NOVA and GLOBALFOUNDRIES Jointly Awarded the “Best Metrology Paper” at SPIE Advanced Lithography Conference

Nova today announced that its co-authored paper with GLOBALFOUNDRIES on “Implementation of machine learning for high volume manufacturing metrology challenges” has been selected as the winner of the Diana Nyyssonen award for “best paper at SPIE’s 2018 Advanced Lithography Symposia.” The award was granted to Nova and GF on the opening day of the 2019 Conference. The paper is a result of the continuous partnership between the companies and demonstrates the innovation Nova promotes in advanced process control utilizing its unique and differentiated software solutions. The methodology described in the paper was already installed and is utilized by GF in high volume manufacturing. 

NOVA and GLOBALFOUNDRIES Jointly Awarded the “Best Metrology Paper” at SPIE Advanced Lithography Conference

Nova today announced that its co-authored paper with GLOBALFOUNDRIES on “Implementation of machine learning for high volume manufacturing metrology challenges” has been selected as the winner of the Diana Nyyssonen award for “best paper at SPIE’s 2018 Advanced Lithography Symposia.” The award was granted to Nova and GF on the opening day of the 2019 Conference. The paper is a result of the continuous partnership between the companies and demonstrates the innovation Nova promotes in advanced process control utilizing its unique and differentiated software solutions. The methodology described in the paper was already installed and is utilized by GF in high volume manufacturing. 

Synopsys and GLOBALFOUNDRIES Collaborate to Develop Industry’s First Automotive Grade 1 IP for 22FDX Process

Synopsys’ Portfolio of DesignWare Foundation, Analog, and Interface IP Accelerate ISO 26262 Qualification for ADAS, Powertrain, 5G, and Radar Automotive SoCs

MOUNTAIN VIEW, Calif., and SANTA CLARA, Calif., Feb. 21, 2019 –

Highlights

  • Synopsys DesignWare IP for automotive Grade 1 and Grade 2 temperature operation on GLOBALFOUNDRIES 22FDX® process includes Logic Libraries, Embedded Memories, Data Converters, LPDDR4, PCI Express 3.1, USB 2.0/3.1, and MIPI D-PHY IP
  • Synopsys’ IP solutions implement additional automotive-grade design rules for the 22FDX process to meet reliability and 15-year automotive operation requirements
  • Synopsys’ IP that supports AEC-Q100 temperature grades and ISO 26262 ASIL Readiness accelerates SoC reliability and functional safety assessments
  • Join Synopsys and GLOBALFOUNDRIES at Mobile World Congress in Barcelona, Spain on Feb. 25 for a panel on “Intelligent Connectivity for a Data-Driven Future”

Synopsys, Inc. (Nasdaq:SNPS) and GLOBALFOUNDRIES (GF) today announced a collaboration to develop a portfolio of automotive Grade 1 temperature (-40C to +150C junction) DesignWare® Foundation, Analog, and Interface IP for the GF 22-nm Fully-Depleted Silicon-On-Insulator (22FDX®) process. By providing IP that is designed for high temperature operation on 22FDX, Synopsys enables designers to reduce their design effort and accelerate AEC-Q100 qualification of system-on-chips (SoCs) for automotive applications such as eMobility, 5G connectivity, advanced driver assistance systems (ADAS), and infotainment. The Synopsys DesignWare IP implements additional automotive design rules for the GF 22FDX process to meet stringent reliability and operation requirements. This latest collaboration complements Synopsys’ broad portfolio of automotive-grade IP that provides ISO 26262 ASIL B Ready or ASIL D Ready certification, AEC-Q100 testing, and quality management.

“Arbe’s ultra-high-resolution radar is leveraging this cutting edge technology that enabled us to create a unique radar solution and provide the missing link for autonomous vehicles and safe driver assistance,” said Avi Bauer, vice president of R&D at Arbe. “We need to work with leading companies who can support our technology innovation. GF’s 22FDX technology, with Synopsys automotive-grade DesignWare IP, will help us meet automotive reliability and operation requirements and is critical to our success.”

“GF’s close, collaborative relationships with leading automotive suppliers and ecosystem partners such as Synopsys have enabled advanced process technology solutions for a broad range of driving system applications,” said Mark Ireland, vice president of ecosystem partnerships at GF. “The combination of our 22FDX process with Synopsys’ DesignWare IP enables our mutual customers to speed the development and certification of their automotive SoCs, while meeting their performance, power, and area targets.”

