Fins and FD-SOI are Complementary, VLSI Research Survey Respondents say

By: Dave Lammers

“There are far fewer bigots out there than there were two years ago.” Dan Hutcheson, CEO of VLSI Research

Two years ago, when Dan Hutcheson, CEO of market research firm VLSI Research Inc. (Santa Clara, Calif.), set out to interview influential IC and intellectual property managers about fully depleted silicon on insulator (FD-SOI), he found two top-of-mind concerns: the availability of external IP which design teams could combine with internal intellectual property, and the then-lack of a process technology roadmap.

Hutcheson redid the VLSI Research survey this year and found a different landscape: the 2018 survey respondents were much less concerned with the roadmap issue now that GLOBALFOUNDRIES has committed to a 12nm node for its FDX technology, and “IP is much less of an issue,” Hutcheson said during a presentation of the 2018 survey results at the 2018 SOI Silicon Valley Symposium in late April.

Dan G. Hutcheson presents his FD-SOI & finFET survey results at the annual SOI Silicon Valley Symposium in April 2018 (Photo Source: GF)

Hutcheson asked 24 people—decision-makers at companies accounting for more than half of the IC and intellectual property markets—about  the transistor reasons to design with FD-SOI. Nearly 40 percent cited “better gain for analog” as the top reason, with a similar number citing lower leakage and better parasitics. Lower noise, better transistor matching, thermal properties, reliability concerns, and better radiation protection followed in importance.

The 2018 survey participants are now aware that RF and mixed-signal technologies are more readily implemented in FD-SOI, including a widely held view that FD-SOI is a better solution for 5G and millimeter-wave RF SoCs.

Times Have Changed

When the 2016 survey was conducted, finFET-based processes were just becoming available. At that time people were thinking in either-or mode: either finFETs or FD-SOI, one or the other. Now that finFETs have become widely available, more nuanced thinking is taking hold. “Now, most people have said finFETs and FD-SOI are complementary technologies, and which one you use depends on application needs,” Hutcheson said.

FinFET-based technologies offer higher performance, integration, and density. However, the design and mask costs are higher than FD-SOI, even though finFET costs have come down over the last two years due to depreciation of tool sets.

Many of the survey respondents said the primary advantages of FD-SOI centered on RF, or “high-mix SoCs” with analog, digital, and RF on the same die. In product markets where RF and sensor integration are valuable, FD-SOI is seen as the way to go “much more than before,” he said.

The respondents told Hutcheson that the fully depleted planar transistors on SOI offer “better gain for analog, better matching, and they are much easier to match. The automotive guys see a better thermal range, and more stable operation” in automotive environments. Also, analog designs benefit from the better gain possible with the FD-SOI depletion-mode transistors, compared with the enhancement-mode transistors of finFETs.

“FD-SOI is uniquely positioned for 5G because of the better parasitics. Some people are trying to use fins for 5G, but fin parasitics are a deciding factor. To paraphrase the respondents, ‘You can always find a way to engineer around anything. But the question is: How much do you want to pay to engineer around that?’” he said.

The 2018 survey asked for the top reasons to favor finFETs. The largest reasons were the performance and density advantages held by leading-edge finFETs. Nearly 30 percent said “FD is not cost-effective on a structural basis in these domains.”  About 15 percent of the respondents said they believe millimeter-wave ICs are “possible to do with bulk.” Others cited a wide variety of reasons for preferring finFETs, including challenges in designing with back-biasing, the finFET ecosystem “has no peers,” a lack of FD-SOI IP, and “management says no.”

Survey respondents see advantages for FD-SOI transistors. (Source: VLSI Research Inc.)

“I asked about body-biasing and found people who said it was oversold,” Hutcheson said. One person said “if I go to my boss and say, we ought to do this because we want to do body-biasing, he is likely to say it is too complex and risky, so just do bulk. It’s better to first sell them on FD’s unique transistor features to management first and then add body-biasing as a bonus later.”

The respondents said FD-SOI had business-reason attractiveness, with about 30 percent citing lower design costs as the top business reason to design with FD-SOI. Lower manufacturing costs, fewer masks, and faster cycle-times/ time-to-market followed.

Hutcheson noted that the Internet of Things label encompasses several large market segments. For edge IoT markets where power consumption is important—which he referred to as “clever power with on/off mission profiles” —FD-SOI “has a huge advantage.” And, he said the survey indicated FD-SOI has advantages for markets where the product life is short, and for companies that have ”low budgets for chip design.”

The main takeaway from the 2018 survey is that managers and engineers are more willing to consider FD-SOI as a complement to finFETs, or in some cases as the only process roadmap that fits their company’s product requirements. Fully 75 percent of the survey respondents said they would consider running two roadmaps, one for finFETs and another for FD-SOI.

“Two years ago, people had a dramatic take on the question: is it finFETs? Or is it FD-SOI? At that time it was an OR-gate kind of situation, but now it is more like an AND gate. People are willing to use both. There are far fewer bigots out there than there were two years ago,” he said.

About Author

Dave Lammers

Dave Lammers

Dave Lammers is a contributing writer for Solid State Technology and a contributing blogger for GF’s Foundry Files. Dave started writing about the semiconductor industry while working at the Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry. He joined E.E. Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave received a master’s in journalism at the University of Missouri School of Journalism.

 

Arbe Robotics 高分辨率成像雷达采用格芯技术,来以实现自动驾驶汽车的安全性

Arbe Robotics专有的芯片组利用格芯的22FDX®技术,为4级和5级自动驾驶提供行业首款实时4D成像雷达

加利福尼亚州圣克拉拉,2018年4月26日 – 格芯今日宣布,Arbe Robotics 已选择在其开创性的专利成像雷达中采用格芯的 22FDX® 工艺,这种成像雷达将帮助实现全自动系统功能,并实现更加安全的自动汽车驾驶体验。

Arbe Robotics 的雷达是世界首款实时显示1度分辨率的雷达,并在传感器和 ADAS 技术方面进行了必要的改进。Arbe 致力于构建具有高分辨率、能够实现零误报的感应系统,让汽车能够完全依赖雷达提供的数据来做出决定。通过采用格芯的 22FDX FD-SOI 技术,这种新型芯片组将会增加芯片上的发射和接收通道,并且能够更好地与 Arbe 的专用处理器集成。

自动驾驶的兴起正在改变整个汽车半导体市场,预计到2023年,其市场价值将增长到约540亿美元。对能够增强驾驶体验的新技术的需求推动了这种增长,例如360度环视技术,需要高分辨率和远程能力。格芯的22FDX工艺提供出色的射频性能、低功耗、低噪声,以及高数字密度,可以帮助提高这些应用的覆盖范围和分辨率。

