memories. Source Dream Chip: System module with chip and two LPDDR4-memories The Dream Chip ADAS chip is a complex and multifunctional SoC. At CDNlive, Dream Chip demonstrated video capabilities through a system board mounted on top of a model car, with the signal of a hood-mounted GoPro camera fed into the system board. Jens Benndorf, COO of Dream Chip, explained the further signaling path: “First fed into the chip, the video signal is passed to one of the four IVPs running a filter algorithm, then passed to the video-output and on to the display. It demonstrated that the IVP6 is working.” Source GF: Dream Chip live Demo setup at CDNLive EMEA In addition to the demo, Benndorf and his team gave a number of presentations on the system, the chip architecture and the CNN-based image processing for which the chip is targeted in the near future. Dream Chip, GF, and partners are working fast and furious (pun intended!) to accelerate the SoC prototype for production readiness. First silicon was demonstrated in February 2017 at Mobile World Congress in Barcelona, and a video on the platform was showcased at CDNLive in May. What will be next? Ride with us, and find out! 22FDX is enabling innovation in ADAS applications and eventually will for autonomous driving too. By then, Bayern Munich players will certainly notice. About Author Gerd Teepe In his role as Director Marketing for Europe, Gerd is responsible for leading the CMOS Platforms marketing initiatives in this region, with focus on accelerating design wins in the IoT/Industrial and Automotive segments as well as emerging markets. Prior to this, Gerd was leading the Design Engineering Organization of GLOBALFOUNDRIES. Gerd Teepe has been with GLOBALFOUNDRIES since its creation in 2009 and is based at the FAB1-site in Dresden. Prior to GLOBALFOUNDRIES, Gerd was with AMD, Motorola-Semiconductors, and NEC, Japan in R&D, Design, Product Management and Marketing roles. Gerd holds a Master’s Degree and a phd from Aachen University, Germany.
A Bigger Role for Foundries in the Analog Market May 30, 2017By: Dave Lammers A growing percentage of analog and mixed-signal ICs are being manufactured at foundries such as GLOBALFOUNDRIES. When it comes to commentary about the semiconductor industry, we live in a big D (digital), little A (analog) world, with leading-edge digital garnering most of the attention. While analog and mixed-signal ICs account for about 15 percent of the chip industry’s revenues — $48 billion in 2016 — there is scant written about how they are manufactured. A principal reason is that, until recently, most analog parts were made on older technologies. But that is changing. Jim Feldhan, president of Semico Research (Phoenix), said mixed-signal chips are adding more digital content, which results in bigger chips, leading to using more advanced process technologies to keep chip size under control. “We used to talk about Big A, little D, but now there is a lot more digital circuitry being added,” he said. The integration of analog and digital functions also leads to using 300mm wafers to control costs. “That encourages more foundry usage,” Feldhan said, adding that few analog IC companies can afford to build 300mm fabs. Companies such as Texas Instruments have moved to 300mm manufacturing for high-volume analog parts, but very few analog companies have the capital to construct and fill a 300mm fab, he added. The financial picture is changing in other ways as well. Analog companies once enjoyed enviable gross margins, Feldhan said, but increased competition has reduced average selling prices (ASPs) sharply over the last five years, from an analog ASP of 46 cents in 2011 to an average of 36 cents last year, according to Semico Research. That 25 percent drop in ASPs has caused more analog companies to put their investments into product development, and less into expensive capacity expansions. “The analog companies are running into the same issues that the digital IC companies have been facing. Their margins are pretty tight, and so it is inevitable that they focus on product development and turn more to foundries,” Feldhan said. GF has responded to these trends in two major ways: expanding analog and mixed-signal capacity, and accelerating its technology roadmap. The company’s 300mm fab in Chengdu, China, Fab 11, will add capacity for 180nm and 130nm production, as well as the 22nm fully depleted SOI (22FDX®) offering that is expected to see widespread mixed-signal usage. A 300mm fab in Singapore, Fab 7, has room for additional production of 130nm, 55nm, and upcoming 40nm analog/mixed-signal processes. Mike Arkin, deputy director for Analog/Power Product Line at GF, said, “We see a need for more capacity. We expect to be growing substantially in the next three to five years, and when we look at our projections, the time is coming when we are going to need even more capacity. The expansion in China will allow GF to continue growing its analog and power business” for the 130nm BCDLite® and 180nm BCDLite offerings. Arkin said many analog and mixed-signal IDMs are going fab-lite or fabless.They are “looking for alternatives to continue their roadmaps without investing so much. Individual companies can’t stay on the treadmill like a foundry can, so we see more IDMs coming to us, reaching out, driving our roadmap and talking to us about designing into the GF processes.” Also, more startups are targeting power management. “There are startups with brilliant ideas that no one has done. In some cases they come out of a university background and are looking for help on the process