Shared technology allows global capacity for 14nm FinFET fabrication in the U.S. and Korea

Seoul, Korea and Santa Clara, Calif. April 17, 2014 – Samsung Electronics Co., Ltd. and GLOBALFOUNDRIES today announced a new strategic collaboration to deliver global capacity for 14 nanometer (nm) FinFET process technology. For the first time, the industry’s most advanced 14nm FinFET technology will be available at both Samsung and GF, giving customers the assurance of supply that can only come from true design compatibility at multiple sources across the globe. The new collaboration will leverage the companies’ worldwide leading-edge semiconductor manufacturing capabilities, with volume production at Samsung’s fabs in Hwaseong, Korea and Austin, Texas, as well as GF’ fab in Saratoga, New York.

Developed by Samsung and licensed to GF, the 14nm FinFET process is based on a technology platform that has already gained traction as the leading choice for high-volume, power-efficient system-on-chip (SoC) designs. The platform taps the benefits of three-dimensional, fully depleted FinFET transistors to overcome the limitations of planar transistor technology, enabling up to 20 percent higher speed, 35 percent less power and 15 percent area scaling over industry 20nm planar technology.

The platform is the first FinFET technology in the foundry industry to provide true area scaling from 20nm. The technology features a smaller contacted gate pitch for higher logic packing density and smaller SRAM bitcells to meet the increasing demand for memory content in advanced SoCs, while still leveraging the proven interconnect scheme from 20nm to offer the benefits of FinFET technology with reduced risk and the fastest time-to-market.

Through this multi-year exclusive technology license, process design kits (PDKs) are available now, allowing customers to start designing with models, design rule manuals, and technology files that have been developed based on silicon results from 14nm FinFET test chips. Mass production for the 14nm FinFET technology will begin at the end of 2014.

“This unprecedented collaboration will result in a global capacity footprint for 14nm FinFET technology that provides AMD with enhanced capabilities to bring our innovative IP into silicon on leading-edge technologies,” said Lisa Su, senior vice president and general manager of Global Business Units at AMD. “The work that GF and Samsung are doing together will help AMD deliver our next generation of groundbreaking products with new levels of processing and graphics capabilities to devices ranging from low-power mobile devices, to next-generation dense servers to high-performance embedded solutions.”

“This strategic collaboration extends the value proposition of a single GDSII multi-sourcing to the FinFET nodes. With this true multi-source platform, Samsung and GF have made it easy for fabless semiconductor companies to access FinFET technology and increase first-time silicon success,” said Dr. Stephen Woo, president of System LSI business, device solutions, Samsung Electronics Division. “Through this collaboration, we are advancing the foundry business and support model to satisfy what customers have been asking for.”

“Today’s announcement is further proof of the importance of collaboration to enable continued innovation in semiconductor manufacturing,” said GF CEO Sanjay Jha. “With this industry-first alignment of 14nm FinFET production capabilities, we can offer greater choice and flexibility to the world’s leading fabless semiconductor companies, while helping the fabless industry to maintain its leadership in the mobile device market.”

About Samsung Electronics Co., Ltd.

Samsung Electronics Co., Ltd. is a global leader in technology, opening new possibilities for people everywhere. Through relentless innovation and discovery, we are transforming the worlds of TVs, smartphones, tablets, PCs, cameras, home appliances, printers, LTE systems, medical devices, semiconductors and LED solutions. We employ 286,000 people across 80 countries with annual sales of US$216.7 billion. To discover more, please visit www.samsung.com.

* Editors’ Note : Samsung Electronics’ Foundry business is dedicated to support fabless and IDM semiconductor companies offering full service solutions encompassing design kits and proven IP to fully turnkey manufacturing to achieve market success with advanced IC designs. For more information, please visit www.samsung.com/Foundry

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit https://www.globalfoundries.com.

CONTACTS:

Jason Gorss
GF
518-305-9022
[email protected]

Lisa Warren-Plungy
Samsung Semiconductor
408-544-5377
[email protected]

Click here to access the press release (PDF)
Click here to access the Overview Presentation (PDF)

Highlights:

• Test chip designed to demonstrate performance and power characteristics of ARM® Cortex®-A12 processor on GlobalFoundries 28nm-SLP process
• Achieved maximum frequency of 2.0GHz in 15 weeks using the full Cadence RTL-to-GDSII digital implementation and signoff solutions
• Full suite of Cadence signoff tools used, including QRC Extraction, Tempus Timing Signoff Solution and the Physical Verification System

SAN JOSE, Calif., March 12, 2014—At CDNLive Silicon Valley 2014, Cadence Design Systems Inc. and GF announced that they have taped out a quad-core test chip built around the ARM Cortex-A12 processor. Targeted to operate at frequencies of up to 2.0GHz while still within the mainstream mobile power and area envelope, the test chip is implemented in GF’s 28nm-SLP (Super Low Power 28 nanometer High-K Metal Gate) process using a full Cadence® tool flow and incorporates ARM POP™ technology to leverage the full performance range of the 28-SLP process.