“Synopsys’ extensive investment in developing automotive-qualified IP for advanced processes, such as GF’s 22FDX, helps designers accelerate their SoC-level qualifications for functional safety, reliability, and automotive quality,” said John Koeter, vice president of marketing for IP at Synopsys. “Our close collaboration with GF mitigates risks for designers integrating DesignWare Foundation, Analog, and Interface IP into low-power, high-performance automotive SoCs on the 22FDX process.”

GLOBALFOUNDRIES & Synopsys at Mobile World Congress 2019

On February 25, 2019, Synopsys will join the GLOBALFOUNDRIES NEXTech Lab Theater Session at MWC19. A panel discussion, with leading industry experts, including Joachim Kunkel, general manager of the Solutions Group at Synopsys, and Mike Cadigan, senior vice president of global sales, business development, customer and design engineering at GF, will offer insights about the importance of intelligent connectivity, the growth, demands, and innovations it is poised to bring, and its impacts across the semiconductor value chain. For more information, visit: https://www.globalfoundries.com/join-gf-mwc19.

Resources

For more information on Synopsys DesignWare IP for automotive Grade 1 temperature operation on GF’s 22FDX process:

About GLOBALFOUNDRIES

GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog/mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

About Synopsys DesignWare IP

Synopsys is a leading provider of high-quality, silicon-proven IP solutions for SoC designs. The broad Synopsys DesignWare IP portfolio includes logic libraries, embedded memories, embedded test, analog IP, wired and wireless interface IP, security IP, embedded processors, and subsystems. To accelerate prototyping, software development and integration of IP into SoCs, Synopsys’ IP Accelerated initiative offers IP prototyping kits, IP software development kits and IP subsystems. Synopsys’ extensive investment in IP quality, comprehensive technical support and robust IP development methodology enables designers to reduce integration risk and accelerate time-to-market. For more information on Synopsys DesignWare IP, visit https://www.synopsys.com/designware

About Synopsys

Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com

Editorial Contacts:

Norma Sengstock
Synopsys, Inc.
650-584-2890
[email protected]

Erica McGill
GLOBALFOUNDRIES
518-795-5240
[email protected]

Xpeedic’s IRIS Qualified on GLOBALFOUNDRIES 12LP Process for High-Performance Applications

Xpeedic Technology, Inc. today announced that its 3D full-wave electromagnetic (EM) simulation tool, IRIS, has been qualified on GLOBALFOUNDRIES’ 12nm Leading-Performance (12LP) process technology. This qualification enables designers to run IRIS with confidence using the certified IRIS process file available on GF’s 12LP FinFET semiconductor manufacturing process.

Xpeedic’s IRIS Qualified on GLOBALFOUNDRIES 12LP Process for High-Performance Applications

Xpeedic Technology, Inc. today announced that its 3D full-wave electromagnetic (EM) simulation tool, IRIS, has been qualified on GLOBALFOUNDRIES’ 12nm Leading-Performance (12LP) process technology. This qualification enables designers to run IRIS with confidence using the certified IRIS process file available on GF’s 12LP FinFET semiconductor manufacturing process.

GLOBALFOUNDRIES Crosses Billion-Dollar Design Win Threshold with 8SW RF SOI Technology

Mobile market continues to favor RF SOI, with 8SW proving to be the industry’s leading platform for power-optimized chips

Santa Clara, Calif., February 20, 2019 – GLOBALFOUNDRIES today announced that the company’s mobile-optimized 8SW RF SOI technology platform has delivered more than a billion dollars of client design win revenue since its launch in September 2017. With yields and performance exceeding client expectations, 8SW is enabling designers to develop solutions that offer extremely fast downloads, higher quality connections and reliable data connectivity for today’s 4G/LTE Advanced operating frequencies and future sub-6 GHz 5G mobile and wireless communication applications.

As the industry’s first 300 mm RF SOI foundry solution, 8SW delivers significant performance, integration and area advantages, with best-in-class low-noise amplifier (LNA) and switch performance which all together improve integration solutions in the front-end module (FEM). The optimized RF FEM platform is tailored to accommodate aggressive LTE and sub-6 GHz standards for FEM applications, including 5G IoT, mobile device and wireless communications.

“At Qorvo, we continuously expand upon our industry-leading RF portfolio to support all pre-5G and 5G architectures, as such we require the best available technologies to enable us to deliver top-notch solutions with the broadest range of connectivity in sub-6 GHz and mmWave 5G,” said Todd Gillenwater, Qorvo CTO. “GF’s 8SW technology delivers a mix of performance, integration and area advantages in FEM switches and LNAs, giving us a great platform for our world-class products.”

