AImotive Releases aiWare: The First of its Kind, AI-Optimized Hardware Accelerator For Autonomous Driving July 3, 2017MOUNTAIN VIEW and SANTA CLARA, Calif., June 29, 2017 – AImotive (www.aimotive.com) today announced its much anticipated, AI-optimized hardware IP is available to global chip manufacturers for license. aiWare, built from the ground up for running neural networks, is up to 20 times more power efficient than other leading AI acceleration hardware solutions on the market. VeriSilicon Holdings Co., Ltd. (www.verisilicon.com), a Silicon Platform as a Service (SiPaaS®) company, will be the first to integrate aiWare into a chip design,and the aiWare-based test chips will be fabricated on the GLOBALFOUNDRIES (GF) 22FDX® semiconductor process (www.globalfoundries.com)
eVaderis加入FDXcelerator™项目,为格芯22FDX®技术平台提供内存IP June 29, 2017eVaderis today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program to provide scalable, advanced memory IP to be compatible with GF’s 22FDX® technology. The advanced memory IP is expected to offer performance and energy saving advantages over competing memory solutions.
EVADERIS JOINS FDXCELERATOR™ PROGRAM TO DELIVER MEMORY IP TO GLOBALFOUNDRIES 22FDX® TECHNOLOGY PLATFORM June 29, 2017eVaderis today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program to provide scalable, advanced memory IP to be compatible with GF’s 22FDX® technology. The advanced memory IP is expected to offer performance and energy saving advantages over competing memory solutions.
ICE-P3 能量处理单元(EPU)集成了温度补偿的电压与频率控制,追求最大节能效果 June 26, 2017San Jose, Calif. – June 26, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today introduced ICE-P3™, the IP industry’s first product to automate implementation of dynamic voltage and frequency scaling (DVFS). ICE-P3 is the newest member of the ICE-Grain™ Family of Energy Processing Units (EPU) that identifies, sequences, and controls power state transitions in hardware up to 500X faster than conventional software-based approaches.
ICE-P3 EPU Integrates Temperature-Compensated Voltage and Frequency Control for Maximum Energy Savings June 26, 2017San Jose, Calif. – June 26, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today introduced ICE-P3™, the IP industry’s first product to automate implementation of dynamic voltage and frequency scaling (DVFS). ICE-P3 is the newest member of the ICE-Grain™ Family of Energy Processing Units (EPU) that identifies, sequences, and controls power state transitions in hardware up to 500X faster than conventional software-based approaches.
Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node June 20, 2017Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its custom/analog and full-flow digital and signoff tools are now enabled for v0.5 of the GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET semiconductor technology. The 7LP process node is expected to deliver 40 percent better performance and twice the area scaling than the previous 14nm FinFET technology.
Synopsys and GLOBALFOUNDRIES Collaborate to Deliver Design Platform and IP Enablement for 7-nm FinFET Process June 20, 2017Synopsys, Inc. (Nasdaq: SNPS) today announced the enablement of the Synopsys Design Platform and DesignWare® Embedded Memory IP on GLOBALFOUNDRIES 7-nm Leading-Performance (7LP) FinFET process technology. Synopsys and GF collaboration on the new process addressed several new challenges specific to the 7LP process. This process is expected to deliver 40 percent more processing power and twice the area scaling compared to GF’s 14nm FinFET process. Designers of premium mobile processors, cloud servers and networking infrastructure can take advantage of these benefits by confidently deploying the silicon-proven Synopsys Design Platform and Embedded Memory IP.
GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC Family June 19, 201755nm LPx RF-enabled platform, with SST’s highly reliable embedded SuperFlash®, provides low power and cost for IoT and “Connected” Health and Wellness Devices Singapore and Santa Clara, Calif., June 19, 2017 – GLOBALFOUNDRIES and ON Semiconductor (Nasdaq: ON) today announced the availability of a System-on-Chip (SoC) family of devices, on GF’s 55nm Low Power Extended (55LPx), RF-enabled process technology platform. ON Semiconductor’s new RSL10 products are based on a multi-protocol Bluetooth 5 certified radio SoC capable of supporting the advanced wireless functionalities in IoT and “Connected” Health and Wellness markets. “Bluetooth low energy technology continues to advance as the key enabler for connecting IoT devices, especially with low power consumption requirements,” said Robert Tong, vice president of ON Semiconductor’s Medical and Wireless Products Division. “GF’s 55LPx platform – with