GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G Networks June 13, 2017FX-7TM offering leverages the company’s 7nm FinFET process to deliver best in class IP and Solutions Santa Clara, Calif., June 13, 2017 – GLOBALFOUNDRIES today announced the availability of FX-7 TM, an application-specific integrated circuit (ASIC) offering built on the company’s 7nm FinFET process technology. FX-7 is an integrated design platform that combines leading-edge manufacturing process technology with a differentiated suite of intellectual property and 2.5D/3D packaging to deliver the industry’s most complete solution for data center, machine learning, automotive, wired communications, and 5G wireless applications. Building on the continued success of FX-14, with industry-leading 56G SerDes and a legacy of ASIC expertise, FX-7 provides a comprehensive suite of tailored interface IPs including High Speed SerDes (60G, 112G), differentiated memory solutions including low-voltage SRAM, high-performance embedded TCAM, integrated DACs/ADCs, ARM processors, and advanced packaging options such as 2.5D/3D. In addition, the FX-7 portfolio enables new design methodologies and complex ASIC solutions for lower power and high-performance applications targeting hyper-scale data centers, 5G networking, and machine and deep learning applications. Future extensions are planned to support solutions for automotive ADAS and imaging applications. “The explosion of data traffic and bandwidth in global networks is driving a new set of demands for our customers,” said Mike Cadigan, senior vice president of the ASIC Business Unit at GF. “By leveraging our most advanced 7LP FinFET process technology, the FX-7 offering continues to extend our leadership in serving our customers by delivering the most advanced lower power and high performance ASIC solutions for new market paradigms such as data centers, deep computing, and wireless networking.” “GF’s 7nm FinFET technology demonstrates the technology and market leadership resulting from the combination of the silicon and manufacturing expertise of GF and IBM’s former semiconductor group,” said Jim McGregor, founder and principal analyst at TIRIAS Research. “With its new FX-7 ASIC offering, GF is extending its reach beyond traditional foundry customers to a new generation of systems companies who are looking to leverage bleeding-edge silicon processes for a wide range of applications, from deep learning for artificial intelligence to next-generation 5G networks.” Design kits for the FX-7 ASIC offering are now available to customers, with volume production expected in 2019. About GF: GF is a leading full-service semiconductor foundry providing a unique combination of design, development and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES offers the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. Contacts: Erica McGillGF(518) 795-4250[email protected]
22FDX® Revving up for Automotive Applications at CDNLive EMEA June 7, 2017 By: Gerd Teepe Recently, Cadence hosted its two-day European CDNLive event at a multi-purpose arena in Munich. The arena at the INFINITY Hotel & Conference Resort is also often a draw for ice-hockey tournaments, rock concerts and other high-profile events and visitors. In fact, the Bayern-Munich soccer team has gathered here before important games the last couple of years, bringing further glamour to the area. While the Bayern Munich players did not occupy the arena this year, there was another star attraction at the show—a technical innovation heralding a new era in image processing. Dream Chip Technologies GmbH of Hannover, Germany demonstrated a system with an image processing chip designed and manufactured with GLOBALFOUNDRIES’ 22nm FD-SOI (22FDX®) technology. Dream Chip’s ADAS SoC system platform is based on a quad ARM® A53 processor complemented with a dual ARM-R5 lock-step processor, making the chip suitable for enhanced ASIL-type security applications. The image workhorse of the chip is the Vision-P6 processor from Cadence. Source Dream Chip: Full system architecture of the image processing platform, soon to be implemented by Dream Chip. The Vision P6 architecture from Cadence is based on the Tensilica architecture and is targeted for Convolutional Neural Network computations (CNNs). Image objects are detected by correlation of video images with a database of known images. For applications in the car, like sign- and pedestrian-recognition, this application needs to run at real-time with 30 frames per second. In essence, it’s a massive computational comparison of pictures occurring in real-time. The prototype shown at CDNLive is the first-ever live system with an SoC implemented with GF’s 22FDX technology. The chip is 64mm2 and is mounted on a package substrate together with two LPDDR4 memories. Source Dream Chip: System module with chip and two LPDDR4-memories The Dream Chip ADAS chip is a complex and multifunctional SoC. At CDNlive, Dream Chip demonstrated video capabilities through a system board mounted on top of a model car, with the signal of a hood-mounted GoPro camera fed into the system board. Jens Benndorf, COO of Dream Chip, explained the further signaling path: “First fed into the chip, the video signal is passed to one of the four IVPs running a filter algorithm, then passed to the video-output and on to the display. It demonstrated that the IVP6 is working.” Source GF: Dream Chip live Demo setup at CDNLive EMEA In addition to the demo, Benndorf and his team gave a number of presentations on the system, the chip architecture and the CNN-based image processing for which the chip is targeted in the near future. Dream Chip, GF, and partners are working fast and furious (pun intended!) to accelerate the SoC prototype for production readiness. First silicon was demonstrated in February 2017 at Mobile World Congress in Barcelona, and a video on the platform was showcased at CDNLive in May. What will be next? Ride with us, and find out! 22FDX is enabling innovation in ADAS applications and eventually will for autonomous driving too. By then, Bayern Munich players will certainly notice. About Author Gerd Teepe In his role as Director Marketing for Europe, Gerd is responsible for leading the CMOS Platforms marketing initiatives in this region, with focus on accelerating design wins in the IoT/Industrial and Automotive segments as well as emerging markets. Prior to this, Gerd was leading the Design Engineering Organization of GLOBALFOUNDRIES. Gerd Teepe has been with GLOBALFOUNDRIES since its creation in 2009 and is based at the FAB1-site in Dresden. Prior to GLOBALFOUNDRIES, Gerd was with AMD, Motorola-Semiconductors, and NEC, Japan in R&D, Design, Product Management and Marketing roles. Gerd holds a Master’s Degree and a phd from Aachen University, Germany.