The Cortex-A12 processor provides a 40 percent performance increase and direct upgrade path from ARM’s highly successful Cortex-A9 processor, while matching the energy efficiency of its predecessor. The successful tapeout marks an important move toward the incorporation of the Cortex-A12 core in mobile applications such as smartphones and tablets.

“As the lead foundry working with the Cortex-A12 processor, we collaborated closely with Cadence and ARM to implement this new core using our 28nm low-power process, and ARM libraries specifically tuned to meet demanding mobile market requirements,” said Ana Hunter, vice president of product management at GF. “This test chip will be instrumental in showing our mutual customers how they can productize and reap the benefits from the Cortex-A12 processor in conjunction with the 28nm-SLP process using a Cadence flow.”

“The ARM Cortex-A12 processor is a high-performance compute solution that will benefit developers looking to upgrade existing mid-range mobile products as well as expanding our technology into a new range of electronic devices such as set-top boxes,” said Dipesh Patel, executive vice president and general manager, physical design group, ARM. “The work by ARM, Cadence and GF in jointly developing a test chip on 28nm utilizing ARM POP IP will accelerate its time to market.”

The full Cadence RTL-to-signoff digital implementation flow was used, including Encounter® RTL Compiler, Encounter RTL Compiler with Physical, Encounter Digital Implementation System and Encounter Conformal Equivalence Checker. The full suite of Cadence signoff tools were also used, including QRC Extraction, Tempus™ Timing Signoff Solution and the Physical Verification System, closing final signoff and achieving tapeout in 15 weeks from RTL availability.

“Projects like this Cortex-A12 processor test chip are important milestones, and can only be achieved through tight collaboration,” said Anirudh Devgan, senior vice president of the Digital and Signoff Group at Cadence. “Our work with GF and ARM will be welcome news for electronics companies interested in exploring ARM’s newest core.”

GF’s 28nm-SLP technology is ideally suited for the next generation of smart mobile devices, enabling designs with faster processing speeds, smaller feature sizes, lower standby power and longer battery life. The technology is based on GF’s “Gate First” approach to High-K Metal Gate (HKMG), which has been in volume production for nearly three years. The technology offers a combination of performance, power efficiency and cost that is ideally suited for the mobile market.

POP technology contains ARM Artisan® Physical IP logic libraries and memory instances specifically tuned for a given ARM core and process technology, a comprehensive benchmarking report to pinpoint exact conditions and results ARM achieved for core implementation, and POP implementation knowledge including a user guide, floor plans and scripts. POP IP products are currently available from 40nm to 28nm, with a roadmap down to 14nm process technology for a wide range of Cortex-A processor series CPU and Mali™ GPU products.

GF will deliver a presentation on their joint work at CDNLive Silicon Valley on March 12. The presentation is titled, “A Power-, Performance-, and Cost-Optimized Cortex-A12 Implementation in 28nm-SLP (Super-Low-Power) Technology”

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit https://www.gf.com.

New channel partner agreement focuses on 40nm and 28nm processes

Munich, February 26th, 2014 – GlobalFoundries and Fraunhofer Institute for Integrated Circuits IIS today announced the extension of their long-term collaboration, focusing on 40nm and 28nm processes. GF will also join the European Multi Product Wafer (MPW) Program EUROPRACTICE.

Through the collaboration GF will offer its leading-edge foundry capabilities to Fraunhofer IIS as an aggregator, and Fraunhofer will enable the academic network in Europe to get access to GF’s process technologies and Process Design Kits (PDK) via EUROPRACTICE.

“As one of the largest foundries worldwide and the largest wafer manufacturer in Europe we are proud to enter this prestigious program,” said Karl Lange, GF Vice President of Sales for Europe. “With Fraunhofer as channel partner, combined with our broad technology portfolio and process know-how, we will add significant value to EUROPRACTICE.”

