Attopsemi’s I-fuse OTP Passed 250 degrees Celsius for 1,000hrs Wafer-level Burn-in Studies on GLOBALFOUNDRIES 22FDX FD-SOI Technology

Attopsemi’s I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for automotive and IoT applications. 

GLOBALFOUNDRIES, indie Semiconductor Deliver Performance-Enhanced Microcontrollers for Automotive Applications

55nm LPx platform, with SST’s highly reliable embedded SuperFlash®, increases performance and energy efficiency for automotive applications

Santa Clara, Calif., November 12, 2018 – GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF’s 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash®) technology. indie Semiconductor’s new Nigel products are based on ARM Cortex-M4 microcontroller cores, capable of supporting advanced functionalities in IoT, medical and automotive markets. indie Semi is already shipping products, manufactured on GF’s 55LPx process, to automotive customers in volume. 

indie’s custom microcontrollers integrate in a single device mixed-signal functionality for sensing, processing, controlling and communicating. GF’s 55LPx platform, with SST’s SuperFlash® memory technology, enables the use of high-density memory and high-performance processing combined with mixed-signal functions in indie’s Nigel M4 controllers, delivering a highly integrated automotive solution at 55nm node.

“indie’s Nigel controller is designed to support high performance computing for automotive system architectures,” said Paul Hollingworth, executive vice president of sales and marketing at indie Semiconductor. “As automotive system requirements get more complex, our customers need solutions to perform complex processing while combining multiple functions into a single chip to minimize size and weight. We chose GF’s automotive-qualified 55LPx platform for its combination of density, performance and cost.”

“GF is pleased to be working with indie Semiconductor, a leader in state-of-the-art SoC technology,” said Rajesh Nair, vice president of mainstream offering management at GF. “indie Semiconductor joins our rapidly growing client base for GF’s 55LPx platform, which offers a combination of superior low-power logic, embedded non-volatile memory, extensive IP, and superior reliability for consumer, industrial and automotive grade 1 applications.”

The 55LPx RF-enabled platform provides a fast path-to-product solution that includes silicon-qualified RF IP and Silicon Storage Technology’s (SST) highly reliable embedded SuperFlash® memory. The platform is in volume production on GF’s 300mm line in Singapore. In addition to Nigel, indie Semiconductor is currently developing several products on the technology, many of which are for automotive applications.

Process design kits and an extensive offering of silicon proven IP are available now. For more information on GF’s mainstream CMOS solutions, contact your GF sales representative or go to globalfoundries.com.

About indie
indie designs and manufactures custom, microcontroller-based chips, using ARM cores. We replace most of the contents of a printed circuit board with a single, optimal chip. This reduces the product size, cost and power consumption compared with solutions based around standard, off-the-shelf components. Reliability, manufacturability and security from copying are all increased. www.indiesemi.com

About GF
GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit https://www.globalfoundries.com.

SuperFlash® is a registered trademark of Silicon Storage Technology, Inc.

格芯携手indie Semiconductor,为汽车应用提供性能增强型微控制器

55nm LPx平台采用SST高度可靠的嵌入式SuperFlash®,可提升汽车应用的性能和能效

 

加利福尼亚州圣克拉拉,2018年11月12日 – 格芯和indie Semiconductor今日宣布推出新一代定制微控制器,它采用配备嵌入式非易失性存储器(SuperFlash®)的格芯55nm低功率扩展(55LPx)工艺平台,并且符合汽车标准。indie Semiconductor全新的Nigel产品基于ARM Cortex-M4微控制器内核,支持物联网、医疗和汽车市场的先进功能。indie Semi采用格芯55LPx工艺生产的产品已向汽车客户批量供货。 

 

indie的定制微控制器将集成于单个器件中,可提供检测、处理、控制和通信等混合信号功能。格芯55LPx平台采用SST的SuperFlash®存储器技术,使indie的Nigel M4控制器能够利用高密度存储器和高性能处理能力,并结合混合信号功能,从而实现55nm工艺的高度集成汽车解决方案。

 

indie Semiconductor销售与营销执行副总裁Paul Hollingworth表示:“indie的Nigel控制器旨在支持汽车系统架构的高性能计算。随着汽车系统的需求越来越复杂,客户要求解决方案能够执行复杂的处理,同时将多个功能集成于单芯片中,以最大限度地缩减尺寸和重量。我们选择格芯符合汽车标准的55LPx平台是因为其具有密度、性能和成本综合优势。”

 