作为首家在宽视场中显示超高分辨率的公司,无论在何种天气和照明条件下,Arbe Robotics 的雷达技术都可以探测300米范围内的行人和障碍物。处理器会根据具体的物体及其速度,创建完整的 3D 图形,并根据其雷达特征对目标进行分类。

“Arbe Robotics 的成像雷达经过优化,旨在提供分辨率极高的实时4D环境图像,”Arbe Robotics 的首席执行官 Kobi Marenko 表示。“与格芯的合作让我们在提高性能水平,进而实现自动驾驶安全性这条道路上向前迈进了一大步。格芯的 22FDX 技术集合了10多年的汽车行业经验,提供按需赋能的节能解决方案,用于满足当前和未来的雷达技术需求。”

“自动驾驶这一趋势正在快速发展,对高分辨率雷达的需求也随之产生。未来如何,将由实时地图、先进的导航软件和汽车传感器提供的实时数据共同决定。”格芯汽车部门的副总裁Mark Granger表示。“因此,格芯非常高兴 Arbe Robotics 选择我们的22FDX平台,双方将携手提供有价值的特性,为自动驾驶行业的急速发展提供支持。”

格芯的22FDX平台是 AutoProTM解决方案 的组成部分,它让客户能够使用更多支持整个 AEC-Q100 质量等级范围(从2级到0级)的制造服务,以便最大程度地简化认证工作,并加快上市时间。

关于Arbe Robotics
Arbe Robotics成立于2015年,致力于实现当今自动驾驶的安全性、经济性和可用性。该公司的4D成像雷达是首款为ADAS、4级和5级全自动汽车提供的高分辨率雷达,让它们在任何天气和任何照明条件下都能“看到”周围的环境;在任何方位,任何高度,任何范围以及任何多普勒效应下,无论距离长短,都是如此。

如需了解更多信息,请访问: https://www.arberobotics.com

关于格芯
格芯是全球领先的全方位服务半导体代工厂,为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务。伴随着全球生产基地横跨三大洲的发展步伐,格芯促生了改变行业的技术和系统的出现,并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉投资公司(Mubadala Investment Company)所有。欲了解更多信息,请访问https://www.globalfoundries.com/cn。

媒体垂询:

杨颖(Jessie Yang)
GF
(021) 8029 6826
[email protected]
邢芳洁(Jay Xing)
86 18801624170
[email protected]

 

Arbe Robotics Selects GLOBALFOUNDRIES for its High-Resolution Imaging Radar to Enable Safety for Autonomous Cars

Arbe Robotics’ proprietary chipset leverages GF’s 22FDX® technology to deliver industry’s first real-time 4D imaging radar for level 4 and 5 autonomous driving

Santa Clara, Calif., April 26, 2018 – GLOBALFOUNDRIES today announced that Arbe Robotics has selected GF’s 22FDX® process for its groundbreaking patented imaging radar that will achieve fully  automated system capabilities and enable safer driving experiences for autonomous vehicles.

Arbe Robotics’ radar is the first in the world to show real-time 1 degree resolution and provide the required enhancements for sensors and ADAS technologies. Arbe’s goal is to build a sensing system with high resolution and zero false alarms, so vehicles will be able to make decisions relying exclusively on the data provided by the radar. Leveraging GF’s 22FDX FD-SOI technology, the new chipset is increasing the amount of transmitting and receiving channels on a chip and allowing for better integration to Arbe’s proprietary processor.

The rise of autonomous driving is changing the automobile semiconductor market, which is expected to grow to an estimated $54 billion by 2023. This is driven by a need for new technologies that promise to enhance the driving experience, such as 360-degree surround view monitoring, which requires high resolution and long-range capabilities. GF’s 22FDX process provides the superior RF performance, power consumption, low noise, and high digital density to increase range and improve resolution for these applications.

As the first company to demonstrate ultra-high-resolution at a wide field of view, Arbe Robotics’ radar technology can detect pedestrians and obstacles at a range of 300 meters, in any weather and lighting conditions. The processor creates a full 3D shape of the objects and their velocity, and classifies targets using their radar signature.

“Arbe Robotics’ Imaging Radar is optimized for providing a real-time 4D picture of the environment at ultra high resolution,” said Kobi Marenko, CEO of Arbe Robotics. “The collaboration with GF is a significant step towards archiving the high-performance level required for autonomous driving safety. With over a decade of automotive industry experience, GF’s 22FDX delivers a performance on-demand, energy-efficient solution for our current and future radar technology needs.”

“The trend of autonomous driving is progressing rapidly, and with it is the need for high-resolution radar. The future will rely on a mix of real-time maps, advanced navigation software, and live data from vehicle sensors,” said Mark Granger, vice president of automotive at GF. “That’s why GF is pleased Arbe Robotics has chosen our 22FDX platform, together bringing valuable attributes that support the explosive growth of the autonomous driving industry.”

GF’s 22FDX platform is a part of the company’s AutoPro™ solutions, which provides customers with additional access to manufacturing services that support the full range of AEC-Q100 quality grades from Grade 2 to Grade 0 to minimize certification efforts and speed time-to-market.

About Arbe Robotics
Arbe Robotics, founded in 2015, has the vision to make autonomous driving safe, affordable and available – today. The company’s 4D Imaging Radar is the first to provide ADAS, level 4, and 5 fully autonomous cars with high-resolution radar that enables them to “see” the environment in any weather and any lighting condition; for long, mid and short ranges in any azimuth, elevation, range, and Doppler.

To learn more visit: https://www.arberobotics.com

About GF
GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit https://www.globalfoundries.com.

Contact:

Erica McGill
GLOBALFOUNDRIES
(518) 795-5240
[email protected]

Arbe Robotics Turns to 22FDX for Hi-Res Automotive Imaging Radar

By: Dave Lammers

High resolution imaging radar enables cars to sense the environment in all weather and lighting conditions to long, mid and short ranges as well as in any azimuth, elevation, and Doppler. It tracks velocity, and detects distance better than sensors now on the market.

The two recent incidents related to self-driving cars in the United States demonstrate the urgent need for improved sensors and related ADAS (Advanced Driver Assistance Systems) technologies. Arbe Robotics, a startup with roots in Israeli military radar technology development, is among the companies answering that need, as it begins rolling out a high-resolution automotive imaging radar chipset based on the 22FDX® technology from GLOBALFOUNDRIES.

Arbe Robotics’ imaging radar provides a high resolution of 1° azimuth and 1.25° elevation, at distances exceeding 300 meters and at a wide field-of-view of 100°.  The company said its advanced technology allows the detection of small targets, such as a human or a bike even if they are somewhat masked by a large object such as a truck. The imaging radar can determine whether objects are moving, and in what direction, and alert the car in real-time about a risk.