“The offer of GF technologies down to 28nm to Europe’s universities and research institutes is an important step for EUROPRACTICE and will stimulate education and research in IC design,” said Josef Sauerer, Head of the Integrated Circuits and Systems Department at Fraunhofer IIS. “Also, our contract research with industries will benefit from GF’s advanced technology portfolio”

Fraunhofer IIS and GF started their collaboration in 2004 with the successful launch of 180nm and later 55nm programs. The extended collaboration will introduce technology nodes down to 28nm in the European Wafer Shuttle Program, helping European academia and research institutes to get access and support for CAD tools and ASIC prototyping at reduced costs.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers.

With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit https://www.gf.com.

About Fraunhofer Institute for Integrated Circuits IIS

Fraunhofer IIS, established in 1985 and based in Erlangen, with additional locations in Nürnberg, Fürth, Würzburg, Ilmenau and Dresden, is today the largest Fraunhofer Institute in the Fraunhofer Society. More than 750 employees work in contract research for industry, service provider companies and public institutions. Fraunhofer IIS became world famous with its significant involvement in the development of the MP3 and MPEG AAC audio encoding processes. In close co-operation with clients from industry, more than 150 scientists conduct research and development in the field of design automation, integrated circuits and sensor systems. Further research areas are digital radio, audio and multimedia technology, digital cinema technology, wired, wireless and optical networks, localisation and navigation, high-speed cameras, ultra-fine-focus x-ray technology, image processing, medical technology and supply chain services. For more information, visit https://www.iis.fraunhofer.de.

About EUROPRACTICE

During the past years, the IC service of EUROPRACTICE has been developed to one of the most successful ASIC prototype and small volume service in Europe with customers from more than 55 countries world-wide. Annually more than 535 ASICs are prototyped on Multi Project Wafer runs and more than 100 small volumes are delivered to industry. The European Commission is funding the EUROPRACTICE service through a contract under the IST FP7 program. Through this funding 650 European academia and research institutes are able to get access and support to CAD tools and ASIC prototyping at reduced costs. ASIC prototype and small volume turnkey offering for industry and academia are offered by IMEC and Fraunhofer IIS, access to CAD tools for academia is offered by STFC. For more information, visit https://www.europractice-ic.com.

Sanjay Jha appointed by GLOBALFOUNDRIES Board to lead company

Santa Clara, Calif., January 6, 2014 — Building on the successful track record of its first five years in the semiconductor industry and its continued commitment to build out its global network of manufacturing facilities, GF announced today, from its new offices in Silicon Valley, Sanjay Jha has been appointed as the company’s new Chief Executive Officer. Jha has served as CEO of Motorola Mobility Inc. and as the COO of Qualcomm Inc.

Ajit Manocha, who served as an advisor to the company’s shareholder prior to being appointed CEO of GF in mid-2011, will return to that role and will work closely with Jha on his transition.

“Ajit has played an instrumental role in making GF the second largest foundry in the world, delivering on customer relationships, technology leadership and operational excellence,” said Ibrahim Ajami, Vice Chairman of the GF Board. “Sanjay is one of the most respected leaders in the technology industry and has a proven track record of consistently delivering shareholder value. His industry background and experience as a foundry customer will position GF for continued growth.”

“This has been an incredible journey and our success thus far has been a testament to our ability to partner with leading customers in the industry. I am confident that I am leaving GF in a position of strength and that Sanjay will take this company to new horizons,” said Manocha.

Jha will lead the company’s build out and ramp of its Fab 8 leading-edge facility in Malta, New York, supporting customers at the 14 nm technology node. GF will also continue its upgrade of facilities in Singapore and Germany, which serve multiple customers across a spectrum of technologies.

“I am thrilled to have the opportunity to lead a company with such a strong track record in an industry that I know and love. I look forward to working closely with Ajit during the transition and with a very talented global team to continue to make our customers successful,” said Jha.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers.

With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit https://www.globalfoundries.com.

The MoU was signed at the 7th Abu Dhabi-Singapore Joint Forum 2013 in Singapore

1. Singapore, 26 Nov 2013 – A*STAR Institute of Microelectronics (IME), GLOBALFOUNDRIES Singapore Pte. Ltd., and Masdar Institute of Science and Technology (MI) have entered into a collaboration to develop and advance micro-electro-mechanical systems (MEMS) technologies for automotive, aerospace, consumer, healthcare, industrial, and mobility applications. The joint research initiative, which builds on the Abu Dhabi-Singapore Joint Forum (ADSJF), is supported by the Advanced Technology Investment Company (ATIC), a Mubadala company focused on building leading technologies companies, and the Economic Development Board (EDB) of Singapore.