A Bigger Role for Foundries in the Analog Market May 30, 2017By: Dave Lammers A growing percentage of analog and mixed-signal ICs are being manufactured at foundries such as GLOBALFOUNDRIES. When it comes to commentary about the semiconductor industry, we live in a big D (digital), little A (analog) world, with leading-edge digital garnering most of the attention. While analog and mixed-signal ICs account for about 15 percent of the chip industry’s revenues — $48 billion in 2016 — there is scant written about how they are manufactured. A principal reason is that, until recently, most analog parts were made on older technologies. But that is changing. Jim Feldhan, president of Semico Research (Phoenix), said mixed-signal chips are adding more digital content, which results in bigger chips, leading to using more advanced process technologies to keep chip size under control. “We used to talk about Big A, little D, but now there is a lot more digital circuitry being added,” he said. The integration of analog and digital functions also leads to using 300mm wafers to control costs. “That encourages more foundry usage,” Feldhan said, adding that few analog IC companies can afford to build 300mm fabs. Companies such as Texas Instruments have moved to 300mm manufacturing for high-volume analog parts, but very few analog companies have the capital to construct and fill a 300mm fab, he added. The financial picture is changing in other ways as well. Analog companies once enjoyed enviable gross margins, Feldhan said, but increased competition has reduced average selling prices (ASPs) sharply over the last five years, from an analog ASP of 46 cents in 2011 to an average of 36 cents last year, according to Semico Research. That 25 percent drop in ASPs has caused more analog companies to put their investments into product development, and less into expensive capacity expansions. “The analog companies are running into the same issues that the digital IC companies have been facing. Their margins are pretty tight, and so it is inevitable that they focus on product development and turn more to foundries,” Feldhan said. GF has responded to these trends in two major ways: expanding analog and mixed-signal capacity, and accelerating its technology roadmap. The company’s 300mm fab in Chengdu, China, Fab 11, will add capacity for 180nm and 130nm production, as well as the 22nm fully depleted SOI (22FDX®) offering that is expected to see widespread mixed-signal usage. A 300mm fab in Singapore, Fab 7, has room for additional production of 130nm, 55nm, and upcoming 40nm analog/mixed-signal processes. Mike Arkin, deputy director for Analog/Power Product Line at GF, said, “We see a need for more capacity. We expect to be growing substantially in the next three to five years, and when we look at our projections, the time is coming when we are going to need even more capacity. The expansion in China will allow GF to continue growing its analog and power business” for the 130nm BCDLite® and 180nm BCDLite offerings. Arkin said many analog and mixed-signal IDMs are going fab-lite or fabless.They are “looking for alternatives to continue their roadmaps without investing so much. Individual companies can’t stay on the treadmill like a foundry can, so we see more IDMs coming to us, reaching out, driving our roadmap and talking to us about designing into the GF processes.” Also, more startups are targeting power management. “There are startups with brilliant ideas that no one has done. In some cases they come out of a university background and are looking for help on the process side,” Arkin said. And, established companies that haven’t had a presence in power are designing solutions. “The companies that haven’t had a power presence need foundries, not just good mixed-signal processes today but an active roadmap to the future as well,” he said. Adding Options and New Nodes GF offers both a bipolar-CMOS-DMOS (BCD) process, which features deep-trench isolation and support for higher voltages as well as a lower cost, lower voltage BCDLite. (BCDLite is a patented process technology that is available only from GF). The BCDLite process is more cost effective due to a less-complicated isolation structure, and is rated for lower voltages than traditional BCD. While BCD has a buried N layer and deep trench isolation, BCDLite uses a Triple Well isolation scheme as a cost reduction for customers which don’t need a high level of isolation. Arkin said some companies could safely use a BCDLite process and reduce costs, compared with the BCD process. “Many customers that use BCD are risk averse. They could use BCDLite, which operates up to 30 to 40 volts compared with 85V for BCD, and still have a robust design. For example, wireless charging could take advantage of BCDLite for consumer-oriented applications. Other industrial customers are thinking of using the automotive-grade BCD processes for assurance in high-temperature environments. There is not a hard line,” Arkin said. BCDLite is a consumer-oriented process, but Arkin said “with automotive driving new applications customers are finding that they can take their consumer-use designs to the BCD automotive process (Grades 1 and 0) for an automotive version of their designs. This is analogous to the way traditional CMOS logic processes have been qualified and marketed for Automotive Gr1 applications.” Expanding the Process Roadmap Since 2010, GF has shipped a cumulative 2.3 million wafers of BCDLite. It is a “solid No. 2” in the analog foundry business, according to Arkin. “GF is actively rolling out sub-100nm BCDLite this year,” Arkin said. “We are investing in bringing our analog and power expertise to even smaller nodes that complement our existing CMOS technologies.” There is an array of other advances coming as well (see chart of process options), with SRAM and non-volatile memory options being offered at the 130nm BCD and BCDLite node, as well as high-voltage and ultra-high-voltage (UHV, up to 700 V) 180nm offerings. Fewer Chips for Smaller Form Factors Feldhan said as system companies seek to reduce the form factors of their phones and other consumer products, they are working with their IC suppliers to integrate more digital cores into their power-management products. “By putting fewer chips on the system board, that reduces the amount of reflow soldering required during assembly,” he added. Arkin said governments around the world increasingly have been requiring less energy usage. “Things are moving faster than ten years ago, when power was flat. A watershed moment came in 2007 when the Energy Star® 4.0 added 80 PLUS® requirements for computers. That’s when the power management market began to change more to efficiency and technical differentiation, from just cost, cost, cost.” The Future of BCDLite “As BCDLite is incorporated into smaller process geometries, it becomes particularly interesting for battery-powered handheld devices, such as smart phones, smart watches, glucose monitors, and many others.” To reduce the form factor of these systems, Arkin said the IC vendors are “working to integrate devices in new and interesting ways, adding features to the socket. Most of that feature enablement is adding digital functions on top of the analog or power.” A next node BCDLite process, he said, is “ideal” for systems running on lithium-ion batteries. Since the analog functions in most cases don’t scale as strongly as digital, vendors adding digital functions on top of analog or power capabilities must deal with cost versus die size challenges. “When they are horizontally adding digital, they have to think about how much can they pack on a single die and still be cost effective,” Arkin said. A major analog and mixed signal customer with strong digital design expertise has solutions which support the Force Touch interface, which offers a more complex or richer way for users to interact with the touch screen. But that comes at a premium, more tightly coupling increasing digital content with the analog functions. With Force Touch and other “sensor sensitive” features, Arkin said “A next node BCDLite process would support more processing capability co-located with analog functions. GF is working on such a process in order to extend the sensor-sensitive capabilities even more.” Automotive is another rapidly evolving market. Mark Granger, a vice president in GF’s automotive group, said BCD and BCDLite are figuring into new automotive applications. “Power management increasingly plays a very important role in EVs (electric vehicles) being able to provide the highest efficiency as they turn the battery charge into propulsion. There are a lot of places where that technology can be used for very efficient power delivery systems.” About Author Dave Lammers Dave Lammers is a contributing writer for Solid State Technology and a contributing blogger for GF’s Foundry Files. Dave started writing about the semiconductor industry while working at the Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry. He joined E.E. Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave received a master’s in journalism at the University of Missouri School of Journalism.