While other car sensors can fail when it is raining, if there’s fog, and due to blinding lights such as a sudden reflection. Arbe’s radar is completely oblivious to all those factors. The custom designed radar processor creates a full real-time 4D image of the environment, and classifies targets using their radar signature.

“The performance we can show leapfrogs the existing radars,” said Avi Bauer, vice president of research and development at the Tel Aviv-based company, founded in 2015. In a previous role he benchmarked the available process technologies – ranging from silicon germanium (SiGe) to bulk CMOS – and found them all lacking. The fully-depleted SOI technology of 22FDX met the needs of both the radar front-end device and the processor. Having both chips made on 22FDX will make it easier to combine them into a single-chip solution as the company’s next-generation offering.

Bauer said that at his previous job, “we hit the glass ceiling with respect to efficiency due to the limitations of bulk CMOS,” including power handling. Bauer said that CMOS, at 28nm design rules, falls short both on integration and long-range radar power. Silicon germanium – used today for long-range radar – performs well but is power hungry and has low density. Moving to a largely digital RF design on a 16nm FinFET process would be too expensive and risky.

“With SOI the design is more straightforward, and (voltage) biasing allows you to do things that cannot be done in standard CMOS,” Bauer said. For the transmit and receive modules, SOI’s higher resistivity substrate benefits the passive components – inductors and capacitors – and allows good isolation. “High Q passives are important. At 22nm, SOI allows better performance overall.”

By avoiding the high mask counts and expensive design tools required for FinFET-based designs, Bauer said the 22FDX process meets the company’s power, performance, and density objectives, while remaining on a Moore’s Law cost-per-function curve. Speed and transistor density are important: high-resolution imaging radars generate enormous amounts of data, which must be processed close to where the sensing is happening, at very low latencies. Arbe developed a custom processor for the radar data analysis, Bauer said, and uses an off-the-shelf processor for memory and other control functions.

To LiDAR, or Not

Bert Fransis, a senior director at GF, said that with a high-resolution imaging radar system which can “see” under all weather conditions, ADAS vehicles “would have something of a winner compared to LiDAR.” Fransis said he believes that high-resolution imaging radar eventually will largely supplant deployment of LiDAR (Light Detection And Ranging), the laser-based sensors often seen on the top of today’s ADAS test cars. The ADAS companies could combine CMOS image cameras and high-resolution imaging radar and “significantly cost reduce what a vision system for a car would look like.” The rotating LiDAR modules mounted on the roofs of test cars cost $10,000 or more, and only work well on a clear day, and even then at relatively meager 20 Hz frame rates.

Today’s LiDAR modules “don’t work in foggy, snowy weather. They only provide high resolution under severe constraints,” Fransis said.

Phil Amsrud, senior analyst for automotive electronics and semiconductors at IHS Markit, said there are innovations going on in the LiDAR arena, ranging from MEMS-based and all-solid-state LiDAR, which are likely to keep LiDAR in the “sensor fusion” packages of many car companies. “Looking at the data we have now, LiDAR is going to have a much longer life than just as a science experiment on test vehicles. There is so much effort going into new technologies with fewer moving parts, so many partnerships underway, that we believe LiDAR will be used in production-intent vehicles. It still fits into the sensor fusion mentality, and I see all of these technologies running in parallel.”

3D Plus Velocity Equals 4D

LiDAR may well continue to be deployed by certain car companies, even as Arbe Robotics and other companies push radar’s effective distance to the 300-meter-plus range, and to higher resolution imaging. It claims to be the first radar company to provide high-resolution 4D pictures (3D + Velocity), at a wide dynamic range for real-time obstacle detection.

Shlomit Hacohen, vice president of marketing at Arbe Robotics, said the company is providing prototypes to customers now, and will move to general availability by early next year. “Our imaging radar is a true enabler of road safety, as it works in all weather and lighting conditions. It tracks velocity, and detects distance better than any other sensor in the market,” she said.

Today’s radars support safety systems, including adaptive cruise control, blind spot detection, and automated emergency braking. “However, with the current radars on the market you need to trade off resolution and field of view,” Hacohen said.

The Arbe Robotics systems can be configured for rear, side, or front-view detection. The company touts its ultra-high resolution of 1° azimuth, 1.25° elevation, and Doppler resolution of 0.1 m/s. It supports a wide field of view of 100° azimuth, 30° elevation, and a real-time-refresh rate of 40 FPS (frames per second).

The company has patented its post processing technology, which reduces power consumption by pointing the camera and LiDAR only to the areas of interest.

MRAM Under Consideration

I asked Bauer if Arbe Robotics plans to use the eMRAM (embedded magnetic RAM) technology developed by GF, and he said it is under consideration for Arbe Robotics’ next-generation, single-chip design. “As a stand-alone system in single device, we probably need to take a look at eMRAM. Today, we are already on the edge, and adding another feature like eMRAM would add risk. But we are looking seriously at it for the next generation.”

About Author

Dave Lammers

Dave Lammers

Dave Lammers is a contributing writer for Solid State Technology and a contributing blogger for GF’s Foundry Files. Dave started writing about the semiconductor industry while working at the Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry. He joined E.E. Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave received a master’s in journalism at the University of Missouri School of Journalism.

 

Arbe Robotics在高清汽车成像雷达中采用22FDX技术

作者: Dave Lammers

借助高清成像雷达,汽车在各种天气和照明条件下,无论距离长短,在任何方位、任何高度以及任何多普勒效应下,都能感应周围的环境状况。与当今市面上的传感器相比,它能够更好地跟踪速度和检测距离。

美国近期发生的两起与自动驾驶汽车有关的事故显示,当前迫切需要改进传感器和ADAS(先进的驾驶辅助系统)相关技术。Arbe Robotics是一家以色列军事雷达技术开发创业公司,它针对这一需求推出了基于格芯22FDX®技术的高清汽车成像雷达芯片组。

Arbe Robotics的成像雷达提供1°方位角、1.25°仰角、超过300米探测距离和100°宽视角的高分辨率性能。该公司表示,其先进技术能够探测到小型目标(例如人或自行车),即使被大型物体(例如卡车)遮住也能探测出来。这种成像雷达能够确定对象是否在移动,以及朝哪个方向移动,并实时提醒汽车存在风险。

其他汽车传感器可能因为下雨,因为起雾,或者因为闪烁的灯光(例如突然出现反射光)而失灵。Arbe的雷达完全不会受到这些因素影响。定制雷达处理器能够实时创建全方位的4D环境图像,并根据其雷达特征对目标进行分类。