2. The Abu Dhabi-Singapore Twin Lab will focus on the development of MEMS technologies including inertial sensors, energy harvesters, nano-opto-mechanical sensors, and ultrasonic transducers. These platform technologies form the foundation of a wide spectrum of sensors that address high volume markets, including mobile platforms, distributed wireless sensor network, healthcare and environment monitoring.

3. GF Singapore is a leading semiconductor foundry providing full-scale wafer manufacturing services to fabless and fablite semiconductor companies. The foundry will serve as the programme manager and manufacturing partner in this collaboration. The opportunity will also enable the foundry to expand its IP portfolio to address MEMS high-volume manufacturing at effective cost levels and capacity to serve the fast growing MEMS market.

4. “We are pleased to be in a strategic and mutually beneficial collaboration with the renowned research institutes from Singapore and Abu Dhabi,” said Mr K. C. Ang, Senior Vice President and General Manager of GF Singapore. “This joint partnership will enable us to harness their R&D capabilities to create innovative technologies and products that will further solidify and strengthen our foundation in MEMS manufacturing.”

5. IME is a research leader in semiconductor research and development, under Singapore’s Agency of Science, Technology and Research (A*STAR), with an established track record in MEMS design and technologies. IME’s extensive experience in sensors and transducers technologies, MEMS process design and integration, as well as state-of-the-art research facilities will help to advance the joint research initiative and further develop innovative technologies for industry.

6. Professor Dim-Lee Kwong, Executive Director of IME, said: “This is a momentous milestone in the field of MEMS research and development for IME and for the parties involved in bringing this initiative to fruition. Each of us plays a key role in the semiconductor eco-system, namely government, industry, academia and research institute, with each bringing valuable opportunities and diverse knowledge. As such, we are confident that this partnership will enable us to successfully push our MEMS research capabilities to greater heights, and contribute to the advancement of the semiconductor industry in both Abu Dhabi and Singapore.”

7. MI is the world’s first graduate-level university, focusing on providing real-world solutions in advanced energy and sustainable technologies. The collaboration will open up opportunities for MI to leverage the industry intelligence of GF Singapore and IME’s MEMS technology development capabilities to develop and grow MEMS scientific research programmes and initiatives.

8. Dr Fred Moavenzadeh, President of Masdar Institute, said: “The agreement with GF Singapore and the Institute of Microelectronics illustrates our commitment to develop strong relationships with internationally renowned research-oriented institutions in advanced technology areas. With the support of the UAE’s leadership, we strive to develop expertise in leading edge areas recognized and pursued by other renowned institutions. We offer our expertise in fabless and fab-lite semiconductor technology and seek to achieve innovative solutions through our collaboration with the Singapore-based entities in MEMS-related research and development projects.”

9. The Memorandum of Understanding was signed today in conjunction with the Abu Dhabi-Singapore Joint Forum at Marina Bay Sands, and was attended by Mr Lee Yi Shyan, Senior Minister of State for Trade & Industry and National Development in Singapore, and His Excellency Khaldoon Al Mubarak, Chairman of the Executive Affairs Authority of the Emirate of Abu Dhabi (EAA).

Media Contacts:

For IME:

Chua Yi Fen
Senior Officer, Marketing & Communications, IME
Phone: +65 6770 5378
Email: [email protected]

For GF Singapore:

Gina Wong
Communications Manager, Asia Pacific & Japan, GF
Phone: +65 6670-1808
Email: [email protected]

For Masdar Institute of Science & Technology:

Bader Al Zarei
Director – Communications
Public Affairs Department, Masdar Institute
Phone: +971 02 8109372
Email: [email protected]

Foundry 2.0 partnership with Open-Silicon and Amkor Technology yields successful 2.5D test vehicle project

Milpitas, Calif., November 21, 2013 – GLOBALFOUNDRIES today unveiled details of a project that demonstrates the value of its open and collaborative approach to delivering next-generation chip packaging technologies. The company, in partnership with Open-Silicon (chief architect) and Amkor Technology, Inc. (assembly and test), jointly exhibited a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer. The jointly developed design is a test vehicle that showcases the benefits of 2.5D technology for mobile and low-power server applications and the viability of the Foundry 2.0 collaborative enablement model.