模拟市场中晶圆厂将扮演更重要的角色 May 30, 2017作者: Dave Lammers 在例如格芯等铸造厂的模拟及混合信号集成电路生产比例正在上升。 当我们讨论到半导体产业时，我们总是将大量关注投入到数字电路，一小部分投入到模拟电路，数字电路总是占据着最大的部分。2016年480亿美金的收益，模拟和混合电路只占市场总收益的15%，关于它们的制造更是少有人知。最主要的原因，是因为模拟电路总是在更旧的技术上实现的，直到现在。 可是事情已经出现转机。 Jim Feldhan是位于菲尼克斯的Semico Research研究中心的主席，他声称混合信号芯片正在加入更多数字内容，导致了芯片尺寸加大，转而对先进的制程技术提出了新的要求以控制芯片大小。“从前总是模拟电路比数字电路重要，现在事实完全相反。” 对模拟和数字的集成同样引入了300mm晶元以控制成分。“这刺激了更多对铸造厂的使用，”Feldhan说道，并提供了能承受300mm晶元花销的几家集成电路公司的名字。 德州仪器已经将300mm制造应用于大批量模拟部件，但是很少模拟公司可以建设300mm的制造厂。 而财政方面也在以不同的形式改变。模拟公司曾经拥有让所有人妒忌的毛利润，Feldhan说道，但是越来越多的公司在过去5年内大幅度削减了平均售价，从2011年的单价46美分到去年的36美分。这25%的缩减让大量公司将投入转移到产品部门，而不是继续对昂贵的产能进行改进。 “模拟公司正在面临数字公司曾经面对的问题，他们的收益十分紧缩，向产品部门投入并向铸造厂寻求帮助是不可避免的。” 格芯对着两个趋势都做出了回应，格芯拓张了模拟和混合信号的产能，并加快了技术发展路线。公司位于中国成都的300mm第11号铸造厂将添入180nm及130nm的制造能力，同时还有预期带动混合信号使用广度的22nm全耗尽式绝缘体上硅（22FDX®）。位于新加坡的300mm第7号铸造厂，也拥有足够的空间加入130nm，55nm和将要到来的40nm模拟/混合信号制程。 Mike Arkin是格芯模拟/供电产品线的副主管,他说道,“我们看到了对产能的需求。我们期望在接下来的3到5年能持续增长。对于我们的规划来说，增加产能的时机已经到来。向中国市场的拓张将让格芯拥有更多模拟和模拟信号的业务”此处，特指130nm BCDLite® 和180nm BCDLite®产品。 Arkin提到许多模拟及模拟信号独立设计制造商正在改为简易型生产厂或无制造厂模式。 他们正在“找寻无需增加投入的出路以延续自己的发展规划。独立公司很难像铸造厂一样坚持下去，所以我们看到了大量这样的公司向我们联系，企图与我们合作，讨论共同发展路线，研究如何使用格芯的制程进行设计。” 同样，越来越多的初创公司正在瞄准电源管理市场。“有许多初创公司具备了别人没有的创意，但是他们需要来自铸造厂的帮助，因为他们就像是刚从大学院校毕业出来，”Arkin说道。 而且，并没有在电源方面露面的公司也再设计电源方案了。“这些公司也需要铸造厂的帮助，不止是好的混合信号制程，而是积极的未来发展路线规划”他说道。 加入新的节点和选择 格芯提供双极-CMOS-DMOS(BCD)制程, 具备深沟隔绝和更高电压支持,以及更低成本更低电压的BCDLite(BCDLite为格芯独家专利)。 BCDLite制程更加具备成本高效率，这是因为它更简易的独立结构，而且它具备传统BCDLite没有的低电压。BCD技术拥有N个埋氧层和深沟隔绝特性, BCDLite技术使用三重阱隔绝方案, 并以此为不需要高度隔绝的客户节省成本。 “许多使用BCD的客户都希望能减小风险，他们可以使用BCDLite，使用30到40伏特的操作电压，而不是BCD的80伏电压，但是可以得到同样稳定可靠的设计。举个例子，无线充电就可以利用BCDLite的优势满足客户指向的应用。其他产业的客户更多地考虑汽车级别的BCD制程以确保高温环境的使用。并没有死标准。”Arkin说道。 BCDLite是客户为先的制程，但是Arkin说“当汽车自动化推动新的应用，客户们发现他们可以将自己的设计在BCD汽车制程上实现（0级或1级）并改造成专为汽车设计的应用。这比起满足汽车1级验证的传统数字CMOS更加的趋近模拟制程。” 拓展制程前进路线 自2010年以来，格芯已累计寄出230万片BCDLite晶元。这在铸造厂行业内是“铁定第二”，Arkin说道。 “格芯正在积极推出100nm一下的BCDLite技术”, Arkin说道”我们正在为现有CMOS技术带来更小节点的补充,并引入模拟和混合信号人才。” 还有大量的不同优势即将展现（请参照制程选项表），SRAM和非易失性内存已在130nm BCD和BCDLite节点提供，同样提供的还有高压和超高压（高达700伏特）180nm产品。 更少的芯片，更小的尺寸 Feldhan提到，当系统公司努力减小他们的手机和其他消费者应用的尺寸，他们与集成电路供应商合作，在能源管理产品中集成更多的数字核心。“通过加入更少的芯片，可以减少在封装过程中所需的回流焊接，”他补充道。 Arkin说全世界的政府都在要求更少的能源消耗。“现在事物的发展比10年前快得多，可是能耗是持平的。分水岭出现在2007年，当能源之星4.0为计算机添加了80PLUS®指标。这是能源管理市场变化的开始，要求从只是成本转移向高效和技术独特性。” BCDLite的未来 “BCDLite技术正在应用于更小几何尺寸的制程，对电池管理类设备例如智能手机，只能手表，血糖仪等等具备独特的吸引力。” 为了将上述系统的尺寸减小，Arkin生成集成电路商正在“用新奇有趣的方式集成设备，添入新的功能。大多数这些添加功能都是在模拟或供电基础上加入数字功能。” 他说，下一个BCDLite制程节点对于锂电池类系统是“完美”的。由于模拟功能通常比重不如数字功能，供应商在添加数字功能上必须解决成本尺寸比的问题。“当他们横向添加数字功能时，他们必须考虑在不影响成本的情况下一块芯片上能放多少东西。” 有一家主流的模拟与混合信号公司，拥有深厚的数字电路知识，提供了新的方案，可使用力度感应进行触屏控制，这提供了复杂而丰富的人机界面。但是这来自模拟和数字电路成分的紧密对等性。 对于压力感应和其他“探测器敏感”型功能，Arkin声称“下一个BCDLite制程节点将支持更多模拟的制程功能。格芯正在努力开发此类制程，以此进一步开拓探测器类型的功能。” 汽车自动化是另一个快速进化的市场。Mark Granger是格芯自动化组的副总裁，他声称BCD和BCDLite正在进入汽车自动化应用。“能源管理正在扮演愈发重要的角色，特别是对于电动车，将电量高效转化为动力上。还有许多其他市场都需要BCD和BCDLite技术，因为他们可带来高效的功率传输系统。” 关于作者 Dave Lammers是固态技术特约撰稿人，也是格芯的Foundry Files的特约博客作者。他于20世界80年代早期在美联社东京分社工作期间开始撰写关于半导体行业的文章，彼时该行业正经历快速发展。他于1985年加入E.E. Times，定居东京，在之后的14年内，足迹遍及日本、韩国和台湾。1998年，Dave与他的妻子Mieko以及4个孩子移居奥斯丁，为E.E Times开设德克萨斯办事处。Dave毕业于美国圣母大学，获得密苏里大学新闻学院新闻学硕士学位。
Perceptia加入格芯的FDXcelerator™项目，将PLL技术带入便携式设备 May 25, 2017Scotts Valley, California – May 25, 2017 – Perceptia Devices, Inc., a developer of innovative phase-locked loop (PLL) and timing technology, today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, an expanding FD-SOI ecosystem to enable faster, broader deployment of the foundry’s 22FDX® and 12 FDX™ FD-SOI processes that support IoT, mobile, and wireless applications.