“我们的雷达所展现的性能要远优于现有的雷达”,(2015年创立于以色列特拉维夫)公司研发部门副总裁Avi Bauer表示。担任之前的职位时,他曾对从锗硅(SiGe)到CMOS体硅等多种可用工艺技术进行基准检测,发现这些技术均存在不足。22FDX全耗尽SOI技术能够满足雷达前端设备和处理器的需求。两种芯片均基于22FDX构建,因而更易同时集成于单芯片解决方案中,造就了该公司的新一代产品。

Bauer表示,在他之前的工作中:“因为CMOS体硅技术的限制,我们在提升效率方面陷入困境”,其中包括功率处理。Bauer表示,依据28nm设计规则,CMOS在集成度和长距离雷达功率方面都存在不足。如今用于长距离雷达的硅锗工艺虽然还不错,但其耗电量高,且密度低。如果采用16nm FinFET工艺进行大型数字RF设计,成本太高,风险太大。

“采用SOI技术之后,设计更加简单,且偏压还可实现标准CMOS中无法实现的目标”,Bauer表示。对于传输和接收模块,SOI的高电阻率衬底对无源组件(电感器和电容器)相当有利,并能提供出色的绝缘性能。“高品质的无源器件非常重要。进行22nm设计时,SOI工艺技术可以提供更出色的整体性能。”

Bauer表示,22FDX工艺无需采用基于FinFET的设计所需的高掩膜数量和昂贵的设计工具,因此能够满足公司的功率、性能和密度目标,同时仍然保持在摩尔定律的每功能单位成本曲线范围内。速度和晶体管密度非常重要:高清成像雷达会生成大量数据,这些数据需要以极低的延迟,在检测位置附近及时处理。Bauer表示,Arbe开发了一款定制处理器用于雷达数据分析,并使用一个现成的处理器来管理存储器和其他控制功能。

采用或不采用LiDAR

格芯的高级总监Bert Fransis表示,通过采用在任何天气条件下能够“视物”的高清成像雷达系统,ADAS汽车“就拥有了战胜LiDAR的条件。”Fransis表示,他相信高清成像雷达最终会大范围部署取代LiDAR(激光探测与测量),后者基于激光传感器,常见于如今的ADAS试验车车顶。ADAS公司可以将CMOS成像摄像头和高清成像雷达相结合,从而“大幅降低汽车的可视系统所需的成本。”安装在试验车车顶、可以旋转的LiDAR模块耗费$10,000或更多的资金,只能在晴天使用,且提供的帧速率只有20 Hz。

目前的LiDAR模块“不能”在雾天、雪天使用。只能在严格的限制条件下,才能提供高分辨率”,Fransis表示。

IHS Markit的汽车电子和半导体高级分析员Phil Amsrud表示,从基于MEMS的LiDAR到全固态LiDAR,LiDAR领域在持续创新,因此很多汽车公司很可能将LiDAR保留在“传感器融合”封装中。“从我们如今掌握的数据来看,LiDAR不止是针对试验车进行科学试验,它的使用寿命应该会更长。现在,大家对于活动部件数量更少的新技术的研究投入了更多精力,进而不断展开诸多合作,所以我们认为,LiDAR将会应用于生产车辆中。它仍然在传感器融合考量的范围之内,我认为这些技术将并行运行。”

3D+速度=4D

即使Arbe Robotics和其他公司将雷达的有效测量范围扩展到300米以上,并能实现更高清的成像,但许多汽车公司仍会继续部署LiDAR。它宣称自己是首家提供高清4D图像(3D+速度),可在宽动态范围内实施监测障碍物的雷达公司。

Arbe Robotics的市场营销副总裁Shlomit Hacohen表示,公司目前可为客户提供原型,预计将于明年初批量上市。“我们的成像雷达能够真正提升道路安全性,因为它可以在所有天气和照明条件下使用。与当今市面上的其他传感器相比,它能够更好地跟踪速度和检测距离。”她表示。

如今的雷达支持安全系统,包括自适应巡航控制、盲点侦测和自动紧急制动。“但是,如果使用目前市面上的雷达,您就需要牺牲一些分辨率和视场”,Hacohen说道。

Arbe Robotics系统可配置用于后视、侧视或前视检测。该公司称,它可以达到1°方位角、1.25°仰角和0.1 m/s的多普勒高清分辨率。它支持100°方位角的宽视场、30°仰角以及40 FPS(帧/秒)的实时刷新率。

该公司的后处理技术已获得专利,该技术通过将摄像头和LiDAR仅指向目标区域来降低功耗。

考虑采用MRAM技术

我询问Bauer,Arbe Robotics是否计划采用格芯开发的eMRAM(嵌入式磁性RAM)技术,他表示Arbe Robotics考虑在下一代单芯片设计中采用该技术。“作为单个设备中的独立系统,我们可能需要了解一下eMRAM技术。如今,我们已经处于关键阶段,再添加一项功能(例如eMRAM)都可能增加风险。但是,我们正慎重考虑将其用在下一代设计中。”

关于作者

Dave Lammers
Dave Lammers是固态技术特约撰稿人,也是格芯的Foundry Files的特约博客作者。他于20世界80年代早期在美联社东京分社工作期间开始撰写关于半导体行业的文章,彼时该行业正经历快速发展。他于1985年加入E.E. Times,定居东京,在之后的14年内,足迹遍及日本、韩国和台湾。1998年,Dave与他的妻子Mieko以及4个孩子移居奥斯丁,为E.E Times开设德克萨斯办事处。Dave毕业于美国圣母大学,获得密苏里大学新闻学院新闻学硕士学位。

 

GLOBALFOUNDRIES Drives Automotive Electronics Forward

By: Mark Granger

Gone are the days when automotive electronics was a slow-moving, trailing-edge business. Today, powerful semiconductor technologies are driving the development of automotive features that once might have been seen as science fiction, such as advanced driver-assistance systems (ADAS) which are paving the way to self-driving cars.

Overall, the market for semiconductors in automotive applications is projected to see a 7% compound annual growth rate (CAGR) from now to 2023, from $35 billion to $54 billion. The ADAS applications where GF offers unique solutions, however, are projected to grow at a whopping 19% CAGR in that period.

The breadth of our technologies, systems design expertise, engineering resources and quality systems all put us in a great position to serve this growing market and provide the automotive industry with innovative solutions that meet its stringent demands for performance, quality, reliability and safety. Customers across the entire automotive supply chain are taking advantage GF’s technology offerings right now, from fabless semiconductor companies to Tier One suppliers to the automakers themselves. Here are a few recent developments I’d like to report.

On the Radar

Automotive radar technology is one of GF’s core competencies, and it’s becoming increasingly important as ADAS systems become more complex and widely used.