While some semiconductor manufacturers are approaching next-generation packaging technologies through internal development, GF is enabling an open supply chain through collaboration with ecosystem partners and customers. This approach allows GF’s customers to choose their preferred supply chain partners, while leveraging the experience of ecosystem partners who have developed deep expertise in design, assembly and test methodologies. When combined with GF’s leading-edge manufacturing capabilities, this open and collaborative model is expected to deliver lower overall cost and less risk in bringing 2.5D technologies to market.

“As the fabless-foundry business model evolves to address the realities of today’s dynamic market, foundries are taking on increasing responsibility for enabling the supply chain to deliver end-to-end solutions that meet the requirements of the broad range of leading-edge designs,” said David McCann, vice president of packaging R&D at GF. “To help address these challenges, we are driving our ‘Foundry 2.0’ collaborative supply chain model by engaging early with ecosystem partners like Open-Silicon and Amkor to jointly develop solutions that will enable the next wave of innovation in the industry.”

The test vehicle features two ARM Cortex-A9 processors manufactured using GF’s 28nm-SLP (Super Low Power) process technology. The processors are attached to a silicon interposer, which is built on a 65nm manufacturing flow with through-silicon-vias (TSVs) to enable high-bandwidth communication between the chips.

Open-Silicon provided the processor, interposer, substrate, and test design, as well as the test and characterization of the final product. GF provided the PDKs, interposer reference flow and manufactured both the 28nm ARM processors and the 65nm silicon interposer with embedded TSVs. Amkor provided the package-related design rules and manufacturing processes for back-side integration, copper pillar micro-bumping, and 2.5D product assembly. GF and Amkor collaborated closely throughout the project to develop and validate the design rules, assembly processes, and required material sets.

The companies demonstrated first-time functionality of the processor, interposer, and substrate designs, and the die-to-substrate (D2S) process used by the supply chain resulted in high yields. The design tools, process design kit (PDK), design rules, and supply chain are now in place and proven for 2.5D interposer products from GF, Amkor, and Open-Silicon.

“This project is a testament to the value of an open and collaborative approach to innovation, leveraging expertise from across the supply chain to demonstrate progress in bringing a critical enabling technology to market,” said Ron Huemoeller, senior vice president of advanced product development at Amkor Technology. “This collaborative model will offer chip designers a flexible approach to 2.5D SoC designs, while delivering cost savings, faster time-to-volume, and a reduction in the technical risk associated with developing new technologies.”

“We are pleased to be at the forefront of making 2.5D a reality with our foundry and OSAT partners,” said Dr. Shafy Eltoukhy, vice president of technology development at Open-Silicon. “This approach will allow designers to choose the right technology for each function of their SoC while simultaneously enabling finer grain and lower power connectivity than traditional packaging solutions along with reduced power budgets for next-generation electronic devices.”

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit https://www.globalfoundries.com.

Design features two 28nm ARM Cortex-A9 processors interfacing across a silicon interposer

Milpitas, Calif., November 21, 2013 — Open-Silicon, Inc., and GLOBALFOUNDRIES today announced the industry’s first demonstration of a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer. The jointly developed design is a proof-of-concept vehicle to showcase the benefits of 2.5D technology for mobile and low-power server applications.

At the heart of the custom SoC are two ARM Cortex-A9 processors manufactured using GF’s 28nm-SLP (Super Low Power) process technology. The processors are attached to a silicon interposer, which is built on a 65nm manufacturing flow with through-silicon-vias (TSVs) to enable high-bandwidth communication between the chips. This approach allows designers to choose the most appropriate process technology for each function of their SoC, while the interposer and TSVs allow for finer grain and lower power connectivity than traditional packaging solutions, leading to smaller form factors and reduced power budgets for next-generation electronic devices.

The companies recently demonstrated the functioning SoC at ARM TechCon in Santa Clara, CA, where they were awarded “Best in Show” in the Chip Design category.

“We are now much closer to building a system in package than before and Open-Silicon is extremely pleased to be at the forefront of making 2.5D a reality with our foundry and OSAT partners,” said Dr. Shafy Eltoukhy, vice president of technology development at Open-Silicon. “Given the multitudes of advantages that this technology offers, we firmly believe that widespread adoption along with heterogeneous die-integration will ensue soon.”

“As chip designers face growing complexity and cost at smaller geometries, the adoption of 2.5D technology is increasingly being viewed as an alternative to traditional scaling at the transistor level,” said Srinivas Nori, director of SoC innovation at GF. “By collaborating closely with design partners like Open-Silicon and OSAT partners like Amkor, we will be able to accelerate the availability of this technology while minimizing cost, improving yield, maximizing re-use, and decreasing risk.”