格芯主流产品管理部门副总裁Rajesh Nair表示:“indie Semiconductor是先进SoC技术领域的领军企业,能够与之合作,格芯感到非常荣幸。indie Semiconductor加入了格芯快速发展的55LPx平台客户群,这一平台为消费类、工业和1级汽车标准应用提供了出色的低功率逻辑、嵌入式非易失性存储器、广泛的IP以及出色的可靠性等综合优势。”

 

55Lpx RF平台提供了一种快速开发产品的解决方案,包括通过硅认证的RF IP和硅存储技术(SST)高度可靠的嵌入式SuperFlash®存储器。格芯位于新加坡的300mm生产线批量生产该平台。除Nigel以外,indie Semiconductor目前正在开发采用该技术的更多产品,其中许多产品将面向汽车应用。

 

工艺设计套件现已上市,并提供广泛的通过芯片验证的IP。如需了解更多有关格芯主流的CMOS解决方案的信息,请联系您的格芯销售代表或访问globalfoundries.com.cn

 

关于indie
indie设计和制造采用ARM内核的定制型微控制器芯片。我们以优化的单芯片替代印刷电路板中的大部分组件。与基于现成标准组件的解决方案相比,定制芯片可减小产品尺寸,降低产品成本和功耗。可靠性、量产性和防复制安全性都得到了提高。www.indiesemi.com

 

关于格芯

格芯是全球领先的全方位服务半导体代工厂,为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务。伴随着全球生产基地横跨三大洲的发展步伐,格芯促生了改变行业的技术和系统的出现,并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉投资公司(Mubadala Investment Company)所有。欲了解更多信息,请访问 https://www.globalfoundries.com/cn

 

SuperFlash®是Silicon Storage Technology, Inc.的注册商标。

 

VeriSilicon Announces Ultra Low Power BLE 5.0 RF IP based on GLOBALFOUNDRIES 22FDX® FD-SOI Process for IoT Applications

Shanghai, China – November 1, 2018 – VeriSilicon Holdings Co., Ltd. (VeriSilicon) today announced its Bluetooth Low Energy (BLE) 5.0 RF IP based on GLOBALFOUNDRIES 22FDX® FD-SOI process.

芯原微电子发布抄底功耗BLE 5.0基于格芯22FDX® FD-SOI工艺的射频IP,针对物联网应用

Shanghai, China – November 1, 2018 – VeriSilicon Holdings Co., Ltd. (VeriSilicon) today announced its Bluetooth Low Energy (BLE) 5.0 RF IP based on GLOBALFOUNDRIES 22FDX® FD-SOI process.

GLOBALFOUNDRIES Introduces Avera Semi, a Wholly Owned Subsidiary to Deliver Custom ASIC Solutions

New company leverages unrivaled legacy of bringing complex ASICs to market

Solutions will focus on networking, datacenter, AI/ML and other high-performance intelligent systems
 

Santa Clara, Calif., November 1, 2018 – GLOBALFOUNDRIES today announced the establishment of Avera Semiconductor LLC, a wholly owned subsidiary dedicated to providing custom silicon solutions for a broad range of applications. Avera Semi will leverage deep ties with GF to deliver ASIC offerings on 14/12nm and more mature technologies while providing clients new capabilities and access to alternate foundry processes at 7nm and beyond.
 

Avera Semi is built upon an unrivaled legacy of ASIC expertise, tapping into a world-class team that has executed more than 2,000 complex designs in its 25-year history. With more than 850 employees, annual revenues in excess of $500 million, and over $3 billion in 14nm designs in execution, Avera Semi is well positioned to serve clients developing products across a wide range of markets, including wired and wireless networking, data centers and storage, artificial intelligence and machine learning, and aerospace and defense.
 

The new company is led by Kevin O’Buckley, a leader in the ASIC business since joining GF as part of the acquisition of IBM Microelectronics in 2015. Previously, he spent nearly 20 years at IBM in a variety of roles spanning both technical and executive leadership positions.
 

“I couldn’t imagine a better time to launch a new venture focused on delivering custom ASIC solutions,” O’Buckley said. “Data traffic and bandwidth demands have exploded, and next-generation systems for cloud and communications must deliver more performance and handle more complexity than ever before. Avera Semi has the right combination of expertise and technology to help our clients design and build high-performance, highly optimized semiconductor solutions.”
 

“Arm has a long history of collaborating with the team building Avera Semi to enhance PPA and bring innovative solutions to market,” said Drew Henry, senior vice president and general manager, Infrastructure Line of Business, Arm. “As the needs for compute requirements continue to evolve and diversify, we look forward to joining Avera’s capabilities and technologies with Arm Neoverse solutions and physical design IP to deliver unique value to a broad customer base.”

