ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22FDX® Technology Platform March 27, 2017Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications.
与格芯公司市场营销与沟通部新任总裁John Volkmann深入交流 March 27, 2017我们与格芯企业营销与沟通部的新任副总裁John Volkmann一起，了解更多关于营销人员背后的故事，包括他早年的职业生涯，作为技术营销人员的不断变化的角色，以及他对新兴半导体趋势的见解。 能不能聊一聊你自己，告诉我们你是如何来格芯工作的？ 我在硅谷的事业始于1990年，也就是在互联网诞生之时。我刚刚离开加利福尼亚州的莫德斯托的加州葡萄酒公司（Monto Wine）的品牌管理工作，这是我离开商学院之后的第一份工作。但是，我希望通过搬到硅谷来继续我在工程领域的事业。 我当时加入了Cunningham Communication公司，这是当时硅谷最大的科技公关公司。我后来进入了Brand Momentum 集团，该公司旨在为硅谷快速发展的科技领军企业提供品牌和定位服务。我为摩托罗拉半导体公司为做了大量的工作，该公司将我带进了半导体行业，后来我在这个行业里越走越远，也进入AMD和格芯这样的优秀企业。 十年之后，我应邀加入了AMD并带领企业营销和沟通团队。 在AMD我获得了广泛的经验，包括收购ATI Technologies，向Mubadala公司出售格芯公司，以及针对英特尔的全球反垄断诉讼。在我加入AMD的时候，我计划在那里工作2-3年，后来却在那里该服务了接近10年。在2012年初，我离开了AMD，并和合作伙伴一起在硅谷共同创立了一家营销咨询公司SeriesC（现为名为 Cunningham Collective）。后来，我被我们的客户QD Vision（一家位于波士顿附近的小型纳米材料公司）聘请为首席营销官CMO。 去年夏天，QD Vision 被三星收购，所以我开始寻找新的发展机会。格芯市场部的职位引起了我的注意，所以我和我在AMD的老朋友John Docherty联系了一下，想看看这个机会是否适合我。一个月后，我正式加入了格芯的这个团队。 这个职位有什么吸引你的地方？更重要的是，是什么吸引来到了格芯？GF？ 我认为格芯是一家具有很大潜力的行业领导公司。整个晶圆制造行业的业务相对比较稳定，而在这个行业里有一个一家独大且有一点“自满”的行业领头羊，获得了过多的市场占有率。这是一个巨大的不断发展中的行业，我认为格芯是唯一能够抓住机遇并且改变这个行业的公司。这个行业的客户并不喜欢供应商拥有过多的力量，我认为在未来几年内格芯可以获得更有意义的市场份额。 作为格芯公司负责营销和沟通的副总裁，您对公司负有什么样的责任？您过去的经历将如何帮助您塑造您的行业愿景并达成格芯的目标？ 这个职位非常像我五年离开AMD所担任的职位，我在AMD已经工作了9年多的时间。我有一个小而高效率且拥有高度积极性的团队，公司对这个团队有抱有很多的期望。我觉得我们有独特的任务，那便是帮助公司将我们的“故事”从强大的个人部分的集合，转变为一个有凝聚力的行业领导者的故事。而我当我加入公司的时候，我们的团队也将会拥有能力来强化公司的品牌和形象，从而重塑外界对于公司的期待。 过去这些年，您是如何看待技术营销人员这个角色的变化的？ 工作职责是一致的：那就是通过相关的差异化建立和发展领导力。但是在过去五年里，环境已经彻底的改变了。例如，科技的普及使每个人的生活更加透明。对于领导人来说，没有什么所谓的“避难所”，你的一切都始终暴露在公众视野中。同样的科技也颠覆大众传媒的业务模式。“传达信息”的概念要比以前复杂得多。连贯且易于记忆的“叙事和表达”方式显得至关重要。理解搜索引擎的运行方式也显得同样重要。最后，今天的“数字居民”一代更倾向于视觉多媒体（比如Snapchat，脸书视频，YouTube）。我们需要不断地将我们的工作从书面文字转换成图像和视频。 从技术的角度来看，半导体行业最大的增长机遇和挑战是什么？您计划如何利用这些机遇和挑战来提升作为行业领导者的格芯？ 技术行业就像是一辆过山车。每当我认为事情应该放缓时，一些巨大的基础性的变化趋势就出现了（例如互联网，智能手机，社交媒体和云计算的出现），这些趋势使半导体内容的需求以惊人的速度增长。今天的例子是物联网，增强现实（AR），虚拟现实（VR），以及自动驾驶汽车。在这样新兴领域占有资源的人将在至少未来十年成为行业的领导者。这是格芯的机会—不要从今天的市场中去分享市场份额，而是去赢得超越目前市场份额的新兴领域去赢得更多机会。我认为我们和其他任何的行业领导者一样优秀，且比大部分好。 John Volkmann2017年3月被聘为格芯市场沟通部的副总裁。在这一职位上，他将领导，发展和执行公司在全球范围内的战略沟通和品牌管理。在工作之余，John与妻子丹尼斯和三个孩子非常享受拥有葡萄酒和高尔夫的美好时光。
Automotive Rising! GLOBALFOUNDRIES’ 22FDX® (FD-SOI) Accelerates March 14, 2017By: Rajeev Rajan There’s no doubt about it, the ‘best of tech’ was on display at this year’s Mobile World Congress, where top manufacturers gathered in Barcelona, Spain to showcase their latest products. Considered the Mobile event, the showroom floor was flooded with the world’s coolest gadgets and devices, some far from being in (mobile) phone form-factor. Thanks to increasingly advanced chipsets and emerging 5G technologies, which are set to open a new era of connectivity, compelling new technologies are being showcased – from wearables, to VR cameras, to autonomous cars – at major tech events such as CES and MWC. Among the new tech, were products for the connected car – not something you’d typically see at this venue, but some of the biggest players in mobile are now taking interest in the connected car space, and showcasing a connected car product right alongside its new flagship smartphone. And, the brains behind the devices in these ‘smart’ cars are semiconductors. Semiconductors are rising in auto-tech and carmakers are increasingly trying to find ways to integrate consumer electronics functions such as Advanced Driver Assistance Systems, or ADAS, applications and driver-assistance technologies into their vehicles. Capabilities such as vision processing, cameras, sensors, connectivity, and mapping take ADAS and autonomous driving to a new level. A case in point, Dream Chip Technologies announcement of the industry`s first 22nm FD-SOI silicon for a new ADAS System-on-Chip (SoC) for automotive computer vision applications during MWC Barcelona. Now, ADAS SoCs have been around for more than 5 years. So what’s the big deal, you