Open-Silicon and GF developed the custom SoC to help overcome some of the challenges associated with bringing 2.5D technology to market. The 2.5D system features the following characteristics:

• Logic die including dual-core ARM Cortex-A9 CPUs, as well as DDR3, USB and AXI bridge interfaces
• A special EDA reference flow designed to address the additional requirements of 2.5D design, including top-level interposer design creation and floor planning, as well as the increased complexity of using TSVs, front-side and back-side bumps, and redistribution layer (RDL) routing
• Support for additional verification steps brought on by 2.5D design rules
• Custom die-to-die IO for better area and power characteristics providing a maximum of 8GB/s full-duplex data-rate across the two die through the silicon interposer
• A development board with memory, boot-ROM, and basic peripherals to demonstrate the die-to-die interface functionality through software running on the CPUs embedded in the logic dies
• A test methodology consisting of Boundary Scan and Loopback modes
• Package-related design rules, back-side integration, copper pillar micro-bumping, and 2.5D product assembly by Amkor Technology, a leading supplier of outsourced semiconductor packaging and test services

About Open-Silicon

Open-Silicon, a leading supplier and developer of customer-specific products (CSPs), provides ASICs, platforms, concept-to-parts development, customized IP, low-effort derivative design, and state-of-the-art manufacturing solutions. With Open-Silicon, customer’s benefit from global engineering including an ARM® Technology Center of Excellence, advanced SerDes integration, 2.5D interposer-based package engineering, experienced architects, leading-edge physical design methodology, and embedded software development, all leveraging the industry’s best technology from both Open-Silicon and the open market. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700 begin_of_the_skype_highlighting 408-240-5700 FREE end_of_the_skype_highlighting.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit https://www.globalfoundries.com.

A Significant Milestone of the Leading Foundry’s Strategic Growth in China to Build A Closer Partner and Customer Relationship

Shanghai, China, September 6, 2013 — GLOBALFOUNDRIES today announced the official opening of its new China office in Shanghai to enhance its presence in the fastest growing market and to strengthen its commitment to better serve China-based customers and the industry.

Given the importance of the China market, the Shanghai-based GF team will focus on providing global manufacturing support and on-the-ground technical and business services to all Chinese customers, as well as offering market-specific solutions for key application sectors in mobility, display, consumers, automotive and power management.

CEO of GF, Ajit Manocha said: “We established a sales office in Shanghai years ago to support our local customers. Over the years, our customers have grown rapidly in their business and advanced quickly into the leading-edge technology. They need, more than ever, a foundry partner who can provide an efficient and sophisticated level of sales and support coverage. We believe it’s the right time to strengthen our commitment to China by launching our first China subsidiary in Shanghai.”

“Having a new office and a stronger team allows us to have the flexibility of growing with our customers and partners, as we continue to provide a collaborative business model to help them succeed in this fast changing and competitive market,” Manocha added.

According to ‘China’s Impact on the Semiconductor Industry 2012 Update,’ a report issued by PwC in March 2013, China semiconductor industry grew by 14.4% in 2011 to reach a record $43.5 billion – growing more than ten times faster than the total worldwide semiconductor industry. A significant portion of that growth was attributed to China’s IC design or fabless sector which grew by more than 36% in 2011. In the meantime, China semiconductor consumption market grew by 14.6% to reach a record 47% of the global market. The report also anticipated that China would present a steady increase in market share of global semiconductor industry over the next five years.

“Everyone in the China team is excited to witness this milestone in GF’s history and is proud to be part of it,” said Joe Chen, Sales Vice President of GF for Greater China. “Building the strategic business relationship with an increasing number of Chinese customers, we are confident that the new office will enhance our capabilities of providing closer and effective local support, boosting our China business in the coming years.”

The partnership with ASIC service providers will continuously be enhanced to strengthen GF’s local capabilities in China. The foundry recently announced that it is working with Fuzhou-based Rockchip Electronics to ramp production for the customer’s RK3188 and RK3168 chips based on the foundry’s 28nm High-K Metal Gate process technology.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit https://www.globalfoundries.com.