Perceptia Joins GlobalFoundries FDXcelerator™ Program to Bring PLL Technology to Portable Devices May 25, 2017Scotts Valley, California – May 25, 2017 – Perceptia Devices, Inc., a developer of innovative phase-locked loop (PLL) and timing technology, today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, an expanding FD-SOI ecosystem to enable faster, broader deployment of the foundry’s 22FDX® and 12 FDX™ FD-SOI processes that support IoT, mobile, and wireless applications.
格芯将与成都共同推动实施FD-SOI 生态圈行动计划 May 23, 2017 将累计投资超过1 亿美元来建立格芯TM FD-SOI 设计卓越中心 成都（2017年5月23日）— 5月23日，格芯（GLOBALFOUNDRIES）今日宣布，在成都市政府的引导和支持下，双方将协同合作以推动中国半导体产业的创新发展。双方将合作建立一个世界级的FD-SOI生态系统，其中涵盖多个成都研发中心及高校合作的研究项目。该项累计投资超过1亿美元的计划期望能吸引到更多顶尖的半导体公司落户成都，并使成都成为下一代芯片设计的卓越中心，以满足移动通信、物联网、汽车及其它高增长市场对高性能芯片的需求。 格芯和成都于近期共同出资建设一家300mm晶圆厂，旨在满足全球市场对 22FDX® FD-SOI 技术不断增加的需求。基于此项合作，成都目前正专注于将自己发展成为22FDX设计的卓越中心。通过合作，双方将在成都建立多个专注于知识产权开发、集成电路设计的中心，并孵化成都本地的无晶圆厂企业，帮助他们雇佣超过500位工程师的团队，以支持半导体和系统公司开发面向移动、互联、5G、物联网和汽车市场的、基于22FDX的产品。计划还提出，将重点建立与有关高校间的合作伙伴关系，以开展FD-SOI相关课程、研究计划及设计竞赛。 格芯产品管理高级副总裁Alain Mutricy表示：“中国是全球最大的半导体市场，同时国家对智慧城市，物联网等前沿技术的重视也居世界前列。格芯是非常契合中国发展的合作伙伴，FD-SOI在成都的生态系统将全面助力芯片设计师最大程度的利用这一技术的能力。我们希望通过与成都的合作，加快FDX在中国的发展和利用。” 成都市委常委、市政府副市长苟正礼表示：“我市与格罗方德公司《投资合作协议》签订后，已于今年2月举行了项目开工仪式，目前厂房等基础设施已全面开工建设，合资公司已成立。为进一步深化合作，吸引更多世界顶尖的半导体公司落户成都，双方共同拟订了FD-SOI产业生态圈行动，计划用6年时间，合建世界级的FD—SOI生态系统，助推成都成为全球卓越的集成电路设计和制造中心。” 格芯“22FDX”工艺采用22nm FD-SOI（全耗尽绝缘硅）晶体管架构，为无线的，使用电池供电的智能系统提供了业界最佳的性能、功耗和面积组合。目前，格芯成都新工厂的建设工作已经展开，预计将于2018年年初完工。完工后，该晶圆厂将率先投入主流工艺的生产，进而专注于22FDX的制造，预计将于2019年开始实现量产。 以下引言来自格芯合作伙伴 “为了回应中国政府关于西部开发的战略，联发科（MediaTek）在2010年建立了我们的成都分公司。成都已快速成为全球高科技企业青睐的投资目的地，我们很高兴地看到，越来越多的公司在这一地区投资，使成都成为格芯FDX技术制造和设计的卓越中心。” ——陈冠州,联发科执行副总裁兼联席首席运营官 “我们很高兴看到成都支持投资于格芯创新FDX技术的生态系统。这一合作对于支持中国快速发展的无晶圆厂半导体行业，以及帮助像瑞芯微电子（Rockchip）这样的公司在移动SoC市场建立差异化竞争优势发挥至关重要的作用。” ——励民，瑞芯微电子（Rockchip）公司CEO “我们对成都和格芯建立这一创新合作关系表示祝贺，它将对中国先进的半导体设计以及FD-SOI制造起到巨大的支持作用。这一针对设计生态系统的投资将帮助复旦微电子继续保持我们在集成电路设计创新解决方案方面的领导地位。” ——沈磊，中国复旦微电子集团负责技术工程和质量保证业务的副总裁 “格芯的FDX产品带来了低功耗FD-SOI技术的所有优点，可在功耗、性能和成本方面提供实时的调整。我们认为它非常适用于多应用场景，并对中国在FD-SOI方面的快速需求充满期待。格芯和成都这一增强FD-SOI设计生态系统的新合作将加快该技术在中国的采用和部署。” ——Handel Jones，International Business Strategies 公司CEO “我们的用户需要高质量的设计工具和处理技术，以帮助他们提供优化的SoC。通过我们与格芯的持续合作，我们期望成为成都FD-SOI生态系统的一部分，使客户可以享受到我们工具和设计流程所带来的好处。” ——Anirudh Devgan 博士，铿腾电子（Cadence） 数字设计与Signoff集团和系统与验证集团执行副总裁兼总经理 “FD-SOI可以带来更好的性能以及更低的裸片成本，所以它是适合中国快速发展的半导体市场的理想技术。Invecas非常高兴地看到成都和格芯共同推动建设这一地区的FD-SOI设计生态系统，我们期待通过在这一地区建立开发中心，成为这一生态系统的一部分，并通过借助其强大的半导体专业能力，开发先进的知识产权，帮助客户在FD-SOI设计中成功。” ——Dasaradha Gude，Invecas公司 CEO “SOI行业论坛预计FD-SOI技术将在中国取得快速发展并带来多方面的机遇。我们非常高兴地看到成都政府支持建设这一技术的设计生态系统。中国的半导体设计行业将会受益于一个强有力的知识产权设计提供商体系，以支持他们为下一代芯片的不断创新的雄心。” ——Carlos Mazure，SOI 行业论坛主席和执行董事 “全世界越来越多的客户都在积极采用FD-SOI技术。中国正在推动互联应用的新浪潮，而成都与格芯在增强设计生态系统上的合力连通将加快中国客户对于FD-SOI技术的使用。Soitec致力于通过提供大量高质量的FD-SOI基层来支持格芯，以支持客户不断增加的需求。” ——Paul Boudre， Soitec公司CEO “我们Synopsys和格芯在FDX平台上的合作为客户提供了一个接触FD-SOI优化知识产权、工具和优化设计流程的机会，可加快他们的开发和部署，使他们的产品可以快速投放市场。在成都与格芯在中国共同建设推进FD-SOI生态圈之际，我们期望着能成为其中活跃的一员。” ——Sassine Ghazi ，Synopsys 公司设计集团高级副总裁兼联席总经理 “通过发展FD-SOI设计生态系统，成都政府和格芯展示了巨大的领导力。芯原微电子在设计FD-SOI的系统单芯片（SoC）方面有超过五年的经验，我们已展示了它在解决超低功率和低功耗应用方面的优势。芯原是一家设计平台即服务（SiPaaS）的公司，我们在中国有超过500名设计工程师，其中150名在成都。我们期望着继续在这一不断扩大的FD-SOI生态系统中扮演一个主要角色，使客户能够为广泛的最终市场-特别是中国市场-交付优化的系统单芯片（SoC）和系统化封装（SiP）解决方案，包括智能设备、智慧家庭、智慧汽车和智慧城市等领域。” ——戴伟民，芯原微电子（VeriSilicon）公司CEO 格芯是全球领先的全方位服务半导体代工厂，为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务。伴随着全球生产基地横跨三大洲的发展步伐，格芯促生了改变行业的技术和系统出现，并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉发展公司（Mubadala Development Company）所有。
GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China May 23, 2017 More than $100M investment to establish a center of excellence for FDX™ FD-SOI design Chengdu, People’s Republic of China, May 23, 2017 — GLOBALFOUNDRIES and the Chengdu municipality today announced an investment to spur innovation in China’s semiconductor industry. The partners plan to build a world-class FD-SOI ecosystem including multiple design centers in Chengdu and university programs across China. The investment of more than $100 million is expected to attract leading semiconductor companies to Chengdu, making it a center of excellence for designing next-generation chips in mobile, Internet-of-Things (IoT), automotive and other high-growth markets. GF and Chengdu recently launched a joint venture to build a 300mm fab to meet accelerating global demand for GF’s 22FDX® FD-SOI technology. Connected to this manufacturing partnership, Chengdu is now focusing on developing the city as a center of excellence for 22FDX design. The partners plan to establish multiple centers focused on IP development, IC design and incubating fabless companies in Chengdu, with the expectation of hiring more than 500 engineers to support semiconductor and systems companies in developing products using 22FDX for mobile, connectivity, 5G, IoT, and automotive. There will also be a focus on creating partnerships with universities across China to develop relevant FD-SOI coursework, research programs and design contests. “China is the largest semiconductor market and is leading the way with a nationwide commitment to smart cities, IoT, smart vision and other advanced, mobile or battery-powered connected systems” said Alain Mutricy, senior vice president of product management at GF. “FDX is especially well suited for Chinese customers, and the FD-SOI ecosystem in Chengdu will provide the support system necessary to help chip designers take full advantage of the technology’s capabilities. We are committed to extend our partnership with Chengdu to accelerate adoption of FDX in China.” “Following the ribbon cutting marking the signing of our Investment Cooperation Agreement, and to deepen our cooperation and attract more best-in-class semiconductor companies to Chengdu, the Chengdu Municipal Government is delighted to cooperate with GlobalFoundries on this FD-SOI ecosystem action plan,” said Gou Zheng Li, Vice Mayor of City of Chengdu. “Over the next six years, we aim to build a world-class ecosystem for FD-SOI and make Chengdu a Center of Excellence for the design and manufacturing of integrated circuits.” GF’s 22FDX technology employs a 22nm Fully-Depleted Silicon-On-Insulator (FD-SOI) transistor architecture to deliver the industry’s best combination of performance, power and area for wireless, battery-powered intelligent systems. Construction of the new Chengdu fab has commenced and is on schedule with an expected completion date in early 2018. The fab will begin production of mainstream process technologies in 2018 and then focus on manufacturing 22FDX, with volume production expected to start in 2019. Supporting Quotes “MediaTek established our site in Chengdu back to 2010. Chengdu is quickly becoming an international destination for cutting-edge technology companies. We are thrilled to see continued investment to establish the region as a center of excellence for both manufacturing and design of GF’s FDX technology.” Joe Chen, Executive Vice President