GLOBALFOUNDRIES FX-14™ delivers industry’s most complete ASIC offering for chip designers targeting cloud, data center, and communication applications

Santa Clara, Calif., November 11, 2015 — GF today announced the availability of FX-14™, an application-specific integrated circuit (ASIC) offering built on the company’s next-generation 14nm FinFET process technology. The GF FX-14 ASIC offering is an ideal solution for customers seeking to strike a balance between high bandwidth, low power, and cost for cloud networking, wireless base station, compute, and storage applications.

With the recent acquisition of IBM’s Microelectronics Division, the FX-14 ASIC offering combines GF’s manufacturing scale and process technology leadership with a legacy of ASIC expertise that has helped customers bring some of the industry’s most complex ASICs to market. Using GF’s 14LPP process technology, FX-14 leverages the production-proven 14nm FinFET platform from the company’s Fab 8 facility in Saratoga County, NY.

“In order to enable extremely high-speed connectivity solutions for a wide range of networking applications, we require ASIC solutions that provide an optimal balance of performance, power and cost,” said Kianoosh Naghshineh, CEO, Chelsio Communications, Inc. “The combination of the recently acquired IBM ASIC design expertise and GF’s 14LPP technology enables Chelsio to continue to push the price-performance curve and deliver industry-leading solutions to our customers.”

“The FX-14 ASIC offering continues to extend our leadership in delivering the most advanced ASIC solutions for the wired and wireless networking infrastructure,” said Mike Cadigan, senior vice president of product management at GF. “Coupling the legacy of strong ASIC expertise with GF’s 14LPP technology provides our customers the best combination to differentiate and stay ahead of evolving marketplace demands.”

The FX-14 ASIC offering includes an enhanced, optimized intellectual property (IP) portfolio, featuring leading-edge ARM cores and ARM® Artisan® physical IP. The broad lineup of cores for system-on-chip designs include 64-bit ARM Cortex®-A72 and ARM Cortex-A53 processors.

“The industry-leading ARM processors that power more than 95% percent of the smartphones shipping today are an ideal complement to GF’s FX-14 ASIC offering,” said James McNiven, general manager, CPU group, ARM. “Our latest collaboration efforts with GF on the FX-14 ASIC offering will further enable our mutual silicon partners to deliver highly-advanced SoCs.”

The FX-14 offering also delivers an optimized IP portfolio including High Speed Serdes (HSS) solutions. The HSS solutions range from the best in class architecture for high performance 56G backplane and chip-to-chip designs to optimized 30G and 16G SERDES designs covering a broad range of interface standards. GF’s embedded memory solutions include ternary content-addressable memory (TCAM), capable of billions of searches per second as well as high density and high performance memory compilers. These memory compilers exploit the industry’s smallest memory cell to achieve outstanding SRAM density as well as take advantage of a performance-tuned memory cell to achieve the best in class performance.

GF’s 14LPP technology offering was qualified in the third quarter of 2015 and is on track for volume production in 2016. FX-14 design kits are available to customers now.

For more information on GF’s ASIC solutions, visit our booth #607 at ARM TechCon from November 10-12, in Santa Clara, California, or go online at www.globalfoundries.com

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contact:

Erica McGill
GF
(518) 305-5978
[email protected]

Leading-edge foundry’s proven silicon technology poised to help enable significant performance and power efficiency improvements for AMD’s next-generation products

Santa Clara, Calif., November 5, 2015 — GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD (NASDAQ: AMD) products using GF’s most advanced 14nm FinFET process technology. As a result of this milestone, GF’s silicon-proven technology is planned to be integrated into multiple AMD products that address the growing need for high-performance, power-efficient compute and graphics technologies across a broad set of applications, from personal computers to data centers to immersive computing devices.

AMD has taped out multiple products using GF’s 14nm Low Power Plus (14LPP) process technology and is currently conducting validation work on 14LPP production samples. Today’s announcement represents another significant milestone towards reaching full production readiness of GF’s 14LPP process technology, which will reach high-volume production in 2016. The 14LPP platform taps the benefits of three-dimensional, fully-depleted FinFET transistors to enable customers like AMD to deliver more processing power in a smaller footprint for applications that demand the ultimate in performance.

“FinFET technology is expected to play a critical foundational role across multiple AMD product lines, starting in 2016,” said Mark Papermaster, senior vice president and chief technology officer at AMD. “GF has worked tirelessly to reach this key milestone on its 14LPP process. We look forward to GF’ continued progress towards full production readiness and expect to leverage the advanced 14LPP process technology across a broad set of our CPU, APU, and GPU products.”

“Our 14nm FinFET technology is among the most advanced in the industry, offering an ideal solution for demanding high-volume, high-performance, and power-efficient designs with the best die size,” said Mike Cadigan, senior vice president of product management at GF. “Through our close design-technology partnership with AMD, we can help them deliver products with a performance boost over 28nm technology, while maintaining a superior power footprint and providing a true cost advantage due to significant area scaling.”