National collaboration announced to build a more robust US supply chain and build the nation’s manufacturing base

New York City, NY, August 20th, 2013 — GLOBALFOUNDRIES and five partners today announced their Clinton Global Initiative (CGI) Commitment to Action, a collaborative effort that has the potential to strengthen the US supply chain and build the manufacturing base. The commitment, which was the outgrowth of discussions during the 2012 CGI America meeting in Chicago, now moves from the developmental to implementation stage.

The NSNI is being lead and facilitated by GF and brings together representatives from the University of Michigan, Battelle and others in a collaborative partnership with the AutoHarvest Foundation, CONNECT, the CONNECTORY, the Hudson Valley Technology Development Center (HVTDC) and the Center for Economic Growth (CEG) to create a regional pilot in the Hudson Valley of NY (“Tech Valley”) that is intended to better connect the supply chain. Key components of the NSNI include helping small and midsized manufacturers get connected to large manufacturers as suppliers, improve access to innovation and to generally help provide direction when it comes to needed assistance through the use of an online network and leveraging the expertise of existing organizations. The overall goal is to create a scalable model, ultimately providing a tool to build a more robust US supply chain and grow the US manufacturing base.

“As it becomes more evident that the success of modern manufacturing will be an integral part of the growth of the U.S. economy, it is apparent that a strong linkage between all size manufactures and access to innovation is imperative to ensure that the U.S. manufacturing sector can compete and lead in the global economy,” said Mike Russo, senior manager, government relations, GF. “Large manufacturers need to be able to easily identify smaller manufacturers who are able to supply needed goods and smaller manufacturers need to know where their potential markets lie and have access to the latest innovation in order to improve manufacturing processes and product design. CGI has provided the vehicle for those now engaged in the NSNI to come together to identify and solve this fundamental problem.”

“The NSNI is intended to develop a comprehensive method to connect the supply chain,” said Sridhar Kota, University of Michigan. “Much of the needed information and resources exist, but there is no easy way for especially small and mid-sized manufacturers to access it. Better connectivity could provide manufacturers the necessary access to resources ranging from IP, expertise, and software tools to test facilities products, parts and capital. A state-of-the-art online network that leverages existing networks and resources will create the needed connectivity, leveraging existing expertise and information.”

“This CGI Commitment to Action, which strives to improve the American economy by invigorating the manufacturing value chain, aligns well with our inclusive intellectual property ecosystem that utilizes social media tools to smart-connect R&D and manufacturing innovators and commercializers to accelerate the adoption of innovation”, said AutoHarvest President and CEO, Jayson D. Pankin.

The process entails developing a scalable model by initially focusing on three geographic regions (the West, Mid-west and East). The CONNECTORY and CONNECT have a presence in California and the Pacific Northwest, the AutoHarvest Foundation in Michigan and the HVTDC/CEG are located in the nation’s new “Tech Valley”. The initial pilot will utilize the HVTDC and their existing platform in conjunction with the Capital Region MEP (led by the Center for Economic Growth) to develop a scalable framework and prototype web-based platform leveraging expertise of the others involved. Several other markets across the nation have expressed an interest to be involved as early pilots.

Regional economic development entities in other markets will be responsible for outreach and facilitation throughout the nation as the initiative is scaled, using the Hudson Valley model. This process will be conducive to scaling because it utilizes the existing grass roots, regional structure to facilitate…giving municipalities and economic development entities the tools necessary to understand the system, working with manufacturers/suppliers and to provide data to update the system in real time (through the use of templates), which helps to maintain the site and database.

While the initial focus of the NSNI is to connect all sized manufacturers in the supply chain in order to grow their markets and to provide better access to both product and process innovation, through better connectivity/sharing of best practices and leveraging existing platforms, the broader goal will be to help address the other top issues identified by manufacturers, including access to capital/financing; assistance in developing sustainability/environmentally friendly operations, access to design enablement and general business assistance to address issues inhibiting business growth.

About the Clinton Global Initiative

Established in 2005 by President Bill Clinton, the Clinton Global Initiative (CGI), an initiative of Bill, Hillary & Chelsea Clinton Foundation, convenes global leaders to create and implement innovative solutions to the world’s most pressing challenges. CGI Annual Meetings have brought together more than 150 heads of state, 20 Nobel Prize laureates, and hundreds of leading CEOs, heads of foundations and NGOs, major philanthropists, and members of the media. To date CGI members have made more than 2,300 commitments, which are already improving the lives of more than 400 million people in over 180 countries. When fully funded and implemented, these commitments will be valued at $73.5 billion. For more information, visit clintonglobalinitiative.org and follow us on Twitter @ClintonGlobal and Facebook at facebook.com/clintonglobalinitiative.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit https://www.globalfoundries.com.