 

“Synopsys’ long history of collaboration with GF has enabled us to deliver a broad portfolio of high-quality DesignWare IP on a range of GF processes,” said John Koeter, vice president of marketing for IP at Synopsys. “We look forward to continuing this success with Avera Semi to provide designers with the necessary IP for their next-generation, high-performance SoC designs on advanced FinFET processes.”

 

Avera Semi offers clients a range of capabilities to enable end-to-end silicon solutions:
 

  • ASIC offerings on both leading-edge and proven process technologies, including a newly established foundry partnership on 7nm

  • A rich IP portfolio, including high-speed SerDes, high-performance embedded TCAMs, ARM® cores and performance and density-optimized embedded SRAMs

  • A comprehensive, production-proven design methodology that builds on a strong record of first-time-right results to help reduce development costs and time-to-market

  • Advanced packaging options to increase bandwidth, eliminate I/O bottlenecks, and reduce memory area, latency and power

  • Flexible ASIC business engagement models that give clients the ability to supplement in-house resources with the level of support needed from experienced chip design, methodology, test and packaging teams
     

About Avera Semi

Avera Semi provides application-specific integrated circuit (ASIC) semiconductor solutions that deliver system-level differentiation for next-generation networking, data center, machine learning, automotive, and aerospace and defense applications. The company was established in 2018 to provide clients sustained access to leading-edge lithography technologies at 7nm and beyond, while leveraging deep ties with GLOBALFOUNDRIES to deliver ASIC offerings on 14/12nm and older technologies. Avera Semi is a wholly owned subsidiary of GLOBALFOUNDRIES. For more information, visit averasemi.com.
 

About GF

GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF, and power/analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com.
 

Contact:
 

Jason Gorss

GLOBALFOUNDRIES

(518) 698-7765

 

[email protected]

格芯宣布成立全资子公司Avera Semi,提供定制ASIC解决方案

新公司充分利用无与伦比的技术传承,将复杂ASIC推向市场
 

其解决方案将专注于网络、数据中心、AI/ML和其他高性能智能系统
 

加利福尼亚州圣克拉拉,2018年11月1日 – 格芯今日宣布成立全资子公司Avera Semiconductor LLC,致力于为各种应用提供定制芯片解决方案。Avera Semi将充分利用与格芯的深厚联系,提供14/12nm以及更成熟技术的ASIC产品,同时为客户提供7nm及以下的新能力和替代代工工艺。
 

Avera Semi拥有无与伦比的ASIC专业知识传承,充分利用世界一流团队,在过去25年中完成了2,000多项复杂设计。Avera Semi拥有850多名员工,年收入超过5亿美元,14nm设计收入预计超过30亿美元,具有十分显著的优势,为客户在广泛的市场上开发产品,包括有线和无线网络、数据中心和存储、人工智能和机器学习,以及航空航天和国防。
 

新公司由Kevin O’Buckley领导,自格芯于2015年收购IBM微电子业务以来,他一直是ASIC业务的负责人。在此之前,他在IBM工作了近20年,担任过各种技术和管理领导职位。
 

O’Buckley表示:“现在是成立新公司,专注于提供定制ASIC解决方案的最好时机。随着数据流量和带宽需求的激增,下一代云和通信系统必须提供更高的性能,处理前所未有的复杂性。Avera Semi拥有专业知识与技术的完美结合,可帮助客户设计和构建性能卓越、高度优化的半导体解决方案。”
 

Arm基础设施业务部高级副总裁兼总经理Drew Henry表示:“Arm与Avera Semi构建的团队拥有悠久的合作历史,不断提升PPA和推出创新解决方案。随着计算需求的不断演进和多样化,我们期待将Arm Neoverse解决方案和物理设计IP与Avera的能力和技术相结合,为广泛的客户群提供独特的价值。”
 

Synopsys IP营销副总裁John Koeter表示:“Synopsys与格芯的悠久的合作历史使我们能够在一系列格芯工艺上提供具有高质量DesignWare IP的广泛产品组合。我们期待与Avera Semi延续过去的成功,为设计人员提供必要的IP,通过先进的FinFET工艺实现下一代高性能SoC设计。”

 

Avera Semi为客户提供各种功能,以实现端到端的芯片解决方案:
 

  • ASIC产品基于先进且经过验证的工艺技术(包括新建立的7nm晶圆厂合作关系)