“As new high-speed standards, including 4G LTE and 5G, continue to grow in complexity, innovation in RF Front End radio design must continue to deliver performance commensurate with growing network, data and application demands,” said Bami Bastani, senior vice president of business units at GF. “GF continuously builds on our extensive RF SOI capabilities that are providing our clients a competitive market advantage with first time design success, optimal performance, and the shortest time to market.”

According to Mobile Experts, the mobile RF front-end market is estimated to reach $22 billion in 2022, with a CAGR of 8.3 percent. With more than 40 billion RF SOI chips shipped thru 2018, GF is uniquely positioned to deliver an expanding RF portfolio for a broad range of high-growth applications such as automotive, 5G connectivity and the Internet of Things (IoT).

“Radio complexity promises to increase for both sub-6 GHz and mmWave, driving tight integration of multiple RF functions,” said Joe Madden, Principal Analyst at Mobile Experts. “The market needs RF solutions with high efficiency and linearity performance, but also using scalable processes on large wafers. GF has established an RF SOI process that will enable longer-term market expansion.”

GF combines legacy RF expertise and the industry’s most differentiated RF technology platform spanning advanced and established technology nodes, to help clients develop 5G connectivity solutions for next-generation products.

GF will present its 5G-ready RF solutions with industry experts at MWC Barcelona on February 25 at the NEXTech Labs Theater, in the Fira Gran Via Convention Center, in Barcelona Spain. For more information, go to globalfoundries.com.

About GLOBALFOUNDRIES

GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF, and analog/mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com.

Contact:

Erica McGill
GLOBALFOUNDRIES
(518) 795-5240
[email protected]

Rambus and GLOBALFOUNDRIES to Deliver High-Speed SerDes on 22FDX® for Communications and 5G Applications

Rambus Inc., a leading provider of semiconductor and IP products, today announced the availability of 32G Multi-protocol SerDes PHY on GLOBALFOUNDRIES 22nm FD-SOI (22FDX®) platform for high-volume, high-performance applications. Designed to meet the performance requirements of high-speed wireline, wireless 5G infrastructure and data center applications, the SerDes PHY delivers data rates up to 32 Gbps and supports multiple standards including PCIe 4.0, JESD204B/C, CPRI, and Ethernet.

Rambus and GLOBALFOUNDRIES to Deliver High-Speed SerDes on 22FDX® for Communications and 5G Applications

 Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of 32G Multi-protocol SerDes PHY on GLOBALFOUNDRIES 22nm FD-SOI (22FDX®) platform for high-volume, high-performance applications. Designed to meet the performance requirements of high-speed wireline, wireless 5G infrastructure and data center applications, the SerDes PHY delivers data rates up to 32 Gbps and supports multiple standards including PCIe 4.0, JESD204B/C, CPRI, and Ethernet.

格芯设计中标逾10亿美元 8SW RF SOI技术功不可没

移动市场持续青睐RF SOI,同时8SW日益成为业界领先的低功耗芯片平台

加利福尼亚州圣克拉拉,2019年2月20日  – 格芯今天宣布,公司自2017年9月推出针对移动应用优化的8SW RF SOI技术平台以来,客户端设计中标收入已逾10亿美元。8SW的良率与性能均超过客户期望,可帮助设计人员开发解决方案,为当今先进的4G/LTE工作频率和未来6GHz以下的5G移动和无线通信应用提供极快的下载速度、更高质量的互连和更可靠的数据连接。
8SW是业内首款300 mm RF SOI代工解决方案,具有显著的性能、集成度和尺寸优势,以及出色的低噪声放大器(LNA)和开关性能,这些均有助于改进前端模块(FEM)中的集成解决方案。优化的RF FEM平台专为满足前端模块应用更高的LTE和6 GHz以下标准而量身定制,包括5G 物联网、移动设备和无线通信。
Qorvo首席技术官Todd Gillenwater表示:“Qorvo持续扩展业内领先的射频产品组合,以支持所有Pre-5G和5G架构,因此我们需要适当的可行技术,以便为客户提供6 GHz以下及5G毫米波等方面连接范围广泛的出色解决方案。格芯8SW技术使前端模块开关和LNA同时具有性能、集成度和尺寸优势,为我们的优质产品提供了一个很好的平台。”
格芯业务部高级副总裁Bami Bastani表示:“随着包括4G LTE和5G在内的新高速标准复杂程度日益增加,射频前端无线电设计的创新性能必须不断满足日益增长的网络、数据和应用需求。格芯不断增强广泛的RF SOI能力,帮助客户在首次设计成功率、优化性能和缩短上市时间方面获得具有竞争力的市场优势。”
Mobile Experts认为,2022年移动射频前端市场估值达到220亿美元,其中CAGR占8.3%。格芯2018年RF SOI芯片出货量超过400亿,在该领域独具优势,可为汽车、5G连接和物联网(IoT)等各种高增长应用提供更广泛的射频产品组合。
Mobile Experts的首席分析师Joe Madden表示:“用于6 GHz以下及毫米波的无线电复杂性将会提高,促使多种射频功能紧密集成。市场需要具备线性性能的射频高效解决方案,同时能够在较大晶圆上使用可扩展工艺。格芯已经拥有成熟的RF SOI工艺,有助于拓展长期市场。”
格芯结合了丰富的射频技术经验和业内极具差异化的射频技术平台,涵盖先进和成熟的技术节点,帮助客户为下一代产品研发5G连接解决方案。
格芯将参加2月25日举办的巴塞罗那全球移动通信大会,与业界专家共聚一堂,展示其支持5G的射频解决方案,地点是西班牙巴塞罗那格兰大道菲拉会议中心NEXTech实验室剧院。如需了解更多信息,请访问globalfoundries.com