wonder? Dream Chip’s multi-processor SoC solution – developed under the European THINGS2DO project in coordination with ARM, Cadence, INVECAS, Arteris, and GF – is the industry’s first SoC designed on GF’s 22FDX® (FD-SOI) process technology. And, this is important if you’re a designer trying to figure out how to reduce complexity while watching your bottom line at the same time. As a complementary path to FinFETs, GF’s 22FDX transistors exhibit Superior RF/Analog – and a high fT and Fmax (350/325GHz), making it an ideal technology for low-power 5G and mmWave applications. Also, the technology platform’s back-biasing capability plays a role in controlling power by raising the threshold voltage and reducing leakage where appropriate, making it a power-efficient fit for wireless, battery-powered computing applications. And, what about cost? With 22nm design rules, single patterning is sufficient, eliminating double patterning and providing a cost-competitive product. Beyond the design process, there are other ‘bells and whistles’ the optimized SoC provides such as video input and output interfaces as well as common communication interfaces on two board-to-board headers. And, some of the key ADAS processing use-cases that can be realized with such an SoC include 360 degree top view, road-sign recognition, lane departure warning, driver distraction warning, blind spot detection, surround vision, flicker mitigation for digital mirroring, pedestrian detection, cruise control and emergency braking. Dream Chip Image Warping Demo (Vehicle: 4 cameras mounted on model car) In addition, Dream Chip’s SoC design incorporates multiple IPs such as foundation IPs, LPDDR4, PLL, Thermal Sensor and Process Monitor, from INVECAS as well as two LPDDR4 3200 high bandwidth memory interfaces. Dream Chip’s ADAS SoC, with GF’s 22FDX process tech, is a prime example of the brain power behind the ‘rise’ of semiconductor technologies that are fueling the growth of automotive and other global markets. These semiconductor devices are elevating consumer experiences that demand simpler, smaller, faster and increasingly lower cost end products. GF technologies, products, and solutions are differentiating key applications in these end spaces. If you missed the buzz of the Dream Chip automotive SoC at Mobile World Congress, we invite you to contact a GF sales representative or visit Dream Chip’s web site at: www.dreamchip.de to learn more. About Author Rajeev Rajan Rajeev Rajan is the Vice President of Internet of Things (IoT) at GLOBALFOUNDRIES. He is responsible for driving thought leadership and awareness of GF’s IoT solutions, which revolves around supporting go-to-market plans across the IoT portfolio as well as providing strategic direction and new market opportunities. Prior to joining GF, Rajeev was Sr. Director, Product Management and Marketing at Qualcomm Life Inc, where he led the product management and strategy for the company’s IoT/IoE and Healthcare and Life Sciences. Rajeev has also held positions of Co-Founder and CTO of 2net™, a Digital Health start-up, which has become the multi-million dollar Qualcomm healthcare company. He has held multiple technology, product, and business strategy roles at Qualcomm. He holds more than 40+ patents and is a co-author of the book Wireless Health: Remaking of Medicine by Pervasive Technologies. He currently serves as an Industrial Advisory Board Member of the Advanced Platform Technology (APT) Center, United States Department of Veterans Affairs (VA). Rajeev holds a BS in Physics from St. Xavier’s College and a MS in Computer Science from Sardar Patel University, in Gujarat, India. He received his Executive MBA from the Rady School of Management at the University of California San Diego, CA and a MS in Biomedical Engineering from Case Western Reserve University in Cleveland, Ohio.
