GF’s FinFET process technology is purpose-built for high-performance, power-efficient Systems-on-a-Chip (SoCs) in demanding, high-volume applications. 3D FinFET transistor technology delivers industry-leading performance and power with significant area  advantages from 12nm area scaling. Equipped with advanced features such as RF, automotive qualification, ultra-low-power memory and logic, GF’s FinFET platforms provide a best-in-class (12nm to 16nm) combination of performance, power and area. As a result, they are well-suited for computing and AI, mobile/consumer and automotive processors, high-end IoT applications, high-performance transceivers and wired/wireless networking applications.

  • Smallest HD SRAM: 0.064 µ2  
  • Automotive Grade 2 qualified
  • 65% higher performance, 60% lower power and 55% area reduction compared to planar 28nm