and Co-COO of MediaTek “The Chengdu Hi-tech Industrial Development Zone is quickly becoming an international center for technology innovation, and we are delighted to see Chengdu’s growing partnership with GF on advanced semiconductor design and manufacturing.” Spencer Pan, AMD President, Greater China “We are pleased to see Chengdu investing in an ecosystem to support GF’s innovative FDX technology. These types of partnerships are critical to supporting China’s growing fabless semiconductor industry and helping companies like Rockchip differentiate in the mobile SoC market.” Min Li, CEO of Rockchip “We congratulate Chengdu and GF for establishing an innovative partnership to support advanced semiconductor design and manufacturing of FD-SOI in China. This investment in a design ecosystem will help Fudan continue to be the leader in delivering innovative solutions in integrated circuit design.” Shen Lei, VP, Technology Engineering and QA, Shanghai Fudan Microelectronics Group Company Limited “This new design and IP ecosystem in Chengdu is exactly what the Chinese fabless industry needs to take advantage of the game-changing features of FD-SOI. The initiative is well positioned for success, considering GF’s track record of positive private-public partnerships to grow ecosystems around its fabs in Germany and New York.” Dan Hutcheson, CEO and Chairman of VLSI Research “GF’s FDX offerings bring together the best in low-power FD-SOI technology to provide real-time trade-offs in power, performance and cost. We see it as a very good fit for multiple applications and expect rapid growth in demand for FD-SOI in China. This new collaboration between GF and Chengdu to invest in expanding the design ecosystem for FD-SOI in China will accelerate its adoption and deployment.” Handel Jones, CEO of International Business Strategies “GF’s 22FDX technology is well suited for high-volume, mainstream applications like mobile, IoT, 5G and automotive. China is driving unprecedented growth in these markets, underpinned by an emerging group of domestic chip designers. Chengdu’s commitment to building a world-class semiconductor ecosystem will help spur continued innovation in this space.” Patrick Moorhead, President and Principal Analyst, Moor Insights & Strategy “Our customers demand the highest quality design tools and process technologies to help them deliver optimized SoCs. Through our ongoing collaboration with GF, we look forward to being a part of this FD-SOI ecosystem in Chengdu to enable customers with our tools and design flows.” Dr. Anirudh Devgan, Executive Vice President and General Manager, Digital & Signoff Group and System & Verification Group at Cadence “FD-SOI is an ideal technology for the fast-growing Chinese semiconductor market since it results in better performance as well as lower die costs. Invecas is pleased that Chengdu and GF are investing in developing a design ecosystem for FD-SOI in the region, and looks forward to being a part of that ecosystem by setting up a development center in the region which will leverage its strong semiconductor expertise and develop advanced IP to help customers win with their FD-SOI designs.” Dasaradha Gude, CEO of Invecas “The SOI Industry Consortium expects the market for FD-SOI technology to grow rapidly in China enabling numerous opportunities. We are pleased to see the Chengdu government investing in developing an extensive design ecosystem for this technology. China’s design community