its low power logic and highly reliable embedded SuperFlash® memory combined with proven RF IP – was an ideal match. The RSL10 family offers the industry’s lowest power consumption in Deep Sleep Mode and Peak Receiving Mode, enabling ultra-long battery life, and supporting functionalities like Firmware Over the Air updates. ON Semiconductor’s new RSL10 SoCs use these advanced features to address a wide range of applications including wearables and IoT edge-node devices such as smart locks and appliances.” “GF’s 55LPx platform, combined with ON Semiconductor’s design, has delivered wearable SoC technology at 55nm, with industry leading energy efficiency,” said David Eggleston, vice president of embedded memory at GF. “This is another proof point that 55LPx is becoming the preferred choice for SoC designers that are seeking cost effective performance, low power consumption, and superior reliability in extreme environments.” GF’s 55nm LPx RF-enabled platform provides a fast path-to-product solution that includes silicon qualified RF IP and Silicon Storage Technology’s (SST) highly reliable embedded SuperFlash® memory featuring: Very fast read speed (<10ns) Small bitcell size Superior data retention (> 20 years) Superior endurance (> 200K cycles) Fully qualified for Auto Grade 1 operation (AEC-Q100) GF’s 55LPx eFlash platform has been in volume production at the foundry’s 300mm line in Singapore since 2015. The 55LPx eFlash platform is a cost effective solution for a broad range of products, ranging from wearable devices to automotive MCUs. Customers can start optimizing their chip designs with GF’s process design kits, enabling designers to develop differentiated eFlash solutions that require cost effective performance, low power consumption, and superior reliability in extreme environments. For more information on GF’s mainstream CMOS solutions, contact your GF sales representative or go to www.globalfoundries.com. To learn more about the RSL10 product family, visit the product page and read the “Bringing Industry’s Lowest Power to Bluetooth Low Energy Technology” blog . To request samples or order an evaluation board, please contact your local ON Semiconductor sales representative. About ON Semiconductor ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient, power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace and defense applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance and ethics program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions. For more information, visit https://www.onsemi.com. About GLOBALFOUNDRIES GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. GLOBALFOUNDRIES® and the GLOBALFOUNDRIES logo and sphere design are trademarks and/or service marks of GLOBALFOUNDRIES Inc. in the United States and other jurisdictions. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected] Brittany BaguioON Semiconductor408) 822-2196[email protected]
格芯和安森美半导体提供业界最低功耗的蓝牙®低能耗SoC系列 June 19, 201755nm LPx RF功能平台,SST高可靠性的嵌入式SuperFlash®,为IoT和“连接”健康与健康设备提供低功耗和低成本的优势。 新加坡和加利福尼亚州圣克拉拉,2017年6月19日 – 格芯和安森美半导体(纳斯达克股票代码:ON)今天宣布,在格芯55nm低功耗扩展(55LPx)上提供了片上系统(SoC)系列器件,支持格芯的制程技术平台。安森美半导体的新RSL10产品基于多协议蓝牙5认证无线电SoC,能够支持物联网和“连接”健康与健康市场中的先进无线功能。 安森美半导体医疗和无线产品部副总裁罗伯特·汤(Robert Tong)表示:“蓝牙低功耗技术能够作为连接物联网设备的关键推动因素,并能满足低功耗的需求,这种技术将会继续进步。格芯的55LPx平台采用低功耗逻辑和高度可靠的嵌入式SuperFlash®存储器,与经过验证的射频IP结合,和将成为非常理想的匹配组合。RSL10系列在深度睡眠模式和峰值接收模式下可以提供业界最低的功耗,实现超长的电池寿命,并支持类似固件的升级更新功能。安森美半导体的新型RSL10 SoC使用这些高级功能来处理各种应用,包括可穿戴式和物联网边缘节点设备,如智能锁和电器。” “ 格芯的嵌入式存储部的副总裁David Eggleston表示:“格芯的55LPx平台与安森美半导体的设计相结合,在55nm上提供了可穿戴式SoC技术,并且具有行业领先的能源效率。“这是另一个可靠的证明,可以证明55LPx正在成为SoC设计师的首选。这些设计师一直都在追求高性价比,低功耗,以及在极端环境中卓越的可靠性。” 格芯的55nm LPx 射频功能平台提供了快速的到达产品解决方案的途径,其中包括硅验证合格的射频IP和硅存储技术(SST)高度可靠的嵌入式SuperFlash®内存,其特点如下: 读取速度非常快(<10ns) 较小的位单元面积 优异的数据保留(> 20年) 卓越的耐力(> 200K周期) 完全符合汽车1级操作(AEC-Q100) 格芯的55LPx eFlash平台自2015年起在新加坡的300mm生产线上批量生产。55LPx eFlash平台是一款具有性价比的解决方案,适用于从穿戴式设备到汽车MCU的广泛产品。 客户可以通过格芯的工艺设计套件来开始优化其芯片设计,使设计人员能够开发差异化的eFlash解决方案,这些解决方案在极端环境中需要具有高性价比,低功耗和卓越的可靠性表现。 有关格芯主流CMOS解决方案的更多信息,请联系您的格芯销售代表或访问 www.globalfoundries.com. 要了解有关RSL10产品系列的更多信息,请访问产品页面,并阅读“带来业界最低工行的蓝牙低功耗技术”博客。要求样品或订购评估版,请联系您当地的安森美半导体销售代表。 关于安森美半导体 安森美半导体(纳斯达克股票代码:ON)正在推动节能创新,使客户能够减少全球能源消耗。该公司是半导体解决方案的领先供应商,提供全面的节能,电源管理,模拟,传感器,逻辑,时序,连接,离散,SoC和定制设备。该公司的产品帮助工程师解决其在汽车,通信,计算,消费,工业,医疗,航天和国防应用中的独特设计挑战。安森美半导体在北美,欧洲和亚太地区的主要市场运营着可靠的世界级供应链和质量项目,强大的合规和道德项目,以及制造设施,销售办事处和设计中心网络。欲了解更多信息,请访问https://www.onsemi.com. 关于格芯 格芯是提供全方位服务的领先半导体晶圆制造商,为世界上最具创新意识的科技公司提供独特的设计,开发和制造服务。格芯的生产制造业务遍布全球三大洲。格芯使技术和系统转型成为可能,并且帮助客户拥有塑造市场的力量。 格芯是Mubadala Development Company旗下公司。欲了解更多信息,请访问公司官方网站 https://www.globalfoundries.com. GLOBALFOUNDRIES®和GLOBALFOUNDRIES徽标和球形设计是GLOBALFOUNDRIES Inc.在美国和其他司法管辖区的商标和/或服务标志。 联系人: Erica McGill 格芯 (518) 795-5240S [email protected] Brittany Baguio 安森美 (408) 822-2196 [email protected]