Radar is one of several sensor types used to detect objects near a vehicle, to enable features like adaptive cruise control. Lidar is another. It uses pulsed lasers to determine distance from an object by measuring the time it takes for the light to reflect back. However, lidar is currently expensive and is affected by weather conditions. Radar is less expensive, and higher-resolution radars promise to compete well with lidar in automotive applications, thereby enabling lower-priced vehicles to enjoy greater ADAS capabilities.

GF’s 22FDX technology offers great millimeter-wave (mmWave) performance and digital density for the next generation of 77-86 GHz medium-/long-range automotive radars. 22FDX-based radar sensors can provide higher resolutions and less latency than current radar sensors at a very low total system cost.

In the very near future, one of our customers will reveal how the company is using 22FDX as the basis of a radar imaging chipset that can detect obstacles at a range of 300 meters with a wide field of view at ultra-high resolution. Stay tuned.

Another example of how automotive radar is evolving comes from our work with a leading automotive electronics customer that is using GF’s mature CMOS process technology to develop a 77 GHz short-/medium-range radar module. The module integrates a microcontroller, digital signal processors, SRAM and flash memory, and support components on a circuit board replacing a much larger radar array.

Electric Cars with Better Range

Source: Silicon Mobility’s demo at Embedded World 2018

Radar is just one automotive semiconductor application, of course. Powertrain control is another. At the recent Embedded World show, our customer Silicon Mobility demonstrated what the company calls a field programmable control unit (FPCU) for electric and hybrid vehicle powertrain control. Built with GF’s 55LPx CMOS technology, it offers real-time processing and control of sensors and actuators, coupled with a standard CPU, in a single semiconductor that conforms to the safety standard ISO 26262 ASIL-D.  Watch a live demo of Silicon Mobility’s electric automotive motor control, enabled by GF’s 55nm eFlash technology, here.

The result is a more powerful, flexible and safe architecture for the control and performance of electric and hybrid powertrains. By executing complex powertrain control algorithms quickly in hardware instead of in software, substantial energy savings and increased battery life can be achieved. The company says the FPCU can extend the range of electric and hybrid vehicles by some 32%.

Proven Quality in Dresden

Automotive customers demand much higher levels of quality and reliability than customers in other markets, which is understandable because we all know that cars and trucks must operate properly in all weather, road and traffic conditions over their entire service lives.

Consequently, semiconductor suppliers to the automotive industry must meet numerous quality standards and certifications that don’t apply to other types of customers. These are governed by a veritable alphabet soup of standards-setting groups and agencies, such as AEC, IATF, ISO, VDA and others.

We have already proven our automotive capability with our Singapore facilities and now I’m proud to report that GF’s Fab 1 in Dresden had its first full IATF16949/ISO9001 audit last month. Meeting this standard certifies that a facility’s quality management systems meet the requirements for automotive production. Conformance to it is essential.  Four auditors spent the better part of a week looking at all aspects and areas of the Dresden site. The result was successful and upon closing 4 actions within the next 60 days, the auditors will recommend Fab 1 for full certification.

These are just a few of the results of our push toward becoming a favored supplier to the automotive industry. It’s an exciting time to be in this business, as the electronics content of cars increases.  There are abundant semiconductor opportunities all along the value chain, and we’re going after them full speed.

Last year GF unveiled its automotive platform, AutoPro™, which provides a full range of technologies and manufacturing services to help carmakers harness the power of silicon for a new era of ‘connected intelligence’. For more information on the company’s auto solutions and service package please visit: globalfoundries.com/market-solutions/automotive.

Source: GF ADAS & Autonomous – a full range of technologies

About Author

Mark Granger

Mark Granger

GLOBALFOUNDRIES’ Vice President of Automotive, Mark Granger, has been in charge of high performance SoC product design and product management for about 20 years, most recently at NVIDIA where he led the company’s efforts to provide leading-edge application processors for autonomous vehicles.

 

GLOBALFOUNDRIES and Toppan Photomasks Extend Advanced Photomask Joint Venture in Germany

Round Rock, Texas, Santa Clara, Calif., and Dresden, Germany, April 9, 2018 — GLOBALFOUNDRIES Inc. (GF) and Toppan Photomasks, Inc. (TPI) today announced a multi-year extension to their Advanced Mask Technology Center (AMTC) joint venture in Dresden, Germany. Opened in 2002, the AMTC provides GF’s fabs in Dresden, Malta and Singapore with high-end production and development masks at world-class cycle times in support of the foundry’s ambitious technology roadmap. The AMTC also supports TPI customers worldwide from Dresden.

Owned equally by TPI and GF, the AMTC joint venture was previously extended in 2012 to further increase tool capability and capacity. This new extension to the agreement aims to continue the current charter for manufacturing production masks as well as developing mask technology for ever smaller geometries. GF is both TPI’s partner in the joint venture and a strategic and critical customer, while TPI is GF’s preferred mask supplier, leveraging AMTC and TPI’s global manufacturing network to support GF’s worldwide operations.

The AMTC provides one of the most essential and complex elements in the semiconductor manufacturing process, which puts the latest technology innovations at consumers’ fingertips.

Since its inception, the output of AMTC has grown continuously with growth rates exceeding 10 percent in recent years. Sizeable investments have enabled the AMTC to keep up with the rapid technological developments and challenges of this dynamic market sector; in 2017 alone more than 100 million euros (US$124 million) were invested.

“From computing to communication, and from automotive to medtech – our dual roadmap allows us to provide innovative technologies for the benefit of our customers around the world,” said Geoff Akiki, World Wide Mask Operations Executive at GF. “Regardless if they choose FD-SOI with its focus on energy efficiency or FinFET with its focus on high performance, both require leading-edge lithographic masks. AMTC is a great partner and provider of those masks. We are especially pleased that the experience of AMTC will be fully utilized to support us at the leading edge of chip technology.”

“Having been in place for more than 15 years, this joint venture is one of the lengthiest in the mask industry,” said Mike Hadsell, TPI CEO. “This is a testament to the synergy and commitment of the partners, as well as the strength of the AMTC and Toppan Dresden team members. AMTC is truly a best-of-breed effort that has provided high-quality masks to TPI’s customer base, both in Europe and globally.”

“AMTC was founded with a mission to be its customers’ first choice for photomasks. To achieve this goal, our experienced and dedicated team pursues cost-effective and timely manufacturing of high-quality masks for multiple nodes. In the process, the partners have continued to strengthen their relationship while allowing AMTC to serve as a valuable resource for our demanding global customer base,” noted Thomas Schmidt, AMTC’s general manager. “AMTC was established to support AMD’s microprocessor production in Dresden at the 65nm/90nm node. We have moved way beyond that and are looking beyond the current 14nm node.”