will benefit from a robust ecosystem of design IP suppliers to support their innovations towards the next-generation chips.” Carlos Mazure, Chairman and Executive Director of the SOI Industry Consortium “FD-SOI continues to see strong momentum and adoption from customers across the globe. China is driving a new wave of connected applications, and Chengdu and GF’s investment in expanding the design ecosystem should accelerate the use of FD-SOI for customers in China. Soitec is committed to support GF with high volumes of quality FD-SOI substrates to support the growing demand from customers.” Paul Boudre, CEO of Soitec “As a charter member of the GF FDXcelerator ecosystem initiative, Synopsys enables our mutual customers to realize the full entitlement of the GF FDX process for their complex designs. The collaboration between Synopsys and GF on the FDX platform provides designers with FD-SOI optimized Synopsys IP, tools and streamlined design flow to speed development and accelerate their time-to-market. Synopsys looks forward to actively participating as Chengdu and GF expand the FD-SOI ecosystem in China.” Sassine Ghazi, SVP and co-GM, Design Group at Synopsys “Chengdu and GF are demonstrating great leadership by investing in the development of a design ecosystem for FD-SOI in Chengdu. VeriSilicon has experience designing SoCs in FD-SOI for more than five years and we have demonstrated its benefits in addressing ultra-low power and low energy applications. Being a Silicon Platform as a Service (SiPaaS) company and with more than 500 R&D engineers in China including more than 150 R&D engineers in Chengdu, VeriSilicon looks forward to continue to play a major role in this expanding FD-SOI ecosystem to enable customers to deliver optimized System on a Chip (SoC) and System in a Package (SiP) solutions for a wide range of end markets including ‘intelligent’ devices, smart homes, smart cars, and smart cities especially for the China market.” Wayne Dai, CEO of VeriSilicon ABOUT GLOBALFOUNDRIES GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. Contacts: Jason GorssGLOBALFOUNDRIES(518) 698-7765[email protected]
GLOBALFOUNDRIES使用12nm FD-SOI技术扩展FDX™路线图 May 18, 201712FDX™可根据需要提供全节点扩展，超低功耗和性能 加利福尼亚州圣克拉拉市 2006年9月29日 格芯今天公布了新的12nm FD-SOI半导体技术，通过提供业界首个多节点FD-SOI线路图，扩展了其领先地位。基于其22FDX®产品的成功，该公司的下一代12FDX™平台旨在实现包括移动计算，5G连联接，人工智能和自主车辆的各种应用的未来智能系统。 这个世界正在被数万亿的设备连接起来，这种趋势使得这个世界更加的集成化，同时许多新兴的应用需要采用新的半导体创新方法来实现。使这些应用成为现实,芯片正在发展成为微型系统。同时，这些微型系统中集成了超低功耗智能组件，包括无线连接，非易失性存储器和电源管理。 格芯的全新12FDX技术专门用于提供前所未有的系统集成度，以及设计灵活性和功率扩展。 12FDX为系统集成设定了新的标准，同时也提供了一个优化平台,把射频（RF），模拟，嵌入式存储器和高级逻辑集成到单个芯片上。通过使用软件控制的晶体管，该技术可以提供业界最广泛的动态电压调整和无与伦比的设计灵活性。同时，能够及时提供峰值性能，并且可以平衡静态和动态功率以实现最终的能源效率。 “某些应用需要FinFET晶体管的卓越性能，但绝大多数连接设备则需要高水平的集成度，以及在性能和功耗上的灵活性。在这些方面，FinFET是无法实现的”，格芯的首席执行官Sanjay Jha说。 “我们的22FDX和12FDX技术通过为下一代连接的智能系统提供替代途径，填补了行业路线图的空白。通过我们的FDX平台，设计成本明显降低。同时，也重新开启了高级节点迁移的门户，从而激发了整个生态系统的创新。“ 格芯的新型12FDX技术建立在12nm全耗尽绝缘体（FD-SOI）平台上，能够实现10nm FinFET的性能，同时具有比16nm FinFET更少的功耗和更低的成本。该平台提供了全节点的扩展能力，相比现今的FinFET技术，提供15％的性能提升，并节省达50％的功耗。 “芯片制造业已不再是一体化的。虽然FinFET是最高性能产品的首选技术，但是对于许多追求性价比的移动产品和物联网产品，其行业产品路线图并不是太清晰。这些产品需要尽可能低的功耗，同时能有足够快的频率。”Linley Group的创始人兼首席分析师Linley Gwennap表示， “格芯的22FDX和12FDX技术已经很好地弥补了这一空白，为先进的节点设计提供了一个替代的迁移路径，特别是针对那些在不增加裸片成本的情况下寻求降低功耗的方案。今天，格芯是22nm及以下FD-SOI唯一的供应商，这一点能让格芯显得独一无二。” “当GF推出22FDX以来，我看到一些全新的功能。” VLSI研究公司董事长兼首席执行官G. Dan Hutcheson表示，“需要特殊化设计的人们无法忽视电力和性能的动态平衡。 现在，凭借其全新的12FDX产品，格芯正在为此技术提供明确的承诺，特别是对于目前市场上最具突破性创新的物联网和汽车。 