Company invests for capacity growth in the United States, Germany, China and Singapore

Santa Clara, Calif., February 9, 2017 – GLOBALFOUNDRIES today announced plans to expand its global manufacturing footprint in response to growing customer demand for its comprehensive and differentiated technology portfolio. The company is investing in its existing leading-edge fabs in the United States and Germany, expanding its footprint in China with a fab in Chengdu, and adding capacity for mainstream technologies in Singapore.

“We continue to invest in capacity and technology to meet the needs of our worldwide customer base,” said GF CEO Sanjay Jha. “We are seeing strong demand for both our mainstream and advanced technologies, from our world-class RF-SOI platform for connected devices to our FD-SOI and FinFET roadmap at the leading edge. These new investments will allow us to expand our existing fabs while growing our presence in China through a partnership in Chengdu.”

In the United States, GF plans to expand 14nm FinFET capacity by an additional 20 percent at its Fab 8 facility in New York, with the new production capabilities to come online in the beginning of 2018. This expansion builds on the approximately $13 billion invested in the United States over the last eight years, with an associated 9,000 direct jobs across four locations and 15,000 jobs within the regional ecosystem. New York will continue to be the center of leading-edge technology development for 7nm and extreme ultraviolet (EUV) lithography, with 7nm production planned for Q2 2018.

In Germany, GF plans to build up 22FDX® 22nm FD-SOI capacity at is Fab 1 facility in Dresden to meet demand for the Internet of Things (IoT), smartphone processors, automotive electronics, and other battery-powered wirelessly connected applications, growing the overall fab capacity by 40 percent by 2020. Dresden will continue to be the center for FDX technology development. GF engineers in Dresden are already developing the company’s next-generation 12FDX™ technology, with customer product tape-outs expected to begin in the middle of 2018.

In China, GF and the Chengdu municipality have formed a partnership to build a fab in Chengdu. The partners plan to establish a 300mm fab to support the growth of the Chinese semiconductor market and to meet accelerating global customer demand for 22FDX. The fab will begin production of mainstream process technologies in 2018 and then focus on manufacturing GF’s commercially available 22FDX process technology, with volume production expected to start in 2019.

In Singapore, GF will increase 40nm capacity at its 300mm fab by 35 percent, while also enabling more 180nm production on its 200mm manufacturing lines. The company will also add new capabilities to produce its industry-leading RF-SOI technology.

“GF has had a strong foundry relationship with Qualcomm Technologies for many years across a wide range of process nodes,” said Roawen Chen, senior vice president, QCT global operations, Qualcomm Technologies, Inc. “We are excited to see GF making these new investments in differentiated technology and expanding global capacity to support Qualcomm Technologies in delivering the next wave of innovation across a range of integrated circuits that support our business.”

“Collaborative foundry partnerships are critical for us to differentiate ourselves in the competitive market for mobile SoCs,” said Min Li, chief executive officer of Rockchip. “We are pleased to see GF bringing its innovative 22FDX technology to China and investing in the capacity necessary to support the country’s growing fabless semiconductor industry.”

“As our customers increasingly demand more from their mobile experiences, the need for a strong manufacturing partner is greater than ever,” said Joe Chen, co-chief operating officer of MediaTek. “We are thrilled to have a partner like GF that invests in the global capacity we need to deliver powerful and efficient mobile technologies for markets ranging from networking and connectivity to the Internet of Things.”

ABOUT GF

GF is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contacts:

Jason Gorss
GF
(518) 698-7765
[email protected]

Increased support affirms FDXcelerator™ Program’s vital role in promoting broader deployment of GLOBALFOUNDRIES FDX™ portfolio

Santa Clara, Calif., December 15, 2016 – GF today announced the addition of eight new partners to its growing FDXcelerator Program, including Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Infosys, Mentor Graphics, Rambus, Sasken, Sonics, and QuickLogic. These new partners join Synopsys, Cadence, INVECAS, VeriSilicon, CEA Leti, Dreamchip, and Encore Semi to provide a suite of services that will enable GF customers to rapidly implement 22FDX® system-on-chip (SoC) designs in low-power applications spanning Internet-of-Things (IoT), mobile, RF connectivity, and networking markets.

The FDXcelerator Partner Program builds upon GF’s 22FDX and 12FDX™ technologies, an alternative to FinFET-based technologies for chips that require performance on demand and energy efficiency at the lowest solution cost. GF’s 22FDX platform provides a lower-cost migration path from bulk nodes such as 40nm and 28nm, which allows customers to design differentiated, intelligent, and fully-integrated system solutions.

FDXcelerator partners play a critical role by providing a set of specific solutions and resources that help increase design productivity on FDX technology and reduce time-to-market for its customers. GF works closely with program partners to help customers create high-performance 22FDX designs while minimizing development costs through access to a broad set of quality offerings, specific to 22FDX technology. The partner ecosystem allows GF to accelerate its traction in the market and more effectively offer its FDX products and services to a broader range of customers.