AMTC was founded in 2002 by AMD, Infineon Technologies and DuPont Photomasks, which became TPI in 2005. Subsequently, GF and TPI became the ownership partners in 2009. AMTC has seen a cumulative investment of more than US$600 million since 2002. The mask facility  employs more than 250 engineers and other specialists. The company is currently expanding its team – please check the AMTC Career Page for open opportunities.

About Toppan Photomasks

Toppan Photomasks, Inc. is a wholly owned subsidiary of Toppan Printing Co., Ltd., a diversified global company with revenue in excess of US$14 billion in 2016. Toppan Photomasks is part of the Toppan Group of photomask companies. As the world’s premier photomask provider, the Toppan Group operates the industry’s most advanced and largest network of manufacturing facilities and offers a comprehensive range of photomask technologies and research and development capabilities to meet the increasingly sophisticated and divergent product-and service requirements of the global semiconductor industry. Toppan Photomasks is headquartered in Round Rock, Texas. For more information, visit www.photomask.com.

About Toppan Printing’s Photomask Business

Toppan Printing is the world’s premier photomask manufacturer. The company supports the global semiconductor industry, from the initial launch of the semiconductor manufacturing process through commercial production, by providing state-of-the-art photomask technology. Toppan is the only global photomask manufacturer providing the highest quality products in a timely manner to customers across Japan, the United States, Europe and Asia. For more information, visit www.toppan.co.jp.

About GLOBALFOUNDRIES

GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GF is owned by Mubadala Investment Company. For more information, visit https://www.globalfoundries.com.

* The names of companies, products and services featured in this press release are the trademarks or registered trademarks of the respective companies.
* The information in this press release is current as the date of publication and is subject to change without notice.

Contacts:

Bud Caverly                                                                                                          Angie Kellen
Toppan Photomasks, Inc.                                                                               Open Sky Communications (for TPI)
Phone: 503-913-0694                                                                                        Phone: 408-829-0106                        
Email: [email protected]                                                     E-mail: [email protected]   

Erica McGill
GLOBALFOUNDRIES
Phone: 518-795-5240
Email: [email protected]

GLOBALFOUNDRIES and Toppan Photomasks Extend Advanced Photomask Joint Venture in Germany

Round Rock, Texas, Santa Clara, Calif., and Dresden, Germany, April 9, 2018 — GLOBALFOUNDRIES Inc. (GF) and Toppan Photomasks, Inc. (TPI) today announced a multi-year extension to their Advanced Mask Technology Center (AMTC) joint venture in Dresden, Germany. Opened in 2002, the AMTC provides GF’s fabs in Dresden, Malta and Singapore with high-end production and development masks at world-class cycle times in support of the foundry’s ambitious technology roadmap. The AMTC also supports TPI customers worldwide from Dresden.

Owned equally by TPI and GF, the AMTC joint venture was previously extended in 2012 to further increase tool capability and capacity. This new extension to the agreement aims to continue the current charter for manufacturing production masks as well as developing mask technology for ever smaller geometries. GF is both TPI’s partner in the joint venture and a strategic and critical customer, while TPI is GF’s preferred mask supplier, leveraging AMTC and TPI’s global manufacturing network to support GF’s worldwide operations.

The AMTC provides one of the most essential and complex elements in the semiconductor manufacturing process, which puts the latest technology innovations at consumers’ fingertips.

Since its inception, the output of AMTC has grown continuously with growth rates exceeding 10 percent in recent years. Sizeable investments have enabled the AMTC to keep up with the rapid technological developments and challenges of this dynamic market sector; in 2017 alone more than 100 million euros (US$124 million) were invested.

“From computing to communication, and from automotive to medtech – our dual roadmap allows us to provide innovative technologies for the benefit of our customers around the world,” said Geoff Akiki, World Wide Mask Operations Executive at GF. “Regardless if they choose FD-SOI with its focus on energy efficiency or FinFET with its focus on high performance, both require leading-edge lithographic masks. AMTC is a great partner and provider of those masks. We are especially pleased that the experience of AMTC will be fully utilized to support us at the leading edge of chip technology.”

“Having been in place for more than 15 years, this joint venture is one of the lengthiest in the mask industry,” said Mike Hadsell, TPI CEO. “This is a testament to the synergy and commitment of the partners, as well as the strength of the AMTC and Toppan Dresden team members. AMTC is truly a best-of-breed effort that has provided high-quality masks to TPI’s customer base, both in Europe and globally.”

“AMTC was founded with a mission to be its customers’ first choice for photomasks. To achieve this goal, our experienced and dedicated team pursues cost-effective and timely manufacturing of high-quality masks for multiple nodes. In the process, the partners have continued to strengthen their relationship while allowing AMTC to serve as a valuable resource for our demanding global customer base,” noted Thomas Schmidt, AMTC’s general manager. “AMTC was established to support AMD’s microprocessor production in Dresden at the 65nm/90nm node. We have moved way beyond that and are looking beyond the current 14nm node.”

AMTC was founded in 2002 by AMD, Infineon Technologies and DuPont Photomasks, which became TPI in 2005. Subsequently, GF and TPI became the ownership partners in 2009. AMTC has seen a cumulative investment of more than US$600 million since 2002. The mask facility  employs more than 250 engineers and other specialists. The company is currently expanding its team – please check the AMTC Career Page for open opportunities.

About Toppan Photomasks

Toppan Photomasks, Inc. is a wholly owned subsidiary of Toppan Printing Co., Ltd., a diversified global company with revenue in excess of US$14 billion in 2016. Toppan Photomasks is part of the Toppan Group of photomask companies. As the world’s premier photomask provider, the Toppan Group operates the industry’s most advanced and largest network of manufacturing facilities and offers a comprehensive range of photomask technologies and research and development capabilities to meet the increasingly sophisticated and divergent product-and service requirements of the global semiconductor industry. Toppan Photomasks is headquartered in Round Rock, Texas. For more information, visit www.photomask.com.

About Toppan Printing’s Photomask Business

Toppan Printing is the world’s premier photomask manufacturer. The company supports the global semiconductor industry, from the initial launch of the semiconductor manufacturing process through commercial production, by providing state-of-the-art photomask technology. Toppan is the only global photomask manufacturer providing the highest quality products in a timely manner to customers across Japan, the United States, Europe and Asia. For more information, visit www.toppan.co.jp.

About GLOBALFOUNDRIES

GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GF is owned by Mubadala Investment Company. For more information, visit https://www.globalfoundries.com.

* The names of companies, products and services featured in this press release are the trademarks or registered trademarks of the respective companies.
* The information in this press release is current as the date of publication and is subject to change without notice.