  • 丰富的IP产品组合,包括高速SerDes、高性能嵌入式TCAM、ARM®内核以及经过性能和密度优化的嵌入式SRAM

  • 经过生产验证的全面设计方法,基于众多的一次成功结果,有助于降低开发成本并加快上市时间

  • 先进封装选项可增加带宽,消除I/O瓶颈,减少内存面积、延迟和功耗

  • 灵活的ASIC业务参与模式,使客户能够根据支持需求从经验丰富的芯片设计、方法、测试和封装团队补充内部资源
     

关于Avera Semi

Avera Semi提供专用集成电路(ASIC)半导体解决方案,为下一代网络、数据中心、机器学习、汽车以及航天和国防应用提供系统级差异化。公司成立于2018年,可持续为用户提供7纳米及以下的领先光刻技术,同时利用与格芯的紧密联系,在14/12纳米及更成熟的技术上提供ASIC产品。Avera Semi是格芯的全资子公司。欲了解更多信息,请访问avera.com。
 

关于格芯

格芯是全球领先的全方位服务半导体代工厂,为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务。伴随着全球生产基地横跨三大洲的发展步伐,格芯促生了改变行业的技术和系统的出现,并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉投资公司(Mubadala Investment Company)所有。欲了解更多信息,请访问 https://www.globalfoundries.com/cn
 

媒体垂询:

杨颖(Jessie Yang)

(021) 8029 6826

[email protected]
 

邢芳洁(Jay Xing)

86 18801624170

[email protected]

 

Netronome Announces Open Chiplet Architecture for Advanced SoC Designs

Netronome, a leader in high-performance intelligent networking solutions, today announced an open architecture for domain-specific accelerators designed to significantly reduce the burgeoning cost of silicon development as demanded by modern data center server, edge computing and automotive applications.

Netronome 发布针对先进SoC设计的开放Chiplet架构

Netronome, a leader in high-performance intelligent networking solutions, today announced an open architecture for domain-specific accelerators designed to significantly reduce the burgeoning cost of…

格芯与成都合作伙伴调整成都合资公司战略

顺应格芯近期宣布的技术组合战略,将合资企业重心转变至满足中国市场高需求的差异化技术

 

中华人民共和国,成都20181026日——今日,格芯与成都合作伙伴签署了投资合作协议修正案。基于市场条件变化、格芯于近期宣布的重新专注于差异化解决方案,以及与潜在客户的商议,将取消对成熟工艺技术(180nm/130nm)的原项目一期投资。同时,将修订项目时间表,以更好地调整产能,满足基于中国的对差异化产品的需求包括格芯业界领先的22FDX技术。

凭借逾20亿美元的设计中标收入以及50多项客户设计,格芯的22FDX技术在汽车、5G连接以及物联网(IoT)等各种高速增长的应用领域内展示了其作为业界领先的功耗优化的芯片平台的吸引力。格芯的中国客户已开始在位于德国德累斯顿的格芯先进生产基地中采用这种技术包括7名客户超过8个产品进入生产爬坡的不同阶段。。

 

瑞芯微电子CEO励民表示:“我们和格芯合作已经很久了。 22FDX低功耗的特点使其非常适合我们的不同产品,比如安防、AI等。我们也期待22FDX落地在中国生产,这将为我们带来更多的便利。”

双方合作伙伴仍计划继续推进FDSOI生态系统建设,包括创建本地技术基础设施、引进更多IP供应商和EDA合作伙伴等,使成都成为FDX技术的重要中心并赋能本土市场的采用以及需求产生。

 

成都股东方认为:“此次格芯成都项目的调整变化为合作双方留出充分时间进行评估,以更准确地掌握中国市场需求,为未来新的产能规划和项目实质性启动做好前期准备”。

格芯CEO汤姆·嘉菲尔德(Tom Caulfield)表示:“作为全球规模最大、增长最快的半导体市场之一,中国是格芯高优先市场。FDX技术特别适合中国市场,我们将继续见证其在5GIoT以及边缘计算等极富吸引力的市场领域的巨大潜力。我们将与成都政府继续深化务实合作,坚定推动成都项目的实施,共同加快中国FDX技术生态系统和客户群的发展。”

关于格芯

格芯是全球领先的全方位服务半导体代工厂,为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务。伴随着全球生产基地横跨三大洲的发展步伐,格芯促生了改变行业的技术和系统的出现,并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉投资公司(Mubadala Investment Company)所有。欲了解更多信息,请访问 https://www.globalfoundries.com/cn

媒体垂询:
 

杨颖(Jessie Yang

(021) 8029 6826

[email protected]

邢芳洁(Jay Xing

86 18801624170

[email protected]