格芯的FD-SOI技术将成为这一突破性创新的关键因素。” IBS公司创始人兼首席执行官Handel Jones表示：“FD-SOI技术可以为那些需要特殊化设计的用户提供功率，性能和成本的动态平衡。”格芯的全新12FDX产品提供了业界首个FD-SOI的产品规划，这样就能将低成本的迁移路径提供给智能客户端，5G，AR / VR，和汽车等领域。 格芯在德国德累斯顿的Fab 1晶圆厂目前正在为12FDX的发展和后续制造准备进行准备。第一批为客户生产的产品预计将于2019年上半年开始生产。 “我们对于格芯12FDX产品的推出感到非常兴奋，并希望这样的产品能提供给中国的客户。”中国科学院上海微系统与信息技术研究所所长的王曦院士说，“扩展FD-SOI产品路线图将使移动，物联网和汽车等市场的客户能够利用FDX技术的功耗优势和性能优势来创造有竞争力的产品。” “NXP半导体公司的的下一代i.MX多媒体应用处理器正在利用FD-SOI的优势，实现在汽车，工业和消费应用领域的功效方面和随时进行调整能力的领先地位。” NXP半导体公司应用处理器产品线的的副总裁Ron Martino表示， “格芯的12FDX技术是对整个行业的一个巨大贡献，因为它为FD-SOI提供了下一代节点，并且将进一步扩展平面设备的能力，为未来智能、联通的安全系统提供更低的风险，更广泛的动态范围和高的性价比。” “在INVECAS，我们的授权是向格芯客户提供无与伦比的IP解决方案，ASIC，设计服务以及软件和系统级专业知识，从而确保他们充分利用技术来降低设计的复杂性和时间门槛。” INVECAS首席执行官Dasaradha Gude说， “基于我们已经为22FDX完成的工作，我们期待扩大我们的战略关系，以支持格芯的新型12FDX技术，为客户提供创新的FD-SOI设计的路线图。” “VeriSilicon作为FD-SOI设计推动者之一，充分地利用了其硅平台服务（SiPaaS）以及为SoC提供一流的IP和设计服务的经验。” VeriSilicon的总裁兼首席执行官Wayne Dai说， “FD-SOI技术的独特优势能使我们在汽车，物联网，移动和消费市场脱颖而出。我们期待与格芯扩大其在12FDX产品线上的合作，并为中国市场的客户提供高质量，低功耗和高性价比的解决方案。” “12FDX开发将在功率，性能和智能扩展方面获得更大的突破，因为12nm最适合双重刻印复写，并以最低的制程复杂度提供最佳的系统性能和功耗表现。”CEA技术研究所Leti首席执行官Marie Semeria表示，“我们很高兴看到莱迪团队与格芯在美国和德国的合作结果，扩展了FD-SOI技术的路线图，这将成为连接设备的全系统芯片集成的最佳平台。” “我们非常高兴看到22FDX产品在无晶圆厂客户圈内的强劲势头，它得到了广泛的采用。现在，这款新的12FDX产品将进一步扩大FD-SOI市场的应用。”Soitec首席执行官Paul Boudre表示， “在Soitec，我们已经准备好支持格芯，从22nm到12nm的高容量，高质量的FD-SOI衬底。这对于我们的行业来说是一个惊人的机会，可以及时支持大量新的移动和连接应用程序。” 关于格芯 GF是世界上第一个具有真正意义上足迹遍布全球的全方位服务晶圆制造商。该公司于2009年3月成名，并迅速实现了规模化，成为世界最大的晶圆生产商之一，为250多个客户提供先进技术和独特制造的组合。格芯在新加坡，德国和美国经营，是唯一提供跨越全球三大洲的制造中心，并提供的足够灵活性和高度安全性的代工厂。该公司的300mm晶圆厂和200mm晶圆厂提供从主流到前沿的全系列制程技术。格芯的制造业务遍及全球，而格芯位于美国，欧洲和亚洲的半导体业务中心的大量的研发和设计实现人员为格芯的全球制造业务提供全面的支持。格芯由Mubadala Development Company拥有。欲了解更多信息，请访问https://www.globalfoundries.com。 联系人： Jason Gorss 电话：（518）698-7765 [email protected]
Racyics为格芯的22FDX®技术推出“makeChip”设计服务平台 May 17, 2017Racyics将提供IP和设计服务作为FDXcelerator™合作伙伴计划的一部分 2017年5月10日 德累斯顿德国 — Racyics GmbH今天宣布已经推出创新性的设计服务平台“makeChip”，该平台由Cadence支持并使用格芯的22FDX®工艺制程技术。 makeChip是基于先进的半导体技术设计集成电路的核心路径。可以适用于初创企业，设计专家，研究机和大学， 该平台为IT基础架构提供了一整套EDA工具安装和技术数据设置，如PDK，基础IP和复杂IP。所有工具和设计数据都由Racyics的经过验证的设计流程和项目管理系统连接起来。该环境可以使任何makeChip客户能够在最先进的技术节点中实现复杂的芯片系统（SoC）。 格芯的22纳米 FD-SOI技术22FDX在供电的效率和生产成本方面具有显著的优势。成功的设计，并能充分发挥潜力和实现最短的上市时间的关键因素便是拥有经验丰富的设计支持团队的支持。 作为格芯FDXcelerator合作伙伴计划的一部分，Racyics公司将为最先进的技术提供全面支持，从而帮助小型企业实现巨大的创新潜力。 “我们希望将初创企业，中小型企业和学术机构推到行业的最前沿。通过makeChip，我们使他们能够在格芯的22FDX技术中快速地执行模拟，混合信号和数字设计，因此他们可以在物联网和工业4.0领域开发大量应用的硬件基础，” Racyics 的CEO Holger Eisenreich说。 格芯负责产品管理的高级副总裁Alain Mutricy说：“我们的22FDX技术正在迅速成为那些聚焦于市场的应用的选择，这类应用需要具备低功耗，高运营效率和价格方面的优势。与Racyics和Cadence的合作将有助于降低中小企业，初创企业和学术界的进入壁垒。” 应用makeChip包括一套完整的数字设计流程，整合来自Cadence的先进的硅片验证解决方案，且无需额外的非商业学术项目成本。对于商业项目，将采用不同的合同协议。 Cadence技术领域运营副总裁Jens Werner说：“Cadence的全流量数字解决方案能够完美地匹配makeChip设计平台。用户能够实现其供电，性能和面积目标。 MakeChip平台将有助于在欧洲及其他地区开展设计。” Racyics公司其makeChip客户提供内部0.4V IP 的22FDX。它在非商业项目的框架下是免费的，同时使平台用户能在世界上首先探索超低电压设计空间，并利用其无与伦比的高能效运营潜力。 在已经开始运行两个22FDX试点项目后，makeChip平台现在向学术界和商业实体开放，以启动他们的设计项目。欲了解更多信息，请访问 www.makechip.design. 关于Racyics Racyics是一家位于德国德累斯顿的经验丰富的设计公司。公司为模拟，混合信号和数字IC提供设计和实施服务。 Racyics团队为欧洲领先的半导体公司工作多年，公司的团队为汽车，消费和通信应用成功地提供了很多芯片的设计，包括在汽车，消费和通讯应用上的28纳米尺寸的设计。作为格芯的渠道合作伙伴，Racyics专注于先进和前沿技术，Racyics提供28nm，22nm和14nm的多项目晶圆（MPW）。此外，Racyics为欧洲中小企业和学术界提供设计支持服务。有关更多信息，请访问www.racyics.com. 关于格芯 格芯是提供全方位服务的领先半导体晶圆制造商，为世界上最具创新意识的科技公司提供独特的设计，开发和制造服务。格芯的生产制造业务遍布全球三大洲。格芯使技术和系统转型成为可能，并且帮助客户拥有塑造市场的力量。 格芯是Mubadala Development Company旗下公司。欲了解更多信息，请访问公司官方网站 https://www.globalfoundries.com. 关于Cadence Cadence使电子系统和半导体公司能够创造出改变人们生活，工作和娱乐方式的新型终端产品。 Cadence的软件，硬件和半导体IP帮助客户更快实现将产品从半导体到印刷电路板到实施交付的整个系统。该公司的“系统设计支持”策略可帮助客户在移动，消费，云数据中心，航天，物联网，工业和其他领域开发差异化的产品。