GF’s 14LPP FinFET is ramping with production-ready yields and excellent model-to-hardware correlation at its Fab 8 facility in New York. In January, the early-access version of the technology (14LPE) was successfully qualified for volume production, while achieving yield targets on lead customer products. The performance-enhanced version of the technology (14LPP) was qualified in the third quarter of 2015, with the early ramp occurring in the fourth quarter of 2015 and full-scale production set for 2016.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contacts:

Erica McGill
GF
(518) 305-5978
[email protected]

Santa Clara, Calif, October 5, 2015 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today appointed Bami Bastani as senior vice president of its Radio Frequency (RF) Business Unit.

With the recent acquisition of IBM’s Microelectronics Division, GF has solidified its technology leadership in wireless front-end module solutions. The company has significantly broadened its existing RF offerings with differentiated RF silicon-on-insulator (RFSOI) and high-performance silicon germanium (SiGe) technologies geared to enable complex RF switches, high-performance power amplifiers, and integrated front-end applications in mobile devices. Coupling these new capabilities with the company’s existing high-voltage CMOS and RF MEMS technologies means GF now offers a complete solution that is unmatched in the market.

Bastani brings more than 35 years of high-tech, semiconductor, and RF experience to GF, and will focus on delivering the next generation of its RF roadmap. He will look to capture further opportunities in the automotive, home, and growing Internet of Things (IoT) markets. Bastani will lead a strong team with a history of providing high-quality, high-performance solutions that address the increasing complexity of mobile radio devices.

“Bami is an experienced executive with deep knowledge of the RF industry. He brings to GF years of leadership and management capabilities that will enable us to grow our RF business,” said GF CEO Sanjay Jha. “Bami has been part of the semiconductor industry for several decades, and his experience spans beyond RF to wafer manufacturing operations and market growth strategies. He adds incredible strength to our already deep leadership team.”

Prior to joining GF, Bastani was President, CEO and Board Member of Meru Networks, a global enterprise- grade Wi-Fi networks solution provider, from 2012 to earlier this year. Bastani transformed Meru from a hardware company to a solution provider with emphasis on Software, Software Defined Networks (2015 SDN Excellence Award), and Subscription Cloud offering (WaaS). He brought a vertical market strategic focus to the company allowing it to broaden its offerings and customer base.

Before that, Bastani has served as the president and CEO as well as in board of director positions in the mobility, consumer, and broadband markets. These include president and CEO roles at Trident Microsystems, Inc., and ANADIGICS Inc. Bastani also served in executive positions at Fujitsu Microelectronics, National Semiconductor and Intel Corporation.

Bastani earned his Ph.D. and MSEE in Microelectronics at Ohio State University. He holds three U.S. Patents, has several publications on semiconductor technology, and has given several invited keynotes on topics of innovation and corporate management.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contact:

Jason Gorss
GF
518-698-7765
[email protected]

Catena Wi-Fi and Bluetooth RF technologies available on GLOBALFOUNDRIES 28nm Super Low Power Process technology

EuMW 2015, Paris, France, September 3: GF, a leading provider of advanced semiconductor manufacturing technology, today announced it has partnered with Catena, a leader in Radio Frequency (RF) Communication IPs for connectivity, to offer complete Wi-Fi® and Bluetooth® solutions for System-on-Chip (SoC) designers targeting mobile, Internet-of-Things (IoT), RF connectivity markets.

Today, designers need an optimized, highly integrated wireless connectivity solution to satisfy the ever-increasing low-power and cost requirements of mobile platforms, wearables and other IoT devices. GF market-leading 28nm Super Low Power (SLP) technology with integrated RF, combined with Catena’s silicon-proven RF IPs offer a power- efficient, cost-optimized solution that provides on-chip features that can be easily integrated into customer applications.

“We are delighted to partner with GF for the development of Catena´s next generation connectivity solutions,” says Mats Carlsson, Director for Business Development at Catena. “This partnership gives Catena access to advanced technology nodes supporting our comprehensive technology roadmap for Wi-Fi and BT connectivity. A close cooperation with leading foundries such as GF together with the latest innovations from Catena offers our customers new levels of product performance, reliability and scalability, and it enables us to push the envelope of integrated RF Front-End innovation. The validation results of Catena´s first 28nm-SLP silicon for RF applications correlate well with simulations.”

“Catena’s IP skills and competencies in wireless RF mixed signal technologies, coupled with GF RF solution enables us to further strengthen our leadership in wireless connectivity and connected devices,” said Peter Rabbeni, director of RF product marketing and business development at GF. “With customer silicon content increasing with each new generation of smartphone the demand for these chips is rapidly increasing. Partnering with Catena enables us to expand our expertise and capabilities and provide radio power solutions for highly integrated mobile applications.”