About GLOBALFOUNDRIES 

GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets.GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF, and analog mixed signal.With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe.GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com.

Contact:
Erica McGill
GLOBALFOUNDRIES
(518) 795-5240
[email protected]

 

GLOBALFOUNDRIES and Dolphin Integration to Deliver Differentiated FD-SOI Adaptive Body Bias Solutions for 5G, IoT and Automotive Applications

IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration

Santa Clara, Calif. and Grenoble, France, February 19, 2019 – GLOBALFOUNDRIES (GF) and Dolphin Integration, a leading provider of semiconductor IP, today announced a collaboration to develop a series of adaptive body bias (ABB) solutions to improve the energy efficiency and reliability of system-on-chip (SoC) on GF’s 22nm FD-SOI (22FDX®) process technology for a wide range of high-growth applications such as 5G, IoT and automotive.

As part of the collaboration, Dolphin Integration and GF are working together to develop a series of off-the-shelf ABB solutions for accelerating and easing body bias implementation on SoC designs. ABB is a unique 22FDX feature that enables designers to leverage forward and reverse body bias techniques to dynamically compensate for process, supply voltage, temperature (PVT) variations and aging effects to achieve additional performance, power, area and cost improvements beyond those from scaling alone.

The ABB solutions in development consist of self-contained IPs embedding the body bias voltage regulation, PVT and aging monitors and control loop as well as complete design methodologies to fully leverage the benefits of corner tightening. GF’s 22FDX technology offers the industry’s lowest static and dynamic power consumption. With automated transistor body biasing adjustment, Dolphin Integration can achieve up to 7x energy efficiency with power supply as low as 0.4V on 22FDX designs.

“We have been working with GF for more than two years on advanced and configurable power management IPs for low power and energy efficient applications,” said Philippe Berger, CEO at Dolphin Integration. “Through our ongoing collaboration with GF, we are focused on creating turnkey IP solutions that allow designers to realize the full benefit of FD-SOI for any SoC design in 22FDX.”

“In order to simplify our client designs and shorten their time-to-market, GF and our ecosystem partners are helping to pave the way to future performance standards in 5G, IoT and automotive,” said Mark Ireland, vice president of ecosystem partnerships at GF. “With the support of silicon IP providers like Dolphin Integration, new power, performance and reliability design infrastructures will be available to customers to fully leverage the benefits of GF’s 22FDX technology.”

Design kits with turnkey adaptive body bias solutions on GF’s 22FDX will be available starting in Q2 2019.

About Dolphin Integration

Founded in 1985, Dolphin Integration currently employs 160 employees in their head office located in Meylan, France and operates subsidiaries in Canada and Israel. Dolphin Integration develops semiconductor IPs mainly serving high volume fabless IC companies and offers integrated circuit design services to customers worldwide. Conscious of AI, IoT, mobile and automotive products’ explosive growth and potential environmental impact, Dolphin Integration is committed to accelerating the development of energy-efficient System-on-Chip (SoC) for its customers.

Dolphin Integration is the registered tradename of Dolphin Design SAS.

To learn more about the company, please visit: www.dolphin-integration.com and follow us on Twitter @Dolphin_Int and LinkedIn

Press contact:

Aurélie Descombes
Phone: +33 480 420 720
[email protected]

About GF

GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF, and analog/mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com.

Contact:

Erica McGill
GLOBALFOUNDRIES
(518) 795-5240
[email protected]