The partner program extends the reach of the FD-SOI ecosystem, creating an open framework that allows selected partners to integrate their products or services into a validated, plug-and-play catalog of design solutions. The program encompasses FDX-tailored solutions and services, including:

• EDA tools that leverage differentiated FD-SOI body-bias features, built into industry-leading design flows;
• IP design elements and complete libraries, including foundational IP, interfaces and complex IP to enable foundry customers to start designs quickly with validated IP elements;
• ASIC platforms for a complete 22FDX ASIC offering;
• Reference solutions and system-level expertise in emerging application areas to speed time-to-market;
• Outsourced assembly and test (OSAT) solution featuring extensive manufacturing capacity to enable state-of-the art SoC delivery, and;
• Design consultation and other services dedicated to FDX technology.

“As the FDXcelerator program continues to expand, partners play a critical role in helping to serve our growing number of customers and extend the reach of our FD-SOI ecosystem by providing innovative FDX-tailored solutions and services,” said Alain Mutricy, senior vice president of product management at GF. “These new partners will help drive deeper engagement and enhance technology collaboration, including tighter interlock around quality, qualification and development methodology, enabling us to deliver advanced 22FDX SoC solutions.”

GF is focused on building strong ecosystem partnerships with industry leaders. With the FDXcelerator program, GF’s partners and customers can now benefit from a greater availability of resources to take advantage of the broad adoption and accelerating growth of the FDX market.

To learn more about GF’s FDXcelerator partner program, please visit our Partners page.

Supporting Quotes

“With a fast-evolving IoT and wearables application landscape, ASE is pleased to have been selected by GF as a trusted partner to provide a robust and reliable supply chain for IC assembly and test services, ultimately accelerating time-to-market for our mutual customers. Through this collaboration, ASE has successfully qualified GF’s FDX technology platform using our innovative wire bond, flip chip and wafer level packaging technologies. Going forward, we are excited to further expand our partnership with GF so customers can increasingly draw from our complementary portfolios encompassing foundry and packaging & test capabilities, all of which are being developed to align with emerging market needs.”

Rich Rice, Senior Vice President, Business Development, ASE Group

“Amkor Technology is pleased to join GF’s FDXcelerator partner program. This ecosystem alliance provides an accelerated time-to-market approach for those customers desiring to benefit from the gains in FD-SOI technology in areas where FinFET struggles with complexity and ability to meet pricing objectives. We look forward to supporting the ecosystem alliance and all of our customers seeking to take advantage of the FDX value proposition.”

Ron Huemoeller, Corporate Vice President, WW R&D and Technology Strategy, Amkor Technology

“Infosys helps clients accelerate their time to market with our silicon to systems range of Engineering Services. Being a partner with GF FDXcelerator program, further enhances our silicon engineering offerings and puts us in a unique position to address technology requirements for our semiconductor clients.”

Sudip Singh, SVP & Global Head of Engineering Services, Infosys

“Mentor Graphics is pleased to be working with GF to provide the industry with more process options for chip design. Mentor’s support for the FDXcelerator program includes not only the Calibre® platform, but also participation from our Digital IC Design product offerings, the Analog FastSPICE (AFS)™ and Eldo® analog/mixed-signal platforms, and the Tessent® test suite. The result is a Mentor offering that allows mutual customers to fully leverage the unique capabilities of GF FDX processes, and move from design to silicon with confidence.”

Joe Sawicki, Vice President and General Manager of the Design-to-Silicon Division at Mentor Graphics

“We are pleased to be part of the FDXcelerator program and to broaden our collaboration with GF. Through our participation in this program, our DPA-resistant security cores will be made available as part of the pre-validated ecosystem of 22FDX™ IP. This program helps extend the reach of our best-in-class security cores and accelerates the time-to-market for our customers.”

Dr. Martin Scott, General Manager of the Rambus Security Division

“Sasken has a deep understanding of the software solutions and processes needed to help OEMs keep pace with the evolution of IoT, automotive, industrial and emerging devices technology. With the increasing demand for custom and bespoke system-on-chip (SoC) solutions, reference designs and newer devices, the FDXcelerator program will enable rapid SoC production and speed up time-to-market. Sasken’s excellence in complete product realization, which includes software and hardware, along with GF’s FDXcelerator Partnership Program will enable custom design solutions at a faster pace.”

Rajiv Mody, Chairman, Managing Director, and CEO, Sasken Communication Technologies Ltd.

“Sonics is partnering with GF FDXcelerator program because we share a commitment to lowering energy consumption and increasing performance for our SoC design customers. Sonics’ leadership in network-on-chip (NoC) technologies has made it the industry’s most trusted solution provider for on-chip communications. Now, our new energy processing unit (EPU) technology provides innovative on-chip energy management capabilities at the architecture level where the greatest potential for power savings is available. Sonics is excited to bridge application and silicon level power control leveraging the unique advantages of 22FDX.”

Grant Pierce, CEO of Sonics

“We are very excited to launch our ultra-low power ArcticPro™ eFPGA IP solution on GF’s cost- and power-optimized 22 FDX process. This partnership leverages our nearly three decades of FPGA experience to provide GF customers with a proven ultra-low power solution that dramatically increases the flexibility of a SoC design. This increased flexibility can significantly broaden the market for SoC designs and accelerate time to market for both semiconductor companies and the OEMs that use eFPGA solutions.”

Brian Faith, President and CEO of QuickLogic Corporation

About GF

GF is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GF is owned by Mubadala Development Company. For more information, visit www.gf.com.

Contacts:
Erica McGill
GF
(518) 305-5978
[email protected]