Based on GF’s 28nm-SLP technology with HKMG, the process technology includes a comprehensive set of design capabilities enabling chip designers to integrate critical RF SoC functionality into their products. The technology is designed for the next generation of connected devices that require low standby power and long battery life integrated with RF/wireless functionality. The technology is enabled with key RF features, including core and I/O (1.5V/1.8V) transistor RF models along with 5V LDMOS devices, which simplifies RF SoC design.

Catena’s Connectivity RF IP portfolio includes optimized, very low power Bluetooth Smart radio, Bluetooth Smart Ready radio, Wi-Fi (802.11a/b/g/n/ac 1×1, 2×2 and 4×4 MIMO) radios and combo Bluetooth / Wi-Fi radio. The radio IPs are available/under development at GF 28nm-SLP technology, and may be ported to alternatives based on customer requirements. Solutions for GNSS/FM broadcast systems are also found in the offerings of Catena.

GF’s 28nm-SLP technology is the first in the industry to provide design enablement support optimized to meet low power and cost requirements of integrated RF SoCs. The technology utilizes the companies’ production-proven, 28nm-SLP silicon-validated design flows, which include a complete set of libraries, compilers, and complex IP.

About Catena

Since its establishment in 1986, Catena is recognized as the partner of choice for global IC makers in designing wireless connectivity and sensor electronics system solutions created by world-class RF, signal processing and system architecture experts. Catena is providing full custom IC developments as well as complete System IP for various applications, enabling its customer’s fast time to market. The developments are mainly one chip solutions including RF, Analog, Mixed Signal, Digital Signal Processing, Embedded Cores, Embedded Software and tooling. For further information please visit www.catena.nl.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contact:

Erica McGill
GF
518-305-5978
[email protected]

Mats Carlsson
Catena Holding BV
Phone: +46 8 5059 5100
[email protected]

GLOBALSOLUTIONS^SM Partnership will enable next-generation wireless technologies for applications in IoT, 5G and automotive

EuMW 2015, Paris, September 3, 2015 – QEOS, Inc., a world leading designer of connectivity and sensing CMOS millimeter-wave (mmWave) solutions, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced they are partnering to co-develop the industry’s first mmW CMOS platform.

Leveraging GF’s 45nm and 40nm low-power process technologies, the mmW platform includes support for the higher data rates required in future mobile broadband access networks, while enabling customers to integrate mixers, Low Noise Amplifiers (LNAs), Power Amplifiers (PAs), and Inter-Frequency (IF) amplifiers, all in a single package. The co-designed platform will leverage GF’s production-proven expertise in advanced silicon RF technologies and QEOS’ next-generation design environment and IP to expand the mmWave wireless technology offerings to enable gigabit interactivity everywhere—from centimeters to hundreds of meters—at a cost of less than $500 per link.

Demonstrations of a 77GHz CMOS Design Library and an adaptive 60GHz CMOS link for gigabit wireless outdoor connectivity can be seen during European Microwave Week, to be held September 6 – 11, 2015 in Paris, France.

The available mmW IP includes:

• Low-power Bits In/Out architecture
• BIST/BIOS for digital die sort
• Beam Steering
• Integrated Transceiver
• Frequency Synthesizer
• Co-designed System in Package with Antenna

“MmW technology is a key pillar for next-generation wireless markets including IoT, 5G and automotive,” said Ted Letavic, department leader of strategic applications and product segments at GF. “Our expanded partnership with QEOS enables our customers to address the challenging requirements for adaptive next-generation gigabit wireless sensing and connectivity, and lays the foundation for accelerating market adoption of mmW products and solutions in high-growth markets.”

“We are honored to partner with one of the world’s leading advanced silicon manufacturers to create the industry’s first mmW CMOS platform. We look forward to supporting our customers in the rapidly growing mmWave markets,” said Ara Chakrabarti, Chief Operating Officer of QEOS, Inc.

“GF’s and QEOS’ partnership is a key milestone for enabling the next generation of low-power mmWave CMOS,” said Rob Shaddock, Chief Technology Officer of TE Connectivity. “TE Connectivity has been watching the developments in this field closely, and we believe that this is going to have a major impact across the connectivity and sensing markets.”

As part of the GLOBALSOLUTIONS partnership, QEOS 45/40nm based mmWave CMOS IP will be available in two forms. Basic block level IP will be available from GF, while more complex subsystem IP will be licensable directly from QEOS. QEOS will provide support and design services for all IP.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

About QEOS, INC.

Headquartered in Milpitas, California, QEOS is a leading provider of low-power connectivity and sensing CMOS millimeter-wave solutions delivered via a portfolio of innovative technologies in wireless and wireline data communications.

Media Contact:

QEOS:

Romain Pelard
Director of Product Management and Marketing
[email protected]

GF:

Erica McGill
Technology Communications
[email protected]