Contacts:

Bud Caverly                                                                                                          Angie Kellen
Toppan Photomasks, Inc.                                                                               Open Sky Communications (for TPI)
Phone: 503-913-0694                                                                                        Phone: 408-829-0106                        
Email: [email protected]                                                     E-mail: [email protected]   

Erica McGill
GLOBALFOUNDRIES
Phone: 518-795-5240
Email: [email protected]

New Semiconductor Architecture to Skyrocket EV and HEV Vehicle Performance and Range

By: Khaled Douzane

An Introduction to the revolutionary and industry first FPCU (Field Programmable Control Unit)

As you probably know, the automotive industry is amidst a digital and electric revolution. Much similar to the evolution from flip phones to smartphones, vehicles are becoming electrified, autonomous, and connected, transforming mobility as we know it forever. What you may not know is semiconductors inside these cars are becoming more and more valuable, as they are the key to enabling electric and hybrid vehicles to conserve power, charge faster and reach new ranges. The world’s top auto manufacturers are judged on these key factors and are in a race to find the best technologies to reach the farthest vehicle range with the least power consumption with the fastest battery charging time.

Seeking of new technologies

The answer to this challenge is extremely complex as it involves several elements within an electrified powertrain system. From the battery technology and electric motor design to the motor positioning, there are limitless combinations of technologies to use in electric powertrains, and we are not diving into that conversation as it would be a very long article. The key to this discussion is the ability to control these new systems efficiently together in harmony for maximum performance with new a semiconductor designed specifically for electric and hybrid powertrain systems.

Amazingly, no adequate solution to date has been offered by traditional semiconductor manufacturers to control these new systems efficiently. Therefore, Tier 1 manufacturers and OEMs are essentially forced to use limiting technologies like multicores and microcontrollers that were designed for gas powered engines. Because of this, Silicon Mobility has engineered a new semiconductor called the Field Programmable Control Unit (FPCU) that enables existing electric and hybrid vehicle technologies to achieve their true potential.

A Semiconductor that surpasses the limits

This new disruptive FPCU semiconductor technology combines a flexible and parallel hardware architecture that offers real-time processing and control of sensors and actuators, coupled with a standard CPU. This is surrounded and complemented with an integrated highest standard safety architecture (ASIL-D) to form a single semiconductor. The result is a far more powerful, flexible and safe architecture for the control and performance of electric and hybrid powertrains.

Source: Silicon Mobility’s demo at Embedded World 2018

The FPCU removes software bottlenecks and increases data processing over 40x faster than traditional semiconductors. The FPCU also enables up to 20x faster hard real-time control loop ensuring engine endurance and eliminating signal delays that can cause engine failure or damage. In addition, by executing complex algorithms in the FPCU hardware instead of software reduces power consumption significantly, reaching reductions of over 180 or 200 percent. This result of less power being consumed is an increased range of electric and hybrid vehicles. The FPCU has been measured to extend electric and hybrid vehicle range by over 32%!

Enabling the electric and hybrid revolution

By introducing the FPCU semiconductor, Silicon Mobility is helping automotive manufacturers and OEMs bring more efficient and custom designed electric and hybrid vehicles to market. Especially with the increased demand for extended vehicle range and increased data processing for autonomous driving, semiconductors like the FPCU are the key to achieving this without the need for rethinking or redesigning vehicle powertrain systems such as the battery or engine. Every top car manufacturer in the world is introducing at least one new electric or hybrid model in the next two years, and semiconductor solutions will be in extremely high demand. With the ability to increase vehicle range and data processing exponentially while reducing power consumption, semiconductor architecture is going to pave the way for electric and hybrid vehicle performance and range. Reason being, it is much less expensive to integrate new semiconductor architecture into existing powertrains than significantly alter powertrain system design and supply chains.

To learn more about Silicon Mobility’s FPCU called OLEA, please visit our website and learn about how this industry first semiconductor architecture can enable your electric and hybrid revolution.

Last year, GLOBALFOUNDRIES and Silicon Mobility successfully produced the industry’s first automotive FPCU solution. Most recently, Silicon Mobility successfully demonstrated its T222 chip at Embedded World 2018. This FPCU solution uses GF’s 55nm Low Power Extended (55LPx) automotive qualified technology platform to integrate multiple functions onto a single chip, boosting performance for hybrid and electric vehicles.

Watch a live demoof Silicon Mobility’s electric automotive motor control, enabled by GF’s 55nm eFlash technology.

About Author

Khaled Douzane

Khaled Douzane

Khaled Douzane has 18 years of experience in the semiconductor industry with and automotive focus. As Silicon Mobility’s Vice President of Products, he is defining and driving all product lines for electric (EV) and hybrid (HEV) powertrain and autonomous vehicle applications. Khaled is a stakeholder in the patented technology design at the core of Silicon Mobilty’s innovative and revolutionary products. Prior to co-founding Silicon Mobility, Khaled contributed to the development of Scaleo, a semiconductor fabless company, where he held several roles, including SoC Desing Manager for eight years and Product Manager for an additional eight years. Khaled Douzane is a graduate of Nice Sophia-Antipolis POLYTECH engineering school with a major in Electronics.

 

Experts Emphasize the Need for Complete 5G Solutions

By: Gary Dagastine

GF spoke 5G and the world listened at Mobile World Congress 2018

The Mobile World Congress in Barcelona, Spain is the wireless industry’s leading annual event, and this year’s edition in late February was buzzing with talk of 5G wireless technology. GLOBALFOUNDRIES seized the moment on the show’s very first morning with a special program on 5G’s evolving uses and technology requirements.

First, Gregg Bartlett and Dr. Bami Bastani, Sr. Vice Presidents of GF’s CMOS and RF business units, respectively, outlined 5G-related semiconductor challenges and opportunities for an audience of device developers, networking specialists and high-performance computing architects. 5G will impact all these areas because it enables smarter devices to feed through higher-bandwidth connections to ever-more-powerful data centers.

Then, a panel discussion moderated by Mike Cadigan, GF’s Sr. Vice President of Global Sales and Business Development, and head of GF’s ASIC business unit, took place. The panel was made up of invited experts from Nokia Mobile Networks, Mobile Experts LLC and TU-Dresden.

They gave insights into why 5G networks aren’t likely to roll out on a nationwide scale, why a one-millisecond network latency is “magical,” how working directly with a foundry can support more holistic solutions, and many other important considerations.

Delivering the promise of 5G demands optimized solutions. Source: GF

5G Computing Demands Optimized Silicon

Bartlett said 5G will drive profound changes in the computing requirements for devices and data centers, because the complexity and volume of network traffic are growing exponentially as the result of more users, more transactions per user and richer content per transaction.

“Data center applications will require very fast processors and near-100% uptime, while edge-connected devices will require chips with extremely low-power/low-leakage performance, and with embedded memory for storage and RF for wireless connectivity,” he said.