汽车自动化的崛起，格芯22FDX®（FD-SOI）正在加速 March 14, 2017作者: Rajeev Rajan 毫无疑问， “最佳技术”正在今年的世界移动通信大会上展示，世界移动通信大会 在西班牙巴塞罗那吸引了顶尖的制造商前来展示各自的最新产品。这届的移动展会被世界上最酷的插件和设备（有的甚至与移动手机没有太大的关系）将展会完全淹没。得益于愈发先进的芯片组与注定会开启连接性新纪元的5G技术崛起，势不可挡的新技术正不断被展示出来—可穿戴设备、VR相机、无人汽车，纷纷在诸如CES 和MWC等各大活动上展出。 在新科技当中，出现了汽车连接性产品—这并非通常大家在展会上能看到的。一些移动业务的大企业现正表现出对车内连接空间的极大兴趣，在各自的新手机产品推出之时就并展示自己的车内连接产品。而此类智能汽车背后的主脑则为半导体。半导体正不断进军汽车科技业，而汽车制造商正更加努力的寻找能够集成更多消费者电子功能的方法，如：植入高级辅助驾驶系统（ADAS），应用和驾驶者辅助技术。视野图像处理、摄像头、探测器、连接仪器、拓录仪器等等高级技术将ADAS和无人驾驶带入了一个全新的境界。 在巴塞罗那的MWC活动中，Dream Chip Technology公布了公布了 业内第一款为汽车电脑成像应用的全新ADAS片上系统而设计的22纳米FD-SOI芯片，正是上述观点最合适不过的例子了。 至此，ADAS SoC已经存在长达5年。到底它有何特点？Dream Chip的多处理器SoC方案在欧洲THINGS2DO 项目下得到开发，该项目与ARM、Cadence、INVECAS、Arteris和格芯合作，此方案为业内首创在格芯22FDX® (FD-SOI)制程技术上设计的SoC。如果您正努力满足设计要求，同时又正考虑降低设计复杂性，那么此方案对您尤为重要。 作为FinFET技术的补充方案，格芯22FDX® 晶体管展现了高级射频/模拟能力 — 高fT和Fmax（350/325GHz），是其成为低功率5G和毫米波应用的理想技术。同时，本技术平台的基极偏置能力具备通过提升阈值电压来控制供电减少漏电的功能，使其成为无线和电池供电类应用的低功耗选择。 优化的SoC还提供了设计流程以外的额外功能，例如视频输入输出接口和板与板之间的公用沟通集管接口。一些关键的ADAS处理使用案例皆可在以下方面得以实现：360度鸟瞰视角、路标识别、行车道偏离警告、驾驶员干扰警告、盲点探测、全视野、数字镜像闪变噪音减少、行人探测、巡航控制和紧急刹车。 Dream Chip图像扭曲演示（车辆工具：4台摄像器固定于模型车上） 此外，Dream Chip的SoC设计集合了多个IP，例如基础IP、LPDDR4、PLL、热探测仪和流程监视器，他们来自INVECAS以及2个LPDDR4 3200高带宽内存接口口。Dream Chip的ADAS SoC，配以格芯22FDX®制程技术，是推动汽车自动化和其他覆盖全球的市场的半导体行业核心智慧的体现。半导体设备正在提升用户的体验，同时满足对更简单、更小、更快、成本更低的追求。格芯的技术、产品和方案是在这些方面带来独特性的关键因素。 如果您错过了在MWC了解Dream Chip汽车SoC的机会，我们欢迎您联系格芯的销售代表或登录Dream Chip的网址： www.dreamchip.de
QuickLogic Releases Aurora Software for Evaluation of ArcticPro eFPGA IP March 13, 2017SUNNYVALE, CA — (Marketwired) — 03/13/17 — QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, embedded FPGA IP, display bridge and programmable logic solutions, today announced that it has released its new Aurora software which enables SoC developers to evaluate the integration of embedded FPGA (eFPGA) IP into devices designed for different GLOBALFOUNDRIES process nodes.