side,” Arkin said. And, established companies that haven’t had a presence in power are designing solutions. “The companies that haven’t had a power presence need foundries, not just good mixed-signal processes today but an active roadmap to the future as well,” he said. Adding Options and New Nodes GF offers both a bipolar-CMOS-DMOS (BCD) process, which features deep-trench isolation and support for higher voltages as well as a lower cost, lower voltage BCDLite. (BCDLite is a patented process technology that is available only from GF). The BCDLite process is more cost effective due to a less-complicated isolation structure, and is rated for lower voltages than traditional BCD. While BCD has a buried N layer and deep trench isolation, BCDLite uses a Triple Well isolation scheme as a cost reduction for customers which don’t need a high level of isolation. Arkin said some companies could safely use a BCDLite process and reduce costs, compared with the BCD process. “Many customers that use BCD are risk averse. They could use BCDLite, which operates up to 30 to 40 volts compared with 85V for BCD, and still have a robust design. For example, wireless charging could take advantage of BCDLite for consumer-oriented applications. Other industrial customers are thinking of using the automotive-grade BCD processes for assurance in high-temperature environments. There is not a hard line,” Arkin said. BCDLite is a consumer-oriented process, but Arkin said “with automotive driving new applications customers are finding that they can take their consumer-use designs to the BCD automotive process (Grades 1 and 0) for an automotive version of their designs. This is analogous to the way traditional CMOS logic processes have been qualified and marketed for Automotive Gr1 applications.” Expanding the Process Roadmap Since 2010, GF has shipped a cumulative 2.3 million wafers of BCDLite. It is a “solid No. 2” in the analog foundry business, according to Arkin. “GF is actively rolling out sub-100nm BCDLite this year,” Arkin said. “We are investing in bringing our analog and power expertise to even smaller nodes that complement our existing CMOS technologies.” There is an array of other advances coming as well (see chart of process options), with SRAM and non-volatile memory options being offered at the 130nm BCD and BCDLite node, as well as high-voltage and ultra-high-voltage (UHV, up to 700 V) 180nm offerings. Fewer Chips for Smaller Form Factors Feldhan said as system companies seek to reduce the form factors of their phones and other consumer products, they are working with their IC suppliers to integrate more digital cores into their power-management products. “By putting fewer chips on the system board, that reduces the amount of reflow soldering required during assembly,” he added. Arkin said governments around the world increasingly have been requiring less energy usage. “Things are moving faster than ten years ago, when power was flat. A watershed moment came in 2007 when the Energy Star® 4.0 added 80 PLUS® requirements for computers. That’s when the power management market began to change more to efficiency and technical differentiation, from just cost, cost, cost.” The Future of BCDLite “As BCDLite is incorporated into smaller process geometries, it becomes particularly interesting for battery-powered handheld devices, such as smart phones, smart watches, glucose monitors, and many others.” To reduce the form factor of these systems, Arkin said the IC vendors are “working to integrate devices in new and interesting ways, adding features to the socket. Most of that feature enablement is adding digital functions on top of the analog or power.” A next node BCDLite process, he said, is “ideal” for systems running on lithium-ion batteries. Since the analog functions in most cases don’t scale as strongly as digital, vendors adding digital functions on top of analog or power capabilities must deal with cost versus die size challenges. “When they are horizontally adding digital, they have to think about how much can they pack on a single die and still be cost effective,” Arkin said. A major analog and mixed signal customer with strong digital design expertise has solutions which support the Force Touch interface, which offers a more complex or richer way for users to interact with the touch screen. But that comes at a premium, more tightly coupling increasing digital content with the analog functions. With Force Touch and other “sensor sensitive” features, Arkin said “A next node BCDLite process would support more processing capability co-located with analog functions. GF is working on such a process in order to extend the sensor-sensitive capabilities even more.” Automotive is another rapidly evolving market. Mark Granger, a vice president in GF’s automotive group, said BCD and BCDLite are figuring into new automotive applications. “Power management increasingly plays a very important role in EVs (electric vehicles) being able to provide the highest efficiency as they turn the battery charge into propulsion. There are a lot of places where that technology can be used for very efficient power delivery systems.” About Author Dave Lammers Dave Lammers is a contributing writer for Solid State Technology and a contributing blogger for GF’s Foundry Files. Dave started writing about the semiconductor industry while working at the Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry. He joined E.E. Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave received a master’s in journalism at the University of Missouri School of Journalism.