Both applications also will make use of artificial intelligence (AI) functionality but they will do so differently, he said. Data centers will use AI to learn, anticipate and direct the behavior of devices and networks, while edge-connected devices such as automotive cameras will use it locally for real-time processing and inference. 5G bandwidth is essential to support all these uses.

Design costs are increasing exponentially at each node. Source: IBS 2017

Bartlett said many companies will find it difficult to take advantage of 5G opportunities because of the significant investments required in design tools, EDA, intellectual property (IP) development and verification. “Many new, innovative companies can’t absorb these development costs, and they need technology solutions offering both competitive advantage and cost reductions going forward,” he said.

He explained how GF’s dual-technology roadmap offers this flexibility, with advanced FinFET CMOS technology for high-performance computing, and FD-SOI technology for wireless and battery-powered applications, both of which can be integrated with best-in-class RF functionality. Application-specific ICs, or ASICs, are another path forward to 5G, and GF offers the leading ASIC IP portfolio and more than 1,000 experienced engineers.

While many customers are clamoring for such wide-ranging, flexible foundry solutions, not all foundries are able to respond. “We have a growing portfolio of what I call ‘revolutionary’ customers, who are using new silicon as a wedge to break or change their industry’s traditional competitive framework,” he said. “They are demanding easier access to silicon and we have aligned ourselves accordingly to provide the optimized solutions they need.”

5G Connectivity Brings More Complexity

On the connectivity side, Bami Bastani said 5G will be rolled out in stages, leveraging the existing 4G/LTE backbone. First there will be enhancements to the existing system, then an initial rollout of sub-6GHz bands with massive MIMO architectures for high-rate transmission, and then a second rollout to expand network capacity and drive even higher data transmission rates by leveraging mmWave bands.

“This all means a more complex radio is required, one that works not only with new network protocols but also with legacy protocols and bands,” he said. “Thus, front-end modules (FEMs) must evolve in many ways as the transition from 4G to 5G takes place.”

Bastani said GF’s rich RF portfolio of silicon-on-insulator (SOI) and silicon germanium (SiGe) technology platforms creates differentiation for customers, as these optimized solutions can address specific customer performance, complexity and cost demands. He gave two examples.

For 5G basestations, control of the antenna arrays will require much more complex signal processing circuitry. “This process is called beamforming, and it can be done with analog, digital or hybrid circuitry depending on the size of the array. How the system is partitioned drives the choice of technology, and GF has a rich set of offerings to address all requirements,” he said.

The requirements are different for small mobile devices. “You’re now dealing with smaller arrays which require higher power per element to achieve the same radiated power. The good news is we can now do much of the beamforming digitally, thereby leveraging the scaling of advanced nodes like 22FDX to achieve low power and cost for these applications,” he said.

Industry Experts Outline the 5G Future

The discussion then shifted to a panel of experts including Joe Madden, principal analyst at Mobile Experts, Professor Frank Fitzek, head of the Deutsche Telekom Chair of Communication Networks at TU Dresden, and Michael Reiha, head of RF IC R&D at Nokia Mobile Networks.

Joe Madden started the panel dialogue, commenting that 5G networks will roll out differently than previous networking technologies. These were characterized by rapid surges of deployment because they enabled existing, widely used applications such as email to go wireless. By contrast, he said, 5G primarily benefits network operators and as-yet non-existent markets.

“From a network operator’s viewpoint the real advantage of 5G is cost. Today, it costs about $1.50 to deliver 1 GB of data over an LTE network, but with mmWave 5G it might be 5 cents or less,” he said, which implies there will be islands of deployment initially, such as in urban centers with dense network traffic or where it’s specifically needed for certain IoT applications.

Moving on to the topic of 5G standards, Cadigan asked Prof. Fitzek to describe the ways in which they are evolving, and how it relates to foundry technology. “Transporting more data isn’t really the issue, it’s all about latency. In that regard, why do we keep arguing that a 1-ms latency requirement is so magical? Well, it has to do with the physics of feedback loops,” said Prof. Fitzek. (Latency is the inherent delay in the network.)

NEXTech Labs Theater, MWC 2018

He gave the example of a 50 Hz power plant feeding electricity into a smart power grid. A mere 10-ms of latency in the grid would result in such large phase shifts in the generator’s electrical output that it could be damaged, he said, whereas 1-ms of latency would be adequate.

“Many people think that if you put the wrong figure for latency into the standard, you can just fix it later. But it will be hard to fix, and to get the full value of 5G networks it must be there from the start.” This doesn’t pose a problem for semiconductor technologists, he said, because they are already very familiar with feedback loops.

The need for low latency is a major reason why Nokia designed its recently introduced 5G Reefshark chipsets itself instead of working with a fabless semiconductor company, according to Reiha. Cadigan asked him what that might mean for future foundry relationships.

Reiha said that to achieve such low latencies one needs to look at 5G requirements holistically, with a vision of the future that semiconductor solutions are flexible enough to support. “Nokia Bell Labs literally wrote the book on massive MIMO, and this enables us to understand the system-based challenges. We also understand the importance of seamless integration of semiconductor functions,” he said.

“What we expect from our foundries is an honest dialog and open access to IP to maintain our quality standards. We need quality IP because we can’t do everything, we’re not experts in all domains,” he said.

Cadigan went on and asked the panelists for their perspective on the approach GLOBALFOUNDRIES is taking in the 5G space. Madden said that GF’s ability to integrate various technologies is very important. “As we go to massive MIMO arrays, there is pressure to reduce the size of radio arrays as well as receivers. There can’t be large transmission lines, and multichip modules where everything is tightly integrated are essential,” he said. Cadigan noted the advanced packaging technology which came to GF from IBM.

Reiha said GF has the best-in-class RF capability, and that from Nokia’s perspective the continuation of ongoing device model improvements for RF is key. “This is especially needed for thermal device models and also for technologies such as SOI to enable more of a seamless mixed-signal simulation environment that would let us build many more sensors and put more control on our RF die, which would really let us focus on having an AI footprint at the antenna interface,” he said.

Prof. Fitzek talked about the importance of software and the openness of GF’s technology. “Because at this point you can’t really foresee what users will do, and machine learning will have its own purposes, your software APIs will only become more important in the future.”

About Author

Gary Dagastine

Gary Dagastine

Gary Dagastine is a writer who has covered the semiconductor industry for EE Times, Electronics Weekly and many specialized media outlets. He is a contributing editor at Nanochip Fab Solutions magazine and also is the Director of Media Relations for the IEEE International Electron Devices Meeting (IEDM), the world’s most influential technology conference for semiconductors. He started in the industry at General Electric Co. where he provided communications support to GE’s power, analog and custom IC businesses. Gary is a graduate of Union College in Schenectady, New York,