QuickLogic 发布用于评估 ArcticPro eFPGA IP 的Aurora软件 March 13, 2017SUNNYVALE, CA — (Marketwired) — 03/13/17 — QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, embedded FPGA IP, display bridge and programmable logic solutions, today announced that it has released its new Aurora software which enables SoC developers to evaluate the integration of embedded FPGA (eFPGA) IP into devices designed for different GLOBALFOUNDRIES process nodes.
InvenSense and GLOBALFOUNDRIES Collaborate on Industry-Leading Ultrasonic Fingerprint Imaging Technology March 9, 2017 UltraPrint technology expected to enable deployment of ultrasonic fingerprint solutions under glass as well as other solid surfaces San Jose, California, March 9, 2017 – InvenSense, Inc. (NYSE: INVN), a leading provider of MEMS sensor platforms, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced their collaboration on an ultrasonic fingerprint imaging technology for InvenSense UltraPrint Ultrasound Fingerprint Touch Sensor Solution. InvenSense and GF are enabling, for the first time, commercial manufacturing of aluminum nitride-based piezoelectric Micromachined Ultrasonic Transducers (pMUT). As a result of the close technological collaboration between InvenSense and GF, InvenSense’s CMOS-MEMS Platform can now be extended to pMUT devices and enable a biometric authentication solution for mobile and IoT products. Mobile OEMs are looking for highly durable, button-free solutions that require fingerprint sensors to be placed behind the cover glass or under metal on the back of phone. Capacitive sensors, incapable of sensing through metal, can only sense through roughly 0.3mm of glass which creates durability concerns. InvenSense’s UltraPrint technology enables the use of thicker glass or metal materials without compromising biometric authentication performance. Moreover, the technology enhances fingerprint imaging, enabling the reader to scan even when the user’s skin contains common contaminants such as oils, lotion, or perspiration. These critical factors combined with GF’s aluminum-nitride-based manufacturing technology ensure consistent quality for higher-performance devices and can be extended to a secure identification for smartphones, home automation, payment or health-related interactions with wearables. “We are pleased to have collaborated closely with GF on the proprietary InvenSense CMOS-MEMS platform (ICMP),” said Mo Maghsoudnia, vice president of technology and worldwide manufacturing at InvenSense. “This close technology collaboration has enabled us to advance the manufacturing of ultrasonic imaging technology, resulting in production of our fingerprint authentication solution for a myriad of applications. We look forward to expanding our collaboration into multiple pMUT devices and the delivery of best-in-class products to our customers.” “InvenSense’s entry into pMUT provides testimony to our differentiated capabilities on aluminum nitride-based piezoelectric MEMS fabrication technology,” said Gregg Bartlett, senior vice president, CMOS Business Unit of GF. “This is particularly notable as we broaden the relationship to now include InvenSense’s ultrasonic fingerprint and other process technologies.” For additional information about InvenSense’s UltraPrint Ultrasonic Fingerprint authentication solution, please contact InvenSense Marketing at [email protected]. About InvenSense InvenSense, Inc. (NYSE: INVN) is the world’s leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything™ targets the consumer electronics and industrial markets with integrated Motion and Sound solutions. Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, audio and location platforms, and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to www.invensense.com and https://www.coursaretail.com. About GF GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. ©2017 InvenSense, Inc. All rights reserved. InvenSense, Sensing Everything, FireFly, SensorStudio, TrustedSensor, Coursa, UltraPrint, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, InvenSenseTV, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated. InvenSense Contact: David A. Almoslino Senior Director, Corporate Marketing InvenSense, Inc.408.501.2278[email protected] GF Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
InvenSense与格芯合作开发业内领先的超声波指纹成像技术 March 9, 2017 UltraPrint技术被预期将推动在如玻璃等坚硬物体表面下的超声波指纹方案 加利福尼亚州 圣何塞 2017年3月9日 — InvenSense, Inc. (NYSE: INVN) 是一家领先的MEMS探测器平台供应者，而格芯是领先的高级半导体制造商。今天，它们共同公布了他们将在超音速指纹成像技术上的合作。双方首创的将氮化铝基的压电效应微机超声换能器(pMUT)投入商业制造。得益于双方的紧密合作，InvenSense的CMOS-MEMS平台现可沿用于pMUT设备，并推动了移动与物联网产品的生物识别认证技术。 移动行业的OEM们正在寻求耐久性度高，且无物理按键的设计方案，这就要求指纹探测器需要放置在手机背面的覆盖玻璃或覆盖金属下面。电容性探测器无法透过金属来识别指纹，在玻璃中也只能够探测到0.3毫米的距离，所以耐用性能非常不理想。InvenSense的UltraPrint技术使厚玻璃或金属材质被成功使用，无需放弃生物识别的性能。而且，此技术极大增强了识别能力，即便在用户手指含有类似于油脂、乳膏或汗渍等干扰物时，探测器也可正常扫描。这些重要的优势，在结合了格芯的氮化铝基制造技术后，可保证在高级设备中稳定的高品质，甚至可被沿用至智能手机、房屋自动化、支付、健康等相关的携带式设备。 InvenSense的技术与全球制造副总裁Mo Maghsoudnia说道：“我们很庆幸在本公司的InvenSenseCOMS-MEMS平台（ICMP）上与格芯进行紧密合作。这使我们得以将超声成像技术投入制造，将指纹认证方案利用到数以万计的应用中去。我们期待与格芯在更多的pMUT设备上展开合作，为客户提供业内最好的产品。” “InvenSense在pMUT上的进展是一种证据，证明了我们的氮化铝基压电效应MEMS制造技术及其具备独特性和多样性。”CMOS业务部高级副总裁GreggBartlett说道，“当我们正在扩大经营范围时，与InvenSense在超声指纹和其他加工技术上建立关系具有超凡的意义。” 欲了解更多关于InvenSense的UltrPrint超声指纹认证方案，清联系InvenSense市场部：[email protected]. 关于Inven Sense InvenSense, Inc. (NYSE: INVN)是世界领先的MEMS探测器平台供应商。其Sensing Everything™为消费者类电子产品和工业市场提供产品集成动态与声音解决方案。我们的方案结合MEMS（微机电系统）探测器（例如加速表、回转仪、罗盘、麦克风）与专利算法、专利固件，智能处理、合成、校准探测器输出，最大化的的提高了性能与精确度。InvenSense的动态捕捉、声音与定位平台及其配套服务使用于移动设备、可穿戴设备、智能房屋、工业用于、汽车自动化和物联网产品中。InvenSense总部坐落于加州圣何塞，并全世界均设有分支机构。获取更多信息，请登录 www.invensense.com and https://www.coursaretail.com. 关于格芯 格芯是提供全方位服务的领先半导体晶圆制造商，为世界上最具创新意识的科技公司提供独特的设计，开发和制造服务。格芯的生产制造业务遍布全球三大洲。格芯使技术和系统转型成为可能，并且帮助客户拥有塑造市场的力量。 格芯是Mubadala Development Company旗下公司。欲了解更多信息，请访问公司官方网站 https://www.globalfoundries.com. InvenSense 公司联系方式： David A. Almoslino 高级总监, 市场部 InvenSense, Inc. 408.501.2278 [email protected] 格芯联系方式： Erica McGill (518) 795-5240 [email protected]
Dream Chip Technologies公司展示了其首个应用了22nm FD-SOI硅芯片的汽车辅助驾驶系统SoC February 27, 2017Dream Chip Technologies announced today the presentation of the industry`s first 22nm FD-SOI silicon for a new ADAS System-on-Chip (SoC) for automotive computer vision applications at the Mobile World Congress in Barcelona. The SoC was created in close cooperation with ARM, Arteris, Cadence, GLOBALFOUNDRIES, and INVECAS as part of the European Commission’s ENIAC THINGS2DO reference development platform.
Dream Chip Technologies Presents First 22nm FD-SOI Silicon of New Automotive Driver Assistance SoC February 27, 2017Advanced driver assistance system (ADAS) computer vision SoC developed for European THINGS2DO project with working first silicon fabricated on GLOBALFOUNDRIES’ 22nm