ABOUT AutoHarvest

AutoHarvest Foundation is a Michigan 501 (c) 3 non-profit organization – led by some of the most highly respected figures in the automotive industry. AutoHarvest is designing and launching a marketplace-driven e-collaboration system that accelerates innovation in advanced manufacturing. AutoHarvest is guided by its peer interest group, which consists of over 170 prominent government, university, automaker, supplier, venture capital, business accelerator and manufacturing organizations. Located within the innovation hubs of the Southeast Michigan region including Wayne State University’s Research and Development Park TechTown – and the University of Michigan’s North Campus Research Complex, AutoHarvest sits in the heart of NAFTA’s automotive cluster. Recently awarded a grant by the New Economy Initiative Foundation (“NEI”), AutoHarvest is part of the Detroit Regional Innovation Network. For more information visit: https://www.autoharvest.org.

ABOUT CONNECT

CONNECT has assisted in the formation and development of more than 3,000 companies in the San Diego region and is widely regarded as one of the world’s most successful organizations linking inventors and entrepreneurs with the resources they need for commercialization of innovative products in high tech and life sciences. The program has been modeled in more than 50 regions around the world. CONNECT has been recognized by Inc., Time and Entrepreneur magazines and in 2011 won the national State Science and Technology Institute’s 2011 Excellence in Tech Based Economic Development Award for Building Entrepreneurial Capacity. In 2010 CONNECT was the recipient of the Innovation in Economic Development Award from the U.S. Department of Commerce for creation of Regional Innovation Clusters. CONNECT manages the San Diego, Imperial Valley, Inland SoCal Innovation Hub (iHub) designated by the state of California Governor’s Office of Business & Economic Development in 2010. Key to our success has been the unique “culture of collaboration” between research organizations, capital sources, professional service providers and the established industries. For information on CONNECT or its programs, contact us at (858) 964-1300 begin_of_the_skype_highlighting (858) 964-1300 FREE end_of_the_skype_highlighting or visit connect.org

ABOUT THE CONNECTORY

Connectory.com® — the award-winning buyer-supplier resource that contains more than 22,000 detailed capabilities profiles of companies across all industries at every level of the supply chain including Manufacturing, Technology/R&D, Technical Services, Industrial Suppliers, Construction and the Trades, and Raw Materials (Agribusiness and Mining/ Quarrying). Connectory is fully keyword searchable with company locations mapped in a linked GIS API. Connectory is the supply chain database partner with CONNECT on their Nearsourcing Initiative aimed at effectively linking innovators to local providers of manufacturing and technical services. Connectory is a project of the East County Economic Development Council. For more information visit: connectory.com.

ABOUT THE HVTDC

Founded in 1988, the Hudson Valley Technology Development Center, Inc. (HVTDC) is a non-profit organization and one of ten regional technology development centers funded cooperatively through the Empire State Development’s Division of Science, Technology and Innovation, which works to facilitate the integration of innovation and technology throughout New York’s economic development efforts and the National Institute of Standards & Technology (NIST). HVTDC partners with their clients by delivering cost effective business solutions that help achieve sustained growth, optimize profits, identify competitive advantages and realize a high level of corporate social responsibility. The HVTDC experienced staff includes electrical, mechanical, computer and industrial engineers and project managers who have in-depth experience in business management, new product design and development, database and web development, production operations, business process analysis/improvement, grant writing and administration, management policy analysis, workforce training/development, strategic planning, organizational design, management policy and industrial engineering.

ABOUT CEG

Since 1987, the Center for Economic Growth (CEG) has been committed to fostering visionary economic growth throughout the 11-county Capital Region, as well as a significant portion of the Tech Valley corridor. As a private, not-for-profit organization we work with a diverse group of members and partners to advance the ability of the region and its assets to succeed in the global marketplace. With a focused and strategic approach we work to: GROW local companies by offering tactical business development strategies and services; ATTRACT opportunities for technology investment and expansion throughout Tech Valley and PREPARE communities to achieve their desired economic growth while enhancing the region’s excellent quality of life. In addition to support from its dedicated members, CEG receives funding and resources from Empire State Development’s Division of Science, Technology and Innovation, which works to facilitate the integration of innovation and technology throughout New York’s economic development efforts, the National Institute of Standards and Technology (NIST) / Manufacturing Extension Partnership (MEP) and National Grid. www.ceg.org